CN115921389A - Cleaning equipment suitable for semiconductor substrate - Google Patents
Cleaning equipment suitable for semiconductor substrate Download PDFInfo
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- CN115921389A CN115921389A CN202211483285.XA CN202211483285A CN115921389A CN 115921389 A CN115921389 A CN 115921389A CN 202211483285 A CN202211483285 A CN 202211483285A CN 115921389 A CN115921389 A CN 115921389A
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- semiconductor substrates
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- 238000004140 cleaning Methods 0.000 title claims abstract description 180
- 239000004065 semiconductor Substances 0.000 title claims abstract description 29
- 239000000758 substrate Substances 0.000 title claims abstract description 26
- 239000007788 liquid Substances 0.000 claims abstract description 31
- 238000005406 washing Methods 0.000 claims abstract description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 51
- 238000007789 sealing Methods 0.000 claims description 30
- 238000009434 installation Methods 0.000 claims description 9
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims description 6
- 235000017491 Bambusa tulda Nutrition 0.000 claims description 6
- 241001330002 Bambuseae Species 0.000 claims description 6
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims description 6
- 239000011425 bamboo Substances 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 claims description 6
- 239000012634 fragment Substances 0.000 claims description 4
- 239000002699 waste material Substances 0.000 claims description 4
- 230000006978 adaptation Effects 0.000 claims description 2
- 238000009826 distribution Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 abstract description 63
- 230000000694 effects Effects 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention belongs to the technical field of semiconductor wafers, and particularly relates to a cleaning device suitable for a semiconductor substrate. This washing equipment suitable for semiconductor substrate, through setting up wafer belt cleaning device, it is rotatory and install ten cleaning rollers on the cleaning barrel to have reached to drive the cleaning barrel through the meshing of drive gear and drive ring gear, ten cleaning rollers pass through the meshing of walking gear and walking ring gear, produce the rotation when the cleaning roller carries out the revolution along with the cleaning barrel, the washing liquid passes through corresponding partial pipe entering total inlet tube of intaking and passes through the shower nozzle blowout, wafer belt cleaning device's rotational speed keeps certain when making the wafer wash, and can carry out omnidirectional washing to the wafer, and then improve the abluent efficiency of wafer.
Description
Technical Field
The invention relates to the technical field of semiconductor wafers, in particular to a cleaning device suitable for a semiconductor substrate.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit device structures can be fabricated on a silicon wafer to form an IC product with specific electrical functions. The starting material for the wafer is silicon, while the crust surface has an inexhaustible amount of silicon dioxide. The silicon dioxide ore is refined by an electric arc furnace, chlorinated by hydrochloric acid and distilled to prepare high-purity polysilicon;
the existing wafer cleaning device is characterized in that a wafer rotates when the wafer is cleaned, a cleaning part sprays cleaning liquid towards one direction all the time, the cleaning liquid can be driven to rotate together under the high-speed rotation of the wafer during cleaning, the cleaning liquid is easy to generate vortexes, the center part of the wafer is insufficiently cleaned, and when the cleaning liquid rotates along with the wafer, the actual cleaning rotating speed during the cleaning of the wafer is lower than the set rotating speed, so that the cleaning effect on the wafer is influenced.
Disclosure of Invention
Based on the technical problems that the cleaning effect on a wafer is influenced because the cleaning effect is not sufficiently cleaned because the wafer rotates when the wafer is cleaned by the conventional wafer cleaning device, and the actual cleaning rotating speed is lower than the set rotating speed when the wafer is cleaned because the cleaning liquid is easy to generate vortexes and the cleaning liquid rotates along with the wafer, the cleaning device for the wafer is provided.
The invention provides a cleaning device suitable for a semiconductor substrate, which comprises a workbench, wherein a machine head used for adsorbing and taking a wafer into a cleaning groove to realize cleaning is fixedly arranged on the upper surface of the workbench, a cleaning groove with a cylindrical inner wall is formed in the upper surface of the workbench, a sealing part is arranged on the inner wall of the upper end of the cleaning groove, a wafer cleaning device is arranged on the inner wall of the cleaning groove below the sealing part, the machine head is used for taking the wafer to be cleaned into the cleaning groove and cleaning the wafer through the wafer cleaning device, and a drain hole used for draining cleaning waste liquid is formed in the inner wall of the bottom of the cleaning groove.
