CN110747438A - 一种高贴合强度旋转靶材的绑定方法 - Google Patents
一种高贴合强度旋转靶材的绑定方法 Download PDFInfo
- Publication number
- CN110747438A CN110747438A CN201911214635.0A CN201911214635A CN110747438A CN 110747438 A CN110747438 A CN 110747438A CN 201911214635 A CN201911214635 A CN 201911214635A CN 110747438 A CN110747438 A CN 110747438A
- Authority
- CN
- China
- Prior art keywords
- rotary target
- target
- backing tube
- indium
- rotary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 38
- 239000013077 target material Substances 0.000 title claims abstract description 32
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 62
- 229910052738 indium Inorganic materials 0.000 claims abstract description 59
- 239000000853 adhesive Substances 0.000 claims abstract description 29
- 230000001070 adhesive effect Effects 0.000 claims abstract description 29
- 239000011248 coating agent Substances 0.000 claims abstract description 24
- 238000000576 coating method Methods 0.000 claims abstract description 24
- 238000010438 heat treatment Methods 0.000 claims abstract description 15
- 239000000126 substance Substances 0.000 claims abstract description 12
- 239000003822 epoxy resin Substances 0.000 claims abstract description 10
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 5
- 238000001465 metallisation Methods 0.000 claims abstract description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 4
- 239000010439 graphite Substances 0.000 claims abstract description 4
- 239000007788 liquid Substances 0.000 claims description 23
- 238000003466 welding Methods 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 10
- 238000012545 processing Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 11
- 238000000926 separation method Methods 0.000 abstract 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 11
- 238000005219 brazing Methods 0.000 description 11
- 229910052750 molybdenum Inorganic materials 0.000 description 11
- 239000011733 molybdenum Substances 0.000 description 11
- 229910001220 stainless steel Inorganic materials 0.000 description 10
- 239000010935 stainless steel Substances 0.000 description 10
- 230000035882 stress Effects 0.000 description 10
- 229910000484 niobium oxide Inorganic materials 0.000 description 9
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 9
- 230000008646 thermal stress Effects 0.000 description 8
- 238000001816 cooling Methods 0.000 description 7
- 238000004544 sputter deposition Methods 0.000 description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000002474 experimental method Methods 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- 239000010936 titanium Substances 0.000 description 6
- 229910052719 titanium Inorganic materials 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000002156 mixing Methods 0.000 description 4
- 239000002893 slag Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000007888 film coating Substances 0.000 description 3
- 238000009501 film coating Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000007788 roughening Methods 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000009658 destructive testing Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000024121 nodulation Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000004901 spalling Methods 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911214635.0A CN110747438B (zh) | 2019-12-02 | 2019-12-02 | 一种高贴合强度旋转靶材的绑定方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911214635.0A CN110747438B (zh) | 2019-12-02 | 2019-12-02 | 一种高贴合强度旋转靶材的绑定方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110747438A true CN110747438A (zh) | 2020-02-04 |
CN110747438B CN110747438B (zh) | 2021-11-23 |
Family
ID=69285396
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201911214635.0A Active CN110747438B (zh) | 2019-12-02 | 2019-12-02 | 一种高贴合强度旋转靶材的绑定方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN110747438B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111926296A (zh) * | 2020-07-15 | 2020-11-13 | 先导薄膜材料(广东)有限公司 | 一种旋转靶材绑定方法 |
CN112080727A (zh) * | 2020-09-11 | 2020-12-15 | 芜湖映日科技有限公司 | 一种旋转靶材的绑定方法 |
CN112458413A (zh) * | 2020-10-23 | 2021-03-09 | 先导薄膜材料(广东)有限公司 | 一种靶材的绑定方法 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008184627A (ja) * | 2007-01-26 | 2008-08-14 | Tosoh Corp | 円筒形スパッタリングターゲット及びその製造方法 |
CN101688293A (zh) * | 2007-07-02 | 2010-03-31 | 东曹株式会社 | 圆筒形溅射靶 |
