CN110753193B - 图像传感器 - Google Patents

图像传感器 Download PDF

Info

Publication number
CN110753193B
CN110753193B CN201910526394.7A CN201910526394A CN110753193B CN 110753193 B CN110753193 B CN 110753193B CN 201910526394 A CN201910526394 A CN 201910526394A CN 110753193 B CN110753193 B CN 110753193B
Authority
CN
China
Prior art keywords
pixel
pixels
photodiodes
photodiode
image sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201910526394.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN110753193A (zh
Inventor
李景镐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of CN110753193A publication Critical patent/CN110753193A/zh
Application granted granted Critical
Publication of CN110753193B publication Critical patent/CN110753193B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/18Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/182Colour image sensors
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/802Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/813Electronic components shared by multiple pixels, e.g. one amplifier shared by two pixels
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/50Control of the SSIS exposure
    • H04N25/57Control of the dynamic range
    • H04N25/59Control of the dynamic range by controlling the amount of charge storable in the pixel, e.g. modification of the charge conversion ratio of the floating node capacitance
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/78Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/79Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/18Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/802Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
    • H10F39/8027Geometry of the photosensitive area
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/803Pixels having integrated switching, control, storage or amplification elements
    • H10F39/8037Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/807Pixel isolation structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/811Interconnections
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/199Back-illuminated image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/803Pixels having integrated switching, control, storage or amplification elements
    • H10F39/8033Photosensitive area
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/805Coatings
    • H10F39/8053Colour filters
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/806Optical elements or arrangements associated with the image sensors
    • H10F39/8063Microlenses

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
CN201910526394.7A 2018-07-23 2019-06-18 图像传感器 Active CN110753193B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2018-0085245 2018-07-23
KR1020180085245A KR102614851B1 (ko) 2018-07-23 2018-07-23 이미지 센서

Publications (2)

Publication Number Publication Date
CN110753193A CN110753193A (zh) 2020-02-04
CN110753193B true CN110753193B (zh) 2024-04-12

Family

ID=69161340

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910526394.7A Active CN110753193B (zh) 2018-07-23 2019-06-18 图像传感器

Country Status (4)

Country Link
US (4) US11094735B2 (https=)
JP (1) JP7403972B2 (https=)
KR (1) KR102614851B1 (https=)
CN (1) CN110753193B (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019140528A (ja) * 2018-02-09 2019-08-22 ソニーセミコンダクタソリューションズ株式会社 撮像装置、及び電子機器
KR102614851B1 (ko) 2018-07-23 2023-12-19 삼성전자주식회사 이미지 센서
KR102885349B1 (ko) * 2019-11-05 2025-11-14 삼성전자주식회사 이미지 센서
KR102902358B1 (ko) * 2019-11-20 2025-12-22 기가조트 테크널러지 인코포레이티드 스케일러블 픽셀 크기 이미지센서
KR102831295B1 (ko) * 2020-07-10 2025-07-07 삼성전자주식회사 이미지 센서
KR20220019895A (ko) * 2020-08-10 2022-02-18 삼성전자주식회사 이미지 센서
EP4270934B1 (en) 2021-02-10 2026-04-01 Samsung Electronics Co., Ltd. Electronic device comprising image sensor and method of operating same
KR102828215B1 (ko) * 2021-03-22 2025-07-04 삼성전자주식회사 이미지 센서
JP7797785B2 (ja) * 2021-05-17 2026-01-14 株式会社ニコン 撮像素子、及び、撮像装置
US12101554B2 (en) * 2021-11-26 2024-09-24 Samsung Electronics Co., Ltd. Method and apparatus for performing autofocusing using summed signals
US11979675B2 (en) * 2022-04-25 2024-05-07 Sony Semiconductor Solutions Corporation Image sensing device with event based vision sensor pixels and imaging pixels
US20250275278A1 (en) * 2024-02-27 2025-08-28 Taiwan Semiconductor Manufacturing Company, Ltd. Image sensing structure and manufacturing method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102625053A (zh) * 2011-01-31 2012-08-01 佳能株式会社 固态图像传感器和照相机
CN105763819A (zh) * 2015-01-05 2016-07-13 佳能株式会社 图像传感器和摄像设备
CN106158897A (zh) * 2011-10-11 2016-11-23 索尼公司 固态成像器件和电子设备
JP2017184181A (ja) * 2016-03-31 2017-10-05 キヤノン株式会社 撮像素子
CN108141549A (zh) * 2015-11-16 2018-06-08 三星电子株式会社 图像传感器和具有图像传感器的电子设备

