CN101937926A - Packaging structure of OLED (Organic Light Emitting Diode) display device - Google Patents
Packaging structure of OLED (Organic Light Emitting Diode) display device Download PDFInfo
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- CN101937926A CN101937926A CN 201010275430 CN201010275430A CN101937926A CN 101937926 A CN101937926 A CN 101937926A CN 201010275430 CN201010275430 CN 201010275430 CN 201010275430 A CN201010275430 A CN 201010275430A CN 101937926 A CN101937926 A CN 101937926A
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Abstract
The invention relates to a packaging structure of an OLED (Organic Light Emitting Diode) display device, which comprises a packaging cover board, UV resin and a base board, wherein the UV resin is positioned between the packaging cover board and the base board and is used for sticking the packaging cover board and the base board; the packaging cover board, the UV resin and the base board form a close cavity; an organic light emitting layer and drying agents are positioned in the close cavity and are respectively cemented on the base board and the packaging cover board; and an auxiliary electrode is connected with a positive pole layer and a negative pole layer, and extends to the close cavity. The packaging structure of an OLED (Organic Light Emitting Diode) display device is characterized in that the lower part of the packaging cover board is provided with a groove; light proof metallic membrances are arranged in the groove; and each membrance just covers the organic light emitting layer of an OLED display device and exposes the UV resin on the periphery of the organic light emitting layer. The invention has the advantages that not only the working efficiency is improved, but also the pollution to a vacuum cavity is avoided, and the line yield is improved. At the same time, packaging covers do not need separating after finishing packaging, and the technical process is simplified.
Description
Technical field
The present invention relates to the OLED display device, relate in particular to the encapsulating structure of OLED display device.
Background technology
Each independent O light-emitting diode display, as shown in Figure 1, mainly comprise encapsulation cover plate (EncapsulationCap) 1, UV resin (UV Resin) 2 and substrate (Substrate) 3, UV resin 2 is used for encapsulation cover plate 1 and substrate 3 are bonded together between encapsulation cover plate 1 and substrate 3, so just by encapsulation cover plate 1, UV resin 2 and substrate 3 form a closed cavity 8, closed cavity is hedged off from the outer world and can prevents that moisture and oxygen from entering its inside, organic luminous layer 5 and drier 4 are positioned at closed cavity 8 and are fitted in respectively on substrate 3 and the encapsulation cover plate 1, anode layer (among Fig. 1 show) is connected with organic luminous layer 5 and is connected with auxiliary electrode 6 to be drawn by it and extends to outside the closed cavity 8, among Fig. 1, though omitted anode layer and cathode layer etc., it only is to draw and representation language in order to simplify that but the one of ordinary skilled in the art should be able to recognize this omission, can't have influence on the correct understanding of technical staff to technical scheme, in diagram, each layer of not drawing or describing, be that those of ordinary skills are known, on narration one deck is positioned at substrate or another layer or under the time, this layer can be located immediately on substrate or another layer, or also can have other known intermediate layer of those of ordinary skills therebetween, among the present invention in other drawing, do not declare especially, all have situation identical among Fig. 1.Encapsulation cover plate 1 material generally adopts glass; UV resin 2 is generally used ultra-violet curing glue; Drier 4 is used for absorbing the moisture and the oxygen of closed cavity 8 inside, generally uses materials such as CaO and BaO; Organic luminous layer 5 generally is made of hole injection layer, hole transmission layer, luminescent layer (red, green, blue), electron transfer layer, electron injecting layer, be clipped between anode layer and the cathode layer, utilize electronics and hole compound carry out luminous, be the core part of OLED display, material is generally used electroluminescent organic material.Auxiliary electrode 6 mainly plays electric actions, is used for connecting anode layer and the cathode layer of OLED, generally uses metal materials such as molybdenum/aluminium/molybdenum, chromium.
In the commercial process, the making of OLED display normally forms several and is the OLED display of M * N (M, N are natural number) arranged on one big encapsulation cover plate 1, wait to finish these are the encapsulation of OLED display of arranged after, be cut into M * N independent O light-emitting diode display.
