CN216488123U - LED chip assembly and LED display device - Google Patents

Abstract

The utility model provides a LED chip subassembly and LED display device, wherein, the LED chip subassembly, include: a substrate layer; the LED light-emitting unit is arranged in the base layer and comprises an LED chip; the transparent supporting layer is arranged on the front side of the substrate layer and covers the light emitting surface of the LED chip; the first insulating layer is arranged on the rear side of the substrate layer, and a first circuit connected with the first electrode of the LED chip and a second circuit connected with the second electrode of the LED chip are arranged in the first insulating layer; the second insulating layer is arranged on the rear side of the first insulating layer, a first conductive part in conductive connection with the first circuit and a second conductive part in conductive connection with the second circuit are arranged in the second insulating layer, and the first conductive part and the second conductive part are exposed out of the rear surface of the second insulating layer. The technical scheme of this application has solved the problem that the line width line spacing of predetermineeing the line on the circuit board in the correlation technique can't satisfy the connection requirement with the LED chip effectively.

Description

LED chip assembly and LED display device

Technical Field

The utility model relates to a LED shows technical field, particularly, relates to a LED chip subassembly and LED display device.

Background

The related art LED lamp includes: the LED chip comprises a substrate or a support, an LED chip, a bonding wire and packaging glue. The LED chip is firstly fixed on a substrate or a support, and the positive and negative electrodes of the LED are LED out through the substrate or the support.

After the size of the LED chip is reduced, the line width and line distance of the substrate or the support cannot meet the connection requirements of the LED chip, the requirements are generally met by changing the substrate into a substrate with higher precision, the high-precision substrate is usually high in cost, the circuit is preset on the circuit board in the prior art, the LED chip is connected with the preset circuit by using the adhesive, the line width and line distance of the preset circuit cannot meet the LED die bonding requirement of less than 20 microns, the connection effect is poor, and poor contact is caused.

SUMMERY OF THE UTILITY MODEL

A primary object of the present invention is to provide a LED chip module and a LED display device to solve the problem that the line width and the line distance of the predetermined circuit on the circuit board in the related art cannot satisfy the connection requirement with the LED chip.

In order to achieve the above object, according to an aspect of the present invention, there is provided an LED chip assembly, including: a substrate layer; the LED light-emitting unit is arranged in the base body layer and comprises an LED chip, the light-emitting surface of the LED chip is exposed out of the front surface of the base body layer, and the first electrode and the second electrode of the LED chip are exposed out of the rear surface of the base body layer; the transparent supporting layer is arranged on the front side of the substrate layer and covers the light emitting surface of the LED chip; the first insulating layer is arranged on the rear side of the substrate layer, and a first circuit connected with the first electrode of the LED chip and a second circuit connected with the second electrode of the LED chip are arranged in the first insulating layer; the second insulating layer is arranged on the rear side of the first insulating layer, a first conductive part in conductive connection with the first circuit and a second conductive part in conductive connection with the second circuit are arranged in the second insulating layer, and the first conductive part and the second conductive part are exposed out of the rear surface of the second insulating layer.

Furthermore, the number of the LED light-emitting units is N, and the number of the LED chips of each LED light-emitting unit is three, wherein N is a natural number and is more than or equal to 1; the number of the first circuits, the number of the second circuits and the number of the first conductive parts are 3N, the number of the second conductive parts is N, the first ends of the 3N first circuits are respectively connected with the first electrodes of the 3N LED chips in a one-to-one correspondence mode, the second end of each first circuit is connected with one first conductive part, the first ends of the 3N second circuits are respectively connected with the second electrodes of the 3N LED chips in a one-to-one correspondence mode, and the second ends of the three second circuits corresponding to the same LED light-emitting unit are connected in a converging mode and are connected with one second conductive part.

Further, the second insulating layer has a rectangular structure, and when N is equal to 1, the three first conductive portions and the one second conductive portion are respectively located at four corners of the rectangular structure.

Furthermore, the number of the LED light-emitting units is 2N, the number of the LED chips of each LED light-emitting unit is three, the 2N LED light-emitting units are arranged in pairs, two first electrodes of two adjacent LED chips in each pair of LED light-emitting units are positioned between two second electrodes, wherein N is a natural number and is not less than 1; the number of the first circuits and the number of the second circuits are 6N, the number of the first conductive parts is 3N, the number of the second conductive parts is two, the first ends of the 6N first circuits are respectively connected with the first electrodes of the 6N LED chips in a one-to-one correspondence mode, the second ends of the two adjacent first circuits are connected in a converging mode and connected with one first conductive part, the first ends of the 6N second circuits are respectively connected with the second electrodes of the 6N LED chips in a one-to-one correspondence mode, and the second ends of the second circuits of the LED light-emitting units located in the same column are connected in a converging mode and connected with one second conductive part.

Further, the transparent support layer is a functional film, and the functional film is one or more of a polarizing film, an anti-glare film and a high-transmittance film, wherein the light transmittance of the high-transmittance film is between 85% and 97%.

Further, the LED chip assembly further includes an adhesive layer connected between the functional film and the base layer.

