CN110753193B - 图像传感器 - Google Patents
图像传感器 Download PDFInfo
- Publication number
- CN110753193B CN110753193B CN201910526394.7A CN201910526394A CN110753193B CN 110753193 B CN110753193 B CN 110753193B CN 201910526394 A CN201910526394 A CN 201910526394A CN 110753193 B CN110753193 B CN 110753193B
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- China
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- pixel
- pixels
- photodiodes
- photodiode
- image sensor
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F39/182—Colour image sensors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/813—Electronic components shared by multiple pixels, e.g. one amplifier shared by two pixels
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/50—Control of the SSIS exposure
- H04N25/57—Control of the dynamic range
- H04N25/59—Control of the dynamic range by controlling the amount of charge storable in the pixel, e.g. modification of the charge conversion ratio of the floating node capacitance
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/79—Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
- H10F39/8027—Geometry of the photosensitive area
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
- H10F39/8037—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/807—Pixel isolation structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/811—Interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/199—Back-illuminated image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
- H10F39/8033—Photosensitive area
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/805—Coatings
- H10F39/8053—Colour filters
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
- H10F39/8063—Microlenses
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2018-0085245 | 2018-07-23 | ||
| KR1020180085245A KR102614851B1 (ko) | 2018-07-23 | 2018-07-23 | 이미지 센서 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110753193A CN110753193A (zh) | 2020-02-04 |
| CN110753193B true CN110753193B (zh) | 2024-04-12 |
Family
ID=69161340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910526394.7A Active CN110753193B (zh) | 2018-07-23 | 2019-06-18 | 图像传感器 |
Country Status (4)
| Country | Link |
|---|---|
| US (4) | US11094735B2 (https=) |
| JP (1) | JP7403972B2 (https=) |
| KR (1) | KR102614851B1 (https=) |
| CN (1) | CN110753193B (https=) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019140528A (ja) * | 2018-02-09 | 2019-08-22 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置、及び電子機器 |
| KR102614851B1 (ko) | 2018-07-23 | 2023-12-19 | 삼성전자주식회사 | 이미지 센서 |
| KR102885349B1 (ko) * | 2019-11-05 | 2025-11-14 | 삼성전자주식회사 | 이미지 센서 |
| KR102902358B1 (ko) * | 2019-11-20 | 2025-12-22 | 기가조트 테크널러지 인코포레이티드 | 스케일러블 픽셀 크기 이미지센서 |
| KR102831295B1 (ko) * | 2020-07-10 | 2025-07-07 | 삼성전자주식회사 | 이미지 센서 |
| KR20220019895A (ko) * | 2020-08-10 | 2022-02-18 | 삼성전자주식회사 | 이미지 센서 |
| EP4270934B1 (en) | 2021-02-10 | 2026-04-01 | Samsung Electronics Co., Ltd. | Electronic device comprising image sensor and method of operating same |
| KR102828215B1 (ko) * | 2021-03-22 | 2025-07-04 | 삼성전자주식회사 | 이미지 센서 |
| JP7797785B2 (ja) * | 2021-05-17 | 2026-01-14 | 株式会社ニコン | 撮像素子、及び、撮像装置 |
| US12101554B2 (en) * | 2021-11-26 | 2024-09-24 | Samsung Electronics Co., Ltd. | Method and apparatus for performing autofocusing using summed signals |
| US11979675B2 (en) * | 2022-04-25 | 2024-05-07 | Sony Semiconductor Solutions Corporation | Image sensing device with event based vision sensor pixels and imaging pixels |
| US20250275278A1 (en) * | 2024-02-27 | 2025-08-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Image sensing structure and manufacturing method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102625053A (zh) * | 2011-01-31 | 2012-08-01 | 佳能株式会社 | 固态图像传感器和照相机 |
| CN105763819A (zh) * | 2015-01-05 | 2016-07-13 | 佳能株式会社 | 图像传感器和摄像设备 |
| CN106158897A (zh) * | 2011-10-11 | 2016-11-23 | 索尼公司 | 固态成像器件和电子设备 |