Before cutting, substrate 3, organic luminous layer 5, the encapsulation cover plate 1 of OLED display need be bonded together by UV resin 2, and in the closed cavity 8 that substrate 3 and encapsulation cover plate 1 forms applying drier 4, the auxiliary electrode 6 that setting simultaneously and anode layer are connected with cathode layer and anode layer and cathode layer drawn extends to outside the closed cavity 8.In encapsulation process, solidify in order to make UV resin 2, need to use UV light irradiation UV resin 2, but the irradiation of UV lamp can damage organic luminous layer 5, for fear of when UV resin 2 solidifies, the UV light irradiation need take measures to avoid the UV light irradiation to organic luminous layer 5 to organic luminous layer 5.
Existing method is to adopt the protection mask plate in the encapsulation process of OLED display.As shown in Figure 1; protection mask plate 7 is made up of quartz material usually; because crome metal has good blocking effect to UV light; thereby utilize on the protection mask plate and be coated with lighttight metal film 71 and stop of the irradiation of UV light organic luminous layer 5; the material preferred chromium of metal film 71; protect simultaneously the purpose of organic luminous layer 5 again in order to reach UV curing resin 2; the matrix of M * N is mated and be arranged in to the size of the organic luminous layer 5 of the size of metal film 71 and OLED display; each metal film 71 can shelter from the organic luminous layer 5 of an OLED display just and expose and be positioned at organic luminous layer 5 UV resin 2 all around, just can prevent that the UV light irradiation is to organic luminous layer 5 like this when using UV light irradiation UV resin 2.Employing protection mask plate 7 comes the detailed process that the OLED display encapsulates: the vacuum chamber of putting into sealed in unit by photo-mask process, the ready-made OLED display screen substrate 3 of evaporation operation earlier; In being full of the glove box of nitrogen, groove around the encapsulation cover plate 1 is smeared UV resin 2 then, then drier 4 is attached on the encapsulation cover plate 1, will smear the encapsulation cover plate 1 of UV resin 2 then and also send in the vacuum chamber of sealed in unit; In vacuum chamber to operate under 1 atmospheric condition; utilize servomechanism that substrate 3 and the encapsulation cover plate 1 of OLED are carried out contraposition; after finishing, contraposition utilize servomechanism will protect mask plate 7 and encapsulation cover plate 1 to be adjacent to; open the UV light irradiation and carry out the curing of UV resin 2; utilize servomechanism will protect mask plate 7 to separate after finishing, utilize manipulator to take out packaged OLED display automatically.
But, when changing the model of OLED display screen, just must change the protection mask plate 7 of different model this moment owing in the industrial processes, often need to produce the OLED display screen of different size.Therefore; there is following shortcoming in the technology that existing utilization protection mask plate carries out the encapsulation of OLED display: 1. when changing the protection mask plate; must open the vacuum chamber of sealed in unit; the activity duration of changing the protection mask plate this moment needed about half an hour; also can cause the pollution of vacuum chamber simultaneously; after replacing is finished, reach stable environment again, also need about 24 hours in order to make vacuum chamber.2. after encapsulation is finished, also need to separate the protection mask plate, at this moment operating personnel tend to cause the damage of protection mask plate when carrying out detached job, because the protection mask plate involves great expense, have increased production cost.
Summary of the invention
The objective of the invention is to have proposed the encapsulating structure of OLED display device in order to overcome the deficiency of the technology that existing utilization protection mask plate encapsulates the OLED display.
The technical solution used in the present invention is: the encapsulating structure of OLED display device, comprise encapsulation cover plate, UV resin and substrate, the UV resin is used between encapsulation cover plate and substrate encapsulation cover plate and substrate bonding, encapsulation cover plate, UV resin and substrate form a closed cavity, organic luminous layer and drier are positioned at closed cavity and are fitted in respectively on substrate and the encapsulation cover plate, auxiliary electrode is connected with cathode layer with anode layer and extends to outside the closed cavity, it is characterized in that, the groove that the below of described encapsulation cover plate has, have lighttight metal film in the described groove, each metal film can shelter from the organic luminous layer of an OLED display just and expose and be positioned at organic luminous layer UV resin all around.