US20100101949A1 (en) * | 2008-10-24 | 2010-04-29 | Applied Materials, Inc. | Rotatable sputter target backing cylinder, rotatable sputter target, method of producing a rotatable sputter target, and coating installation |
JP2017089014A (ja) * | 2017-02-14 | 2017-05-25 | Jx金属株式会社 | 円筒型スパッタリングターゲット及びその製造方法 |
CN107663630A (zh) * | 2016-07-29 | 2018-02-06 | 欧美达应用材料科技股份有限公司 | 旋转靶材 |
CN107969159A (zh) * | 2015-05-06 | 2018-04-27 | 攀时奥地利公司 | 管靶 |
CN108517498A (zh) * | 2018-04-17 | 2018-09-11 | 洛阳科威钨钼有限公司 | 一种用于磁控溅射的一体式管状钼靶材的制备方法 |
CN108570652A (zh) * | 2018-07-24 | 2018-09-25 | 江苏迪丞光电材料有限公司 | 一种可承受高功率溅射的旋转靶材及其制备方法 |
CN109352109A (zh) * | 2018-11-29 | 2019-02-19 | 广西晶联光电材料有限责任公司 | 一种旋转靶材绑定的装置和方法 |
CN107771224B (zh) * | 2015-03-18 | 2019-08-30 | 先导薄膜材料(广东)有限公司 | 形成旋转溅射靶的方法 |
-
2019
- 2019-12-02 CN CN201911214635.0A patent/CN110747438B/zh active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008184627A (ja) * | 2007-01-26 | 2008-08-14 | Tosoh Corp | 円筒形スパッタリングターゲット及びその製造方法 |
CN101688293A (zh) * | 2007-07-02 | 2010-03-31 | 东曹株式会社 | 圆筒形溅射靶 |
US20100101949A1 (en) * | 2008-10-24 | 2010-04-29 | Applied Materials, Inc. | Rotatable sputter target backing cylinder, rotatable sputter target, method of producing a rotatable sputter target, and coating installation |
CN107771224B (zh) * | 2015-03-18 | 2019-08-30 | 先导薄膜材料(广东)有限公司 | 形成旋转溅射靶的方法 |
CN107969159A (zh) * | 2015-05-06 | 2018-04-27 | 攀时奥地利公司 | 管靶 |
CN107663630A (zh) * | 2016-07-29 | 2018-02-06 | 欧美达应用材料科技股份有限公司 | 旋转靶材 |
JP2017089014A (ja) * | 2017-02-14 | 2017-05-25 | Jx金属株式会社 | 円筒型スパッタリングターゲット及びその製造方法 |
CN108517498A (zh) * | 2018-04-17 | 2018-09-11 | 洛阳科威钨钼有限公司 | 一种用于磁控溅射的一体式管状钼靶材的制备方法 |
CN108570652A (zh) * | 2018-07-24 | 2018-09-25 | 江苏迪丞光电材料有限公司 | 一种可承受高功率溅射的旋转靶材及其制备方法 |
CN109352109A (zh) * | 2018-11-29 | 2019-02-19 | 广西晶联光电材料有限责任公司 | 一种旋转靶材绑定的装置和方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111926296A (zh) * | 2020-07-15 | 2020-11-13 | 先导薄膜材料(广东)有限公司 | 一种旋转靶材绑定方法 |
CN112080727A (zh) * | 2020-09-11 | 2020-12-15 | 芜湖映日科技有限公司 | 一种旋转靶材的绑定方法 |
CN112080727B (zh) * | 2020-09-11 | 2021-04-23 | 芜湖映日科技股份有限公司 | 一种旋转靶材的绑定方法 |
CN112458413A (zh) * | 2020-10-23 | 2021-03-09 | 先导薄膜材料(广东)有限公司 | 一种靶材的绑定方法 |
Also Published As
Publication number | Publication date |
---|---|
CN110747438B (zh) | 2021-11-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN110747438B (zh) | 一种高贴合强度旋转靶材的绑定方法 | |
JP5194460B2 (ja) | 円筒形スパッタリングターゲット及びその製造方法 | |
CN110804726A (zh) | 一种旋转靶材的绑定方法 | |
JP5672536B2 (ja) | 円筒形スパッタリングターゲットおよびその製造方法 | |
JP5428741B2 (ja) | 円筒形スパッタリングターゲットの製造方法 | |
JP5309978B2 (ja) | 円筒形スパッタリングターゲットの製造方法 | |
JP2008184640A (ja) | 円筒形スパッタリングターゲット及びその製造方法 | |
KR101137906B1 (ko) | 회전식 타겟 어셈블리 | |
JP2015036431A (ja) | 円筒形スパッタリングターゲットおよびその製造方法。 | |
TWI440732B (zh) | Cylindrical sputtering target and its manufacturing method | |
CN107971620A (zh) | 一种钨靶材扩散焊接方法及靶材组件 | |
JP5672537B2 (ja) | 円筒形スパッタリングターゲットおよびその製造方法 | |
CN110218983A (zh) | 磁控溅射旋转靶材的绑定方法 | |
CN107663630A (zh) | 旋转靶材 | |
CN110408897A (zh) | 一种旋转靶材的垂直绑定装置以及绑定方法 | |
JP2010150610A (ja) | 円筒形スパッタリングターゲット | |
CN1865465A (zh) | 一种利用高强梯度磁场制备梯度复合材料的方法和装置 | |
CN104058796B (zh) | Ptc陶瓷复合电极及其制备方法 | |
US9932667B2 (en) | Non-continuous bonding of sputtering target to backing material | |
US11830712B2 (en) | High efficiency rotatable sputter target | |
JP2018135590A (ja) | 円筒形スパッタリングターゲット、焼結体及び円筒形スパッタリングターゲットの製造方法 | |
CN113174579B (zh) | 除氧化物的旋转靶材绑定方法、计算机可读存储介质及绑定装置 | |
TWI619561B (zh) | Rotating target | |
JP4985215B2 (ja) | 円筒形スパッタリングターゲットの製造方法 | |
CN113265637A (zh) | 设有间隔物的旋转靶材绑定方法、计算机可读存储介质及绑定装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Ma Chaoning Inventor after: Liu Suoxin Inventor after: Guo Peng Inventor after: Chen Biao Inventor before: Chen Biao Inventor before: Guo Peng Inventor before: Liu Suoxin Inventor before: Ma Chaoning |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240725 Address after: Room 307, 3rd Floor, Guanya International Star City, No. 100 Guting Avenue, Yanghe Industrial New Area, Liuzhou City, Guangxi Zhuang Autonomous Region, 545000 Patentee after: GUANGXI CRYSTAL UNION PHOTOELECTRIC MATERIALS Co.,Ltd. Country or region after: China Patentee after: Fenglianke Optoelectronics (Luoyang) Co.,Ltd. Address before: 545616 No.222, office building No.2, Liudong standard workshop, No.2, Shuiwan Road, Liudong New District, Liuzhou City, Guangxi Zhuang Autonomous Region Patentee before: GUANGXI CRYSTAL UNION PHOTOELECTRIC MATERIALS Co.,Ltd. Country or region before: China |