CN110699041B - Particle composition for grinding - Google Patents
Particle composition for grinding Download PDFInfo
- Publication number
- CN110699041B CN110699041B CN201911031841.8A CN201911031841A CN110699041B CN 110699041 B CN110699041 B CN 110699041B CN 201911031841 A CN201911031841 A CN 201911031841A CN 110699041 B CN110699041 B CN 110699041B
- Authority
- CN
- China
- Prior art keywords
- grinding
- particle composition
- parts
- diamond
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
Abstract
The invention belongs to the technical field of precision grinding processing, and particularly relates to a particle composition for grinding. The composition is solid columnar particles, and acts on the surface of a workpiece to be processed to achieve a grinding effect in the process of thinning and polishing the workpiece to be processed, so that the grinding efficiency is improved on the basis of ensuring accurate control of the roughness of the surface of the workpiece, the manpower and material resource investment is saved, and the problems of high cost, production pollution discharge and the like are solved. The invention can precisely meet the diversified requirements of products by using diamonds with different grain diameters and concentrations according to the requirements of coarse thinning, fine thinning, different products, different product roughness and the like.
Description
Technical Field
The invention belongs to the technical field of precision grinding processing, and particularly relates to a particle composition for grinding.
Background
The double-sided flat grinding machine is characterized in that a cast iron disc is applied to a double-sided flat grinding machine, and grinding liquid (suspending agent, dispersing agent, diamond, boron carbide, alumina micro powder and the like) containing grinding materials is matched to horizontally grind workpieces (sapphire, glass and the like) to achieve the purposes of thinning and polishing.
Therefore, it is imperative to develop a polishing method that is environmentally friendly, has high efficiency, and can precisely control the roughness of the workpiece surface!
Disclosure of Invention
The present invention addresses the above-described deficiencies of the prior art and provides a particulate composition for polishing.
The technical scheme for solving the technical problems is as follows: a particle composition for grinding comprises, by weight, 20-44 parts of diamond, 20-55 parts of aluminum oxide, 10-20 parts of zirconium oxide, 2-10 parts of silicon dioxide, 1-5 parts of calcium stearate, 0.2-2 parts of a silane coupling agent, 15-25 parts of resin powder and 4-10 parts of glass fiber.
Further, the diamond particle size is 4-120 μm, and the diamond concentration is 0.1-8.8 carat/cm3。
Further, the silane coupling agent is KH550, KH560 or KH 570.
Further, the particle size of the resin powder is 3-75 μm; the resin is epoxy resin, phenolic resin or epoxy modified phenolic resin.
Further, the polishing particle composition is in the form of a column, and has a diameter of 5 to 6mm and a height of 1.0 to 1.6 mm.
Further, the above-mentioned particle composition for grinding is obtained by mixing diamond, alumina, zirconia, silica, calcium stearate, a silane coupling agent, a resin powder and a glass fiber, and then performing powder metallurgy molding and sintering.
The application method of the particle composition for grinding comprises the steps of taking a circular plate (with the current specifications of phi 578 phi 180mm and phi 960 phi 410mm) formed by combining PC and PVC as a supporting body, uniformly bonding or welding the particle composition on the surface of the supporting body to form a grinding disc, fixing the grinding disc on a double-sided grinding machine through double-sided adhesive tape, grinding the surface of a workpiece to be processed by the grinding disc under the driving of the double-sided grinding machine, washing the surface of the workpiece to be processed by using a recyclable cleaning solution in a matching way in the grinding process, and precisely controlling the roughness of the surface of the workpiece through the grinding discs with different particle sizes, so that the environment-friendly, high-efficiency, high-quality and high-precision grinding is realized.
The cleaning solution plays a role in lubricating and cooling, and specifically can be deionized water or a cleaning solution commonly used in the field or self-prepared, for example, the cleaning solution is composed of 10-20 wt% of borate ester, 6-15 wt% of triethanolamine, 8-20 wt% of water-soluble polyether, 6-15 wt% of glycerol, 0.05-3 wt% of a defoaming agent, 0-1 wt% of a bactericide, 10-20 wt% of hydroxyethyl ethylenediamine and 50 wt% of water.
