CN110739342B

CN110739342B - Display panel, preparation method thereof and display device

Info

Publication number: CN110739342B
Application number: CN201911195447.8A
Authority: CN
Inventors: 张跳梅; 霍宇飞; 孙阔; 张振华; 王本莲
Original assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Priority date: 2019-11-28
Filing date: 2019-11-28
Publication date: 2022-10-11
Anticipated expiration: 2039-11-28
Also published as: CN110739342A

Abstract

The application provides a display panel, a preparation method thereof and a display device, which are used for disconnecting a light-emitting function layer positioned in an isolation region so as to cut off a path for transmitting water vapor and oxygen to a pixel region through the light-emitting function layer. The display panel is provided with a display area, and the display area comprises an opening area, an isolation area and a pixel area, wherein the isolation area is arranged around the opening area in a closed mode; the pixel region and the isolation region are both provided with an intermediate layer and a light-emitting functional layer which are sequentially stacked on the substrate along the thickness direction of the display panel; the middle layer positioned in the isolation area is provided with a chute which is closed and surrounds the opening area, the chute comprises a first side surface which is obliquely arranged, and a first included angle formed between the first side surface and the bottom surface of the chute is an acute angle; wherein the luminescent functional layer located in the isolation region is interrupted at the first side of the chute. The preparation method is used for manufacturing the display panel comprising the luminous area and the transparent area. The display device comprises the display panel.

Description

Display panel, preparation method thereof and display device

Technical Field

The application relates to the technical field of display, in particular to a display panel, a preparation method thereof and a display device.

Background

With the development of the OLED panel industry, large-size, large-viewing angle, full-screen gradually become a hot research field. The full-screen is a display screen with an ultrahigh screen occupation ratio, and the ideal full-screen display occupation ratio is 100%, namely, the front of the mobile phone is a display interface. However, the mobile phone is limited by the installation requirements of indispensable basic functional components of mobile phones such as a front camera of the mobile phone, a mobile phone receiver, a face recognition sensor, a light sensor and the like, and at present, a certain gap is required to be reserved above a mobile phone screen to install the functional components, so that display screens such as a bang screen, a water drop screen and the like are formed.

With the continuous development of the full-face screen, the vast consumers cannot meet the requirements of the design of the Liuhai screen, the water drop screen and the like, and the display panel 10 with the holes 11 appears immediately, as shown in fig. 1, the holes 11 can be used for placing cameras, so that the utilization rate of the screen is greatly increased, and the visual experience effect of the users is improved.

The main technical difficulty of punching holes in the display area is that the organic light-emitting material layer needs to be effectively broken at the edge of the hole, because the organic light-emitting material layer is very sensitive to water and oxygen, if the holes are punched directly, the organic light-emitting material layer is exposed at the edge, and a channel for transmitting water vapor and oxygen is formed, so that the pixel area fails to emit light and can not display normally.

Therefore, how to effectively block the path for transmitting water vapor and oxygen to the pixel region through the organic light emitting material layer is a problem to be solved in the art.

Disclosure of Invention

The application provides a display panel, a preparation method thereof and a display device, which are used for disconnecting a light-emitting function layer positioned in an isolation region so as to cut off a path for transmitting water vapor and oxygen to a pixel region through the light-emitting function layer.

According to a first aspect of embodiments of the present application, there is provided a display panel. The display panel comprises a substrate, the display panel is provided with a display area, and the display area comprises an opening area, an isolation area and a pixel area, wherein the isolation area is arranged around the opening area in a closed mode;

the pixel region and the isolation region are respectively provided with an intermediate layer and a light-emitting functional layer which are sequentially overlapped on the substrate along the thickness direction of the display panel;

the middle layer positioned in the isolation area is provided with a chute which is closed and surrounds the perforated area, the chute comprises a first side surface which is obliquely arranged, and a first included angle formed between the first side surface and the bottom surface of the chute is an acute angle;

wherein the luminescent functional layer located in the isolation region is interrupted at the first side of the chute.

Optionally, the intermediate layer is a planarization layer.

Optionally, the first included angle is 30 to 60 degrees.

Optionally, the intermediate layer includes a first intermediate layer and a second intermediate layer stacked in sequence from bottom to top along the thickness direction;

the chute comprises a first part and a second part which are sequentially overlapped from bottom to top along the thickness direction, the first part is positioned in the first middle layer, the second part is positioned in the second middle layer, each part is provided with the first side surface, and the first side surface of the first part and the first side surface of the second part are respectively positioned in different planes;

the light-emitting functional layer is broken at both the first side of the first portion and the first side of the second portion.