The sealing component is composed of placing grooves formed in the inner walls of the two sides of the cleaning tank, two second sliding grooves which are symmetrically distributed and two sealing plates which are respectively inserted into the inner walls of the two placing grooves, wherein the two second sliding grooves are formed in the inner top walls of the two placing grooves.
Preferably, one end of the second chute penetrates through and extends to the upper surface of the workbench, two sliding strips which are symmetrically distributed are fixedly connected to the upper surfaces of the two sealing plates, and a supporting plate is fixedly connected to the upper surfaces of the two sliding strips.
Preferably, the equal fixedly connected with otic placode in both sides surface of backup pad, the last fixed surface of workstation installs four cylinders that are the distribution of rectangle array, four the one end of the pneumatic rod of cylinder respectively with four a side fixed surface of otic placode is connected, two the equal fixedly connected with support column in upper surface of backup pad.
Preferably, the wafer cleaning device by be fixed in the support ring of washing tank inner wall the installation section of thick bamboo, the installation section of thick bamboo inner wall of the upper surface fixed connection of support ring pass through the rotatory scavenge cylinder and the total inlet tube of the T shape structure that cup joints of bearing and constitute, the first connecting ring of lower fixed surface of scavenge cylinder is connected with, the first ring channel that the inner wall is T shape structure is seted up to the upper surface of total inlet tube, the surface of first connecting ring with the inner wall rotation of first ring channel cup joints.
Preferably, the inner surface of the support ring is fixedly sleeved with the outer surface of the main water inlet pipe, so as to further support and fix the main water inlet pipe.
Preferably, the inside wall fixedly connected with joint piece of installation section of thick bamboo, the inner wall fixed mounting of joint piece has driving motor, driving motor's main shaft surface fixedly connected with drive gear, the fixed cover of lower extreme surface of wash bowl has connect the drive ring gear, drive gear with the drive ring gear meshing transmission, the upper end inside wall of wash bowl has seted up ten with the axis of wash bowl is the first interface that the ring array distributes as the central line, ten the inner wall of first interface all is through bearing fixedly connected with cleaning roller.
Preferably, a second annular groove is formed in the inner side wall of the upper end of the cleaning groove, a walking toothed ring is fixedly mounted on the inner bottom wall of the second annular groove, ten cleaning rollers are arranged at the tail ends of the cleaning rollers and extend into the second annular groove, a walking gear is fixedly sleeved in the second annular groove, and the walking gear is in meshing transmission with the walking toothed ring.
Preferably, the washing tank is located third ring channel, two have all been seted up to the inside wall of the top of second ring channel and below the sealing ring has been cup jointed in the rotation of the inner wall of third ring channel, the week side of sealing ring seted up with the socket joint of cleaning roller surface looks adaptation, just the surface of cleaning roller with the inner wall rotation of socket joint is cup jointed, and the washing mouth has all been seted up to the upper surface of wash bowl and the week side of cleaning roller, just the equal fixed mounting of inner wall of washing mouth has the shower nozzle.
Preferably, three evenly distributed's second connector has been seted up to the lower extreme inner wall of total inlet tube, just the one end of second connector runs through to the inside wall of washing tank, the inner wall fixed intercommunication of second connector has first minute pipe of intaking, and three first solenoid valve is all installed to the inner wall of first minute pipe of intaking, and three first opening has all been seted up to the inner wall of second connector, the inner wall of first opening install with the second minute pipe of the fixed intercommunication of one end of first minute pipe of intaking.
Preferably, the inner wall of the drain hole is fixedly communicated with a water outlet pipe, the inner wall of the bottom of the cleaning tank is fixedly connected with a filter cover for preventing fragments generated after the wafer bursts from falling into the water outlet pipe, the outer surface of the bottom of the main water inlet pipe is fixedly connected with the inner wall of the filter cover, and then the bottom of the main water inlet pipe is vertically supported through the filter cover.
The beneficial effects of the invention are as follows:
1. seal the part through setting up, reached through the promotion of four cylinders to the otic placode, drive the backup pad and remove, because be connected through the draw runner between backup pad and the closing plate for synchronous motion is to closing plate and backup pad, and then controls the effect of the motion of closing plate and backup pad simultaneously through the cylinder.