Furthermore, a first gap for accommodating the first circuit and a second gap for accommodating the second circuit are arranged on the first insulating layer.

Furthermore, a third gap for accommodating the first conductive part and a fourth gap for accommodating the second conductive part are arranged on the second insulating layer.

Further, the thickness of the base layer is smaller than or equal to that of the LED chip.

According to another aspect of the present invention, there is provided an LED display device, comprising one or more LED chip assemblies, the LED chip assemblies being the above-mentioned LED chip assemblies.

Use the technical scheme of the utility model, LED chip subassembly includes: the LED light-emitting device comprises a substrate layer, an LED light-emitting unit, a transparent supporting layer, a first insulating layer and a second insulating layer. The LED light-emitting unit is arranged in the base layer. The LED light emitting unit includes an LED chip. The luminous surface of the LED chip is exposed out of the front surface of the base layer, and the first electrode and the second electrode of the LED chip are exposed out of the rear surface of the base layer. The transparent supporting layer is arranged on the front side of the substrate layer and covers the light emitting surface of the LED chip. The transparent supporting layer can support the base body layer and the LED light-emitting units, and is convenient to connect and fix. The first insulating layer is arranged on the rear side of the substrate layer, and a first circuit connected with the first electrode of the LED chip and a second circuit connected with the second electrode of the LED chip are arranged in the first insulating layer. The second insulating layer is arranged on the rear side of the first insulating layer, a first conductive part in conductive connection with the first electrode and a second conductive part in conductive connection with the second electrode are arranged in the second insulating layer, and the first conductive part and the second conductive part are exposed out of the rear surface of the second insulating layer. In this way, the first circuit connected between the first conductive part and the first electrode and the second circuit connected between the second conductive part and the second electrode are integrated inside the LED chip assembly, and the first insulating layer can isolate the first circuit and the second circuit and prevent the occurrence of a short circuit, and the second insulating layer can isolate not only the first conductive part and the second conductive part but also the first conductive part and the second circuit and the second conductive part and the first circuit and prevent the occurrence of a short circuit. Therefore, the first conductive part, the second conductive part, the first circuit and the second circuit are integrated on the LED chip assembly, a circuit board with a preset circuit in the related technology is not needed, the connection requirement with the LED chip can be met, the packaging and mounting requirements of the smaller LED chip can be favorably realized, and the LED chip assembly is used for the use requirements of the smaller LED chip and the smaller LED lamp bead. Therefore, the technical scheme of the application can solve the problem that the line width and the line distance of the preset line on the circuit board in the related technology can not meet the connection requirement of the LED chip.

Drawings

The accompanying drawings, which form a part of the present application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 shows a schematic longitudinal sectional view of a first embodiment of an LED display assembly according to the present invention;

FIG. 2 shows a schematic top view of one LED lighting unit of the LED display assembly of FIG. 1 on a transparent support layer;

FIG. 3 shows a schematic top view of a first insulating layer of the LED display assembly of FIG. 1;

FIG. 4 shows a schematic top view of a second insulating layer of the LED display assembly of FIG. 1;

FIG. 5 shows a schematic partial cross-sectional view of the second insulating layer of the LED display assembly of FIG. 4;

fig. 6 shows a schematic longitudinal cross-sectional view of two LED lighting units of a second embodiment of an LED display assembly according to the present invention on a transparent support layer;

FIG. 7 shows a schematic top view of two LED lighting units of the LED display assembly of FIG. 6 on a transparent support layer;

FIG. 8 shows a schematic top view of the first insulating layer of the LED display assembly of FIG. 6;

FIG. 9 shows a schematic top view of a second insulating layer of the LED display assembly of FIG. 6;

fig. 10 shows a schematic top view of two LED lighting units of a third embodiment of an LED display assembly according to the present invention on a transparent support layer;

FIG. 11 shows a schematic top view of the first insulating layer of the LED display assembly of FIG. 10;

FIG. 12 shows a schematic top view of the second insulating layer of the LED display assembly of FIG. 10;

fig. 13 shows a schematic top view of four LED lighting units of an embodiment four of an LED display assembly according to the present invention on a transparent support layer;

FIG. 14 shows a schematic top view of the first insulating layer of the LED display assembly of FIG. 13;

fig. 15 shows a schematic top view of the second insulating layer of the LED display assembly of fig. 13.

Wherein the figures include the following reference numerals:

10. a substrate layer; 20. an LED chip; 21. a first electrode; 22. a second electrode; 23. a light emitting face; 30. a transparent support layer; 41. a first insulating layer; 42. a second insulating layer; 51. a first circuit; 52. a second circuit; 61. a first conductive portion; 62. a second conductive portion; 70. and (7) bonding the layers.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

Unless specifically stated otherwise, the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

