CN110719699B - 在基板的侧部上形成布线的方法 - Google Patents
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Abstract
在基板的侧部上形成布线的方法。本公开涉及一种在基板上形成布线的方法,更具体地,涉及一种在基板的侧部上形成布线的方法,其中使用溅射以在基板的侧部上形成布线,从而形成具有低电阻的布线并由此提供改进了电特性的基板。作为根据本公开的在基板的侧部上形成布线的方法,一种形成基板的布线的方法包括:通过将沉积掩模附接到基板来对其上将要形成布线的基板侧部进行掩模;以及在将经掩模的基板引入腔室中之后,基于溅射在基板侧部上形成布线。
Description
技术领域
本公开涉及一种在基板上形成布线的方法,更具体地,涉及一种在基板的侧部上形成布线的方法,在该方法中使用溅射来在基板的侧部上形成布线,从而形成具有低电阻的布线并且从而提供了电特性提高的基板。
背景技术
用于连接元件,供电和收发电信号的电路的布线形成在安装有各种半导体和类似电子元件的基板上。为了在基板上形成布线,可以使用各种布线形成方法。
最近,已经采用了丝网印刷技术在基板上形成布线。换句话说,基于丝网印刷技术在基板上形成布线的方法是指采用丝网印刷技术在基板上涂敷银膏并形成高导电性布线的方法。
然而,这种基于丝网印刷技术在基板上形成布线的传统方法具有以下缺点:由于布线的高电阻,待涂覆材料的外部影响以及在涂敷材料时材料的低均匀性而导致的布线电路的电特性不均匀。此外,这种湿法工序的缺点在于最终产品的物理电特性受杂质污染的影响。
此外,近来对用于形成无边框基板以实现大屏幕和高清晰度显示器的技术的兴趣日益增长。为了提供无边框基板,需要一种技术来在基板的侧面上形成布线。
关于用于提供无边框基板的技术,韩国专利No.10-1613773(下文中,称为“相关技术”)公开了一种触摸面板,其中连接到Tx电极图案和Rx电极图案的金属布线延伸并连接到显示设备的侧面和背面,以减小边框宽度并增加显示区域。
相关技术仅公开了通过在基板的侧面上形成布线来减小边框宽度的面板,但是没有明确地教导在基板的侧面上形成布线的具体方法。
此外,相关技术没有提出在基板的侧部上形成具有低电阻并且电特性优异的布线的具体方法。
发明内容
因此,本发公开被构思以解决上述问题,并且本公开的一个方面是提供一种在基板的侧部上形成布线的方法,其中使用溅射以在基板的侧部上形成布线,从而形成具有低电阻的布线,并由此提供改进了电特性的基板。
本公开的另一方面提供了一种在基板的侧部上形成布线的方法,其中基板的顶部电路图案和底部电路图案经由通过溅射到侧部所形成的布线可电连接,从而去除边框,并由此实现大屏幕和高清晰度显示设备。
根据本公开的一个实施方式,提供了一种形成基板的布线的方法,该方法包括以下步骤:通过将沉积掩模附接到基板来对其上将要形成布线的基板侧部进行掩模;以及在将经掩模的基板引入腔室中之后,基于溅射在基板侧部上形成布线。
基板侧部可以包括基板的侧面以及基板的与侧面相邻的顶部和底部,并且基板侧部上的布线可以被配置为将在基板的顶部上形成的顶部电路图案和在基板的底部上形成的底部电路图案电连接。
可以使用设置为面向基板的侧面的中央源靶和设置在中央源靶的相反两侧并朝向基板倾斜的侧源靶,基于溅射在腔室内部沉积要在基板侧部上形成的布线。
基板可以被设置为在腔室内部安装于夹具,相对于基板的长度方向能旋转,并且能调节角度以面向中央源靶。
附图说明
根据以下结合附图进行的示例性实施方式的描述,本公开的以上和/或其它方面将变得显而易见并且更容易理解,在附图中:
图1是示出根据本公开的一个实施方式的在基板的侧部上形成布线的方法的流程图;
图2示出了根据本公开的一个实施方式的应用在基板的侧部上形成布线的方法的基板的示例性截面图;
图3示出了根据本公开的一个实施方式的通过在基板的侧部上形成布线的方法在其侧部上形成有布线的基板的截面图;以及
图4示出了根据本公开的一个实施方式的为了实施在基板的侧部上形成布线的方法所采用的溅射设备的示意性截面图。
[附图标记]
10:基板侧部 11:侧面
13:邻侧顶部 15:邻侧底部
30:基板 50:显示元件
60:顶部电路图案 70:控制器元件
80:底部电路图案 90:侧部布线
100:显示设备 110:真空腔室
130:源靶 131:中央源靶
133:侧源靶 150:夹具连接器
具体实施方式
图1是示出根据本公开的一个实施方式的在基板的侧部上形成布线的方法的流程图。
如图1所示,根据本公开的实施方式的在基板的侧部上形成布线的方法首先对其上将要形成布线的基板侧部(参见图2中的“10”)执行掩模。具体地,溅射方法是根据本公开的在基板的侧部上形成布线的关键方法,因此将沉积掩模附接到基板,从而对要形成有布线的基板侧部10进行掩模(s10)。
基板侧部的掩模操作s10包括将沉积掩模附接到基板(参见图2至图4中的'30'),从而能够通过溅射在基板侧部10上沉积布线的操作。沉积掩模被形成为具有“[”形状,由此附接到基板的顶部和底部以及基板30的侧部10。
沉积掩模可以由膜、金属和印墨形成。具体地,沉积掩模可以以聚酰亚胺(PI)膜的形式给出。当将PI膜用作沉积掩模时,沉积掩模以各种粘合剂位于其间的方式紧密地附接到包括基板侧部10的基板30。
由于粘合剂插置在PI膜掩模和基板30之间,PI膜掩模首先经过临时接合工序,以便在预定处理条件下临时附接到基板30,然后经过确切接合工序以便在预定处理条件下接合到基板30。
当完成将沉积掩模接合到包括其上将要形成布线的基板侧部10的基板30的掩模操作时,对掩模基板30执行溅射操作。也就是说,将掩模基板30引入腔室(参见图4中的“110”),然后通过溅射在基板侧部10上形成布线(S30)。
根据本公开,通过在真空腔室110内部进行溅射来沉积基板侧部10上的布线。因此,当具有“[”形状的沉积掩模附接到包括其上要形成布线的基板侧部10的基板30的一部分时,将基板30传送到腔室110中并进行溅射工序。
实施溅射工序,使得沉积能够集中在其上将要形成布线的基板侧部10上。也就是说,根据本公开的溅射是对基板侧部10而不是对整个基板30进行的。
根据本公开的通过溅射在基板侧部10上形成布线的方法是指使用溅射以在基板300的侧部上形成布线的方法,在该方法中基板30可以包括任何基板,只要该基板需要形成电路图案并经由侧部连接电路图案即可。换句话说,根据本公开的基板30包括其上形成有电路图案并且其侧部可以具有用于与电路图案电连接的布线的各类基板,诸如玻璃、塑料、膜等。
具体地,根据本公开的基板30可以包括其顶部和底部安装有各种元件并且分别形成有电路图案的基板。此外,如图2所示,其上将要形成布线的基板侧部10包括:侧面11,其与基板的边缘部分对应;邻侧顶部(side-adjacent top)13,即,基板30的与侧面11相邻的顶部;以及邻侧底部(side-adjacent bottom)15,即,基板30的与侧面11相邻的底部。
具体而言,如图2所示,根据本公开的基板侧部10包括基板30的侧面11以及基板的与基板30的侧面11邻近的顶部(即,邻侧顶部13)和底部(即,邻侧底部15),并且基板侧部10上的布线(即,侧部布线(参见图3中的“90”))被形成为将在基板30的顶部上所形成的顶部电路图案60和在基板30的底部上所形成的底部电路图案80电连接。
