CN110739342A

CN110739342A - Display panel, preparation method thereof and display device

Info

Publication number: CN110739342A
Application number: CN201911195447.8A
Authority: CN
Inventors: 张跳梅; 霍宇飞; 孙阔; 张振华; 王本莲
Original assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Priority date: 2019-11-28
Filing date: 2019-11-28
Publication date: 2020-01-31
Anticipated expiration: 2039-11-28
Also published as: CN110739342B

Abstract

The application provides display panels, a preparation method thereof and a display device, wherein the display panel is provided with a display area, the display area comprises an opening area, an isolation area and a pixel area, the isolation area is arranged around the opening area in a closed mode, the pixel area is arranged around the isolation area, the pixel area and the isolation area are both provided with an intermediate layer and a light-emitting function layer which are sequentially overlapped on a substrate along the thickness direction of the display panel, the intermediate layer of the isolation area is provided with a chute which is arranged around the opening area in a closed mode, the chute comprises a side face which is arranged in an inclined mode, the included angle formed by the side face and the bottom face of the chute is an acute angle, the light-emitting function layer of the isolation area is disconnected on the side face of the chute, and the preparation method is used for manufacturing the display panel comprising a light-emitting area and a transparent area.

Description

Display panel, preparation method thereof and display device

Technical Field

The application relates to the technical field of display, in particular to display panels, a preparation method thereof and a display device.

Background

With the development of the OLED panel industry, a large-size, large-viewing-angle and full-screen display gradually becomes a hot research field, the full-screen display refers to types of display screens with an ultrahigh screen ratio, the screen ratio of an ideal full-screen display is 100%, that is, the front of a mobile phone is a display interface, but the full-screen display is limited by the installation requirements of essential basic functional components of the mobile phone such as a front camera of the mobile phone, a mobile phone receiver, a face recognition sensor, a light sensor and the like, at present, a determined notch is required to be reserved above the mobile phone screen to install the functional components, and thus display screens such as a bang screen, a water drop screen and the like are formed.

With the continuous development of the full-face screen, large consumers cannot meet the requirements of bang screens, water drop screens and other designs, and then display panels 10 with holes 11 appear, as shown in fig. 1, the holes 11 can be used for placing cameras, so that the utilization rate of the screen is greatly increased, and the visual experience effect of users is improved.

The main technical difficulty of punching holes in the display area is that the organic light-emitting material layer needs to be effectively broken at the edge of the hole, because the organic light-emitting material layer is very sensitive to water and oxygen, if the holes are punched directly, the organic light-emitting material layer is exposed at the edge, and a channel for transmitting water vapor and oxygen is formed, so that the pixel area fails to emit light and can not display normally.

Therefore, it is difficult problems to be solved in the art how to effectively block the path of water vapor and oxygen transmitted to the pixel region through the organic light emitting material layer.

Disclosure of Invention

The application provides display panels, a preparation method thereof and a display device, which are used for disconnecting a light-emitting function layer in an isolation region so as to cut off a path for transmitting water vapor and oxygen to a pixel region through the light-emitting function layer.

According to an th aspect of an embodiment of the present application, there is provided a kinds of display panels, the display panel including a substrate, the display panel having a display area including an aperture area, an isolation area disposed to close around the aperture area, and a pixel area disposed to surround the isolation area;

the pixel region and the isolation region are respectively provided with an intermediate layer and a light-emitting functional layer which are sequentially overlapped on the substrate along the thickness direction of the display panel;

the middle layer of the isolation region is provided with a chute which is closed and surrounds the opening region, the chute comprises an th side surface which is obliquely arranged, and a th included angle formed by the th side surface and the bottom surface of the chute is an acute angle;

wherein the light emission functional layer located in the isolation region is broken at the th side of the inclined groove.

Optionally, the intermediate layer is a planarization layer.

Optionally, the th angle is 30-60 degrees.

Optionally, the intermediate layer includes a th intermediate layer and a second intermediate layer sequentially stacked from bottom to top along the thickness direction;

the chute comprises th part and a second part which are sequentially overlapped from bottom to top in the thickness direction, wherein the th part is positioned in the th middle layer, the second part is positioned in the second middle layer, each part is provided with the th side face, and the th side face of the th part and the th side face of the second part are respectively positioned in different planes;

the light emission function layer is broken at both the th side of the th portion and the th side of the second portion.

