CN110676197A - Accurate semiconductor belt cleaning device - Google Patents
Accurate semiconductor belt cleaning device Download PDFInfo
- Publication number
- CN110676197A CN110676197A CN201910967045.9A CN201910967045A CN110676197A CN 110676197 A CN110676197 A CN 110676197A CN 201910967045 A CN201910967045 A CN 201910967045A CN 110676197 A CN110676197 A CN 110676197A
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- CN
- China
- Prior art keywords
- box
- semiconductor
- rotating electrical
- box body
- cleaning device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
Abstract
The invention relates to the technical field of semiconductors, and discloses a precision semiconductor cleaning device which comprises a box body, a controller, a water tank, a semiconductor inlet, a semiconductor outlet and a wastewater outlet; the inside left side fixed mounting of box has the cylinder chamber, the interior middle part in cylinder chamber is fixed with the cylinder, the right side output of cylinder is provided with the horizontal piston rod that passes the cylinder chamber, the terminal fixed mounting of piston rod has rotatory installation piece, the right side of rotatory installation piece is rotated and is connected with the connecting rod with the piston rod is with the axle center, the terminal fixed mounting of connecting rod has the grip block, the inside right side fixed mounting of box has the rotating electrical machines chamber, the interior middle part in rotating electrical machines chamber is provided with the rotating electrical machines, the left side output of rotating electrical machines rotates and is connected with the rotary rod that passes the rotating electrical machines chamber, the terminal also fixed mounting of. One side of the clamping block is provided with a clamping opening, and the inner top of the box body above the clamping block is downwards provided with two groups of water spraying openings. The invention has the advantages of high flushing speed, comprehensiveness, high precision and good effect.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a precise semiconductor cleaning device.
Background
Cleaning of semiconductor wafers is a very delicate task and the semiconductor wafers are demanding in terms of cleaning environment, which requires ensuring cleanliness of the surrounding environment during cleaning, and cleaning of the wafers is also a time-consuming and labor-consuming task.
Chinese patent (publication No. CN 110112086A, bulletin date: 2019.08.09) discloses a semiconductor wafer cleaning device, which comprises a feeding system, a discharging system, an operation system and a grabbing system, wherein the feeding system and the discharging system both comprise two material belts, the intermittent feeding and discharging of a semiconductor wafer are realized through the synchronous operation of the two material belts, when the grabbing system moves to a cleaning area of a cam ring rail under the action of a chain, the grabbing system extends into a cleaning box, and when the grabbing system moves to a parallel area of the cam ring rail under the action of the chain, the grabbing system leaves the cleaning box; and when the grabbing system moves to the feeding system and the discharging system, the grabbing system is contacted with the claw opening limiting device and is opened. However, the cleaning equipment cannot ensure that each position of the semiconductor can be flushed, so that the flushing is incomplete, and the flushing precision is influenced.
Disclosure of Invention
The present invention has been made to solve the above-mentioned problems occurring in the background art.
In order to achieve the purpose, the invention provides the following technical scheme: a precision semiconductor cleaning device comprises a box body, a controller, a water tank, a semiconductor inlet, a semiconductor outlet and a wastewater outlet; the controller is fixedly installed in the middle of the left side wall of the box body, and the controller can control the start and stop of each part of the whole device. The box sets up to transparent construction, and convenient to use person observes inside condition. The top left side fixed mounting of box has a set of water tank, has seted up the semiconductor downwards on the right side box of water tank and has imported and exported, and the inside left side fixed mounting of box has the cylinder chamber, and the interior middle part in cylinder chamber is fixed with the cylinder, and the right side output of cylinder is provided with the horizontal piston rod that passes the cylinder chamber, and the terminal fixed mounting of piston rod has rotatory installation piece, and the right side of rotatory installation piece is rotated and is connected with the connecting rod with the same axle center with the piston rod, and the terminal fixed mounting of connecting rod has the. The inside right side fixed mounting of box has the rotating electrical machines chamber, and the interior middle part in rotating electrical machines chamber is provided with the rotating electrical machines, and the left side output of rotating electrical machines rotates and is connected with the rotary rod that passes the rotating electrical machines chamber, and the terminal also fixed mounting of rotary rod has the grip block. One side of grip block is provided with the centre gripping mouth, and the inside of centre gripping mouth is used for the one side of centre gripping semiconductor body, can carry out the centre gripping fixedly with the semiconductor body that gets into from semiconductor import and export through the left and right sides grip block. The piston rod is driven to move left and right through the starting cylinder, the clamping blocks at the tail ends of the connecting rods are driven to adjust the position left and right, the right end of the semiconductor body is placed in the clamping blocks at the tail ends of the rotating rods, then the semiconductor body is tightly fixed between the two groups of clamping blocks through the clamping blocks at the tail ends of the connecting rods at the left side, then the rotating motor is started to drive the rotating rods to rotate, and then the semiconductor body between the two groups of clamping blocks is driven to rotate. The top of the interior of the box that is located the grip block top is provided with two sets of water jets downwards, and the top of water jet communicates through the raceway and fixes on the water tank of box upper surface, is provided with the solenoid valve on the raceway for the flow of control raceway normal water, through the downward water spray of water jet, and then washs the semiconductor body of centre gripping between the grip block, is convenient for carry out the omnidirectional abundant washing to semiconductor body through adopting rotatory abluent mode. And the left side and the right side of the bottom of the box body are downwards provided with a wastewater outlet, so that the flushed wastewater is conveniently discharged through the wastewater outlet.