The workpiece to be processed comprises high-flatness workpieces such as glass, wafers (semiconductor silicon wafers and solar silicon wafers), diamond composite sheets, diamond polycrystal, diamond cutters, cubic boron nitride, tungsten steel (hard alloy), novel engineering structural ceramics, jewels, crystal, rare earth materials (magnetic materials), high-speed steel, bearing steel, tool steel, stainless steel, powder metallurgy, cast iron, sliding sheets of air-conditioning and refrigerator compressors, valve plates, automobile steering pumps, blades, rotor and stator measuring gauge blocks, thin-wall bearings and the like.
The invention has the characteristics and beneficial effects that:
1. in the composition, the diamond is used for cutting and grinding, so that the thickness can be effectively reduced; the aluminum oxide has the functions of assisting grinding and repairing the surface; the zirconia is used for auxiliary grinding; the silicon dioxide is used as an anti-caking agent and is used for improving the flowability of powder in the composition; calcium stearate is used as a release agent and has the function of enabling the composition to be easily processed and molded; the silane coupling agent functions to promote the composition to form a bond; the resin powder acts as a binder; the glass fibers function to improve the robustness of the resulting particulate composition.
2. The composition is solid columnar particles, and acts on the surface of a workpiece to be processed to achieve a grinding effect in the process of thinning and polishing the workpiece to be processed, so that the grinding efficiency is improved on the basis of ensuring accurate control of the roughness of the surface of the workpiece, the manpower and material resource investment is saved, and the problems of high cost, production pollution discharge and the like are solved. The invention can precisely meet the diversified requirements of products by using diamonds with different grain diameters and concentrations according to the requirements of coarse thinning, fine thinning, different products, different product roughness and the like.
Detailed Description
The principles and features of this invention are described below in conjunction with examples, which are set forth to illustrate, but are not to be construed to limit the scope of the invention.
Example 1
A granular composition for grinding is prepared from diamond (10 microns, 1.8 carats/cm in concentration)3)22g of aluminum oxide, 53g of aluminum oxide, 19g of zirconium oxide, 4g of silicon dioxide, 1.5g of calcium stearate, 0.8g of KH5500, 19g of epoxy resin powder and 5g of glass fiber.
The using method comprises the following steps: a circular plate (with specification phi 578 phi 180mm) formed by combining PC and PVC is used as a bearing body, the particle composition is uniformly adhered or welded on the surface of the bearing body to form a grinding disc, the grinding disc is fixed on a double-sided grinding machine through double-sided adhesive tape, the grinding disc is driven by the double-sided grinding machine to grind the surface of a workpiece to be processed, and a recyclable cleaning solution is matched and used in the grinding process to wash the surface of the workpiece to be processed.
Example 2
A granular composition for grinding is prepared from diamond (50 microns, 2.5 carats/cm)3)30g of aluminum oxide, 28g of zirconium oxide, 17.5g of silicon dioxide8.5g, 4g of calcium stearate, KH5601.6 g, 24g of phenolic resin powder and 8g of glass fiber.
The using method comprises the following steps: a circular plate (with specification phi 578 phi 180mm) formed by combining PC and PVC is used as a bearing body, the particle composition is uniformly adhered or welded on the surface of the bearing body to form a grinding disc, the grinding disc is fixed on a double-sided grinding machine through double-sided adhesive tape, the grinding disc is driven by the double-sided grinding machine to grind the surface of a workpiece to be processed, and a recyclable cleaning solution is matched and used in the grinding process to wash the surface of the workpiece to be processed.