Optionally, the th side of the th part slopes in the same or opposite direction as the th side of the second part.

Optionally, the display area further includes a blocking area, the blocking area is located between the isolation area and the pixel area, a blocking column located on the substrate is arranged in the blocking area, the blocking column is closed and surrounds the isolation area, the upper surface of the blocking column is higher than the upper surface of the middle layer of the pixel area, and the light-emitting functional layer is arranged on the upper surface of the blocking column.

Optionally, display panel still includes the packaging layer, is located the pixel region the packaging layer includes the edge inorganic packaging layer, organic layer and the inorganic packaging layer of second that the thickness direction was folded by supreme down and is established in proper order are located block regionally with keep apart regionally the packaging layer only includes the edge the thickness direction is folded by supreme down and is established inorganic packaging layer and the inorganic packaging layer of second in proper order.

Optionally, the upper surface of the blocking pillar is higher than the upper surface of the middle layer of the pixel region by 2.5 to 3.5 micrometers.

According to a second aspect of the embodiments of the present application, there are provided kinds of display devices including the display panel as described above.

According to a third aspect of embodiments of the present application, there is provided a manufacturing method of kinds of display panels, the manufacturing method being used for manufacturing the above display panel, the manufacturing method including:

forming the intermediate layer on the substrate in the thickness direction;

opening the inclined groove in the middle layer of the isolation area, wherein the inclined groove is arranged around the opening area in a closed mode, the inclined groove comprises an th side face which is arranged in an inclined mode, and an included angle between the th side face and a th side face formed by the bottom face of the inclined groove is an acute angle;

forming the light emission function layer on the intermediate layer in the thickness direction, the light emission function layer located in the isolation region being broken at an th side of the inclined groove.

Optionally, the chute is formed by a laser etching process.

Optionally, the light emitting functional layer is formed by an evaporation process.

In the display panel, the preparation method thereof and the display device of the embodiment, the inclined groove is arranged in the middle layer of the isolation region, and the inclined groove has the th side surface arranged obliquely, so that the light-emitting functional layer is disconnected on the th side surface of the inclined groove, and a path for transmitting water vapor and oxygen to the pixel region through the light-emitting functional layer is cut off, so that the water vapor and the oxygen are prevented from entering the pixel region from the opening of the opening region along the light-emitting functional layer, and the erosion of the pixel region is avoided.

Drawings

Fig. 1 is a schematic top view of a display panel in the prior art.

Fig. 2 is a schematic top view of the display panel of embodiment 1.

Fig. 3 is a schematic partial cross-sectional view of a display panel according to embodiment 1.

Fig. 4 is a partial structure enlarged view of a portion a of fig. 3.

Fig. 5(a) -5 (d) are process flow diagrams of a method of manufacturing a display panel according to an exemplary embodiment.

Fig. 6 is a schematic partial cross-sectional view of a display panel according to embodiment 2.

Fig. 7 is a partial structure enlarged view of a portion B of fig. 6.

Fig. 8 is a schematic partial cross-sectional view of a display panel according to another implementation mode of example 2.

Fig. 9(a) to 9(e) are process flow charts of the manufacturing method of the display panel of example 2.

Description of reference numerals in fig. 1

Display panel 10

Hole 11

Description of reference numerals in fig. 2 to 9

Display panel 20

Display area 21

Open area 22

Isolation region 23

Barrier region 24

Pixel region 25

Substrate 30

Thin film transistor 40

Active layer 42

Gate insulating layer 43

Grid 44

Source electrode 46

Drain 47

Intermediate layer 50

Chute 51

th part 51a

Second part 51b

th side 511

side 511a of part

nd side 511b of the second portion

Second side 512

th intermediate layer 52

Second intermediate layer 53

Light emitting device 60

Light-emitting functional layer 61

Anode 62

Pixel defining layer 63

Blocking post 70

Encapsulation layer 80

Thickness direction T of display panel

Angle α of

Second included angle β

Thickness t1 of planarization layer

Length of chute L1

Length L11 of part

Length of second portion L12

Spacing length l1 between two adjacent chutes

The upper surface of the barrier pillar is higher than the upper surface of the intermediate layer by a distance d1

Detailed Description

The embodiments described in the exemplary embodiments below do not represent all embodiments that are equivalent to the present application, rather, they are merely examples of means that are equivalent to the aspects of the present application, as detailed in the appended claims.