As a further scheme of the invention: four groups of cushion blocks used for keeping the bottom of the box body stable are fixedly arranged at the bottom of the box body.
As a further scheme of the invention: the cross section of the box body is set to be a rectangle with a semicircular upper part and a semicircular lower part, so that the whole box body is kept to be stably placed, and meanwhile, the attractiveness of the box body can be improved.
As a further scheme of the invention: a group of push-pull type opening covers are arranged in the middle of the semiconductor inlet and outlet, push blocks are fixedly mounted at the tops of the opening covers, and the semiconductor inlet and outlet can be opened and closed conveniently through the push-pull type opening covers.
As a further scheme of the invention: the rubber pad is fixedly adhered to the inner surface of the clamping opening, and the rubber pad is arranged to improve the clamping force of the semiconductor body and prevent the semiconductor body from being abraded.
As a further scheme of the invention: the air cylinder, the rotating motor, the water spraying opening and the electromagnetic valve are all electrically connected with the controller.
As a still further scheme of the invention: the internal surface fixed mounting that is located the box between two sets of waste water exports has a set of middle part bellied guide plate that makes progress, and the setting up of guide plate is convenient for guide and washes the quick waste water to waste water export in flow of production, prevents to take place to pile up in the inside of box.
Compared with the prior art, the invention has the beneficial effects that: through treating abluent semiconductor centre gripping in the intermediate position of box, then set up it into rotation state, and then two sets of water jets of rethread are washed it, and the omnidirectional of being convenient for is washed, guarantees the precision of washing.
Drawings
Fig. 1 is a schematic view of an external structure of a precision semiconductor cleaning apparatus.
FIG. 2 is a schematic diagram of a front view of an internal structure of a precision semiconductor cleaning apparatus.
FIG. 3 is a schematic diagram of a clamping block in a precision semiconductor cleaning apparatus.
Wherein: the semiconductor device comprises a box body 10, a controller 11, a water tank 12, a semiconductor inlet and outlet 13, a cover 14, a semiconductor body 15, a clamping block 16, a waste water outlet 17, a rotary motor cavity 18, a cylinder cavity 19, a cylinder 20, a piston rod 21, a rotary mounting block 22, a connecting rod 23, a rotary motor 24, a rotary rod 25, a clamping port 26, a rubber pad 27, a water spray port 28 and a water delivery pipe 29.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
Example one
Referring to fig. 1-3, a precision semiconductor cleaning apparatus includes a tank 10, a controller 11, a water tank 12, a semiconductor inlet 13, a semiconductor outlet 17; four groups of cushion blocks for keeping the bottom of the box body 10 stable are fixedly arranged at the bottom of the box body 10. The case 10 is formed in a transparent structure so that a user can observe the inside of the case. The cross section of the box body 10 is set to be semicircular at the upper part and rectangular at the lower part, so that the whole box body 10 is kept to be stably placed, and meanwhile, the attractiveness of the box body 10 can be improved. The middle part of the left side wall of the box body 10 is fixedly provided with a controller 11, and the controller 11 can control the start and stop of each part of the whole device. A group of water tank 12 is fixedly installed on the left side of the top of the tank body 10, a semiconductor inlet and outlet 13 is formed in the right side of the water tank 12 and is arranged on the tank body 10 downwards, a group of push-pull type opening covers 14 are arranged in the middle of the semiconductor inlet and outlet 13, push-pull type pushing blocks are fixedly installed on the tops of the opening covers 14, and the push-pull type opening covers 14 are arranged to facilitate opening and closing of the semiconductor.