The invention has the beneficial effects as follows: because the present invention replaces the protection mask plate that uses by form lighttight metal film on the encapsulation cover plate of OLED display self in encapsulation process, thereby its specific embodiment is to put into the vacuum chamber of sealed in unit earlier by the substrate of photo-mask process, the ready-made OLED display of evaporation operation; Adopt the encapsulation cover plate of metal-plated membrane, put it in the glove box that is full of nitrogen, groove around the encapsulation cover plate is smeared the UV resin, then drier is attached on the encapsulation cover plate, will smear the encapsulation cover plate of UV resin then and also send in the vacuum chamber of sealed in unit; In vacuum chamber,, utilize servomechanism that oled substrate and packaged glass are carried out contraposition, open the curing that the UV light irradiation carries out the UV resin, utilize manipulator to take out packaged oled substrate automatically after finishing to operate under 1 atmospheric condition.Like this, when changing the model of OLED display if desired, it is just passable directly to change encapsulation cover plate outside vacuum chamber, just needn't open vacuum chamber, has both improved operating efficiency, and the pollution of also avoiding to vacuum chamber has improved yields.Simultaneously, after encapsulation is finished, do not need encapsulation cover plate is separated yet, simplified process.
Description of drawings
Fig. 1 is the encapsulating structure schematic diagram of existing OLED display device.
Fig. 2 is the encapsulating structure schematic diagram of OLED display of the present invention.
Fig. 3 is the planar structure schematic diagram of encapsulation cover plate of the encapsulating structure of OLED display of the present invention.
Fig. 4 is the schematic cross-section of encapsulation cover plate of the encapsulating structure of OLED display of the present invention.
Description of reference numerals: encapsulation cover plate 1, metal film 11, groove 12, UV resin 2, substrate 3, drier 4, organic luminous layer 5, auxiliary electrode 6, protection mask plate 7, closed cavity 8.
Embodiment
The invention will be further described below in conjunction with the drawings and specific embodiments.
As shown in Figures 2 and 3, the encapsulating structure of OLED display device, comprise encapsulation cover plate 1, UV resin 2 and substrate 3, UV resin 2 is used for encapsulation cover plate 1 and substrate 3 are bonded together between encapsulation cover plate 1 and substrate 3, encapsulation cover plate 1, UV resin 2 and substrate 3 form a closed cavity 8, organic luminous layer 5 and drier 4 are positioned at closed cavity 8 and are fitted in respectively on substrate 3 and the encapsulation cover plate 1, auxiliary electrode 6 is connected with cathode layer with anode layer and extends to outside the closed cavity 8, the below of described encapsulation cover plate 1 has groove 12, has lighttight metal film 11 in the described groove 12, the material preferred chromium of metal film 11, each metal film 11 can shelter from the organic luminous layer 5 of an OLED display just and expose and be positioned at organic luminous layer 5 UV resin 2 all around, like this, metal film 11 is positioned at outside the closed cavity 8, more near the ultraviolet irradiation light source, better shielding of ultraviolet.
Said structure is an encapsulation unit after cutting, and in fact, before cutting, several encapsulation units are M * N (M, N are natural number) arranged, accordingly, encapsulation cover plate 1 is also corresponding is M * N arranged, as shown in Figure 3 and Figure 4, among the figure, M is 4, and N is 8.
The manufacture method of above-mentioned encapsulation cover plate 1 is:
1) adopt etching or fine frosted (Micro Sanding) to wait any one feasible pattern on smooth encapsulation cover plate 1, to make groove 12;
2) utilize sputter or hot evaporation process to plate layer of metal chromium in the one side with groove 12 of encapsulation cover plate 1;
3) utilize the photoetching principle that crome metal is etched into arranged structure as shown in Figure 3; Use spin coating method to plate one deck photoresist, after overexposure, developing process, adopt etching to eliminate, form the metal film 11 that is the arranged structure as shown in Figure 3 inessential part to photoresist on the surface of crome metal;
4) encapsulation cover plate 1 after completing in the step 3) is put in the OLED display device packaging technology, the OLED display device that is used to complete, the encapsulation unit after encapsulation is finished and cut is as shown in Figure 2.
The foregoing description is the scheme of PMOLED, and is same, and the present invention also is useful for AMOLED, and its structure is identical with present embodiment, so be not described in detail.
Those of ordinary skill in the art will appreciate that embodiment described here is in order to help reader understanding's principle of the present invention, should to be understood that protection scope of the present invention is not limited to such special statement and embodiment.Those of ordinary skill in the art can make various other various concrete distortion and combinations that do not break away from essence of the present invention according to these technology enlightenments disclosed by the invention, and these distortion and combination are still in protection scope of the present invention.