Optionally, the first side of the first portion is inclined in the same direction or in an opposite direction to the first side of the second portion.

Optionally, the display area further includes a blocking area, the blocking area is located between the isolation area and the pixel area, a blocking column located on the substrate is arranged in the blocking area, the blocking column is closed and surrounds the isolation area, the upper surface of the blocking column is higher than the upper surface of the middle layer of the pixel area, and the light-emitting functional layer is arranged on the upper surface of the blocking column.

Optionally, display panel still includes the encapsulated layer, is located the pixel region the encapsulated layer includes the edge thickness direction is by lower supreme first inorganic encapsulated layer, organic layer and the inorganic encapsulated layer of second of overlapping in proper order, is located block regionally with keep apart regionally the encapsulated layer only includes the edge thickness direction is by lower supreme first inorganic encapsulated layer and the inorganic encapsulated layer of second of overlapping in proper order.

Optionally, the upper surface of the blocking pillar is higher than the upper surface of the middle layer of the pixel region by 2.5 to 3.5 micrometers.

According to a second aspect of embodiments of the present application, there is provided a display device including the display panel as described above.

According to a third aspect of embodiments of the present application, there is provided a manufacturing method of a display panel, the manufacturing method being used for manufacturing the display panel, the manufacturing method including:

forming the intermediate layer on the substrate in the thickness direction;

the middle layer positioned in the isolation area is provided with the inclined groove, the inclined groove is arranged around the opening area in a closed mode, the inclined groove comprises a first side face which is arranged in an inclined mode, and a first included angle formed between the first side face and the bottom face of the inclined groove is an acute angle;

forming the light emitting functional layer on the intermediate layer in the thickness direction, the light emitting functional layer located in the isolation region being broken at the first side surface of the inclined groove.

Optionally, the chute is formed by a laser etching process.

Optionally, the light emitting functional layer is formed by an evaporation process.

According to the display panel, the preparation method thereof and the display device, the inclined groove is arranged on the middle layer of the isolation area, the inclined groove is provided with the first side face which is arranged in an inclined mode, so that the light-emitting functional layer is disconnected on the first side face of the inclined groove, a path for transmitting water vapor and oxygen to the pixel area through the light-emitting functional layer is cut off, and the water vapor and the oxygen are prevented from entering the pixel area from the opening of the opening area along the light-emitting functional layer and corroding the pixel area.

Drawings

Fig. 1 is a schematic top view of a display panel in the prior art.

Fig. 2 is a schematic top view of the display panel of embodiment 1.

Fig. 3 is a schematic partial cross-sectional view of a display panel according to embodiment 1.

Fig. 4 is a partial structure enlarged view of a portion a of fig. 3.

Fig. 5 (a) -5 (d) are process flow diagrams of a method of manufacturing a display panel according to an exemplary embodiment.

Fig. 6 is a schematic partial cross-sectional view of a display panel according to embodiment 2.

Fig. 7 is a partial structure enlarged view of a portion B of fig. 6.

Fig. 8 is a partial cross-sectional structure diagram of a display panel according to another embodiment of example 2.

Fig. 9 (a) to 9 (e) are process flow charts of the manufacturing method of the display panel of example 2.

Description of reference numerals in fig. 1

Display panel 10

Hole 11

Description of reference numerals in fig. 2 to 9

Display panel 20

Display area 21

Open area 22

Isolation region 23

Barrier region 24

Pixel region 25

Substrate 30

Thin film transistor 40

Active layer 42

Gate insulating layer 43

Gate 44

Source electrode 46

Drain 47

Intermediate layer 50

Chute 51

First portion 51a

Second part 51b

First side 511

First side 511a of the first part

First side 511b of the second portion

Second side 512

First intermediate layer 52

Second intermediate layer 53

Light emitting device 60

Light-emitting functional layer 61

Anode 62

Pixel defining layer 63

Blocking post 70

Encapsulation layer 80

Thickness direction T of display panel

First included angle alpha

Second included angle beta

Thickness t1 of the planarization layer

Length L1 of chute

Length of the first portion L11

Length L12 of the second portion

The interval length l1 between two adjacent chutes

The upper surface of the barrier pillar is higher than the upper surface of the intermediate layer by a distance d1

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus consistent with certain aspects of the present application, as detailed in the appended claims.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this application belongs. The use of the terms "a" or "an" and the like in the description and in the claims of this application do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprising" or "comprises", and the like, means that the element or item listed as preceding "comprising" or "includes" covers the element or item listed as following "comprising" or "includes" and its equivalents, and does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "plurality" includes two, and is equivalent to at least two. As used in this specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

Example 1

As will be understood from fig. 2 to fig. 4, the present embodiment provides a display panel 20 and a display device including the same.