As shown in fig. 1 to 5, the LED chip assembly of the first embodiment includes: a base layer 10, an LED light emitting unit, a transparent support layer 30, a first insulating layer 41 and a second insulating layer 42. The LED lighting units are arranged in a matrix layer 10. The LED light emitting unit includes an LED chip 20. The light emitting surface 23 of the LED chip 20 is exposed on the front surface of the base layer 10, and the first electrode 21 and the second electrode 22 of the LED chip 20 are exposed on the rear surface of the base layer 10. The transparent support layer 30 is disposed on the front side of the base layer 10 and covers the light emitting surface 23 of the LED chip 20. The first insulating layer 41 is provided on the rear side of the base layer 10, and a first circuit 51 connected to the first electrode 21 of the LED chip 20 and a second circuit 52 connected to the second electrode 22 of the LED chip 20 are provided in the first insulating layer 41. The second insulating layer 42 is disposed on the rear side of the first insulating layer 41, a first conductive portion 61 electrically connected to the first circuit 51 and a second conductive portion 62 electrically connected to the second circuit 52 are disposed in the second insulating layer 42, and the first conductive portion 61 and the second conductive portion 62 are exposed on the rear surface of the second insulating layer 42.

With the technical solution of the first embodiment, the transparent support layer 30 is disposed on the front side of the substrate layer 10 and covers the light emitting surface 23 of the LED chip 20. The transparent support layer 30 can support the substrate layer 10 and the LED light emitting units during the processing process, so as to facilitate connection and fixation. The first insulating layer 41 is provided on the rear side of the base layer 10, and a first circuit 51 connected to the first electrode 21 of the LED chip 20 and a second circuit 52 connected to the second electrode 22 of the LED chip 20 are provided in the first insulating layer 41. The second insulating layer 42 is disposed on the rear side of the first insulating layer 41, a first conductive portion 61 electrically connected to the first electrode 21 and a second conductive portion 62 electrically connected to the second electrode 22 are disposed in the second insulating layer 42, and the first conductive portion 61 and the second conductive portion 62 are exposed on the rear surface of the second insulating layer 42. In this way, the first circuit 51 connected between the first conductive part 61 and the first electrode 21 and the second circuit 52 connected between the second conductive part 62 and the second electrode 22 are integrated inside the LED chip assembly, and the first insulating layer 41 can isolate the first circuit 51 and the second circuit 52, preventing the occurrence of a short circuit. The second insulating layer 42 can isolate the first conductive part 61 and the second conductive part 62 from each other, and can isolate the first conductive part 61 from the second circuit 52 and the second conductive part 62 from the first circuit 51, thereby preventing short-circuiting. Thus, in the technical scheme of the embodiment, the first conductive part 61, the second conductive part 62, the first circuit 51 and the second circuit 52 are integrated on one LED chip assembly, and a circuit board with a preset circuit in the related art is not required, so that the connection requirement with the LED chip 20 can be met, the packaging and mounting requirements of the smaller LED chip 20 can be realized, and the use requirements of the smaller LED chip 20 and the smaller LED lamp bead can be met. Therefore, the first technical solution of the embodiment can solve the problem that the line width and the line distance of the preset lines on the circuit board in the related art cannot meet the connection requirement with the LED chip 20. The polarity of the first electrode 21 is opposite to that of the second electrode 22, and one of the polarity of the first electrode 21 and the polarity of the second electrode 22 is a positive electrode and the other is a negative electrode. The LED light-emitting unit is of a pixel structure.

The substrate layer 10 in the first embodiment is made of one or more materials selected from epoxy, silica gel, and black ink, and carbon powder may be added to the epoxy and the silica gel to improve the contrast of the LED chip assembly. The first insulating layer 41 and the second insulating layer 42 are both SiO₂Or a SiN film. The first circuit 51 and the second circuit 52 may be transparent conductive circuit layers such as ITO, ZnO, silver nanowires, graphene, or may be circuit layers of metals such as copper, gold, nickel, or alloys thereof. The first electrode 21, the second electrode 22, the first conductive part 61, and the second conductive part 62 may be made of an alloy of copper, nickel, and gold, and the surface layer may be made of gold. Moreover, the LED light emitting sheet of the embodimentThe element is fixed on the transparent supporting layer 30, and then the first conductive part 61 and the second conductive part 62 are led out from the second insulating layer 42 by the processes of semiconductor deposition, photoetching and the like, so that the accuracy is higher.

As shown in fig. 1 to 5, in the first embodiment, N is 1, there is one LED light emitting unit, and there are 3 LED chips 20 in each LED light emitting unit; the number of the first circuit 51, the second circuit 52, and the first conductive part 61 is 3, and the number of the second conductive part 62 is 3. The 3 LED chips 20 are a red light chip, a green light chip, and a blue light chip in sequence.

Specifically, if the first electrode 21 is a positive electrode and the second electrode 22 is a negative electrode, the first ends of the 3 first circuits 51 are respectively connected to the positive electrodes of the 3 LED chips 20 in a one-to-one correspondence manner, the second end of each first circuit 51 is connected to one first conductive portion 61, the first ends of the 3 second circuits 52 are respectively connected to the negative electrodes of the 3 LED chips 20 in a one-to-one correspondence manner, and the second ends of the 3 second circuits 52 are connected in a converging manner and are connected to one second conductive portion 62. The second end confluence connections of the 3 second circuits 52 can form a common pole. Thus, the first circuit 51 and the second circuit 52 are convenient to connect and wire, and the arrangement mode of the LED chips 20 is more reasonable. If the first electrode 21 is a cathode and the second electrode 22 is an anode, the first ends of the 3 first circuits 51 are respectively connected with the cathodes of the 3 LED chips 20 in a one-to-one correspondence manner, the second end of each first circuit 51 is connected with a first conductive part 61, the first ends of the 3 second circuits 52 are respectively connected with the anodes of the 3 LED chips 20 in a one-to-one correspondence manner, and the second ends of the 3 second circuits 52 are converged and connected with a second conductive part 62. The second end confluence connections of the 3 second circuits 52 can form a common pole. Thus, the first circuit 51 and the second circuit 52 are convenient to connect and wire, and the arrangement mode of the LED chip 20 is more reasonable.

As shown in fig. 1 to 5, in the first embodiment, in order to more reasonably arrange three first conductive portions 61 and one second conductive portion 62 on the second insulating layer 42, the second insulating layer 42 has a rectangular structure, and the three first conductive portions 61 and the one second conductive portion 62 are respectively located at four corners of the rectangular structure.

As shown in fig. 1 to 5, in the first embodiment, the transparent support layer 30 is a functional film, and the functional film is one or more of a polarizing film, an anti-glare film and a high-transmittance film, wherein the light transmittance of the high-transmittance film is between 85% and 97%, and is preferably 85% or 89% or 93% or 97%. The special light-emitting effect of the LED chip component can be realized through the functional film. When the functional film is a polarizing film, the LED chip assemblies with polarized light can be realized, and the LED chip assemblies with different polarization directions are arranged in a spaced array, so that the LED display screen with the 3D function can be realized; when the functional film is an anti-glare film, an LED chip assembly with low reflectivity can be realized, wherein the reflectivity SCI is between 3% and 8%, and the reflectivity SCI is preferably 3% or 58% or 8%; when the functional film is a high-transmittance film, the LED chip assembly with high light transmittance can be realized. The thickness of the functional film is more than or equal to 20 μm, so that the functional film can be conveniently arranged into a single-layer film or a composite film and is beneficial to improving the luminous effect.

Specifically, when the functional film is a polarizing film, for example, a number 1 LED lighting unit is prepared by using a left polarizing film as a carrier film of one LED lighting unit, and a number 2 LED lighting unit is prepared by using a right polarizing film as a carrier film of another LED lighting unit, when an LED display device is prepared, the number 1 LED lighting unit and the number 2 LED lighting unit are respectively used as pixels of adjacent rows or adjacent columns, and then LED display screens with different polarization directions of the adjacent columns and the adjacent rows, that is, LED display screens with 3D effect can be realized.

As shown in fig. 1 to 5, in order to facilitate the adhesion of the base layer 10 to the functional film, the LED chip assembly further includes an adhesive layer 70 attached between the functional film and the base layer 10. The adhesive layer 70 is preferably a transparent UV glue or a thermosetting glue.

As shown in fig. 1 to 5, a first opening for accommodating the first circuit 51 and a second opening for accommodating the second circuit 52 are disposed on the first insulating layer 41. The anodes of the three RGB LED chips 20 are connected together through the first notch, and the remaining three cathodes of the LED chips 20 are independent, respectively, or vice versa. The second insulating layer 42 has a third opening for receiving the first conductive portion 61 and a fourth opening for receiving the second conductive portion 62. The third notch allows the first conductive portion 61 connected to the first circuit 51 to be led out from the third notch to the rear surface of the second insulating layer 42, and the fourth notch allows the second conductive portion 62 connected to the second circuit 52 to be led out from the fourth notch to the rear surface of the second insulating layer 42.

As shown in fig. 1 to 5, in order to facilitate the arrangement of the first insulating layer 41 on the rear surface of the base layer 10, the thickness of the base layer 10 is less than or equal to the thickness of the LED chip 20.

In the second embodiment of the LED chip assembly of the present application, the difference from the first embodiment of the LED chip assembly is the number of LED chip assemblies. As shown in fig. 1 and 6 to 9, in the second embodiment, N is 2, 2 LED lighting units are arranged left and right, and 3 LED chips 20 are provided for each LED lighting unit. The number of the first circuit 51, the second circuit 52, and the first conductive part 61 is 6, and the number of the second conductive part 62 is 2. The 3 LED chips 20 of each LED light emitting unit are a red chip, a green chip, and a blue chip in sequence. The center distance of the 2 red light chips is equal to the center distance of the 2 LED light-emitting units. The first electrode 21 and the second electrode 22 of the red chip of the left one LED lighting unit are arranged in a left-to-right direction in fig. 6, and the first electrode 21 and the second electrode 22 of the red chip of the left one LED lighting unit are also arranged in a left-to-right direction in fig. 6. Similarly, the first electrode 21 and the second electrode 22 of the green chip are arranged in the same manner as those of the red chip, and the first electrode 21 and the second electrode 22 of the blue chip are arranged in the same manner as those of the red chip.