| JP2017184181A (ja) * | 2016-03-31 | 2017-10-05 | キヤノン株式会社 | 撮像素子 |
| CN108141549A (zh) * | 2015-11-16 | 2018-06-08 | 三星电子株式会社 | 图像传感器和具有图像传感器的电子设备 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8059174B2 (en) | 2006-05-31 | 2011-11-15 | Ess Technology, Inc. | CMOS imager system with interleaved readout for providing an image with increased dynamic range |
| JP5300414B2 (ja) | 2008-10-30 | 2013-09-25 | キヤノン株式会社 | カメラ及びカメラシステム |
| JP6039165B2 (ja) * | 2011-08-11 | 2016-12-07 | キヤノン株式会社 | 撮像素子及び撮像装置 |
| JP2015012127A (ja) * | 2013-06-28 | 2015-01-19 | ソニー株式会社 | 固体撮像素子および電子機器 |
| JP2015216625A (ja) * | 2014-04-22 | 2015-12-03 | キヤノン株式会社 | 撮像素子及び撮像装置 |
| KR102268712B1 (ko) * | 2014-06-23 | 2021-06-28 | 삼성전자주식회사 | 자동 초점 이미지 센서 및 이를 포함하는 디지털 영상 처리 장치 |
| KR102286109B1 (ko) * | 2014-08-05 | 2021-08-04 | 삼성전자주식회사 | 이미지 픽셀, 이를 포함하는 이미지 센서, 및 이를 포함하는 이미지 처리 시스템 |
| JP2016058559A (ja) * | 2014-09-10 | 2016-04-21 | ソニー株式会社 | 固体撮像装置およびその駆動方法、並びに電子機器 |
| US9749556B2 (en) * | 2015-03-24 | 2017-08-29 | Semiconductor Components Industries, Llc | Imaging systems having image sensor pixel arrays with phase detection capabilities |
| GB2537421A (en) | 2015-04-17 | 2016-10-19 | Stmicroelectronics (Research & Development) Ltd | A pixel having a plurality of photodiodes |
| WO2016189600A1 (ja) | 2015-05-22 | 2016-12-01 | オリンパス株式会社 | 撮像装置 |
| KR102374112B1 (ko) * | 2015-07-15 | 2022-03-14 | 삼성전자주식회사 | 오토 포커싱 픽셀을 포함하는 이미지 센서, 및 이를 포함하는 이미지 처리 시스템 |
| KR20170019542A (ko) * | 2015-08-11 | 2017-02-22 | 삼성전자주식회사 | 자동 초점 이미지 센서 |
| KR102437162B1 (ko) | 2015-10-12 | 2022-08-29 | 삼성전자주식회사 | 이미지 센서 |
| JP2017194558A (ja) | 2016-04-20 | 2017-10-26 | オリンパス株式会社 | 撮像装置および撮像方法 |
| KR102591008B1 (ko) | 2016-05-23 | 2023-10-19 | 에스케이하이닉스 주식회사 | 이미지 센서 |
| US9936123B2 (en) | 2016-08-04 | 2018-04-03 | Omnivision Technologies, Inc. | Camera and method with widescreen image on nearly-square aspect ratio photosensor array |
| US10038863B2 (en) * | 2016-08-17 | 2018-07-31 | Renesas Electronics Corporation | Image sensing device |
| JP6778595B2 (ja) * | 2016-08-17 | 2020-11-04 | ルネサスエレクトロニクス株式会社 | 撮像素子 |
| CN110663248B (zh) * | 2017-06-02 | 2023-10-24 | 索尼半导体解决方案公司 | 固态摄像装置和电子设备 |
| KR102614851B1 (ko) | 2018-07-23 | 2023-12-19 | 삼성전자주식회사 | 이미지 센서 |
-
2018
- 2018-07-23 KR KR1020180085245A patent/KR102614851B1/ko active Active
-
2019
- 2019-03-04 US US16/291,345 patent/US11094735B2/en active Active
- 2019-05-13 JP JP2019090581A patent/JP7403972B2/ja active Active
- 2019-06-18 CN CN201910526394.7A patent/CN110753193B/zh active Active
-
2021
- 2021-07-08 US US17/370,724 patent/US11791365B2/en active Active
-
2023
- 2023-09-13 US US18/466,475 patent/US20230420481A1/en not_active Abandoned
-
2025
- 2025-10-16 US US19/360,462 patent/US20260047217A1/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102625053A (zh) * | 2011-01-31 | 2012-08-01 | 佳能株式会社 | 固态图像传感器和照相机 |
| CN106158897A (zh) * | 2011-10-11 | 2016-11-23 | 索尼公司 | 固态成像器件和电子设备 |
| CN105763819A (zh) * | 2015-01-05 | 2016-07-13 | 佳能株式会社 | 图像传感器和摄像设备 |
| CN108141549A (zh) * | 2015-11-16 | 2018-06-08 | 三星电子株式会社 | 图像传感器和具有图像传感器的电子设备 |
| JP2017184181A (ja) * | 2016-03-31 | 2017-10-05 | キヤノン株式会社 | 撮像素子 |
Non-Patent Citations (2)
| Title |
|---|
| "A 32×32 CMOS image sensor:Tested using process and temperature compensated voltage controlled current source";P. Saidesh Kumar等;18th international symposium on VLSI design and test;20140821;全文 * |
| "光电跟踪系统及其自动调焦技术的研究";杨帆;中国优秀硕士学位论文全文数据库;20180315;全文 * |
Also Published As
| Publication number | Publication date |
|---|---|
| US11094735B2 (en) | 2021-08-17 |
| JP7403972B2 (ja) | 2023-12-25 |
| US20260047217A1 (en) | 2026-02-12 |
| KR20200010769A (ko) | 2020-01-31 |
| US20210335879A1 (en) | 2021-10-28 |
| JP2020017941A (ja) | 2020-01-30 |
| KR102614851B1 (ko) | 2023-12-19 |
| US20230420481A1 (en) | 2023-12-28 |
| CN110753193A (zh) | 2020-02-04 |
| US20200027914A1 (en) | 2020-01-23 |
| US11791365B2 (en) | 2023-10-17 |
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