The display panel 20 has a display area 21, and the display area 21 includes an opening area 22, an isolation area 23 disposed to close around the opening area 22, and a pixel area 25 disposed to surround the isolation area 23. The above-described opening region 22 is used for assembling a camera or the like after the opening process, and the shape of the opening region 22 may be, for example, a circular shape as shown in the drawing, or may be, for example, another regular shape such as a rectangular shape.

The display panel 20 includes a base 30, and the base 30 is not limited herein, and the base 30 may be a substrate base plate; the film may be composed of a base substrate and a film layer provided on the base substrate.

The pixel region 25 and the isolation region 23 are each provided with the intermediate layer 50 and the light-emitting functional layer 61 stacked in this order on the substrate 30 in the thickness direction T of the display panel 20. The intermediate layer 50 in the isolation region 23 is provided with an inclined groove 51 which closely surrounds the opening region 22, the inclined groove 51 comprises a first side surface 511 which is obliquely arranged, and a first included angle alpha formed by the first side surface 511 and the bottom surface of the inclined groove 51 is an acute angle. In this embodiment, the inclined groove 51 further includes a second side surface 512 disposed opposite to the first side surface 511, and a second included angle β formed between the second side surface 512 and the bottom surface of the inclined groove 51 is an obtuse angle.

Wherein the light-emitting functional layer 61 located in the isolation region 23 is broken at the first side 511 of the diagonal groove 51. This is because, during the evaporation of the light-emitting functional layer 61, the first side surface 511 of the inclined groove 51 is shielded by the intermediate layer 50 thereon, so that the light-emitting functional layer 61 is disconnected at the first side surface 511 of the inclined groove 51, thereby blocking a path for transmitting water vapor and oxygen to the pixel region 25 through the light-emitting functional layer 61, and preventing the water vapor and oxygen from entering the pixel region 25 from the opening of the aperture region 22 along the light-emitting functional layer 61 to corrode the pixel region 25.

In the present embodiment, the inclined grooves 51 are not limited to one, and when the number of the inclined grooves 51 is plural, the plural inclined grooves 51 are provided at intervals. The length L1 of the inclined grooves 51 is 6 to 13 micrometers, and the interval length L1 between two adjacent inclined grooves 51 is 10 to 17 micrometers. The depth of the diagonal grooves 51 is equal to the thickness of the intermediate layer 50, but is not limited thereto, and a portion of the intermediate layer 50 may remain under the bottom surfaces of the diagonal grooves 51, and the thickness of the intermediate layer 50 under the bottom surfaces of the diagonal grooves 51 is not more than 0.3 μm.

The pixel region 25 in the display region 21 is used for displaying a picture, and the pixel region 25 includes a plurality of sub-pixels including at least a first color sub-pixel, a second color sub-pixel, and a third color sub-pixel. Illustratively, the first color sub-pixel, the second color sub-pixel, and the third color sub-pixel are a red sub-pixel, a green sub-pixel, and a blue sub-pixel, respectively. For the first color sub-pixels, the second color sub-pixels and the third color sub-pixels, the distribution thereof may refer to the conventional arrangement in the art.

Each sub-pixel includes, in addition to the light-emitting functional layer 61, an anode 62 disposed on a side of the light-emitting functional layer 61 close to the substrate 30, and a cathode (not shown) disposed on a side far from the substrate 30. In each sub-pixel, the anode 62, the light-emitting functional layer 61, and the cathode constitute one light-emitting device 60. The light emitting device 60 further includes a pixel defining layer 63, and the pixel defining layer 63 serves to separate adjacent light emitting devices 60 from each other to prevent crosstalk. Wherein the pixel defining layer 63 may cover a portion of the anode 62, i.e., the anode 62 is formed first, and the pixel defining layer 63 is formed after the anode 62.