As shown in fig. 1 and 6 to 9, if the first electrode 21 is a positive electrode and the second electrode 22 is a negative electrode, the first ends of the 6 first circuits 51 are respectively connected with the positive electrodes of the 6 LED chips 20 in a one-to-one correspondence manner, the second end of each first circuit 51 is connected with a first conductive part 61, the first ends of the 6 second circuits 52 are respectively connected with the negative electrodes of the 6 LED chips 20 in a one-to-one correspondence manner, the second ends of the 3 second circuits 52 of each LED light-emitting unit are connected in a converging manner and are connected with a second conductive part 62, and the second ends of the 3 second circuits 52 of each LED light-emitting unit are connected in a converging manner to form a common electrode. If the first electrode 21 is a negative electrode, and the second electrode 22 is a positive electrode, the first ends of the 6 first circuits 51 are respectively connected with the negative electrodes of the 6 LED chips 20 in a one-to-one correspondence manner, the second end of each first circuit 51 is connected with a first conductive part 61, the first ends of the 6 second circuits 52 are respectively connected with the positive electrodes of the 6 LED chips 20 in a one-to-one correspondence manner, the second ends of the 3 second circuits 52 of each LED light-emitting unit are connected in a converging manner and are connected with a second conductive part 62, and the second ends of the 3 second circuits 52 of each LED light-emitting unit are connected in a converging manner to form a common electrode. Thus, the first circuit 51 and the second circuit 52 are convenient to connect and wire, and the arrangement mode of the LED chip 20 is more reasonable.

In the second embodiment, the second insulating layer 42 has a rectangular structure, and six first conductive portions 61 and two second conductive portions 62 are located at four corners and a middle position of the rectangular structure, respectively.

In the embodiment not shown in the figure, the number of the LED light-emitting units is N, wherein N is a natural number and N is more than or equal to 3, and the number of the LED chips 20 of each LED light-emitting unit is three. The first circuit 51, the second circuit 52, and the first conductive part 61 are 3N in number. The number of the second conductive parts 62 is N, the first ends of the 3N first circuits 51 are respectively connected with the first electrodes 21 of the 3N LED chips 20 in a one-to-one correspondence manner, the second end of each first circuit 51 is connected with one first conductive part 61, the first ends of the 3N second circuits 52 are respectively connected with the second electrodes 22 of the 3N LED chips 20 in a one-to-one correspondence manner, the second ends of the three second circuits 52 of each LED light-emitting unit are connected in a converging manner and are connected with one second conductive part 62, wherein the second ends of the three second circuits 52 of each LED light-emitting unit are connected in a converging manner to form a common electrode.

As shown in fig. 1, 10 to 12, in the third embodiment of the LED chip assembly of the present application, the difference from the second embodiment of the LED chip assembly is the arrangement of the LED chips 20 of the two LED light emitting units. In the third embodiment, the number of the LED light emitting units is 2. The 2 LED chip assemblies are arranged left and right. The number of the LED chips 20 of each LED light emitting unit is 3, 2 LED light emitting units are arranged in pairs, and the two first electrodes 21 of two adjacent LED chips 20 are located between the two second electrodes 22. In the third embodiment, the first electrode 21 and the second electrode 22 of the LED chip assembly of the left one LED light emitting unit are arranged in the right-to-left direction in fig. 10. The first electrode 21 and the second electrode 22 of the LED chip assembly of the right one LED light emitting unit are arranged in the left-to-right direction in fig. 10.

As shown in fig. 1, 10 to 12, the 3 LED chips 20 of each LED light emitting unit are a red chip, a green chip, and a blue chip in sequence, and the 6 LED chips 20 include 2 red chips, 2 green chips, and 2 blue chips. The center distance of the 2 red light chips is equal to the center distance of the 2 LED light-emitting units. The two first electrodes 21 are located between the two second electrodes 22, wherein the two second electrodes 22 are the second electrode 22 of the red chip of the left LED light-emitting unit and the second electrode 22 of the red chip of the right LED light-emitting unit, respectively, and the two first electrodes 21 are the first electrode 21 of the red chip of the left LED light-emitting unit and the first electrode 21 of the red chip of the right LED light-emitting unit, respectively. Similarly, the first electrode 21 and the second electrode 22 of the green chip are arranged in the same manner as those of the red chip, and the first electrode 21 and the second electrode 22 of the green chip are arranged in the same manner as those of the red chip.

As shown in fig. 1, 10 to 12, each of the first circuit 51 and the second circuit 52 has 6 pieces. If the first electrode 21 is a negative electrode and the second electrode 22 is a positive electrode, the number of the first conductive parts 61 is 3, the number of the second conductive parts 62 is 2, and the first ends of the 6 first circuits 51 are respectively connected to the first electrodes 21 of the 6 LED chips 20 in a one-to-one correspondence manner. The second ends of two adjacent first circuits 51 are connected in confluence and are connected to one first conductive part 61, the first ends of 6 second circuits 52 are respectively connected to the second electrodes 22 of 6 LED chips 20 in one-to-one correspondence, and the second ends of 3 second circuits 52 of each LED light emitting unit are connected in confluence and are connected to one second conductive part 62. The second end confluence connections of the 3 first circuits 51 of each LED lighting unit can form a common pole, and the second end confluence connections of the 3 second circuits 52 of each LED lighting unit can form a common pole. Thus, the first circuit 51 and the second circuit 52 are convenient to connect and wire, and the arrangement mode of the LED chip 20 is more reasonable.