Claims (1)
1.OLED the encapsulating structure of display device, comprise encapsulation cover plate, UV resin and substrate, the UV resin is used between encapsulation cover plate and substrate encapsulation cover plate and substrate bonding, encapsulation cover plate, UV resin and substrate form a closed cavity, organic luminous layer and drier are positioned at closed cavity and are fitted in respectively on substrate and the encapsulation cover plate, auxiliary electrode is connected with cathode layer with anode layer and extends to outside the closed cavity, it is characterized in that, there is the groove that is arranged the below of described encapsulation cover plate, have lighttight metal film in the described groove, each metal film can shelter from the organic luminous layer of an OLED display just and expose and be positioned at organic luminous layer UV resin all around.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010275430 CN101937926A (en) | 2010-09-08 | 2010-09-08 | Packaging structure of OLED (Organic Light Emitting Diode) display device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201010275430 CN101937926A (en) | 2010-09-08 | 2010-09-08 | Packaging structure of OLED (Organic Light Emitting Diode) display device |
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| CN101937926A true CN101937926A (en) | 2011-01-05 |
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| CN 201010275430 Pending CN101937926A (en) | 2010-09-08 | 2010-09-08 | Packaging structure of OLED (Organic Light Emitting Diode) display device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102881825A (en) * | 2012-09-28 | 2013-01-16 | 京东方科技集团股份有限公司 | Packaging device and method for packaging organic optoelectronic device |
| CN105098092A (en) * | 2015-06-17 | 2015-11-25 | 京东方科技集团股份有限公司 | Packaging method, display panel and display device |
| CN106848090A (en) * | 2016-12-26 | 2017-06-13 | 武汉华星光电技术有限公司 | A kind of method for packing of OLED display panel and OLED display panel |
| WO2020020176A1 (en) * | 2018-07-25 | 2020-01-30 | 深圳Tcl新技术有限公司 | Led display screen and manufacturing method therefor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101154679A (en) * | 2002-10-16 | 2008-04-02 | 株式会社日立制作所 | Display device |
| CN201812824U (en) * | 2010-09-08 | 2011-04-27 | 四川虹视显示技术有限公司 | Packaging structure of organic light-emitting diode (OLED) display device |
-
2010
- 2010-09-08 CN CN 201010275430 patent/CN101937926A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101154679A (en) * | 2002-10-16 | 2008-04-02 | 株式会社日立制作所 | Display device |
| CN201812824U (en) * | 2010-09-08 | 2011-04-27 | 四川虹视显示技术有限公司 | Packaging structure of organic light-emitting diode (OLED) display device |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102881825A (en) * | 2012-09-28 | 2013-01-16 | 京东方科技集团股份有限公司 | Packaging device and method for packaging organic optoelectronic device |
| CN102881825B (en) * | 2012-09-28 | 2015-08-05 | 京东方科技集团股份有限公司 | A kind of method of packaging system and encapsulation organic optoelectronic device |
| CN105098092A (en) * | 2015-06-17 | 2015-11-25 | 京东方科技集团股份有限公司 | Packaging method, display panel and display device |
| WO2016202031A1 (en) * | 2015-06-17 | 2016-12-22 | 京东方科技集团股份有限公司 | Packaging method, display panel and display device |
| CN105098092B (en) * | 2015-06-17 | 2017-11-17 | 京东方科技集团股份有限公司 | Method for packing, display panel and display device |
| US10008696B2 (en) | 2015-06-17 | 2018-06-26 | Boe Technology Group Co., Ltd. | Packaging method, display panel and display device |
| CN106848090A (en) * | 2016-12-26 | 2017-06-13 | 武汉华星光电技术有限公司 | A kind of method for packing of OLED display panel and OLED display panel |
| CN106848090B (en) * | 2016-12-26 | 2018-06-19 | 武汉华星光电技术有限公司 | A kind of packaging method of OLED display panel and OLED display panel |
| WO2020020176A1 (en) * | 2018-07-25 | 2020-01-30 | 深圳Tcl新技术有限公司 | Led display screen and manufacturing method therefor |
| US11769786B2 (en) | 2018-07-25 | 2023-09-26 | Shenzhen Tcl New Technology Co., Ltd. | LED display screen and manufacturing method therefor |
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Application publication date: 20110105 |