CN110730557A - 高速柔性电路板、光组件和光模块 - Google Patents
高速柔性电路板、光组件和光模块 Download PDFInfo
- Publication number
- CN110730557A CN110730557A CN201910837848.2A CN201910837848A CN110730557A CN 110730557 A CN110730557 A CN 110730557A CN 201910837848 A CN201910837848 A CN 201910837848A CN 110730557 A CN110730557 A CN 110730557A
- Authority
- CN
- China
- Prior art keywords
- channel
- signal
- circuit board
- hole
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 120
- 238000004806 packaging method and process Methods 0.000 claims abstract description 15
- 230000005540 biological transmission Effects 0.000 abstract description 9
- 238000004891 communication Methods 0.000 abstract description 7
- 239000002184 metal Substances 0.000 description 10
- 238000005538 encapsulation Methods 0.000 description 7
- 230000008054 signal transmission Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
- H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4237—Welding
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
- G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
- Semiconductor Lasers (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910837848.2A CN110730557B (zh) | 2019-09-05 | 2019-09-05 | 高速柔性电路板、光组件和光模块 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910837848.2A CN110730557B (zh) | 2019-09-05 | 2019-09-05 | 高速柔性电路板、光组件和光模块 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110730557A true CN110730557A (zh) | 2020-01-24 |
CN110730557B CN110730557B (zh) | 2020-08-28 |
Family
ID=69217907
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910837848.2A Active CN110730557B (zh) | 2019-09-05 | 2019-09-05 | 高速柔性电路板、光组件和光模块 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN110730557B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112510479A (zh) * | 2020-12-02 | 2021-03-16 | 南昌攀藤科技有限公司 | 激光装置 |
CN113721330A (zh) * | 2021-08-31 | 2021-11-30 | 青岛海信宽带多媒体技术有限公司 | 一种高速激光器组件及光模块 |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1855465A (zh) * | 2005-04-28 | 2006-11-01 | 株式会社半导体能源研究所 | 半导体器件和显示器 |
CN101644734A (zh) * | 2008-08-07 | 2010-02-10 | 和硕联合科技股份有限公司 | 电路板负片检查方法及系统 |
CN102110920A (zh) * | 2009-12-23 | 2011-06-29 | 上海贝尔股份有限公司 | 高速连接器封装和封装方法 |
CN102970822A (zh) * | 2011-08-31 | 2013-03-13 | 英业达股份有限公司 | 一种热风焊盘结构 |
CN103153001A (zh) * | 2013-02-05 | 2013-06-12 | 浙江宇视科技有限公司 | 一种pcb板及加工方法 |
CN103269562A (zh) * | 2013-04-25 | 2013-08-28 | 华为技术有限公司 | 一种应用于电路板的滤波装置 |
CN103929876A (zh) * | 2013-01-11 | 2014-07-16 | 中兴通讯股份有限公司 | 一种印制电路板组合焊盘 |
CN107580409A (zh) * | 2017-11-10 | 2018-01-12 | 郑州云海信息技术有限公司 | 一种新型过孔结构 |
CN109451659A (zh) * | 2018-12-18 | 2019-03-08 | 广东浪潮大数据研究有限公司 | 一种pcb板 |
US10231325B1 (en) * | 2016-12-20 | 2019-03-12 | Juniper Networks, Inc. | Placement of vias in printed circuit board circuits |
CN109633832A (zh) * | 2018-12-17 | 2019-04-16 | 青岛海信宽带多媒体技术有限公司 | 光模块及其焊接方法 |
-
2019
- 2019-09-05 CN CN201910837848.2A patent/CN110730557B/zh active Active
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1855465A (zh) * | 2005-04-28 | 2006-11-01 | 株式会社半导体能源研究所 | 半导体器件和显示器 |
CN101644734A (zh) * | 2008-08-07 | 2010-02-10 | 和硕联合科技股份有限公司 | 电路板负片检查方法及系统 |
CN102110920A (zh) * | 2009-12-23 | 2011-06-29 | 上海贝尔股份有限公司 | 高速连接器封装和封装方法 |