In the third embodiment, the second insulating layer 42 has a rectangular structure, and 3 first conductive portions 61 and 2 second conductive portions 62 are located at three corners and an intermediate position of the rectangular structure.

In the fourth embodiment of the LED chip assembly of the present application, the difference from the third embodiment of the LED chip assembly is the number of LED light emitting units. As shown in fig. 1 and 13 to 15, in the fourth embodiment, there are 4 LED lighting units. The 2 LED light-emitting units are arranged left and right to form a first group, and the 2 LED light-emitting units are arranged left and right to form a second group which is positioned below the first group. The number of the LED light emitting units is 4, the number of the LED chips 20 of each LED light emitting unit is three, the 4 LED light emitting units are arranged in pairs, and the two first electrodes 21 of the two LED chips 20 arranged adjacently in each pair of LED light emitting units are located between the two second electrodes 22. The 3 LED chips 20 of each LED light-emitting unit are a red light chip, a green light chip and a blue light chip in sequence, and the 6 LED chips 20 comprise 2 red light chips, 2 green light chips and 2 blue light chips. The center distance of every left and right 2 red light chips is equal to the center distance of 2 LED light-emitting units. The two first electrodes 21 are located between the two second electrodes 22, wherein the two second electrodes 22 are the second electrode 22 of the red chip of the left LED light-emitting unit and the second electrode 22 of the red chip of the right LED light-emitting unit, respectively, and the two first electrodes 21 are the first electrode 21 of the red chip of the left LED light-emitting unit and the first electrode 21 of the red chip of the right LED light-emitting unit, respectively. Similarly, the first electrode 21 and the second electrode 22 of the green chip are arranged in the same manner as those of the red chip, and the first electrode 21 and the second electrode 22 of the green chip are arranged in the same manner as those of the red chip.

As shown in fig. 1 and fig. 13 to fig. 15, each of the first circuits 51 and the second circuits 52 is 12, the number of the first conductive parts 61 is 6, the number of the second conductive parts 62 is 2, the first ends of the 12 first circuits 51 are respectively connected to the first electrodes 21 of the 12 LED chips 20 in a one-to-one correspondence manner, the second ends of the 6 first circuits 51 of the two LED light emitting units in each group are connected to one first conductive part 61 after being merged two by two, the first ends of the 12 second circuits 52 are respectively connected to the second electrodes 22 of the 12 LED chips 20 in a one-to-one correspondence manner, and the second ends of the 6 second circuits 52 (the 6 second circuits 52 on the left side or the 6 second circuits 52 on the right side in fig. 14) of the LED light emitting units in the same column (arranged up and down in fig. 13) are merged and connected to one second conductive part 62. The second end merged connections of the two first circuits 51 may form a common pole, and the second end merged connections of the 6 second circuits 52 may form a common pole. Thus, the first circuit 51 and the second circuit 52 are convenient to connect and wire, and the arrangement mode of the LED chip 20 is more reasonable.

In the fourth embodiment, the second insulating layer 42 has a rectangular structure. The 6 first conductive portions 61 and the 2 second conductive portions 62 are located at four corners and a middle position of the rectangular structure.

In the embodiment not shown in the figure, the number of the LED light-emitting units is 2N, wherein N is more than or equal to 3. The LED chips 20 of each LED lighting unit are three, 2N LED lighting units are arranged in pairs, and the two first electrodes 21 of the two LED chips 20 arranged adjacently in each pair of LED lighting units are located between the two second electrodes 22. The number of the first circuits 51 and the number of the second circuits 52 are 6N, the number of the first conductive parts 61 is 3N, the number of the second conductive parts 62 is 2, first ends of the 6N first circuits 51 are respectively connected with the first electrodes 21 of the 6N LED chips 20 in a one-to-one correspondence manner, second ends of two adjacent first circuits 51 in the 3N first circuits 51 are connected in a confluence manner and connected with one first conductive part 61, first ends of the 6N second circuits 52 are respectively connected with the second electrodes 22 of the 6N LED chips 20 in a one-to-one correspondence manner, and second ends of the 3N second circuits 52 of the LED light emitting units located in the same column are connected in a confluence manner and connected with one second conductive part 62. The second end junction connection of the first circuit 51 can form a common pole and the second end junction connection of the second circuit 52 can form a common pole.

The application also provides an LED display device, the LED display device of the embodiment comprises one or more LED chip components, and the LED chip components are the LED chip components. Due to the fact that the LED chip assembly can solve the problem that the line width and the line distance of the preset line on the circuit board in the related technology cannot meet the connection requirements of the LED chip, the LED display device comprising the LED chip assembly can solve the same technical problem.