Unless defined otherwise, technical or scientific terms used herein or similar terms used herein to the extent that they are commonly understood by one of ordinary skill in the art to which this application belongs may not be used to limit the number, but rather, the use of the terms "" or "" in this specification and in the claims may mean that there are at least . the terms "including" or "comprising" and similar terms mean that the preceding element or item is meant to encompass the following element or item and its equivalents, and does not exclude other elements or items or similar terms such as "connected" or "connected" are not meant to be limited to physical or mechanical connections, and may include electrical connections, whether direct or indirect, "plural" includes two, corresponds to at least two.

Example 1

Please refer to fig. 2 to fig. 4, in order to understand that the present embodiment provides display panels 20 and a display device including the same.

The display panel 20 has a display area 21, and the display area 21 includes an opening area 22, an isolation area 23 disposed to close around the opening area 22, and a pixel area 25 disposed to surround the isolation area 23. The above-mentioned opening region 22 is used for assembling a camera or the like after the opening process, and the shape of the opening region 22 may be, for example, a circular shape as shown in the drawing, or may be, for example, another regular shape such as a rectangular shape.

The display panel 20 includes a base 30, and the base 30 is not limited herein, and the base 30 may be substrate boards, or may be composed of a substrate board and a film layer disposed on the substrate board.

The pixel region 25 and the isolation region 23 are both provided with an intermediate layer 50 and a light-emitting functional layer 61 sequentially stacked on the substrate 30 along a thickness direction T of the display panel 20, the intermediate layer 50 located in the isolation region 23 is provided with an inclined groove 51 which is closed to surround the opening region 22, the inclined groove 51 includes an obliquely arranged first side surface 511, and an included angle α formed by the side surface 511 and a bottom surface of the inclined groove 51 is an acute angle.

The reason why the light-emitting functional layer 61 located in the isolation region 23 is cut off at the th side 511 of the inclined groove 51 is that, during the evaporation of the light-emitting functional layer 61, the th side 511 of the inclined groove 51 is shielded by the intermediate layer 50 thereon, so that the light-emitting functional layer 61 is cut off at the th side 511 of the inclined groove 51, thereby blocking a path for transmitting moisture and oxygen to the pixel region 25 through the light-emitting functional layer 61, and preventing the moisture and oxygen from entering the pixel region 25 from the opening of the aperture region 22 along the light-emitting functional layer 61 to corrode the pixel region 25.

In the present embodiment, the number of the inclined grooves 51 is not limited to , and when the number of the inclined grooves 51 is plural, the inclined grooves 51 are arranged at intervals, the length L1 of each inclined groove 51 is 6 to 13 micrometers, the interval length L1 of each adjacent two inclined grooves 51 is 10 to 17 micrometers, the depth of each inclined groove 51 is equal to the thickness of the intermediate layer 50, but the present invention is not limited thereto, a part of the intermediate layer 50 may be left under the bottom surface of each inclined groove 51, and the thickness of the intermediate layer 50 under the bottom surface of each inclined groove 51 is not more than 0.3 micrometer.

The pixel region 25 in the display area 21 is used for displaying a picture, and the pixel region 25 comprises a plurality of sub-pixels, wherein the plurality of sub-pixels at least comprises th color sub-pixel, second color sub-pixel and third color sub-pixel, for example, th color sub-pixel, second color sub-pixel and third color sub-pixel are red sub-pixel, green sub-pixel and blue sub-pixel respectively, for th color sub-pixel, second color sub-pixel and third color sub-pixel, the distribution mode can refer to the conventional arrangement in the field.

Each sub-pixel comprises, in addition to the above-mentioned light-emitting functional layer 61, an anode 62 disposed on the side of the light-emitting functional layer 61 close to the substrate 30 , and a cathode (not labeled) disposed on the side far from the substrate 30 , wherein in each sub-pixel, the anode 62, the light-emitting functional layer 61 and the cathode form light-emitting devices 60, the light-emitting devices 60 further comprise a pixel defining layer 63, and the pixel defining layer 63 is used for separating the adjacent light-emitting devices 60 to prevent crosstalk, wherein the pixel defining layer 63 may cover a portion of the anode 62, that is, the anode 62 is formed first, and the pixel defining layer 63 is formed after the anode 62.

The light-emitting functional layer 61 includes at least a light-emitting layer. As shown in the figure, the light-emitting function layer 61 may further include an Electron Transport Layer (ETL), an Electron Injection Layer (EIL), a Hole Transport Layer (HTL), and a Hole Injection Layer (HIL), in addition to the light-emitting layer. Of course, the light-emitting function layer 61 may include a part of ETL, EIL, HTL, HIL in addition to the light-emitting layer.

A Thin-film transistor 40 (TFT) is also provided between the substrate 30 and the light emitting device 60 in the pixel region 25. The thin film transistor 40 includes an active layer 42, a gate insulating layer 43, a gate electrode 44, an interlayer insulating layer (not shown), and source and drain

electrodes

46 and 47, and the drain and

source electrodes

47 and 46 are connected to the active layer 42. The drain electrode 47 of the thin film transistor 40 is electrically connected to the anode 62 of the light emitting device 60.

In the present embodiment, the intermediate layer 50 is a planarization layer. The planarization layer is disposed between the thin film transistor 40 and the light emitting device 60. The planarization layer has a thickness t1 of 1-3 microns.

The planarization layer has an advantage in thickness with respect to a layer structure in the thin film transistor 40, such as an interlayer insulating layer, and the inclined groove 51 is formed in the planarization layer, and the th side surface 511 inclined to the th side surface α formed by the bottom surface of the inclined groove 51 is an acute angle, and thus has a long cross section, thereby being capable of better blocking a path for transmitting moisture and oxygen to the pixel region through the light emitting functional layer 61.

Optionally, the included angle α of the is 30 to 60 degrees, the included angle α of the is too small to facilitate forming the chute 51 by laser etching, and meanwhile, the included angle α of the cannot be too large, so that the light-emitting functional layer 61 cannot be broken at the side surface 511 of the of the chute 51 in the evaporation process, and optimally, the included angle α of the is 45 degrees.

In this embodiment, the display area 21 further includes a blocking area 24, the blocking area 24 is located between the isolation area 23 and the pixel area 25, a blocking pillar 70 is disposed on the substrate 30 in the blocking area 24, the blocking pillar 70 is disposed around the isolation area 23 in a closed manner, an upper surface of the blocking pillar 70 is higher than an upper surface of the intermediate layer 50 of the pixel area 25, and the light emitting function layer 61 is disposed on the upper surface of the blocking pillar 70. The upper surface of the barrier post 70 is raised above the upper surface of the intermediate layer 50 of the pixel region 25 by a distance d1 of 2.5 microns to 3.5 microns. Preferably, the upper surface of the barrier pillar 70 is 3 micrometers above the upper surface of the intermediate layer 50 of the pixel region 25 by a distance d 1.

In this embodiment, the display panel 20 further includes a package layer 80, the package layer 80 located in the pixel region 25 includes an th inorganic package layer, an organic layer, and a second inorganic package layer sequentially stacked from bottom to top along the thickness direction T, and the package layers 80 located in the blocking region 24 and the isolation region 23 only include an th inorganic package layer and a second inorganic package layer sequentially stacked from bottom to top along the thickness direction.

the inorganic encapsulation layer and the second inorganic encapsulation layer are used to prevent moisture and oxygen entering from the front of the display panel 20 from entering into the light emitting function layer 61. the inorganic encapsulation layer and the second inorganic encapsulation layer are made of inorganic materials such as silicon nitride and/or silicon oxide, and the organic layer is used to prevent inorganic particles in the inorganic encapsulation layer from affecting the preparation of the second inorganic encapsulation layer, which leads to the film cracking of the second inorganic encapsulation layer, therefore, it is necessary to provide an organic layer to flatten the inorganic encapsulation layer, which may be acrylic, for example.

Since the material of the organic layer has a fluidity of , in order to facilitate the preparation of the organic layer, the barrier pillars 70 are provided to intercept the flow of the material of the organic layer toward the side near the open cell region 22. the longitudinal sectional shape of the barrier pillars 70 may be, for example, a trapezoid, a rectangle, etc., in the case where the longitudinal sectional shape of the barrier pillars 70 is a trapezoid, the length of the top side of the trapezoid is smaller than the length of the bottom side thereof.

In this embodiment, the blocking pillars 70 are not limited to , and when the number of the blocking pillars 70 is multiple, the blocking pillars 70 are spaced apart, the blocking pillars 70 are advantageous to block the material of the organic layer in step , and the material of the organic layer is prevented from spreading to the opening region 22 due to insufficient blocking capability of the single blocking pillar 70, and the length of the single blocking pillar 70 is 40 micrometers to 60 micrometers, so that planes are formed on the upper surfaces of the blocking pillars 70, and the flat effect of the display panel 20 is prevented from being affected by sharp corners formed on the upper surfaces of the blocking pillars 70.

According to a second aspect of the embodiments of the present application, there are provided kinds of display devices including the display panel 20 as above.

Based on the same inventive concept as , embodiments of the present application provide methods for manufacturing a display panel 20, as shown in fig. 5(a) -5 (d), where the method is used to manufacture the display panel 20, as described above, the display panel 20 has a display area 21, and the display area 21 includes an opening area 22, an isolation area 23 disposed around the opening area 22 in a closed manner, and a pixel area 25 disposed around the isolation area 23, the method includes:

step 100: forming the intermediate layer on the substrate in the thickness direction;

step 200, arranging the inclined grooves in the middle layer of the isolation area, wherein the inclined grooves are arranged around the opening area in a closed mode, the inclined grooves comprise th side surfaces which are arranged in an inclined mode, and an included angle between the th side surfaces and th side surfaces formed by the bottom surfaces of the inclined grooves is an acute angle;

and 300, forming the light-emitting functional layer on the middle layer along the thickness direction, wherein the light-emitting functional layer positioned in the isolation area is disconnected on the th side of the inclined groove.

Before step 100, the manufacturing method includes forming a thin film transistor 40 on a substrate 30, specifically, forming an active layer thin film on the substrate 30 and patterning the active layer thin film to form an active layer 42, forming a gate insulating layer thin film on the active layer 42, forming an th conductive thin film on the gate insulating layer thin film and patterning a th conductive thin film to form a gate electrode 44, forming an interlayer insulating layer thin film on the gate electrode 44, and etching the interlayer insulating layer thin film and the gate insulating layer thin film to form a source electrode 46 contact hole and a drain electrode 47 contact hole to form an interlayer insulating layer and a gate insulating layer 43, wherein the etching may be, for example, dry etching.

Next, a second conductive film is formed on the interlayer insulating layer and patterned to form a source electrode 46 and a drain electrode 47, the source electrode 46 being connected to the active layer 42 through a source electrode 46 contact hole, and the drain electrode 47 being connected to the active layer 42 through a drain electrode 47 contact hole.

In step 100, as shown in fig. 5(a), an intermediate layer 50 (i.e., a planarization layer) is formed on the source electrode 46 and the drain electrode 47. Specifically, a planarization layer film is formed on the source and drain

electrodes

46 and 47, and the planarization layer film is patterned to form via holes to form a planarization layer.

In step 200, as shown in fig. 5(b), an inclined groove 51 is formed in the intermediate layer 50 (i.e., the planarization layer) located in the isolation region 23, the inclined groove 51 is disposed to closely surround the opening region 22, the inclined groove 51 includes an obliquely disposed th side surface 511, and an included angle α between the th side surface 511 and a th side surface formed by the bottom surface of the inclined groove 51 is an acute angle.

In step 300, as shown in fig. 5(c), a third conductive film is formed on the intermediate layer 50 (i.e., the planarization layer), the third conductive film is patterned to form an anode 62, the anode 62 is electrically connected to the drain electrode 47 through a via hole on the planarization layer, a pixel defining layer film is formed on the anode 62, the pixel defining layer film is patterned to form a pixel defining layer 63, the pixel defining layer 63 has an open region to expose the anode 62, a light emitting function layer 61 is formed in the open region of the pixel defining layer 63, a fourth conductive film is formed on the light emitting function layer 61, and the fourth conductive film is patterned to form a cathode, so as to complete the fabrication of the light emitting device 60, wherein the light emitting function layer 61 is formed through an evaporation process, so that the light emitting function layer 61 is disconnected through the side 511 of the inclined groove 51 during the evaporation process.

In the present embodiment, the patterning of the active layer film, the th conductive film, the second conductive film, the third conductive film and the fourth conductive film includes processes of coating photoresist, exposing, developing and etching.