Among them, the light emitting function layer 61 includes at least a light emitting layer. As shown in the figure, the light-emitting function layer 61 may further include an Electron Transport Layer (ETL), an Electron Injection Layer (EIL), a Hole Transport Layer (HTL), and a Hole Injection Layer (HIL) in addition to the light-emitting layer. Of course, the light-emitting function layer 61 may include a part of ETL, EIL, HTL, HIL in addition to the light-emitting layer.

A Thin-film transistor (TFT) 40 is also provided between the substrate 30 and the light emitting device 60 in the pixel region 25. The thin film transistor 40 includes an active layer 42, a gate insulating layer 43, a gate electrode 44, an interlayer insulating layer (not shown), and source and drain

electrodes

46 and 47, and the drain and

source electrodes

47 and 46 are connected to the active layer 42. The drain electrode 47 of the thin film transistor 40 is electrically connected to the anode 62 of the light emitting device 60.

In the present embodiment, the intermediate layer 50 is a planarization layer. The planarization layer is disposed between the thin film transistor 40 and the light emitting device 60. The thickness t1 of the planarization layer is 1 to 3 micrometers.

The planarization layer has a thickness advantage with respect to a layer structure in the thin film transistor 40, such as an interlayer insulating layer. The first side surface 511, which is formed by the inclined groove 51 and the bottom surface of the inclined groove 51, and has an acute first angle α is formed in the inclined groove 51, so that the path for transmitting water vapor and oxygen to the pixel region through the light-emitting functional layer 61 can be better blocked due to the long cross section.

Optionally, the first included angle α is 30 to 60 degrees, and an excessively small angle of the first included angle α is not favorable for forming the chute 51 by laser etching; meanwhile, the angle of the first included angle α cannot be too large, so that the light-emitting functional layer 61 cannot be cut off at the first side surface 511 of the inclined groove 51 during the evaporation process. Most preferably, the first included angle α is 45 degrees.

In this embodiment, the display area 21 further includes a blocking area 24, the blocking area 24 is located between the isolation area 23 and the pixel area 25, a blocking pillar 70 is disposed on the substrate 30 in the blocking area 24, the blocking pillar 70 is disposed around the isolation area 23 in a closed manner, an upper surface of the blocking pillar 70 is higher than an upper surface of the intermediate layer 50 of the pixel area 25, and the light emitting function layer 61 is disposed on the upper surface of the blocking pillar 70. The upper surface of the blocking post 70 is higher than the upper surface of the intermediate layer 50 of the pixel region 25 by a distance d1 of 2.5 to 3.5 micrometers. Preferably, the upper surface of the barrier pillar 70 is higher than the upper surface of the intermediate layer 50 of the pixel region 25 by a distance d1 of 3 μm.

In this embodiment, the display panel 20 further includes an encapsulation layer 80, the encapsulation layer 80 located in the pixel region 25 includes a first inorganic encapsulation layer, an organic layer, and a second inorganic encapsulation layer sequentially stacked from bottom to top along the thickness direction T, and the encapsulation layer 80 located in the blocking region 24 and the isolation region 23 only includes a first inorganic encapsulation layer and a second inorganic encapsulation layer sequentially stacked from bottom to top along the thickness direction.

The first inorganic encapsulating layer and the second inorganic encapsulating layer serve to prevent moisture and oxygen entering from the front surface of the display panel 20 from entering the light emitting functional layer 61. The materials of the first inorganic encapsulation layer and the second inorganic encapsulation layer are inorganic substances, such as silicon nitride and/or silicon oxide. The organic layer is used to prevent the inorganic particles in the first inorganic encapsulation layer from affecting the preparation of the second inorganic encapsulation layer, resulting in the cracking of the film layer of the second inorganic encapsulation layer, and therefore, the organic layer is required to be disposed to planarize the first inorganic encapsulation layer.

Since the material of the organic layer has a certain fluidity, in order to facilitate the preparation of the organic layer, the blocking pillars 70 are provided to intercept the flow of the material of the organic layer toward the side near the open pore region 22. The longitudinal sectional shape of the barrier post 70 may be, for example, trapezoidal, rectangular, or the like. In the case where the longitudinal sectional shape of the barrier post 70 is a trapezoid, the length of the top side of the trapezoid is smaller than the length of the bottom side thereof.