The application also provides a processing method of the LED chip assembly, which is used for processing the LED chip assembly. As shown in fig. 1 to 5, the method for processing the LED chip assembly includes the steps of:

obtaining a transparent support layer 30;

fixing the LED light-emitting unit on the transparent support layer 30, and enabling a light-emitting surface 23 of an LED chip 20 of the LED light-emitting unit to face the transparent support layer 30;

arranging a base layer 10 around the LED light-emitting unit, and exposing a first electrode 21 and a second electrode 22 of the LED chip 20 to the surface of the base layer 10 far away from the transparent supporting layer 30;

covering the surface of the base layer 10 far away from the transparent support layer 30 with a first insulating layer 41, and exposing a first circuit 51 connected with the first electrode 21 and a second circuit 52 connected with the second electrode 22 to the surface of the first insulating layer 41 far away from the base layer 10;

the second insulating layer 42 covers the surface of the first insulating layer 41 away from the base layer 10, and the first conductive part 61 connected to the first electrode 21 and the second conductive part 62 connected to the second circuit 52 are exposed on the surface of the second insulating layer 42 away from the first insulating layer 41.

In this way, the first circuit 51 connected between the first conductive portion 61 and the first electrode 21 and the second circuit 52 connected between the second conductive portion 62 and the second electrode 22 are integrated inside the LED chip assembly, and the first insulating layer 41 can isolate the first circuit 51 and the second circuit 52 from each other and prevent short circuit, and the second insulating layer 42 can isolate not only the first conductive portion 61 and the second conductive portion 62 but also the first conductive portion 61 and the second circuit 52 and the second conductive portion 62 from the first circuit 51 and prevent short circuit. Thus, in the technical scheme of the embodiment, the first conductive part 61, the second conductive part 62, the first circuit 51 and the second circuit 52 are integrated on one LED chip assembly, and a circuit board with a preset circuit in the related art is not required, so that the connection requirement with the LED chip 20 can be met, the packaging and mounting requirements of the smaller LED chip 20 can be realized, and the use requirements of the smaller LED chip 20 and the smaller LED lamp bead can be met. Therefore, the technical solution of the embodiment can solve the problem that the line width and the line distance of the preset line on the circuit board in the related art cannot meet the connection requirement with the LED chip 20.

As shown in fig. 1 to 5, after the step of obtaining the transparent support layer 30, the processing method further comprises the steps of: an adhesive layer 70 is coated on the surface of the transparent support layer 30. In this way, the LED light emitting unit can be adhered to the transparent support layer 30 by the adhesive layer 70.

As shown in fig. 1 to 5, the step of fixing the LED light emitting unit on the transparent support layer 30 with the light emitting surface 23 of the LED chip 20 of the LED light emitting unit facing the transparent support layer 30 includes: the temporary substrate with the LED lighting units is stacked with the transparent support layer 30 to fix the LED lighting units on the surface of the transparent support layer 30 facing the temporary substrate, and the temporary substrate is removed. The provision of the temporary substrate facilitates the positioning of the LED lighting units so that the LED lighting units can be quickly and accurately fixed on the surface of the transparent support layer 30 facing the temporary substrate.

In this embodiment, the method for processing the LED chip assembly specifically includes the following steps:

1. taking a hard substrate which is made of transparent materials with small thermal expansion and contraction such as glass, quartz stone, sapphire and the like, and etching alignment marks in a circular shape, a square shape or other shapes on at least three of four corners of the substrate by using laser; the substrate is printed with a layer of UV debonding glue and serves as a supporting plate for the subsequent processing of the LED light-emitting unit;

2. adhering a functional film on a substrate, and arranging an adhesive layer on the functional film in a printing, spin-coating or other modes;

3. taking a temporary substrate, arranging RGB LED chips 20 of LED light-emitting units on the temporary substrate, wherein the positions of the LED chips 20 on the temporary substrate are that a first electrode 21 and a second electrode 22 face the temporary substrate, and the temporary substrate is also provided with an alignment mark;

4. superposing the temporary substrate and a transparent support layer 30 to perform position confirmation with a position mark, combining the LED chip 20 with the functional film through an adhesive, and performing thermal curing at a temperature of 120-200 ℃ for 30 minutes to 2 hours;

5. arranging a base layer 10 on the LED chip 20 by using the modes of molding, dispensing, spraying and the like, wherein the thickness of the base layer 10 is less than or equal to that of the LED;

6. depositing a layer of insulating film 1 on the upper surfaces of the isolation adhesive and the LED by adopting a CVD (chemical vapor deposition) process, wherein the thickness of the insulating film 1 is preferably 20 nm-1 mu m;

7. by adopting a photoetching process, three first notches and three second notches are arranged on the first insulating layer 41, the first notches correspond to the anode of the LED chip 20, and the second notches correspond to the cathode of the LED chip 20;

8. depositing a metal layer on the first insulating layer 41, and forming a first circuit 51 and a second circuit 52 by using the processes of photolithography, corrosion and the like;

9. depositing a second insulating layer 42 on the upper surface of the first insulating layer 41 by using a CVD (chemical vapor deposition) process, wherein the thickness of the second insulating layer 42 is 20 nm-1 mu m;