2. Through setting up wafer belt cleaning device, it is rotatory to have reached to drive gear through driving motor, it is rotatory and install ten cleaning rollers on the cleaning barrel to drive the cleaning barrel through the meshing of drive gear and drive ring gear, ten cleaning rollers pass through the meshing of walking gear and walking ring gear, produce the rotation along with the cleaning barrel when carrying out the revolution at the cleaning roller, the washing liquid gets into total inlet tube through corresponding minute water pipe, and convey to the cleaning barrel in, and convey the inside of cleaning liquid respectively to ten cleaning rollers through the cleaning barrel, rethread shower nozzle blowout, belt cleaning device's rotational speed when guaranteeing to rinse the wafer, and can carry out omnidirectional washing to the wafer, and then improve the abluent efficiency of wafer.
Drawings
FIG. 1 is a schematic view of a cleaning apparatus for semiconductor substrates according to the present invention;
FIG. 2 is a sectional view of a stage structure of a cleaning apparatus for semiconductor substrates according to the present invention;
FIG. 3 is a sectional view of a mounting barrel structure of a cleaning apparatus for semiconductor substrates according to the present invention;
FIG. 4 is a perspective view of a platen of an apparatus for cleaning semiconductor substrates according to the present invention;
FIG. 5 is a perspective view of a sealing member of a cleaning apparatus for semiconductor substrates according to the present invention;
FIG. 6 is a perspective view of a wafer cleaning apparatus suitable for use with a semiconductor substrate cleaning apparatus according to the present invention;
FIG. 7 is a perspective view of a traveling gear ring structure of a cleaning apparatus for semiconductor substrates according to the present invention;
FIG. 8 is a cross-sectional view of a wafer cleaning apparatus suitable for use with semiconductor substrate cleaning equipment in accordance with the present invention;
FIG. 9 is an enlarged view of a structure A in FIG. 3 of a cleaning apparatus for semiconductor substrates according to the present invention.
In the figure: 1. a work table; 2. a cleaning tank; 3. a machine head; 4. a placement groove; 41. a second chute; 42. a sealing plate; 43. a slide bar; 44. a support plate; 45. an ear plate; 46. a cylinder; 47. a support column; 5. a support ring; 51. mounting the cylinder; 52. a cleaning cylinder; 53. a main water inlet pipe; 54. a first connecting ring; 55. a first annular groove; 56. a clamping block; 57. a drive motor; 58. a drive gear; 59. a drive gear ring; 510. a first connection port; 511. cleaning the roller; 512. a second annular groove; 513. a walking toothed ring; 514. a traveling gear; 515. a third annular groove; 516. a seal ring; 517. a socket; 518. cleaning the opening; 519. a spray head; 520. a second connection port; 521. a first water inlet branch pipe; 522. a first solenoid valve; 523. a first communication port; 524. a second water inlet branch pipe; 6. a drain hole; 61. a filter housing; 62. and (5) discharging a water pipe.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-9, a cleaning device suitable for semiconductor substrates, comprises a workbench 1, a machine head 3 for sucking wafers by negative pressure to realize wafer cleaning is fixedly installed on the upper surface of the workbench 1, the existing machine head 3 sucks the upper surface of the wafers, then descends and extends to realize telescopic action, a cleaning tank 2 with an inner wall in a cylindrical structure is arranged on the upper surface of the workbench 1, a sealing part is arranged on the inner wall of the upper end of the cleaning tank 2, a wafer cleaning device is arranged on the inner wall of the cleaning tank 2 below the sealing part, and the wafers needing to be cleaned are taken by the machine head 3 into the cleaning tank 2 to be cleaned by the wafer cleaning device.
As shown in fig. 1 to 5, in order to prevent the cleaning solution inside the cleaning tank 2 from being volatilized too fast, a sealing member is provided, which is composed of two placing grooves 4 provided on the inner walls of both sides of the cleaning tank 2, two second sliding grooves 41 provided on the inner top walls of the two placing grooves 4 and symmetrically distributed, and two sealing plates 42 respectively inserted into the inner walls of the two placing grooves 4, in order to guide the sliding strips 43, one end of the second sliding groove 41 is penetrated and extended to the upper surface of the table 1, in order to allow the supporting plate 44 and the sealing plates 42 to move synchronously, two sliding strips 43 symmetrically distributed are fixedly connected to the upper surfaces of the two sealing plates 42, and the supporting plate 44 is fixedly connected to the upper surfaces of the two sliding strips 43.