In the present embodiment, the blocking post 70 is not limited to one, and when the number of the blocking posts 70 is plural, the plural blocking posts 70 are disposed at intervals. The plurality of barrier pillars 70 is advantageous to further intercept the material of the organic layer, and to prevent the material of the organic layer from spreading toward the open pore region 22 due to insufficient interception capability of the single barrier pillar 70. The length of the single barrier pillar 70 is 40 to 60 micrometers, so that the upper surface of the barrier pillar 70 forms a plane to prevent the upper surface of the barrier pillar 70 from forming a sharp corner to affect the planar effect of the display panel 20.

According to a second aspect of the embodiments of the present application, there is provided a display device including the display panel 20 as above.

Based on the same inventive concept, embodiments of the present application provide a method of manufacturing a display panel 20, as shown in fig. 5 (a) -5 (d). The manufacturing method is used for manufacturing the display panel 20, as described above, the display panel 20 has the display area 21, and the display area 21 includes the opening area 22, the isolation area 23 disposed around the opening area 22 in a closed manner, and the pixel area 25 disposed around the isolation area 23. The preparation method comprises the following steps:

step 100: forming the intermediate layer on the substrate in the thickness direction;

step 200: the middle layer positioned in the isolation area is provided with the inclined groove, the inclined groove is arranged around the opening area in a closed mode, the inclined groove comprises a first side face which is arranged in an inclined mode, and a first included angle formed between the first side face and the bottom face of the inclined groove is an acute angle;

step 300: and forming the light-emitting functional layer on the intermediate layer along the thickness direction, wherein the light-emitting functional layer in the isolation region is broken at the first side surface of the inclined groove.

Prior to step 100, the fabrication method includes forming a thin film transistor 40 on a substrate 30. Specifically, an active layer thin film is formed on the substrate 30 and patterned to form the active layer 42; forming a gate insulating film on the active layer 42; forming a first conductive film on the gate insulating film and patterning the first conductive film to form a gate electrode 44; an interlayer insulating film is formed on the gate electrode 44, and the interlayer insulating film and the gate insulating film are etched to form a source electrode contact hole 46 and a drain electrode contact hole 47, which may be, for example, dry etching, to form the interlayer insulating layer, the gate insulating layer 43.

Subsequently, a second conductive film is formed on the interlayer insulating layer and patterned to form a source electrode 46 and a drain electrode 47, the source electrode 46 being connected to the active layer 42 through a source electrode 46 contact hole, and the drain electrode 47 being connected to the active layer 42 through a drain electrode 47 contact hole.

In step 100, as shown in fig. 5 (a), an intermediate layer 50 (i.e., a planarization layer) is formed on the source electrode 46 and the drain electrode 47. Specifically, a planarization layer film is formed on the source and drain

electrodes

46 and 47, and the planarization layer film is patterned to form via holes to form a planarization layer.

In step 200, as shown in fig. 5 (b), an inclined groove 51 is formed in the intermediate layer 50 (i.e., the planarization layer) located in the isolation region 23, the inclined groove 51 is disposed to closely surround the opening region 22, the inclined groove 51 includes an obliquely disposed first side surface 511, and a first included angle α formed by the first side surface 511 and a bottom surface of the inclined groove 51 is an acute angle. The inclined groove 51 is formed by a laser etching process, and the irradiation direction of the laser is inclined. The laser etching process has the advantages of being capable of accurately controlling the etching depth and simple in process.

In step 300, as shown in fig. 5 (c), a third conductive film is formed on the intermediate layer 50 (i.e., the planarization layer), and the third conductive film is patterned to form an anode 62, wherein the anode 62 is electrically connected to the drain 47 through a via hole on the planarization layer; forming a pixel defining layer film on the anode 62, patterning the pixel defining layer film to form a pixel defining layer 63, the pixel defining layer 63 having an opening region to expose the anode 62; forming a light emitting function layer 61 in an opening region of the pixel defining layer 63; a fourth conductive film is formed on the light emitting function layer 61 and patterned to form a cathode, to complete the fabrication of the light emitting device 60. Wherein the light emitting functional layer 61 is formed by an evaporation process such that the light emitting functional layer 61 is disconnected by the first side 511 of the inclined groove 51 during the evaporation process.

In this embodiment, the patterning of the active layer film, the first conductive film, the second conductive film, the third conductive film and the fourth conductive film includes processes of coating a photoresist, exposing, developing, etching, and the like. The patterning of the planarization layer film and the pixel defining layer film includes processes of coating photoresist, exposing, developing, and the like.