10. by adopting a photoetching process, three third gaps and a fourth gap are arranged on the second insulating layer 42, wherein the three third gaps correspond to three mutually independent first lines, and the fourth gap corresponds to the second circuit 52 in confluence connection;

11. depositing a metal layer on the second insulating layer 42, and forming three first conductive portions 61 and one second conductive portion 62 by using the processes of photolithography, corrosion, and the like;

12. cutting according to the preset size of the LED display assembly, irradiating the substrate from the side far away from the second insulating layer 42 by adopting UV light, and removing the viscosity between the substrate and the functional film so as to obtain the discrete LED chip assembly.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the orientation words such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of description, and in the case of not making a contrary explanation, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be interpreted as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

Spatially relative terms, such as "above … …," "above … …," "above … … surface," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and if not stated otherwise, the terms have no special meaning, and therefore, the scope of the present invention should not be construed as being limited.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. An LED chip assembly, comprising:

a substrate layer (10);

the LED light-emitting unit is arranged in the base layer (10) and comprises an LED chip (20), a light-emitting surface (23) of the LED chip (20) is exposed out of the front surface of the base layer (10), and a first electrode (21) and a second electrode (22) of the LED chip (20) are exposed out of the rear surface of the base layer (10);

a transparent support layer (30) that is provided on the front side of the base layer (10) and covers the light-emitting surface (23) of the LED chip (20);

a first insulating layer (41) provided on the rear side of the base layer (10), wherein a first circuit (51) connected to the first electrode (21) of the LED chip (20) and a second circuit (52) connected to the second electrode (22) of the LED chip (20) are provided in the first insulating layer (41);

the second insulating layer (42) is arranged on the rear side of the first insulating layer (41), a first conductive part (61) in conductive connection with the first circuit (51) and a second conductive part (62) in conductive connection with the second circuit (52) are arranged in the second insulating layer (42), and the first conductive part (61) and the second conductive part (62) are exposed out of the rear surface of the second insulating layer (42).

2. The LED chip assembly of claim 1,

the number of the LED light-emitting units is N, and the number of the LED chips (20) of each LED light-emitting unit is three, wherein N is a natural number and is more than or equal to 1;

the number of the first circuits (51), the number of the second circuits (52) and the number of the first conductive parts (61) are 3N, the number of the second conductive parts (62) is N, the first ends of the 3N first circuits (51) are respectively connected with the first electrodes (21) of the 3N LED chips (20) in a one-to-one correspondence manner, the second end of each first circuit (51) is connected with one first conductive part (61), the first ends of the 3N second circuits (52) are respectively connected with the second electrodes (22) of the 3N LED chips (20) in a one-to-one correspondence manner, and the second ends of the three second circuits (52) corresponding to the same LED light-emitting unit are connected and converged with one second conductive part (62).

3. The LED chip assembly of claim 1, wherein said second insulating layer (42) has a rectangular configuration, and when N is 1, three of said first conductive portions (61) and one of said second conductive portions (62) are located at four corners of said rectangular configuration, respectively.

4. The LED chip assembly of claim 1,

the number of the LED light-emitting units is 2N, the number of the LED chips (20) of each LED light-emitting unit is three, the 2N LED light-emitting units are arranged in pairs, two first electrodes (21) of two adjacent LED chips (20) in each pair of the LED light-emitting units are positioned between two second electrodes (22), wherein N is a natural number and is more than or equal to 1;

the number of the first circuits (51) and the number of the second circuits (52) are 6N, the number of the first conductive parts (61) is 3N, the number of the second conductive parts (62) is two, the first ends of the 6N first circuits (51) are respectively connected with the first electrodes (21) of the 6N LED chips (20) in a one-to-one correspondence manner, the second ends of the two adjacent first circuits (51) are connected in a converging manner and are connected with one first conductive part (61), the first ends of the 6N second circuits (52) are respectively connected with the second electrodes (22) of the 6N LED chips (20) in a one-to-one correspondence manner, and the second ends of the second circuits (52) of the LED light-emitting units positioned in the same column are connected in a converging manner and are connected with one second conductive part (62).

5. The LED chip assembly of claim 1, wherein the transparent support layer (30) and the substrate layer (10) are functional films, the functional films are one or more of a polarizing film, an anti-glare film and a high-transmittance film, and the high-transmittance film has a light transmittance of 85% to 97%.

6. LED chip assembly according to claim 5, characterized in that it further comprises an adhesive layer (70) connected between the functional film and the base layer (10).

7. LED chip assembly according to claim 1, characterized in that a first indentation accommodating the first circuitry (51) and a second indentation accommodating the second circuitry (52) are provided on the first insulating layer (41).

8. The LED chip assembly of claim 1, wherein said second insulating layer (42) is provided with a third indentation for receiving said first conductive portion (61) and a fourth indentation for receiving said second conductive portion (62).

9. LED chip assembly according to claim 1, characterized in that the thickness of the base layer (10) is smaller than or equal to the thickness of the LED chip (20).

10. An LED display device comprising one or more LED chip assemblies, wherein the LED chip assembly is the LED chip assembly of any one of claims 1 to 9.

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