In order to control the position of the supporting plate 44, lug plates 45 are fixedly connected to the surfaces of the two sides of the supporting plate 44, four air cylinders 46 distributed in a rectangular array are fixedly mounted on the upper surface of the workbench 1, furthermore, one ends of air pressure rods of the four air cylinders 46 are fixedly connected to the surface of one side of the four lug plates 45 respectively, in order to place a wafer, supporting columns 47 are fixedly connected to the surfaces of the two supporting plates 44, and the supporting columns 47 form an annular structure.
As shown in fig. 1-4 and fig. 6-9, the wafer cleaning apparatus comprises a support ring 5 fixed on the inner wall of the cleaning tank and provided with a water leakage port, a mounting cylinder 51 fixedly connected to the upper surface of the support ring 5, a cleaning cylinder 52 of a T-shaped structure in which the inner wall of the mounting cylinder 51 is rotatably sleeved by a bearing, and a main water inlet pipe 53, wherein the inner wall of the lower end of the mounting cylinder 51 is fixedly connected to the outer surface of the main water inlet pipe 53, a first connecting ring 54 is fixedly connected to the lower surface of the cleaning cylinder 52 in order to rotatably seal the cleaning cylinder 52 and the main water inlet pipe 53, and further, a first annular groove 55 of a T-shaped structure is provided on the upper surface of the main water inlet pipe 53, and the outer surface of the first connecting ring 54 is rotatably sleeved with the inner wall of the first annular groove 55.
In order to install the driving motor 57 on the inner wall of the installation cylinder 51, the inner wall of the installation cylinder 51 is fixedly connected with the clamping block 56, the inner wall of the clamping block 56 is fixedly provided with the driving motor 57, in order to drive the cleaning cylinder 52 to rotate, the outer surface of the main shaft of the driving motor 57 is fixedly connected with the driving gear 58, and further, the outer surface of the lower end of the cleaning cylinder 52 is fixedly sleeved with the driving gear ring 59, so that the driving gear 58 and the driving gear ring 59 are in meshing transmission.
In order to mount the cleaning roller 511 on the peripheral side surface of the cleaning cylinder 52, ten first connection ports 510 are formed in the inner side wall of the upper end of the cleaning cylinder 52 and distributed in an annular array with the axis of the cleaning cylinder 52 as the center line, and the cleaning roller 511 is fixedly connected to the inner walls of the ten first connection ports 510 through bearings, so that the cleaning roller 511 can rotate in the first connection ports 510.
In order to control the cleaning roller 511 to rotate along with the cleaning cylinder 52, and improve the cleaning effect of the wafer, a second annular groove 512 is formed in the inner side wall of the upper end of the cleaning tank 2, a walking gear ring 513 is fixedly installed on the inner bottom wall of the second annular groove 512, in order to enable the cleaning roller 511 to rotate, the tail ends of the ten cleaning rollers 511 extend into the second annular groove 512, a walking gear 514 is fixedly sleeved and connected, the walking gear 514 and the walking gear ring 513 are in meshed transmission, in order to prevent cleaning liquid from entering the second annular groove 512 to corrode the walking gear 514 and the walking gear ring 513, third annular grooves 515 are formed in the inner side walls of the cleaning tank 2 above and below the second annular groove 512, and sealing rings 516 are rotatably sleeved on the inner walls of the two third annular grooves 515.
In order to match the cleaning roller 511 and the sealing ring 516, a socket 517 matched with the outer surface of the cleaning roller 511 is formed on the circumferential side surface of the sealing ring 516, the outer surface of the cleaning roller 511 is rotatably sleeved with the inner wall of the socket 517, in order to clean the wafer, cleaning ports 518 are formed on the upper surface of the cleaning cylinder 52 and the circumferential side surface of the cleaning roller 511, spray heads 519 are fixedly mounted on the inner walls of the cleaning ports 518, and the impact force of the cleaning liquid is increased.