更详细地,根据本公开的基板30可以包括用于各种元件、装置和设备的基板。例如,根据本公开的基板30可以用于如图2所示的显示设备100。在这种情况下,可以使诸如液晶显示(LCD)元件、有机发光二极管(OLED)或微发光二极管(LED)之类的显示元件50阵列以在基板30的顶部上形成显示元件矩阵。此外,可以在基板30的底部上形成用于控制显示元件50并收发电信号的控制器元件70以及各种相关元件。
用于显示元件50的布线(即,顶部电路图案60)形成在基板30的顶部上,并且用于控制器元件70等的布线(即,底部电路图案80)形成在基板30的底部上。因此,如图3所示,必须在基板侧部10上形成用于顶部电路图案60和底部电路图案80之间的电连接的侧部布线90。
形成在基板侧部10上的侧部布线90具有如图3所示的的截面,以将顶部电路图案60和底部电路图案80电连接。因为侧部布线90具有用于顶部电路图案60和底部电路图案80之间的电连接的形状,所以如图2所示,形成有侧部布线90的基板侧部10与不仅包括基板30的侧面11而且包括邻侧顶部13和邻侧底部15的部分对应。
如上所述,如图4所示,掩模基板30被引入真空腔室110中并经受溅射。这里,真空腔室110中的溅射是在基板侧部10上形成侧部布线90的工序。因此,执行真空腔室110中的溅射以使沉积集中在基板侧部10上。
为此,通过使用设置为面向基板30的侧面11的中央源靶131和设置在中央源靶131的相反两侧并且朝向基板30倾斜的侧源靶133进行溅射,在腔室110内部沉积根据本公开的要在基板侧部上形成的布线(即,侧部布线90)。
具体地,如图4所示,掩模基板30(即使在图4中未例示出掩模,沉积掩模也如上所述地附接到包括基板侧部10的基板的顶部和底部)以基板侧部10面朝下的方式垂直设置。
因为基板30按照使基板侧部10在真空腔室110中面朝下的方式垂直地设置,所以将用于基于溅射在基板侧部10上进行沉积的源靶130放置在真空腔室110的下侧并且朝向基板侧部10定向。
如此,源靶130包括中央源靶131和分别布置在中央源靶131的侧面的两个侧源靶133。中央源靶131与垂直设置的基板30平行设置,并且与基板30中的基板侧部10的侧面11相对。因此,中央源靶131主要负责在基板30的侧面11上的主要沉积。
一对侧源靶133分别布置在中央源靶131的两侧,并朝向基板30倾斜。也就是说,一对侧源靶133分别面向构成基板侧部10的邻侧顶部13和邻侧底部15逐一布置。
在这种情况下,两个侧源靶133也可以被布置成甚至面向基板30的侧面11,如图4所示。因为基板的侧面11占据与形成布线和沉积的部分相对应的基板侧部10的大百分比,并且具有更大的沉积范围,所以侧源靶133被布置成不仅影响在邻侧顶部13和邻侧底部15上的溅射沉积,而且影响在基板30的侧面11上的溅射沉积。换句话说,侧源靶133被倾斜布置以面向基板30的邻侧顶部13和邻侧底部15以及侧面11。
如图4所示,基板30在安装至夹具(未示出)时垂直设置,并且能旋转或能调节角度以具有各种姿势,以便增强沉积的均匀性和效率。也就是说,在腔室110内部安装至夹具的基板30相对于基板30的作为旋转轴的长度方向能旋转,并且能调节角度以面向中央源靶131。
具体地,夹具(未示出)通过具有预定形状的夹具连接器150连接到腔室110,并且稳定地固定以保持基板30,使得基板30能够在腔室110内部安装至夹具(未示出)并且垂直设置。