Optionally, before step 300, that is, before forming the light-emitting functional layer 61 on the intermediate layer 50, the method for manufacturing the display panel 20 further includes:

a barrier pillar 70 is formed in the barrier region 24 between the isolation region 23 and the pixel region 25, the barrier pillar 70 being disposed closely around the isolation region 23, an upper surface of the barrier pillar 70 being higher than an upper surface of the intermediate layer 50 of the pixel region 25.

In step 300, the step of forming the light-emitting function layer 61 on the intermediate layer 50 further includes: the light emitting function layer 61 is formed on the barrier ribs 70.

After step 300, i.e., after forming the light emitting function layer 61, as shown in fig. 5(d), the method for manufacturing the display panel 20 further includes:

the packaging layer 80 is formed on the light-emitting function layer 61 and the th side 511 of the inclined groove 51, the packaging layer 80 located in the pixel region 25 includes a th inorganic packaging layer, an organic layer and a second inorganic packaging layer which are sequentially stacked from bottom to top along the thickness direction T, and the packaging layer 80 located in the blocking region 24 and the isolation region 23 only includes a th inorganic packaging layer and a second inorganic packaging layer which are sequentially stacked from bottom to top along the thickness direction T.

After the encapsulation layer 80 is formed, the display panel 20 with holes is obtained by laser dicing.

Example 2

As will be understood from fig. 6 to 8, the overall structure of the display panel of the present embodiment is substantially the same as that of embodiment 1, except that the intermediate layer 50 includes a third intermediate layer and a fourth intermediate layer 53 stacked in sequence from bottom to top in the thickness direction T, the inclined groove 51 includes a third portion 51a and a fourth portion 51b stacked in sequence from bottom to top in the thickness direction T, the third 0 portion 51a is located in the third 1 intermediate layer 52, the fourth portion 51b is located in the fourth intermediate layer 53, each portion 2 has a 3-th side, the -th side 511a of the 4 portion 51a and the -th side 511b of the second portion 51b are located in different planes, the light emitting functional layer 61 is disconnected at the -th side 511a of the -th portion 51a and the -th side 511b of the second portion 51b, and thus, by forming two inclined grooves -th sides in the same 51, the light emitting functional layer 61 can be better formed in the same area, thereby preventing the pixel opening region 22 from moisture and moisture from entering the pixel 25.

As shown in FIG. 6, the inclination direction of the side 511a of the -th portion 51a is opposite to the inclination direction of the -th side 511b of the second portion 51 b. in the present embodiment, as shown in FIG. 7, the length L11 of the -th portion 51a of the inclined groove 51 is 6 to 10 micrometers, and the length L12 of the second portion 51b of the inclined groove 51 is 10 to 13 micrometers.

As shown in fig. 8, in another implementation of this embodiment, the inclination direction of the th side 511a of the th part 51a and the inclination direction of the th side 511b of the second part 51b may also be the same.

Based on the same concept of , the embodiments of the present application provide methods for manufacturing the display panel 20, as shown in fig. 9(a) to 9(e), the overall steps of the manufacturing method of the present embodiment are substantially the same as those of embodiment 1, except that:

in step 100, as shown in FIG. 9(a), an intermediate layer 50 is formed on the source electrode 46 and the drain electrode 47, the intermediate layer 50 including a th intermediate layer 52 and a second intermediate layer 53. specifically, a th planarizing layer film is formed on the source electrode 46 and the drain electrode 47, and the th planarizing layer film is patterned to form a via hole to form a th planarizing layer, i.e., the th intermediate layer 52;

in step 200, as shown in FIG. 9(b), a part 51a of the inclined groove 51 is formed in the th planarization layer through a laser etching process, and the th part 51a of the inclined groove 51 is inclined to the left (or right), as shown in FIG. 9(c), a second part 51b of the inclined groove 51 is formed in the second planarization layer again through a laser etching process, and the second part 51b of the inclined groove 51 is inclined to the right (or left), each part has a th side surface, and the th side surface 511a of the th part 51a and the th side surface 511b of the second part 51b are respectively located in different planes.