A cylinder cavity 19 is fixedly mounted on the left side inside the box body 10, a cylinder 20 is fixed in the middle of the inside of the cylinder cavity 19, a transverse piston rod 21 penetrating through the cylinder cavity 19 is arranged at the right output end of the cylinder 20, a rotary mounting block 22 is fixedly mounted at the tail end of the piston rod 21, a connecting rod 23 coaxial with the piston rod 21 is rotatably connected to the right side of the rotary mounting block 22, and a clamping block 16 is fixedly mounted at the tail end of the connecting rod 23. The inside right side fixed mounting of box 10 has rotating electrical machines chamber 18, and the interior middle part in rotating electrical machines chamber 18 is provided with rotating electrical machines 24, and rotating electrical machines 24's left side output rotates and is connected with the rotary rod 25 that passes rotating electrical machines chamber 18, and the end of rotary rod 25 also fixed mounting has clamping block 16. The clamping block 16 is provided with a clamping opening 26 at one side, the clamping opening 26 is used for clamping one side of the semiconductor body 15, and the semiconductor body 15 entering from the semiconductor inlet/outlet 13 can be clamped and fixed through the clamping blocks 16 at the left side and the right side. A rubber pad 27 is fixedly adhered to the inner surface of the clamping opening 26, and the rubber pad 27 is arranged to improve the clamping force of the semiconductor body 15 and prevent the semiconductor body 15 from being worn. The piston rod 21 is driven to move left and right by the starting cylinder 20, the clamping blocks 16 at the tail ends of the connecting rods 23 are further driven to adjust the positions left and right, the right ends of the semiconductor bodies 15 are placed into the clamping blocks 16 at the tail ends of the rotating rods 25, then the semiconductor bodies 15 are tightly fixed between the two groups of clamping blocks 16 by moving the clamping blocks 16 at the tail ends of the left connecting rods 23, then the rotating motor 24 is started to drive the rotating rods 25 to rotate, and then the semiconductor bodies 15 between the two groups of clamping blocks 16 are driven to rotate. The inner top of the box body 10 above the clamping blocks 16 is downwards provided with two groups of water spraying ports 28, the tops of the water spraying ports 28 are communicated with the water tank 12 fixed on the upper surface of the box body 10 through water conveying pipes 29, the water conveying pipes 29 are provided with electromagnetic valves for controlling the flow of water in the water conveying pipes 29, water is sprayed downwards through the water spraying ports 28, then the semiconductor body 15 clamped between the clamping blocks 16 is cleaned, and the semiconductor body 15 is conveniently and fully washed in all directions by adopting a rotary cleaning mode. The left side and the right side of the bottom of the box body 10 are downwards provided with a waste water outlet 17, and the flushed waste water is conveniently discharged through the waste water outlet 17. The cylinder 20, the rotating electrical machine 24, the water jet 28 and the electromagnetic valve are all electrically connected with the controller 11.
The working principle of the invention is as follows: firstly, a semiconductor body 15 to be cleaned is placed in the box body 10 through the semiconductor inlet and outlet 13, then the right side of the semiconductor body 15 is clamped in the right clamping block 16, then the air cylinder 20 is started to drive the left clamping block 16 to move rightwards, then the left side of the semiconductor body 15 is stabilized, then the water spraying port 28 is started to spray water in the water tank 12 downwards to the semiconductor body 15, then the rotating motor 24 is started to drive the rotating rod 25 to rotate, further the semiconductor body 15 is driven to rotate and wash, and then the waste water generated by washing is discharged through the waste water outlet 17.
Example two
On the basis of the first embodiment, a group of guide plates with the middle parts protruding upwards are fixedly arranged on the inner surface of the box body 10 between the two groups of waste water outlets 17, and the guide plates are arranged to guide the waste water generated by flushing to flow into the waste water outlets 17 quickly, so that accumulation in the box body 10 is prevented.
Although the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present patent within the knowledge of those skilled in the art.
Claims (8)
1. A precision semiconductor cleaning device comprises a box body (10), a controller (11), a water tank (12), a semiconductor inlet and outlet (13) and a waste water outlet (17); the semiconductor water heater is characterized in that the box body (10) is of a transparent structure, a cylinder cavity (19) is fixedly mounted on the left side of the inside of the box body (10), an air cylinder (20) is fixed in the middle of the inside of the cylinder cavity (19), a transverse piston rod (21) penetrating through the cylinder cavity (19) is arranged at the right output end of the air cylinder (20), a rotary mounting block (22) is fixedly mounted at the tail end of the piston rod (21), a connecting rod (23) coaxial with the piston rod (21) is rotatably connected to the right side of the rotary mounting block (22), a clamping block (16) is fixedly mounted at the tail end of the connecting rod (23), a rotary motor cavity (18) is fixedly mounted at the right side of the inside of the box body (10), the utility model discloses a water tank (12) of fixing at box (10) upper surface is provided with the solenoid valve on raceway (29), waste water outlet (17) have been seted up downwards to the bottom left and right sides of box (10) to the interior middle part in rotating electrical machine chamber (18), the left side output of rotating electrical machine (24) rotates and is connected with rotary rod (25) that pass rotating electrical machine chamber (18), the end of rotary rod (25) also fixed mounting has grip block (16), one side of grip block (16) is provided with centre gripping mouth (26), the interior top of box (10) that is located grip block (16) top is provided with two sets of water jet (28) downwards, the top of water jet (28) communicates through raceway (29) and fixes on water tank (12) of box (10) upper surface, be.
2. A precision semiconductor cleaning device according to claim 1, characterized in that four sets of pads for keeping the bottom of the tank (10) stable are fixedly installed on the bottom of the tank (10).
3. A precision semiconductor cleaning apparatus according to claim 2, wherein the cross section of the tank (10) is configured to be an upper semicircular lower rectangular shape.
4. A precision semiconductor cleaning device according to claim 3, characterized in that a group of push-pull type flaps (14) is provided in the middle of the semiconductor inlet/outlet (13).
5. A precision semiconductor cleaning device according to claim 4, characterized in that the pushing block (13) is fixedly mounted on the top of the cover (14).
6. The precision semiconductor cleaning apparatus according to claim 1, wherein a rubber pad (27) is fixedly adhered to an inner surface of the holding opening (26).
7. The precision semiconductor cleaning device according to claim 6, wherein the cylinder (20), the rotating motor (24), the water jet (28) and the solenoid valve are electrically connected to the controller (11).
8. A precision semiconductor cleaning device according to claim 1 or 2, characterized in that a set of flow guide plates with upward convex middle parts are fixedly arranged on the inner surface of the box body (10) between the two sets of waste water outlets (17).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910967045.9A CN110676197A (en) | 2019-10-12 | 2019-10-12 | Accurate semiconductor belt cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910967045.9A CN110676197A (en) | 2019-10-12 | 2019-10-12 | Accurate semiconductor belt cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110676197A true CN110676197A (en) | 2020-01-10 |
Family
ID=69081921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910967045.9A Pending CN110676197A (en) | 2019-10-12 | 2019-10-12 | Accurate semiconductor belt cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110676197A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114111281A (en) * | 2021-11-26 | 2022-03-01 | 盐城矽润半导体有限公司 | Nitrogen drying equipment for semiconductor wafer processing |
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| CN207235225U (en) * | 2017-08-04 | 2018-04-13 | 苏州鸿仕泰机械有限公司 | A kind of wiring board cleaning device recycled easy to adjusting |
| CN108993967A (en) * | 2018-07-09 | 2018-12-14 | 武汉理工大学 | A kind of vehicle part cleaning device |
| CN109047163A (en) * | 2018-08-01 | 2018-12-21 | 南京泰明生物科技有限公司 | A kind of cleaning equipment for optical polish piece |
| CN109127514A (en) * | 2018-09-19 | 2019-01-04 | 安徽宇臻实业有限公司 | A kind of glass washing device |
| CN208321458U (en) * | 2018-04-28 | 2019-01-04 | 天津市靓亚运动器材有限公司 | A kind of bicycle accessories cleaning device |
| CN110112086A (en) * | 2019-05-30 | 2019-08-09 | 滕吉美 | A kind of semiconductor chip cleaning equipment |
-
2019
- 2019-10-12 CN CN201910967045.9A patent/CN110676197A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207235225U (en) * | 2017-08-04 | 2018-04-13 | 苏州鸿仕泰机械有限公司 | A kind of wiring board cleaning device recycled easy to adjusting |
| CN208321458U (en) * | 2018-04-28 | 2019-01-04 | 天津市靓亚运动器材有限公司 | A kind of bicycle accessories cleaning device |
| CN108993967A (en) * | 2018-07-09 | 2018-12-14 | 武汉理工大学 | A kind of vehicle part cleaning device |
| CN109047163A (en) * | 2018-08-01 | 2018-12-21 | 南京泰明生物科技有限公司 | A kind of cleaning equipment for optical polish piece |
| CN109127514A (en) * | 2018-09-19 | 2019-01-04 | 安徽宇臻实业有限公司 | A kind of glass washing device |
| CN110112086A (en) * | 2019-05-30 | 2019-08-09 | 滕吉美 | A kind of semiconductor chip cleaning equipment |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114111281A (en) * | 2021-11-26 | 2022-03-01 | 盐城矽润半导体有限公司 | Nitrogen drying equipment for semiconductor wafer processing |
| CN114111281B (en) * | 2021-11-26 | 2023-05-12 | 盐城矽润半导体有限公司 | Nitrogen drying equipment for semiconductor wafer processing |
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Application publication date: 20200110 |