为了改变由夹具保持并安装至夹具的基板30的姿势,夹具可以相对于夹具连接器150能旋转或以预定角度倾斜。为此,可以有各种结构。例如,如图4所示,夹具连接器150向左或向右(即,朝向侧源靶133的方向)能旋转和能调节角度,因此安装至夹具的基板30也相对于基板30的作为旋转轴的长度方向能旋转并且朝向侧源靶133能调节角度,从而调节角度以引导基板的侧面11朝向中央源靶131。
通过夹具的前述操作,基板30能够具有朝向源靶130的各种姿势和各种角度,并且因此在溅射期间根据需要能调节沉积的均匀性,从而形成均匀布线。
此外,根据本公开的在基板的侧部上形成布线的方法还可以包括在前述的对基板侧部进行掩模的操作s10之前清洁基板的操作s11。
在掩模操作之前,清洁基板的操作s11执行通过等离子体工序清洁基板的表面。在掩模操作之前,在基板30的表面上可能存在细颗粒。为了精细清洁以去除这种细颗粒,可以进一步执行基于等离子体的清洁操作。如此,将掩模操作应用于经过清洁操作的基板,从而防止细颗粒的不良影响。
此外,根据本公开的在基板的侧部上形成布线的方法还可以包括在基板侧部10上形成布线(即,侧部布线90)的操作之前的在腔室110内部通过离子束工序对基板30进行预处理的预处理操作s31。
换句话说,为了增强基板侧部10和具有预定图案的侧部布线90之间沉积的粘合力和紧密接触,在基板侧部10上形成侧部布线90的操作s30之前,在真空腔室110内部执行离子束工序。为此,在真空腔室110内部仅添加用于处理离子束的离子束发生器(例如,离子束枪)。
如此,在腔室110内一次连续地执行使用离子束的预处理工序和用于形成侧部布线90的工序,因此简化了工序以高效地进行基板制造工序。
此外,通过在腔室110内部的溅射沉积来实现上述在基板侧部上形成布线的操作s30,其中,尽管基板侧部10上的布线可以被形成为具有一个金属层,即,仅具有与布线的最小金属层相对应的导电金属层,但是可以包括依次堆叠的粘合金属层、导电金属层和保护金属层,以形成高质量布线。
也就是说,通过依次堆叠粘合金属层、导电金属层和保护金属层来形成根据本公开的形成在基板侧部10上的布线(即,侧部布线90)。
粘合金属层可以包含例如金属材料的导电材料。金属材料可以包括镍(Ni)铬(Cr)合金、钛(Ti)、钼(Mo)、不锈钢(SUS)或它们的合金中的一种,作为单层或多层。
例如,粘合金属层可以包含镍铬合金。包括镍和铬的粘合金属层中镍与铬的重量比可以在8:2至9.5:0.5的范围内选择。铬可以增强基板(特别是塑料基板)和导电金属层之间的粘合力。由镍铬合金制成的粘合金属层可以使基板和导电层之间的粘合力比仅包含镍的粘合金属层的粘合力强大约1.5倍。
当粘合金属层包含镍铬合金时,与仅含镍的粘合金属层相比,溅射工艺的薄膜形成效率得到提高。仅使用具有磁性的镍执行的溅射可以降低粘合金属层的薄膜厚度均匀性或类似质量。然而,根据本公开的实施方式的使用镍铬合金执行的溅射提高了所形成薄膜的质量,并且如上所述增强了基板和导电金属层之间的粘合力。
在通过溅射在基板侧部10上形成粘合金属层之后,在粘合金属层上形成导电金属层。导电金属层可以被形成为包含各种金属或合金。例如,导电金属层可以含有铜,或者可以作为含有不低于约85wt%的锡(Sn)的锡(Sn)基无铅金属层来提供。除了锡(Sn)之外,导电金属层可以包含银(Ag)、铜(Cu)、铋(Bi)、锌(Zn)和铟(In)中的至少一种。在导电金属层包含银(Ag)和铜(Cu)的情况下,导电金属层可以包含比铜(Cu)更多的银(Ag)以具有更低的熔点。