Example 3
A granular composition for grinding is prepared from diamond (100 microns, 3.2 carats/cm)3)40g, 43g of aluminum oxide, 15g of zirconium oxide, 3g of silicon dioxide, 3g of calcium stearate, KH5700.6 g, 16g of epoxy modified phenolic resin powder and 6g of glass fiber.
Comparative example 1
The grinding cutting fluid comprises, by weight, 5g of a diamond grinding material (granularity M10/20, purity 99.5%), 3g of a silane coupling agent A-171 (purity 98.5%), 1g of potassium dodecylbenzene sulfonate, 1g of tetradecyl sodium sulfonate, 0.5g of 2-undecyl-N-carboxymethyl-N-hydroxyethyl imidazoline, 0.5g of disodium N-dodecyliminodipropionate, 5g of N-methylpyrrolidone of a modified polyurea, 0.5g of N-methylpyrrolidone, 10g of saturated alkane of C16 (purity 98.5%), 30g of polyethylene glycol and 43.5g of deionized water.
The preparation method of the grinding cutting fluid comprises the following steps: adding a silane coupling agent A-171 into a diamond grinding material, uniformly stirring and ultrasonically dispersing for 15min at the ultrasonic power of 1000W and the frequency of 40KHz, adding saturated alkane of C16, uniformly stirring and ultrasonically dispersing (the power and the frequency are the same as above) for 20min to obtain a solution A for later use; adding potassium dodecylbenzene sulfonate, sodium tetradecyl sulfonate, 2-undecyl-N-carboxymethyl-N-hydroxyethyl imidazoline, disodium N-dodecyliminodipropionate, N-methylpyrrolidone and N-methylpyrrolidone of modified polyurea into a mixed solution of polyethylene glycol and deionized water, uniformly stirring, and performing ultrasonic dispersion (with the same power and frequency) for 10min to obtain a solution B for later use; adding the solution A into the solution B while stirring, uniformly mixing, and performing ultrasonic dispersion (with the same power and frequency) for 30min to obtain the final product.
The using method comprises the following steps: the surface of a workpiece to be processed is ground by adopting a traditional cast iron disc matched with grinding cutting fluid.
Comparative example 2
The grinding cutting fluid comprises, by weight, 5g of a diamond grinding material (granularity M50/70, purity 99.5%), 3g of a silane coupling agent A-171 (purity 98.5%), 1g of potassium dodecylbenzene sulfonate, 1g of tetradecyl sodium sulfonate, 0.5g of 2-undecyl-N-carboxymethyl-N-hydroxyethyl imidazoline, 0.5g of disodium N-dodecyliminodipropionate, 5g of N-methylpyrrolidone of a modified polyurea, 0.5g of N-methylpyrrolidone, 10g of saturated alkane of C16 (purity 98.5%), 30g of polyethylene glycol and 43.5g of deionized water.
The preparation method of the grinding cutting fluid comprises the following steps: adding a silane coupling agent A-171 into a diamond grinding material, uniformly stirring and ultrasonically dispersing for 15min at the ultrasonic power of 1000W and the frequency of 40KHz, adding saturated alkane of C16, uniformly stirring and ultrasonically dispersing (the power and the frequency are the same as above) for 20min to obtain a solution A for later use; adding potassium dodecylbenzene sulfonate, sodium tetradecyl sulfonate, 2-undecyl-N-carboxymethyl-N-hydroxyethyl imidazoline, disodium N-dodecyliminodipropionate, N-methylpyrrolidone and N-methylpyrrolidone of modified polyurea into a mixed solution of polyethylene glycol and deionized water, uniformly stirring, and performing ultrasonic dispersion (with the same power and frequency) for 10min to obtain a solution B for later use; adding the solution A into the solution B while stirring, uniformly mixing, and performing ultrasonic dispersion (with the same power and frequency) for 30min to obtain the final product.
The using method comprises the following steps: the surface of a workpiece to be processed is ground by adopting a traditional cast iron disc matched with grinding cutting fluid.