Optionally, before step 300, that is, before forming the light-emitting functional layer 61 on the intermediate layer 50, the method for manufacturing the display panel 20 further includes:

a barrier pillar 70 is formed in the barrier region 24 between the isolation region 23 and the pixel region 25, the barrier pillar 70 being disposed closely around the isolation region 23, an upper surface of the barrier pillar 70 being higher than an upper surface of the intermediate layer 50 of the pixel region 25.

In step 300, the step of forming the light-emitting function layer 61 on the intermediate layer 50 further includes: the light emitting function layer 61 is formed on the barrier ribs 70.

After step 300, i.e., after forming the light emitting function layer 61, as shown in fig. 5 (d), the method for manufacturing the display panel 20 further includes:

the encapsulation layer 80 is formed on the first side 511 of the light-emitting functional layer 61 and the inclined groove 51, the encapsulation layer 80 located in the pixel region 25 includes a first inorganic encapsulation layer, an organic layer, and a second inorganic encapsulation layer that are sequentially stacked from bottom to top along the thickness direction T, and the encapsulation layer 80 located in the blocking region 24 and the isolation region 23 only includes a first inorganic encapsulation layer and a second inorganic encapsulation layer that are sequentially stacked from bottom to top along the thickness direction T.

After the encapsulation layer 80 is formed, the display panel 20 with holes is obtained by laser dicing.

Example 2

As will be understood from fig. 6 to 8, the overall structure of the display panel of the present embodiment is basically the same as that of embodiment 1, and the difference is that the intermediate layer 50 includes a first intermediate layer 52 and a second intermediate layer 53 stacked in sequence from bottom to top along the thickness direction T. The inclined groove 51 includes a first portion 51a and a second portion 51b stacked in the thickness direction T from bottom to top, the first portion 51a is located in the first intermediate layer 52, the second portion 51b is located in the second intermediate layer 53, each portion has a first side surface, and the first side surface 511a of the first portion 51a and the first side surface 511b of the second portion 51b are located in different planes, respectively. The light-emitting functional layer 61 is broken at both the first side 511a of the first portion 51a and the first side 511b of the second portion 51 b. In this way, by forming the two first side surfaces 511 in the same inclined groove 51, the light emitting functional layer 61 can be cut off twice in the same inclined groove 51, so that it can be better prevented that moisture and oxygen enter the pixel region 25 from the opening of the aperture region 22 along the light emitting functional layer 61 to corrode the pixel region 25.

As shown in fig. 6, the first side 511a of the first portion 51a is inclined in the opposite direction to the first side 511b of the second portion 51 b. In the present embodiment, as shown in fig. 7, the length L11 of the first portion 51a of the diagonal groove 51 is 6 to 10 micrometers, and the length L12 of the second portion 51b of the diagonal groove 51 is 10 to 13 micrometers.

As shown in fig. 8, in another embodiment of the present embodiment, the inclination direction of the first side 511a of the first portion 51a and the inclination direction of the first side 511b of the second portion 51b may be the same.

Based on the same inventive concept, embodiments of the present application provide a method for manufacturing a display panel 20, as shown in fig. 9 (a) to 9 (e). The overall steps of the preparation method of this example are essentially the same as those in example 1, with the following differences:

in step 100, as shown in fig. 9 (a), an intermediate layer 50 is formed on the source electrode 46 and the drain electrode 47, the intermediate layer 50 including a first intermediate layer 52 and a second intermediate layer 53. Specifically, a first planarizing layer film is formed on the source and drain

electrodes

46 and 47, and patterned to form via holes to form a first planarizing layer, i.e., a first intermediate layer 52; forming a second planarizing layer film on the first planarizing layer, and patterning the second planarizing layer film to form a via hole to form a second planarizing layer, that is, a second intermediate layer 53;

in step 200, as shown in fig. 9 (b), a first portion 51a of the inclined groove 51 is formed in the first planarization layer by a laser etching process, the first portion 51a of the inclined groove 51 being inclined to the left (or right); as shown in fig. 9 (c), a second portion 51b of the inclined groove 51 is formed in the second planarization layer again by the laser etching process, and the second portion 51b of the inclined groove 51 is inclined to the right (or left); each of the portions has a first side, and the first side 511a of the first portion 51a and the first side 511b of the second portion 51b are located in different planes, respectively.