CN102970822A (zh) * | 2011-08-31 | 2013-03-13 | 英业达股份有限公司 | 一种热风焊盘结构 |
CN103929876A (zh) * | 2013-01-11 | 2014-07-16 | 中兴通讯股份有限公司 | 一种印制电路板组合焊盘 |
CN103153001A (zh) * | 2013-02-05 | 2013-06-12 | 浙江宇视科技有限公司 | 一种pcb板及加工方法 |
CN103269562A (zh) * | 2013-04-25 | 2013-08-28 | 华为技术有限公司 | 一种应用于电路板的滤波装置 |
US10231325B1 (en) * | 2016-12-20 | 2019-03-12 | Juniper Networks, Inc. | Placement of vias in printed circuit board circuits |
CN107580409A (zh) * | 2017-11-10 | 2018-01-12 | 郑州云海信息技术有限公司 | 一种新型过孔结构 |
CN109633832A (zh) * | 2018-12-17 | 2019-04-16 | 青岛海信宽带多媒体技术有限公司 | 光模块及其焊接方法 |
CN109451659A (zh) * | 2018-12-18 | 2019-03-08 | 广东浪潮大数据研究有限公司 | 一种pcb板 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112510479A (zh) * | 2020-12-02 | 2021-03-16 | 南昌攀藤科技有限公司 | 激光装置 |
CN113721330A (zh) * | 2021-08-31 | 2021-11-30 | 青岛海信宽带多媒体技术有限公司 | 一种高速激光器组件及光模块 |
CN113721330B (zh) * | 2021-08-31 | 2023-01-24 | 青岛海信宽带多媒体技术有限公司 | 一种高速激光器组件及光模块 |
Also Published As
Publication number | Publication date |
---|---|
CN110730557B (zh) | 2020-08-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10243621B2 (en) | Tightly-coupled near-field communication-link connector-replacement chips | |
CN108732691B (zh) | 光组件、光模块、以及光传输装置 | |
JP5580994B2 (ja) | 光モジュール | |
US8655119B2 (en) | Connection device and optical device | |
US7260285B2 (en) | Optical module with flexible substrate | |
JP7295634B2 (ja) | 光サブアッセンブリ及び光モジュール | |
US9530907B2 (en) | Optical module and method of manufacturing optical module | |
KR101512816B1 (ko) | 플렉시블 인쇄회로기판 및 이를 포함하는 광통신 모듈 | |
US7991029B2 (en) | Optical module | |
US10135223B2 (en) | Optical module | |
US20120207437A1 (en) | Optical module | |
US10624204B2 (en) | Optical module and optical transmission equipment | |
US20120032752A1 (en) | Vertical quasi-cpwg transmission lines | |
CN110730557B (zh) | 高速柔性电路板、光组件和光模块 | |
JP6445268B2 (ja) | 光モジュール、光送受信モジュール、及びフレキシブル基板 | |
US7553092B2 (en) | Optical module and optical module package | |
KR20040110829A (ko) | 티오 캔 구조의 광수신 모듈 | |
JP3895331B2 (ja) | To−can構造の光モジュール | |
US7316509B2 (en) | Apparatus for electrical and optical interconnection | |
WO2018134967A1 (ja) | 光モジュール及びcanパッケージ | |
CN214708173U (zh) | 一种高速柔板结构及光模块 | |
CN110798967A (zh) | 软板结构、to光模块及光传输装置 | |
CN114040274A (zh) | 一种应用于xgspon光模块的柔性电路 | |
US11089683B2 (en) | Optical module | |
KR100883128B1 (ko) | 광 하이브리드 모듈 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: High speed flexible circuit board, optical component and optical module Effective date of registration: 20211214 Granted publication date: 20200828 Pledgee: Bank of China Limited Guangzhou Development Zone Branch Pledgor: Guangwei Technology (Guangzhou) Co.,Ltd. Registration number: Y2021980014962 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20200828 Pledgee: Bank of China Limited Guangzhou Development Zone Branch Pledgor: Guangwei Technology (Guangzhou) Co.,Ltd. Registration number: Y2021980014962 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: High speed flexible circuit boards, optical components, and optical modules Granted publication date: 20200828 Pledgee: Bank of China Limited Guangzhou Development Zone Branch Pledgor: Guangwei Technology (Guangzhou) Co.,Ltd. Registration number: Y2024980021256 |