Testing
The glass surface of the mobile phone screen was thinned using the particulate composition obtained in example 1 in combination with the method of use thereof, the particulate composition obtained in example 2 in combination with the method of use thereof, the abrasive cutting fluid obtained in comparative example 1 in combination with the method of use thereof, and the abrasive cutting fluid obtained in comparative example 2 in combination with the method of use thereof, and tested for cooling property, cleaning property, roughness, and polishing efficiency, respectively.
Test 1
According to the processing requirements, the particle composition (in which the diamond particle size is larger) obtained in example 2 and the grinding cutting fluid obtained in comparative example 2 are combined with the using method to carry out rough thinning on the glass surface of the mobile phone screen, and the roughness Ra of the glass surface is required to be about 600, and the specific table is shown in table 1.
TABLE 1
As can be seen from the performance data in table 1, the grinding particle composition obtained by the present invention, in combination with the grinding method of the present invention, during the course of coarse thinning, the temperature of the glass surface of the mobile phone screen is low, no oil stain residue is left, the grinding efficiency is greatly improved, the roughness fluctuation range of the glass surface is very small, and the processing requirements can be satisfied; the existing grinding cutting fluid is combined with the traditional grinding mode, the temperature of the glass surface is very high, a large amount of oil stain residues exist, the grinding efficiency is very low, the roughness fluctuation range of the glass surface is very large, and the product quality is uneven.
Test 2
According to the processing requirements, the glass surface of the mobile phone screen obtained in the test 1 is further finely thinned by using the particle composition obtained in the example 1 (in which the diamond particle size is small) in combination with the use method thereof, and the grinding cutting fluid obtained in the comparative example 1 in combination with the use method thereof, and the roughness Ra of the glass surface is required to be about 200, which is specifically shown in Table 2.
TABLE 2
As can be seen from the performance data in table 2, the glass surface temperature of the mobile phone screen is low, no oil stain residue is left, the grinding efficiency is greatly improved, the roughness fluctuation range of the glass surface is very small, and the processing requirements can be better met by combining the grinding particle composition obtained by the invention with the grinding mode of the invention; the existing grinding cutting fluid is combined with the traditional grinding mode, the temperature of the glass surface is very high, a large amount of oil stain residues exist, the grinding efficiency is very low, the roughness fluctuation range of the glass surface is very large, the product quality is uneven, and even the smoothness requirement of the required glass can not be met.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (3)
1. A particle composition for grinding is characterized by comprising, by weight, 20-44 parts of diamond, 20-55 parts of aluminum oxide, 10-20 parts of zirconium oxide, 2-10 parts of silicon dioxide, 1-5 parts of calcium stearate, 0.2-2 parts of a silane coupling agent, 15-25 parts of resin powder and 4-10 parts of glass fiber;
the diamond grain diameter is 4-120 mu m, and the diamond concentration is 0.1-8.8 carat/cm3;
The particle composition for grinding is columnar, the diameter of the particle composition is 5-6mm, and the height of the particle composition is 1.0-1.6 mm;
the grinding particle composition is prepared by mixing diamond, aluminum oxide, zirconium oxide, silicon dioxide, calcium stearate, a silane coupling agent, resin powder and glass fiber, and then performing powder metallurgy forming and sintering;
the use method of the grinding particle composition comprises the following steps: the method comprises the following steps of taking a circular plate formed by combining PC and PVC as a bearing body, uniformly bonding or welding the particle composition on the surface of the bearing body to form a grinding disc, fixing the grinding disc on a double-sided grinding machine through double-sided adhesive tape, and grinding the surface of a workpiece to be processed by the grinding disc under the driving of the double-sided grinding machine.