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8059174B2 (en) 2006-05-31 2011-11-15 Ess Technology, Inc. CMOS imager system with interleaved readout for providing an image with increased dynamic range
JP5300414B2 (ja) 2008-10-30 2013-09-25 キヤノン株式会社 カメラ及びカメラシステム
JP6039165B2 (ja) * 2011-08-11 2016-12-07 キヤノン株式会社 撮像素子及び撮像装置
JP2015012127A (ja) * 2013-06-28 2015-01-19 ソニー株式会社 固体撮像素子および電子機器
JP2015216625A (ja) * 2014-04-22 2015-12-03 キヤノン株式会社 撮像素子及び撮像装置
KR102268712B1 (ko) * 2014-06-23 2021-06-28 삼성전자주식회사 자동 초점 이미지 센서 및 이를 포함하는 디지털 영상 처리 장치
KR102286109B1 (ko) * 2014-08-05 2021-08-04 삼성전자주식회사 이미지 픽셀, 이를 포함하는 이미지 센서, 및 이를 포함하는 이미지 처리 시스템
JP2016058559A (ja) * 2014-09-10 2016-04-21 ソニー株式会社 固体撮像装置およびその駆動方法、並びに電子機器
US9749556B2 (en) * 2015-03-24 2017-08-29 Semiconductor Components Industries, Llc Imaging systems having image sensor pixel arrays with phase detection capabilities
GB2537421A (en) 2015-04-17 2016-10-19 Stmicroelectronics (Research & Development) Ltd A pixel having a plurality of photodiodes
WO2016189600A1 (ja) 2015-05-22 2016-12-01 オリンパス株式会社 撮像装置
KR102374112B1 (ko) * 2015-07-15 2022-03-14 삼성전자주식회사 오토 포커싱 픽셀을 포함하는 이미지 센서, 및 이를 포함하는 이미지 처리 시스템
KR20170019542A (ko) * 2015-08-11 2017-02-22 삼성전자주식회사 자동 초점 이미지 센서
KR102437162B1 (ko) 2015-10-12 2022-08-29 삼성전자주식회사 이미지 센서
JP2017194558A (ja) 2016-04-20 2017-10-26 オリンパス株式会社 撮像装置および撮像方法
KR102591008B1 (ko) 2016-05-23 2023-10-19 에스케이하이닉스 주식회사 이미지 센서
US9936123B2 (en) 2016-08-04 2018-04-03 Omnivision Technologies, Inc. Camera and method with widescreen image on nearly-square aspect ratio photosensor array
US10038863B2 (en) * 2016-08-17 2018-07-31 Renesas Electronics Corporation Image sensing device
JP6778595B2 (ja) * 2016-08-17 2020-11-04 ルネサスエレクトロニクス株式会社 撮像素子
CN110663248B (zh) * 2017-06-02 2023-10-24 索尼半导体解决方案公司 固态摄像装置和电子设备
KR102614851B1 (ko) 2018-07-23 2023-12-19 삼성전자주식회사 이미지 센서

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102625053A (zh) * 2011-01-31 2012-08-01 佳能株式会社 固态图像传感器和照相机
CN106158897A (zh) * 2011-10-11 2016-11-23 索尼公司 固态成像器件和电子设备
CN105763819A (zh) * 2015-01-05 2016-07-13 佳能株式会社 图像传感器和摄像设备
CN108141549A (zh) * 2015-11-16 2018-06-08 三星电子株式会社 图像传感器和具有图像传感器的电子设备
JP2017184181A (ja) * 2016-03-31 2017-10-05 キヤノン株式会社 撮像素子

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
"A 32×32 CMOS image sensor:Tested using process and temperature compensated voltage controlled current source";P. Saidesh Kumar等;18th international symposium on VLSI design and test;20140821;全文 *
"光电跟踪系统及其自动调焦技术的研究";杨帆;中国优秀硕士学位论文全文数据库;20180315;全文 *

Also Published As

Publication number Publication date
US11094735B2 (en) 2021-08-17
JP7403972B2 (ja) 2023-12-25
US20260047217A1 (en) 2026-02-12
KR20200010769A (ko) 2020-01-31
US20210335879A1 (en) 2021-10-28
JP2020017941A (ja) 2020-01-30
KR102614851B1 (ko) 2023-12-19
US20230420481A1 (en) 2023-12-28
CN110753193A (zh) 2020-02-04
US20200027914A1 (en) 2020-01-23
US11791365B2 (en) 2023-10-17

Similar Documents

Publication Publication Date Title
CN110753193B (zh) 图像传感器
US11189651B2 (en) Image sensor
CN104519285B (zh) 用于基板堆叠式图像传感器的全局快门的像素电路
US10950640B2 (en) Image sensor
CN112310130B (zh) 使用增压电容器和负偏置电压的图像传感器
CN112929585B (zh) 图像传感器
CN111757031A (zh) 成像设备和图像传感器
KR102422224B1 (ko) 적층형 이미지 센서 및 이를 포함하는 시스템
CN111835989B (zh) 图像传感器
WO2015190070A1 (en) Solid-state imaging device, manufacturing method of solid-state imaging element, and imaging apparatus
US11658193B2 (en) Image sensor
US11652130B2 (en) Image sensor and manufacturing method of the same
KR102890086B1 (ko) 이미지 센서
US12087791B2 (en) Image sensor
TWI818918B (zh) 製造圖像感測器的方法和系統
KR102368112B1 (ko) 고체 촬상 장치 및 전자 기기
EP4187914A1 (en) Image sensor and autofocusing method of the same

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant