CN115921389B - Cleaning equipment suitable for semiconductor substrate - Google Patents
Cleaning equipment suitable for semiconductor substrate Download PDFInfo
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- CN115921389B CN115921389B CN202211483285.XA CN202211483285A CN115921389B CN 115921389 B CN115921389 B CN 115921389B CN 202211483285 A CN202211483285 A CN 202211483285A CN 115921389 B CN115921389 B CN 115921389B
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- water inlet
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- 238000004140 cleaning Methods 0.000 title claims abstract description 183
- 239000004065 semiconductor Substances 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 title claims abstract description 22
- 239000007788 liquid Substances 0.000 claims abstract description 23
- 238000005406 washing Methods 0.000 claims abstract description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 57
- 238000007789 sealing Methods 0.000 claims description 32
- 230000005540 biological transmission Effects 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 6
- 238000004891 communication Methods 0.000 claims description 5
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims description 3
- 235000017491 Bambusa tulda Nutrition 0.000 claims description 3
- 241001330002 Bambuseae Species 0.000 claims description 3
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims description 3
- 239000011425 bamboo Substances 0.000 claims description 3
- 239000002699 waste material Substances 0.000 claims description 3
- 230000006978 adaptation Effects 0.000 claims description 2
- 239000012634 fragment Substances 0.000 claims description 2
- 230000006835 compression Effects 0.000 claims 1
- 238000007906 compression Methods 0.000 claims 1
- 230000008602 contraction Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 abstract description 65
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 238000011010 flushing procedure Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention belongs to the technical field of semiconductor wafers, in particular to cleaning equipment suitable for semiconductor substrates, which comprises a workbench provided with a cleaning tank, wherein a machine head for adsorbing and taking the wafer into the cleaning tank to realize cleaning is fixedly arranged on the upper surface of the workbench. This cleaning equipment suitable for semiconductor substrate through setting up wafer belt cleaning device, has reached and has driven the wash bowl through the meshing of drive gear with the drive ring gear and rotate and install ten cleaning rollers on the wash bowl, ten cleaning rollers produce the rotation through the meshing of walking gear with the walking ring gear when the cleaning roller revolves along with the wash bowl, the washing liquid gets into total inlet tube through corresponding intake pipe and passes through the shower nozzle blowout, the rotational speed of wafer belt cleaning device keeps certain when making the wafer wash to can carry out the omnidirectional washing to the wafer, and then improve the abluent efficiency of wafer.
Description
Technical Field
The invention relates to the technical field of semiconductor wafers, in particular to cleaning equipment suitable for semiconductor substrates.
Background
A wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the wafer is circular in shape; various circuit element structures can be fabricated on a silicon wafer to form an IC product with specific electrical functions. The starting material for the wafer is silicon, while the crust surface is useful with inexhaustible silicon dioxide. Refining silicon dioxide ore by an electric arc furnace, chloridizing by hydrochloric acid, and distilling to prepare high-purity polysilicon;
the existing wafer cleaning device rotates the wafer when cleaning the wafer, the cleaning component always sprays the cleaning liquid towards one direction, the cleaning liquid can rotate together under the high-speed rotation of the wafer during cleaning, vortex is easily generated in the cleaning liquid, the central part of the wafer is insufficiently cleaned, and the actual cleaning rotating speed of the cleaning liquid during cleaning the wafer is lower than the set rotating speed along with the rotation of the wafer, so that the cleaning effect of the wafer is affected.
Disclosure of Invention
Based on the technical problems that the existing wafer cleaning device rotates the wafer when the wafer is cleaned, vortex is easily generated by the cleaning liquid, the cleaning of the center part of the wafer is insufficient, the actual cleaning rotating speed of the cleaning liquid when the wafer is cleaned is lower than the set rotating speed along with the wafer, and the cleaning effect of the wafer is affected.
The invention provides cleaning equipment suitable for a semiconductor substrate, which comprises a workbench, wherein a machine head used for adsorbing and taking a wafer into a cleaning tank to realize cleaning is fixedly arranged on the upper surface of the workbench, the upper surface of the workbench is provided with a cleaning tank with a cylindrical inner wall, the inner wall of the upper end of the cleaning tank is provided with a sealing part, the inner wall of the cleaning tank, which is positioned below the sealing part, is provided with a wafer cleaning device, the machine head is used for taking the wafer to be cleaned into the cleaning tank and cleaning the wafer through the wafer cleaning device, and the inner wall of the bottom of the cleaning tank is provided with a drain hole used for discharging cleaning waste liquid.
The sealing part is composed of a placing groove arranged on the inner walls of two sides of the cleaning tank, two second sliding grooves symmetrically distributed on the inner top walls of the two placing grooves, and two sealing plates respectively inserted into the inner walls of the two placing grooves.
Preferably, one end of the second sliding groove penetrates through and extends to the upper surface of the workbench, two sliding strips which are symmetrically distributed are fixedly connected to the upper surfaces of the two sealing plates, and a supporting plate is fixedly connected to the upper surfaces of the two sliding strips.
Preferably, the two side surfaces of the supporting plate are fixedly connected with ear plates, four cylinders distributed in a rectangular array are fixedly arranged on the upper surface of the workbench, one ends of the pneumatic rods of the four cylinders are fixedly connected with one side surface of each ear plate, and the upper surfaces of the two supporting plates are fixedly connected with supporting columns.
Preferably, the wafer cleaning device is composed of a supporting ring fixed on the inner wall of the cleaning tank, a mounting cylinder fixedly connected with the upper surface of the supporting ring, a cleaning cylinder of a T-shaped structure in which the inner wall of the mounting cylinder is rotatably sleeved with a bearing, and a total water inlet pipe, wherein a first connecting ring is fixedly connected with the lower surface of the cleaning cylinder, a first annular groove with the inner wall of the T-shaped structure is formed in the upper surface of the total water inlet pipe, and the outer surface of the first connecting ring is rotatably sleeved with the inner wall of the first annular groove.
Preferably, the inner surface of the supporting ring is fixedly sleeved with the outer surface of the total water inlet pipe, so that the total water inlet pipe is further supported and fixed.
Preferably, the inside wall fixedly connected with joint piece of installation section of thick bamboo, the inner wall fixed mounting of joint piece has driving motor, driving motor's main shaft surface fixedly connected with drive gear, the lower extreme external surface fixed sleeve of wash bowl has driven the ring gear, drive gear with the transmission of drive ring gear meshing, ten with the axis of wash bowl is the first connector that annular array distributes for the central line has been seted up to the upper end inside wall of wash bowl, ten the inner wall of first connector is all through bearing fixedly connected with cleaning roller.
Preferably, a second annular groove is formed in the inner side wall of the upper end of the cleaning groove, a walking toothed ring is fixedly arranged on the inner bottom wall of the second annular groove, the tail ends of ten cleaning rollers extend into the second annular groove and are fixedly sleeved with a walking gear, and the walking gear is meshed with the walking toothed ring for transmission.
Preferably, the washing tank is located the third ring channel has all been seted up to the inside wall of the top of second ring channel and below, two the inner wall rotation of third ring channel has cup jointed the sealing ring, the week side of sealing ring seted up with the bell mouth of cleaning roller surface looks adaptation, just the surface of cleaning roller with the inner wall rotation of bell mouth cup joints, and the washing mouth has all been seted up to the upper surface of a washing section of thick bamboo and the week side of cleaning roller, just the inner wall of washing mouth is all fixed mounting has the shower nozzle.
Preferably, the lower extreme inner wall of total inlet tube has seted up three evenly distributed's second connector, just the one end of second connector runs through to the inside wall of washing tank, the inner wall fixed intercommunication of second connector has first water inlet pipe, and three first solenoid valve is all installed to the inner wall of first water inlet pipe, and three first communication port has all been seted up to the inner wall of second connector, the inner wall of first communication port install with the second water inlet pipe of the one end fixed intercommunication of first water inlet pipe.
Preferably, the inner wall of the drain hole is fixedly communicated with a water outlet pipe, the inner wall of the bottom of the cleaning tank is fixedly connected with a filter cover used for preventing fragments generated after the wafer bursts from falling into the water outlet pipe, the outer surface of the bottom of the total water inlet pipe is fixedly connected with the inner wall of the filter cover, and then the bottom of the total water inlet pipe is vertically supported by the filter cover.
The beneficial effects of the invention are as follows:
1. through setting up the sealing part, reached the promotion to the otic placode through four cylinders, drive the backup pad and remove, owing to be connected through the draw runner between backup pad and the closing plate for closing plate and backup pad are synchronous motion, and then control the effect of the motion of closing plate and backup pad simultaneously through the cylinder.
2. Through setting up wafer belt cleaning device, reached and driven the drive gear rotation through driving motor, the meshing through drive gear and drive ring gear drives the wash bowl and rotates and install ten cleaning rollers on the wash bowl rotatory, ten cleaning rollers produce the rotation through the meshing of walking gear and walking ring gear when the cleaning roller revolves along with the wash bowl, the washing liquid gets into total inlet tube through corresponding intake manifold, and convey to in the wash bowl, and convey the inside of ten cleaning rollers respectively with the washing liquid through the wash bowl, rethread shower nozzle blowout, ensure the rotational speed of belt cleaning device when wasing the wafer, and can carry out the omnidirectional washing to the wafer, and then improve the abluent efficiency of wafer.
Drawings
FIG. 1 is a schematic diagram of a cleaning apparatus for semiconductor substrates according to the present invention;
FIG. 2 is a cross-sectional view of a stage structure of a cleaning apparatus for semiconductor substrates according to the present invention;
FIG. 3 is a cross-sectional view of a mounting cylinder for a semiconductor substrate cleaning apparatus according to the present invention;
FIG. 4 is a perspective view of a stage structure of a cleaning apparatus for semiconductor substrates according to the present invention;
FIG. 5 is a perspective view of a sealing member of a cleaning apparatus for semiconductor substrates according to the present invention;
FIG. 6 is a perspective view of a wafer cleaning apparatus for cleaning semiconductor substrates according to the present invention;
FIG. 7 is a perspective view showing a traveling ring gear structure of a cleaning apparatus for semiconductor substrates according to the present invention;
FIG. 8 is a cross-sectional view of a wafer cleaning apparatus for cleaning a semiconductor substrate according to the present invention;
fig. 9 is an enlarged view of the structure a in fig. 3 for a cleaning apparatus for semiconductor substrates according to the present invention.
In the figure: 1. a work table; 2. a cleaning tank; 3. a machine head; 4. a placement groove; 41. a second chute; 42. a sealing plate; 43. a slide bar; 44. a support plate; 45. ear plates; 46. a cylinder; 47. a support column; 5. a support ring; 51. a mounting cylinder; 52. a cleaning cylinder; 53. a main water inlet pipe; 54. a first connection ring; 55. a first annular groove; 56. a clamping block; 57. a driving motor; 58. a drive gear; 59. driving the toothed ring; 510. a first connection port; 511. a cleaning roller; 512. a second annular groove; 513. a walking toothed ring; 514. a traveling gear; 515. a third annular groove; 516. a seal ring; 517. a sleeve interface; 518. a cleaning port; 519. a spray head; 520. a second connection port; 521. a first water inlet pipe; 522. a first electromagnetic valve; 523. a first communication port; 524. a second water inlet pipe; 6. a drain hole; 61. a filter cover; 62. and a water outlet pipe.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
Referring to fig. 1 to 9, a cleaning device suitable for semiconductor substrates comprises a workbench 1, wherein a machine head 3 for sucking a wafer to clean the wafer under negative pressure is fixedly arranged on the upper surface of the workbench 1, the existing machine head 3 adsorbs the upper surface of the wafer, then the existing machine head is lowered and extended to realize telescopic action, a cleaning tank 2 with a cylindrical inner wall is arranged on the upper surface of the workbench 1, a sealing part is arranged on the inner wall of the upper end of the cleaning tank 2, a wafer cleaning device is arranged on the inner wall of the cleaning tank 2 below the sealing part, and the machine head 3 takes the wafer to be cleaned into the cleaning tank 2 to clean the wafer through the wafer cleaning device.
As shown in fig. 1-5, in order to prevent the cleaning solution inside the cleaning tank 2 from volatilizing too fast, a sealing component is provided, which is composed of a holding groove 4 opened on two side inner walls of the cleaning tank 2, two second sliding grooves 41 symmetrically distributed opened on inner top walls of the two holding grooves 4, and two sealing plates 42 respectively inserted on inner walls of the two holding grooves 4, one end of the second sliding groove 41 penetrates and extends to the upper surface of the workbench 1 in order to guide the sliding strips 43, two sliding strips 43 symmetrically distributed are fixedly connected on the upper surfaces of the two sealing plates 42, and the upper surfaces of the two sliding strips 43 are fixedly connected with the supporting plate 44 in order to make the supporting plate 44 and the sealing plates 42 move synchronously.
In order to control the position of the supporting plate 44, ear plates 45 are fixedly connected to two side surfaces of the supporting plate 44, four cylinders 46 distributed in a rectangular array are fixedly mounted on the upper surface of the workbench 1, one ends of air pressure rods of the four cylinders 46 are fixedly connected with one side surface of the four ear plates 45 respectively, support columns 47 are fixedly connected to the upper surfaces of the two supporting plates 44 for placing wafers, and the plurality of support columns 47 form an annular structure.
As shown in fig. 1-4 and fig. 6-9, the wafer cleaning device is composed of a supporting ring 5 fixed on the inner wall of a cleaning tank and provided with a water leakage port, a mounting cylinder 51 fixedly connected with the upper surface of the supporting ring 5, a cleaning cylinder 52 and a total water inlet pipe 53 which are of a T-shaped structure and are rotatably sleeved on the inner wall of the mounting cylinder 51 through bearings, the inner wall of the lower end of the mounting cylinder 51 is fixedly connected with the outer surface of the total water inlet pipe 53, a first connecting ring 54 is fixedly connected with the lower surface of the cleaning cylinder 52 for enabling the cleaning cylinder 52 to be rotatably and hermetically connected with the total water inlet pipe 53, and further, a first annular groove 55 with the inner wall of the T-shaped structure is formed in the upper surface of the total water inlet pipe 53, and the outer surface of the first connecting ring 54 is rotatably sleeved with the inner wall of the first annular groove 55.
In order to install the driving motor 57 on the inner wall of the installation cylinder 51, a clamping block 56 is fixedly connected to the inner wall of the installation cylinder 51, the driving motor 57 is fixedly installed on the inner wall of the clamping block 56, a driving gear 58 is fixedly connected to the outer surface of a main shaft of the driving motor 57 for driving the cleaning cylinder 52 to rotate, and further, a driving toothed ring 59 is fixedly sleeved on the outer surface of the lower end of the cleaning cylinder 52, so that the driving gear 58 and the driving toothed ring 59 are meshed for transmission.
In order to install the cleaning roller 511 on the circumferential side surface of the cleaning barrel 52, ten first connection ports 510 which are distributed in an annular array with the axis of the cleaning barrel 52 as a central line are formed in the inner side wall of the upper end of the cleaning barrel 52, and the cleaning roller 511 is fixedly connected to the inner walls of the ten first connection ports 510 through bearings, so that the cleaning roller 511 can rotate in the first connection ports 510.
In order to control the cleaning roller 511 to revolve along with the cleaning drum 52 and rotate at the same time, a second annular groove 512 is formed in the inner side wall of the upper end of the cleaning tank 2, a traveling toothed ring 513 is fixedly mounted on the inner bottom wall of the second annular groove 512, in order to enable the cleaning roller 511 to rotate, the tail ends of the ten cleaning rollers 511 extend into the second annular groove 512 and fixedly sleeve a traveling gear 514, the traveling gear 514 is meshed with the traveling toothed ring 513 for transmission, in order to prevent cleaning liquid from entering the second annular groove 512 to corrode the traveling gear 514 and the traveling toothed ring 513, third annular grooves 515 are formed in the inner side walls of the cleaning tank 2 above and below the second annular groove 512, and sealing rings 516 are rotatably sleeved on the inner walls of the two third annular grooves 515.
In order to match the cleaning roller 511 and the sealing ring 516, a socket 517 adapted to the outer surface of the cleaning roller 511 is provided on the circumferential side surface of the sealing ring 516, the outer surface of the cleaning roller 511 is rotationally sleeved with the inner wall of the socket 517, and in order to clean the wafer, cleaning openings 518 are provided on the upper surface of the cleaning cylinder 52 and the circumferential side surface of the cleaning roller 511, and spray heads 519 are fixedly mounted on the inner wall of the cleaning openings 518, so that the impact force of the cleaning liquid is increased.
In order to prevent mixing of each cleaning solution, three second connection ports 520 which are uniformly distributed are formed in the inner wall of the lower end of the total water inlet pipe 53, one end of each second connection port 520 penetrates through the inner wall of the cleaning tank 2, further, a first water inlet branch pipe 521 is fixedly communicated with the inner wall of each second connection port 520, first electromagnetic valves 522 are respectively mounted on the inner walls of the three first water inlet branch pipes 521, the plurality of first electromagnetic valves 522 are respectively self-locking electromagnetic valves, first connection ports 523 are respectively formed in the inner walls of the three second connection ports 520, further, a second water inlet branch pipe 524 which is fixedly communicated with one end of each first water inlet branch pipe 521 is mounted on the inner wall of each first connection port 523, and a cleaning solution storage cylinder is arranged at one end of each second water inlet branch pipe 524.
In order to discharge the waste liquid of cleaning liquid, offer the wash port 6 that is used for carrying out the exhaust wash liquid at the bottom inner wall of washing tank 2, further, the inner wall fixed intercommunication at wash port 6 has outlet pipe 62, further in order to prevent that the wafer from bursting the back, the wafer piece can fall into outlet pipe 62 in, cause outlet pipe 62 to block up, be connected with at the bottom inner wall of washing tank 2 fixedly and be used for preventing the piece that produces after the wafer bursts and fall into the filter mantle 61 in outlet pipe 62, in order to support the bottom of total inlet tube 53, the bottom surface at total inlet tube 53 and the inner wall fixed connection of filter mantle 61, and then carry out vertical support to the bottom of total inlet tube 53 through filter mantle 61.
Working principle: the wafer is placed on the supporting columns 47, the machine head 3 adsorbs and takes the wafer, the four air cylinders 46 are controlled to be electrified, the two supporting plates 44 and the two sealing plates 42 are driven to move to two sides, the wafer to be cleaned is further stretched into the cleaning tank 2, the four air cylinders 46 are controlled to be electrified again, the supporting plates 44 and the sealing plates 42 are controlled to move to the middle, and the wafer is sealed in the cleaning tank 2;
the first electromagnetic valve 522 and the second electromagnetic valve 65 are controlled to be opened and closed by the PLC, the three water inlet branch pipes connected with the main water inlet pipe 53 respectively transmit pure water, first cleaning liquid and second cleaning liquid, and the wafer flushing sequence is as follows: the cleaning device comprises a first cleaning liquid, pure water, a second cleaning liquid and pure water, wherein during flushing, a driving motor 57 drives a driving gear 58 to rotate, a cleaning barrel 52 is driven to rotate through the engagement of the driving gear 58 and a driving toothed ring 59, ten cleaning rollers 511 arranged on the cleaning barrel 52 are driven to rotate during the rotation of the cleaning barrel 52, the ten cleaning rollers 511 are meshed with a traveling toothed ring 513 through traveling gears 514, rotation is generated while the cleaning rollers 511 revolve along with the cleaning barrel 52, the cleaning liquid enters a total water inlet pipe 53 through corresponding water inlet pipes and is conveyed into the cleaning barrel 52, the cleaning liquid is conveyed into the ten cleaning rollers 511 respectively through the cleaning barrel 52, and is sprayed out through a spray head 519, and the cleaning liquid is prevented from entering a second annular groove 512 through a sealing ring 516 to corrode the traveling gears 514 and the traveling toothed ring 513;
after the first cleaning solution finishes cleaning the wafer, the first electromagnetic valve 522 in the water inlet branch pipe of the first cleaning solution is controlled to close the pipeline, water supply is stopped, the second electromagnetic valve 65 for supplying pure water is controlled to open the corresponding pipeline, then the wafer is washed, after the pure water is washed, the first electromagnetic valve 522 in the water inlet branch pipe for controlling the pure water is controlled to close the water inlet branch pipe, the first electromagnetic valve 522 in the water inlet branch pipe for controlling the second cleaning solution is controlled to open the corresponding pipeline, the second cleaning solution is used for washing the wafer, finally the pure water is used for washing the wafer, and then the waste water flows out through the water outlet pipe 62 in the processes of washing the wafer with the first cleaning solution, the second cleaning solution and the pure water.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (6)
1. A cleaning apparatus for semiconductor substrates, characterized in that: the cleaning device comprises a workbench (1) provided with a cleaning tank (2), wherein a machine head (3) for adsorbing and taking a wafer into the cleaning tank to realize cleaning is fixedly arranged on the upper surface of the workbench (1), and a drain hole (6) for draining cleaning waste liquid is formed in the inner wall of the bottom of the cleaning tank (2);
the cleaning tank is characterized in that a sealing part for sliding and sealing the cleaning tank (2) left and right is arranged at the top edge of the cleaning tank (2), the sealing part comprises a supporting plate (44) sliding left and right along the width direction of the workbench (1) and a supporting column (47) for temporarily placing the wafer, the sealing part further comprises a placing groove (4) arranged on the inner walls of the two sides of the cleaning tank (2), two second sliding grooves (41) which are symmetrically distributed are formed in the inner top wall of the two placing grooves (4), sealing plates (42) are inserted into the inner walls of the two placing grooves (4), and the left and right opening and closing of the two sealing plates (42) are used for sealing the machine head (3);
the wafer cleaning device is arranged in the cleaning tank (2) and is used for rotationally cleaning the lower surface of the wafer, and comprises a cleaning cylinder (52) which rotates circumferentially along the axis of the cleaning tank (2) and ten cleaning rollers (511) which rotate along the circumferential rotation of the cleaning cylinder (52), wherein the circumferential rotation of the cleaning cylinder (52) drives the cleaning rollers (511) to rotate and clean the lower surface of the wafer;
the wafer cleaning device further comprises a supporting ring (5) fixed on the inner wall of the cleaning tank (2), an installation cylinder (51) is fixedly connected to the upper surface of the supporting ring (5), the inner wall of the upper end of the installation cylinder (51) is rotatably sleeved with the outer surface of the cleaning cylinder (52) through a bearing, a total water inlet pipe (53) is fixedly connected to the inner wall of the lower end of the installation cylinder (51), a first connecting ring (54) is fixedly connected to the lower surface of the cleaning cylinder (52), a first annular groove (55) with a T-shaped inner wall is formed in the upper surface of the total water inlet pipe (53), and the outer surface of the first connecting ring (54) is rotatably sleeved with the inner wall of the first annular groove (55);
the inner side wall of the mounting cylinder (51) is fixedly connected with a clamping block (56), a driving motor (57) is fixedly arranged on the inner wall of the clamping block (56), a driving gear (58) is fixedly connected with the outer surface of a main shaft of the driving motor (57), a driving toothed ring (59) is fixedly sleeved on the outer surface of the lower end of the cleaning cylinder (52), the driving gear (58) is meshed with the driving toothed ring (59) for transmission, ten first connecting ports (510) which are distributed in an annular array by taking the axis of the cleaning cylinder (52) as a central line are formed in the inner side wall of the upper end of the cleaning cylinder (52), and one end outer surface of each cleaning roller (511) is fixedly connected with the inner walls of the ten first connecting ports (510) through bearings respectively;
a second annular groove (512) is formed in the inner side wall of the upper end of the cleaning groove (2), a traveling toothed ring (513) is fixedly arranged on the inner bottom wall of the second annular groove (512), the tail ends of ten cleaning rollers (511) extend into the second annular groove (512) and are fixedly sleeved with a traveling gear (514), and the traveling gear (514) is meshed with the traveling toothed ring (513) for transmission;
three evenly distributed's second connector (520) have been seted up to the lower extreme inner wall of total inlet tube (53), just the one end of second connector (520) runs through to the inside wall of washing tank (2), the inner wall fixed intercommunication of second connector (520) has first water inlet branch pipe (521), and three first solenoid valve (522) are all installed to the inner wall of first water inlet branch pipe (521), and three first communication port (523) have all been seted up to the inner wall of second connector (520), second water inlet branch pipe (524) with the one end fixed intercommunication of first water inlet branch pipe (521) are installed to the inner wall of first communication port (523).
2. A cleaning apparatus for semiconductor substrates as claimed in claim 1, wherein: one end of the second sliding groove (41) penetrates through and extends to the upper surface of the workbench (1), two sliding strips (43) which are symmetrically distributed are fixedly connected to the upper surfaces of the two sealing plates (42), and the upper surfaces of the two sliding strips (43) are fixedly connected with the lower surface of the supporting plate (44).
3. A cleaning apparatus for semiconductor substrates as claimed in claim 1, wherein: the two side surfaces of the supporting plate (44) are fixedly connected with ear plates (45), four cylinders (46) distributed in a rectangular array are fixedly arranged on the upper surface of the workbench (1), one ends of air compression rods of the four cylinders (46) are fixedly connected with one side surface of the four ear plates (45) respectively, and the two supporting plates (44) are driven to move left and right along the width direction of the workbench (1) through the expansion and contraction of the four cylinders (46).
4. A cleaning apparatus for semiconductor substrates as claimed in claim 1, wherein: the inner surface of the supporting ring (5) is fixedly sleeved with the outer surface of the total water inlet pipe (53), and further supports and fixes the total water inlet pipe (53).
5. A cleaning apparatus for semiconductor substrates as defined in claim 4, wherein: the washing tank (2) is located the inside wall of the top and the below of second ring channel (512) has all seted up third ring channel (515), two the rotatory sealing ring (516) that has cup jointed of inner wall of third ring channel (515), the perisporium of sealing ring (516) seted up with socket (517) of cleaning roller (511) surface looks adaptation, just the surface of cleaning roller (511) with the rotatory socket of inner wall of socket (517), the washing mouth (518) have all been seted up to the perisporium of upper surface and cleaning roller (511) of washing section of thick bamboo (52), just the inner wall of washing mouth (518) all fixed mounting shower nozzle (519).
6. A cleaning apparatus for semiconductor substrates as claimed in claim 1, wherein: the inner wall of the drain hole (6) is fixedly communicated with a water outlet pipe (62), the inner wall of the bottom of the cleaning tank (2) is fixedly connected with a filter cover (61) used for preventing fragments generated after the wafer bursts from falling into the water outlet pipe (62), the outer surface of the bottom of the total water inlet pipe (53) is fixedly connected with the inner wall of the filter cover (61), and then the bottom of the total water inlet pipe (53) is vertically supported by the filter cover (61).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211483285.XA CN115921389B (en) | 2022-11-24 | 2022-11-24 | Cleaning equipment suitable for semiconductor substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211483285.XA CN115921389B (en) | 2022-11-24 | 2022-11-24 | Cleaning equipment suitable for semiconductor substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115921389A CN115921389A (en) | 2023-04-07 |
| CN115921389B true CN115921389B (en) | 2024-03-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211483285.XA Active CN115921389B (en) | 2022-11-24 | 2022-11-24 | Cleaning equipment suitable for semiconductor substrate |
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| CN (1) | CN115921389B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108435616A (en) * | 2018-06-01 | 2018-08-24 | 四川益泽丰信息科技有限公司 | A kind of outdoor LED screen auto dust cleaning machine |
| CN212883752U (en) * | 2020-08-28 | 2021-04-06 | 刘静 | Ultrasonic image probe belt cleaning device |
| CN114114806A (en) * | 2021-11-06 | 2022-03-01 | 江苏金狮堂视觉科技有限公司 | Digital exhibition room projection presentation device |
| CN216064584U (en) * | 2021-10-25 | 2022-03-18 | 楚楠 | Chemical production is with industrial chemicals rinsing device |
| CN114669548A (en) * | 2022-05-26 | 2022-06-28 | 智程半导体设备科技(昆山)有限公司 | Single-chip type semiconductor substrate cleaning machine |
| CN114682345A (en) * | 2022-04-01 | 2022-07-01 | 江西英特科胜动保科技有限公司 | Dust clearing device is used in animal remedy powder production |
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2022
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108435616A (en) * | 2018-06-01 | 2018-08-24 | 四川益泽丰信息科技有限公司 | A kind of outdoor LED screen auto dust cleaning machine |
| CN212883752U (en) * | 2020-08-28 | 2021-04-06 | 刘静 | Ultrasonic image probe belt cleaning device |
| CN216064584U (en) * | 2021-10-25 | 2022-03-18 | 楚楠 | Chemical production is with industrial chemicals rinsing device |
| CN114114806A (en) * | 2021-11-06 | 2022-03-01 | 江苏金狮堂视觉科技有限公司 | Digital exhibition room projection presentation device |
| CN114682345A (en) * | 2022-04-01 | 2022-07-01 | 江西英特科胜动保科技有限公司 | Dust clearing device is used in animal remedy powder production |
| CN114669548A (en) * | 2022-05-26 | 2022-06-28 | 智程半导体设备科技(昆山)有限公司 | Single-chip type semiconductor substrate cleaning machine |
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| CN115921389A (en) | 2023-04-07 |
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Address after: 215000, No. 889 Zhonghua Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region after: China Address before: Room 3, 299 Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region before: China |