The steps after step 200 are the same as those of example 1, the light-emitting functional layer 61 is formed on the intermediate layer 50 in the thickness direction T, and the light-emitting functional layer 61 located in the isolation region 23 is broken at both the -th side 511a of the -th part 51a and the -th side 511b of the second part 51b as shown in fig. 9(d), the encapsulating layer 80 is formed on the -th side 511a of the -th part 51a of the light-emitting functional layer 61 and the diagonal groove 51 and the -th side 511b of the second part 51b as shown in fig. 9(e), the encapsulating layer 80 located in the pixel region 25 includes a inorganic encapsulating layer, an organic layer, and a second inorganic encapsulating layer stacked in this order from bottom to top in the thickness direction T, and the encapsulating layer 80 located in the barrier region 24 and the isolation region 23 includes only a inorganic encapsulating layer and a second inorganic encapsulating layer stacked in this order from bottom to top in the thickness direction T.

In the display panel, the manufacturing method thereof and the display device of the embodiment, the two side surfaces (the side surface 511a of the -th portion 51a and the side surface 511b of the second portion 51 b) are formed in the same inclined groove, so that the light emitting functional layer is disconnected twice in the same inclined groove, and moisture and oxygen can be better prevented from entering the pixel region from the opening of the opening region along the light emitting functional layer, and the pixel region is prevented from being corroded.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the scope of protection of the present application.

Claims

A display panel of kinds, the display panel including a substrate, wherein the display panel has a display area including an opening area, an isolation area disposed to close around the opening area, and a pixel area disposed to surround the isolation area;

the pixel region and the isolation region are respectively provided with an intermediate layer and a light-emitting functional layer which are sequentially overlapped on the substrate along the thickness direction of the display panel;

the middle layer of the isolation region is provided with a chute which is closed and surrounds the opening region, the chute comprises an th side surface which is obliquely arranged, and a th included angle formed by the th side surface and the bottom surface of the chute is an acute angle;

wherein the light emission functional layer located in the isolation region is broken at the th side of the inclined groove.
2. The display panel of claim 1, wherein the intermediate layer is a planarization layer.
3. The display panel of claim 1, wherein the th angle is 30 degrees to 60 degrees.
4. The display panel according to claim 1, wherein the intermediate layer comprises an th intermediate layer and a second intermediate layer which are stacked in this order from bottom to top in the thickness direction;

the chute comprises th part and a second part which are sequentially overlapped from bottom to top in the thickness direction, wherein the th part is positioned in the th middle layer, the second part is positioned in the second middle layer, each part is provided with the th side face, and the th side face of the th part and the th side face of the second part are respectively positioned in different planes;

the light emission function layer is broken at both the th side of the th portion and the th side of the second portion.
5. The display panel according to claim 4, wherein an inclination direction of the side of the th part is the same as or opposite to an inclination direction of the th side of the second part.
6. The display panel according to claim 1, wherein the display region further includes a blocking region between the blocking region and the pixel region, wherein a blocking pillar on the substrate is disposed in the blocking region, the blocking pillar is disposed to surround the blocking region in a closed state, an upper surface of the blocking pillar is higher than an upper surface of an intermediate layer of the pixel region, and the light-emitting functional layer is disposed on the upper surface of the blocking pillar.
7. The display panel according to claim 6, wherein the display panel further comprises an encapsulation layer, the encapsulation layer located in the pixel region comprises th inorganic encapsulation layer, an organic layer and a second inorganic encapsulation layer which are sequentially stacked from bottom to top along the thickness direction, and the encapsulation layer located in the blocking region and the isolation region only comprises th inorganic encapsulation layer and the second inorganic encapsulation layer which are sequentially stacked from bottom to top along the thickness direction.
8. The display panel according to claim 6, wherein an upper surface of the blocking pillar is higher than an upper surface of the intermediate layer of the pixel region by 2.5 to 3.5 micrometers.
A display device of , comprising the display panel of any of claims 1-8 through .
10, A method for manufacturing the display panel of any one of claims 1-8 through , the method comprising:

forming the intermediate layer on the substrate in the thickness direction;

opening the inclined groove in the middle layer of the isolation area, wherein the inclined groove is arranged around the opening area in a closed mode, the inclined groove comprises an th side face which is arranged in an inclined mode, and an included angle between the th side face and a th side face formed by the bottom face of the inclined groove is an acute angle;

forming the light emission function layer on the intermediate layer in the thickness direction, the light emission function layer located in the isolation region being broken at an th side of the inclined groove.
11. The manufacturing method of a display panel according to claim 10, wherein the inclined grooves are formed by a laser etching process.
12. The method for manufacturing a display panel according to claim 10, wherein the light-emitting functional layer is formed by an evaporation process.