在通过如上所述的溅射在粘合金属层上沉积导电金属层之后,通过溅射在相同腔室110内部在导电金属层上沉积保护金属层。
保护金属层可以包含金属材料。例如,像粘合金属层一样,保护金属材料可以包含镍(Ni)铬(Cr)合金、钛(Ti)、钼(Mo)、不锈钢(SUS)或它们的合金中的一种。优选地,保护金属层在相同腔室110内部由与粘合金属层的材料相同的材料制成。如此,粘合金属层和保护金属层在一个腔室内部由相同材料制成,从而简化了整个工序,从而使制造基板的时间、精力和成本最小化。保护金属层在制造、分配等工序中保护导电金属层免受腐蚀和污染。
此外,如上所述,通过溅射在腔室内部依次堆叠粘合金属层、导电金属层和保护金属层,形成在基板侧部10上形成的布线,因此每个金属层能够经受离子束工序。换句话说,根据本公开的用于在基板的侧部上形成布线的方法的腔室110支持如上所述的离子束工序,因此在形成每个金属层之前执行离子束工序,从而增强基板与粘合金属层之间以及金属层之间的附接、粘合和紧密接触。
具体地,在一个腔室内部,基板侧部10首先经过离子束工序,然后通过溅射在基板侧部10上沉积粘合金属层。接下来,粘合金属层经过离子束工序,然后通过溅射在粘合金属层上沉积导电金属层。接下来,导电金属层经过离子束工序,然后通过溅射在导电金属层上沉积保护金属层。如此,在形成金属层之前在一个腔室中执行了离子束工序,从而通过简化的工序和简化的设备结构增强了基板和金属层之间以及金属层之间的紧密接触,从而提高了制造基板的效率。
此外,当完成上述在基板侧部10上形成布线的操作s30时,取出基板30,并在去除掩模之后进行布线测试、视觉测试等(s50)。
利用根据本公开的针对技术问题和解决方案的在基板的侧部上形成布线的前述方法,使用溅射在基板侧部上形成布线,从而具有形成具有低电阻的布线的效果,由此提供改进了电特性的基板。
此外,根据本公开,基板的顶部电路图案和底部电路图案经由通过溅射到侧部所形成的布线可电连接,从而具有去除边框的优点,并由此实现大屏幕和高清晰度显示设备。
尽管已经示出并描述了本公开的一些示例性实施方式,但是这些实施方式仅用于示例的目的,并且本领域技术人员将理解,在不脱离本发明的原理和精神的情况下,可以在这些实施方式中进行改变,本发明的范围由所附权利要求及其等同物来限定。
Claims (2)
1.一种形成基板的布线的方法,该方法包括以下步骤:
通过将沉积掩模附接到所述基板来对其上将要形成布线的基板侧部进行掩模,其中,所述基板侧部包括对应于所述基板的边缘部分的侧面、对应于所述基板的与所述侧面相邻的顶部的邻侧顶部、以及对应于所述基板的与所述侧面相邻的底部的邻侧底部;以及
在将经掩模的基板侧部引入腔室中之后,基于溅射在所述经掩模的基板侧部上形成所述布线,
其中,使用设置为面向所述基板侧部的所述侧面的中央源靶和设置在所述中央源靶的相反两侧并朝向所述基板倾斜以面向所述邻侧顶部和所述邻侧底部的侧源靶,基于溅射在所述腔室内部沉积在所述经掩模的基板侧部上形成的所述布线,并且
其中,所述基板的作为所述基板侧部的相反侧的一端与所述腔室内的夹具连接器连接,并且所述基板的作为所述基板侧部的另一端在角度上能调节以面向所述中央源靶,其中,所述基板相对于所述基板的作为轴的长度方向能旋转,使得所述基板侧部被所述中央源靶和所述侧源靶溅射。
2.根据权利要求1所述的方法,其中,所述经掩模的基板侧部上的所述布线被配置为将在所述基板侧部的所述邻侧顶部上所形成的顶部电路图案和在所述基板侧部的所述邻侧底部上所形成的底部电路图案电连接。
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