Subsequently, steps after step 200 are the same as in example 1. As shown in fig. 9 (d), the light-emitting functional layer 61 is formed on the intermediate layer 50 in the thickness direction T, and the light-emitting functional layer 61 located in the isolation region 23 is broken at both the first side 511a of the first portion 51a and the first side 511b of the second portion 51 b; as shown in fig. 9 (e), the encapsulation layer 80 is formed on the light-emitting functional layer 61, the first side surface 511a of the first portion 51a of the inclined groove 51, and the first side surface 511b of the second portion 51b, the encapsulation layer 80 located in the pixel region 25 includes a first inorganic encapsulation layer, an organic layer, and a second inorganic encapsulation layer that are sequentially stacked from bottom to top in the thickness direction T, and the encapsulation layer 80 located in the blocking region 24 and the isolation region 23 includes only the first inorganic encapsulation layer and the second inorganic encapsulation layer that are sequentially stacked from bottom to top in the thickness direction T.

In the display panel, the manufacturing method thereof and the display device of the embodiment, the two first side surfaces (the first side surface 511a of the first portion 51a and the first side surface 511b of the second portion 51 b) are formed in the same inclined groove, so that the light emitting functional layer is disconnected twice in the same inclined groove, and thus, moisture and oxygen can be better prevented from entering the pixel region from the opening of the opening region along the light emitting functional layer to corrode the pixel region.

The above description is only a preferred embodiment of the present application and should not be taken as limiting the present application, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A display panel, the display panel includes the substrate, characterized by, the display panel has display interval, the said display interval includes the open area, closes the isolated area that sets up around the open area, and pixel area set up around the isolated area;

the pixel region and the isolation region are respectively provided with an intermediate layer, a light-emitting functional layer and a packaging layer which are sequentially overlapped on the substrate along the thickness direction of the display panel, wherein the intermediate layer is a planarization layer;

the middle layer positioned in the isolation area is provided with a chute which is closed and surrounds the perforated area, the chute comprises a first side surface and a second side surface which are obliquely arranged, a first included angle formed by the first side surface and the bottom surface of the chute is an acute angle, the first side surface and the second side surface are oppositely arranged, and a second included angle formed by the second side surface and the bottom surface of the chute is an obtuse angle;

wherein the light-emitting functional layer located in the isolation region is broken at the first side of the diagonal groove, and a part of the light-emitting functional layer is located in the diagonal groove;

the intermediate layer comprises a first intermediate layer and a second intermediate layer which are sequentially overlapped from bottom to top along the thickness direction;

the light-emitting functional layer is disconnected on the first side face of the first part and the first side face of the second part, and the packaging layer is not disconnected on the first side face of the first part and the first side face of the second part.

2. The display panel of claim 1, wherein the first included angle is 30 degrees to 60 degrees.

3. The display panel according to claim 1, wherein a direction of inclination of the first side of the first portion is the same as or opposite to a direction of inclination of the first side of the second portion.

4. The display panel according to claim 1, wherein the display region further includes a blocking region between the isolation region and the pixel region, wherein a blocking pillar on the substrate is disposed in the blocking region, the blocking pillar is disposed to surround the isolation region in a closed state, an upper surface of the blocking pillar is higher than an upper surface of an intermediate layer of the pixel region, and the light emitting functional layer and the encapsulation layer are disposed on the upper surface of the blocking pillar.

5. The display panel according to claim 4, wherein the encapsulation layers in the pixel region include a first inorganic encapsulation layer, an organic layer, and a second inorganic encapsulation layer that are sequentially stacked from bottom to top along the thickness direction, and the encapsulation layers in the blocking region and the isolation region include only a first inorganic encapsulation layer and a second inorganic encapsulation layer that are sequentially stacked from bottom to top along the thickness direction.

6. The display panel according to claim 4, wherein an upper surface of the barrier pillar is higher than an upper surface of the intermediate layer of the pixel region by 2.5 to 3.5 micrometers.

7. A display device characterized by comprising the display panel according to any one of claims 1 to 6.

8. A method for manufacturing a display panel according to any one of claims 1 to 6, the method comprising:

forming the intermediate layer on the substrate in the thickness direction;

the middle layer positioned in the isolation area is provided with the inclined groove, the inclined groove is arranged around the opening area in a closed mode, the inclined groove comprises a first side face which is arranged in an inclined mode, and a first included angle formed by the first side face and the bottom face of the inclined groove is an acute angle;

9. The manufacturing method of a display panel according to claim 8, wherein the inclined grooves are formed by a laser etching process.

10. The method for manufacturing a display panel according to claim 9, wherein the light-emitting functional layer is formed by an evaporation process.