2. The polishing particle composition according to claim 1, wherein the silane coupling agent is KH550, KH560 or KH 570.
3. The particulate composition for grinding according to claim 1, wherein the particle diameter of the resin powder is 3 to 75 μm; the resin is epoxy resin, phenolic resin or epoxy modified phenolic resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911031841.8A CN110699041B (en) | 2019-10-28 | 2019-10-28 | Particle composition for grinding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911031841.8A CN110699041B (en) | 2019-10-28 | 2019-10-28 | Particle composition for grinding |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110699041A CN110699041A (en) | 2020-01-17 |
CN110699041B true CN110699041B (en) | 2020-09-08 |
Family
ID=69203737
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201911031841.8A Active CN110699041B (en) | 2019-10-28 | 2019-10-28 | Particle composition for grinding |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN110699041B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113025210A (en) * | 2021-03-24 | 2021-06-25 | 宜山光电科技(苏州)有限公司 | Quartz glass grinding fluid and preparation method thereof |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090307986A1 (en) * | 2008-06-12 | 2009-12-17 | Hung-Hui Huang | Polishing composition and making method thereof for polishing a substrate |
CN109321204A (en) * | 2018-10-24 | 2019-02-12 | 河南省力量钻石股份有限公司 | A kind of more particle agglomeration type abrasive grain bodies, preparation method and applications |
-
2019
- 2019-10-28 CN CN201911031841.8A patent/CN110699041B/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN110699041A (en) | 2020-01-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103013345B (en) | Oily diamond grinding liquid and preparation method thereof | |
Dong et al. | Characterization of material removal in ultrasonically assisted grinding of SiCp/Al with high volume fraction | |
CN1589189A (en) | Porous abrasive tool and method for making the same | |
CN103571333B (en) | CMP (Chemical-Mechanical Polishing) polishing liquid with mixed grinding materials for alkaline sapphire substrate and preparation method thereof | |
CN111515874A (en) | Efficient ultra-precision polishing method based on shear expansion effect | |
CN102212334B (en) | Coarse grinding fluid for sapphire substrate and preparation method thereof | |
CN107722935B (en) | Spherical diamond stacked abrasive and manufacturing method thereof | |
CN105273638B (en) | Anti- cleavage suspension lapping liquid of gallium oxide wafer and preparation method thereof | |
CN104669132B (en) | Viscoelastic magnetic grinding tool and preparation method thereof | |
CN106086897A (en) | A kind of rustless steel light guide plate polishing fluid and its preparation method and application | |
CN103361530B (en) | Diamond cutting blade and preparation method thereof | |
CN104385154B (en) | A kind of preparation method of grinding tool Low-temperature vitrified bond | |
CN106634836A (en) | Diamond paste as well as preparation method and application thereof | |
CN110699041B (en) | Particle composition for grinding | |
CN111548737A (en) | Diamond grinding fluid and preparation method thereof | |
CN101307211A (en) | Method for preparing nanometer silicon dioxide abradant polishing solution | |
CN105921739B (en) | A kind of high-precision ultra-thin cutting piece made from diamond and preparation method thereof | |
CN102516874A (en) | Polishing liquid for ultra-precision sharpening of diamond cutting tool and preparation method thereof | |
Li et al. | Ultrathin diamond blades for dicing single crystal SiC developed using a novel bonding method | |
CN106272034A (en) | A kind of grinding pad for processing soft brittle crystal material and preparation method thereof | |
JP2017024161A (en) | Polishing tool and manufacturing method of the same, and manufacturing method of polished product | |
CN103242803A (en) | Quasi-crystal abrasive paste applicable to surface mechanical finishing of soft metals | |
CN109913133B (en) | Efficient high-quality chemical mechanical polishing solution for yttrium aluminum garnet crystals | |
CN103045167A (en) | Magnetic grinding material and preparation method thereof | |
CN101508087B (en) | Diamond thin-film grinding method and catalyst grinding wheel thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A particle composition for grinding Effective date of registration: 20230718 Granted publication date: 20200908 Pledgee: Postal Savings Bank of China Limited Yantai Laishan District sub branch Pledgor: Yantai Shengdao Electronic Technology Co.,Ltd. Registration number: Y2023980048755 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right |