In order to prevent each kind of cleaning liquid from mixing, three second connectors 520 distributed uniformly are arranged on the inner wall of the lower end of the main water inlet pipe 53, one ends of the second connectors 520 penetrate through the inner wall of the cleaning tank 2, furthermore, the inner wall of the second connectors 520 is fixedly communicated with the first water inlet branch pipes 521, the inner walls of the three first water inlet branch pipes 521 are provided with first electromagnetic valves 522, each of the first electromagnetic valves 522 is a self-locking electromagnetic valve, the inner walls of the three second connectors 520 are provided with first communication ports 523, furthermore, the inner walls of the first communication ports 523 are provided with second water inlet branch pipes 524 fixedly communicated with one ends of the first water inlet branch pipes 521, and one ends of the three second water inlet branch pipes 524 are provided with cleaning liquid storage cylinders.
In order to discharge the waste liquid of the cleaning liquid, a drain hole 6 for discharging the cleaning waste liquid is formed in the inner wall of the bottom of the cleaning tank 2, further, a water outlet pipe 62 is fixedly communicated with the inner wall of the drain hole 6, further, in order to prevent the wafer from bursting, the wafer fragments can fall into the water outlet pipe 62 to block the water outlet pipe 62, a filter cover 61 for preventing the fragments generated after the wafer bursts from falling into the water outlet pipe 62 is fixedly connected to the inner wall of the bottom of the cleaning tank 2, in order to support the bottom of the main water inlet pipe 53, the outer surface of the bottom of the main water inlet pipe 53 is fixedly connected with the inner wall of the filter cover 61, and then the bottom of the main water inlet pipe 53 is vertically supported through the filter cover 61.
The working principle is as follows: the wafer is placed on the supporting column 47, the machine head 3 adsorbs and takes the wafer, the four air cylinders 46 are controlled to be electrified to drive the two supporting plates 44 and the two sealing plates 42 to move towards two sides, the wafer to be cleaned is further stretched into the cleaning tank 2, the four air cylinders 46 are controlled to be electrified again, the supporting plates 44 and the sealing plates 42 are controlled to move towards the middle, and the wafer is sealed in the cleaning tank 2;
through opening and closing of first solenoid valve 522 and second solenoid valve 65 of PLC programmable controller control, the branch pipe of three intaking that is connected with total inlet tube 53 conveys pure water, first kind of washing liquid and second kind of washing liquid respectively, and the washing order of wafer is: the first cleaning liquid → pure water → the second cleaning liquid → pure water, when washing, the driving motor 57 drives the driving gear 58 to rotate, the cleaning cylinder 52 is driven to rotate by the engagement of the driving gear 58 and the driving gear ring 59, the cleaning cylinder 52 drives the ten cleaning rollers 511 mounted on the cleaning cylinder 52 to rotate when rotating, the ten cleaning rollers 511 are engaged with the walking gear ring 513 through the walking gear 514, the cleaning rollers 511 rotate along with the cleaning cylinder 52 when revolving, the cleaning liquid enters the main water inlet pipe 53 through the corresponding water inlet branch pipe and is conveyed into the cleaning cylinder 52, the cleaning liquid is conveyed to the insides of the ten cleaning rollers 511 through the cleaning cylinder 52 and is sprayed out through the spray head 519, and the cleaning liquid is prevented from entering the second annular groove 512 through the sealing ring 516 to corrode the walking gear 514 and the walking gear ring 513;
after the first cleaning liquid finishes cleaning the wafer, the first electromagnetic valve 522 in the water inlet branch pipe of the first cleaning liquid is controlled to close the pipeline, water supply is stopped, the second electromagnetic valve 65 for providing pure water is controlled to open the corresponding pipeline, then the wafer is washed, after the wafer is washed by the pure water, the first electromagnetic valve 522 in the water inlet branch pipe of the pure water is controlled to close the water inlet branch pipe, the corresponding pipeline is opened by the first electromagnetic valve 522 for controlling the water inlet branch pipe for providing the second cleaning liquid, the wafer is washed by the second cleaning liquid, finally the wafer is washed by the pure water, and in the cleaning process of the first cleaning liquid, the second cleaning liquid and the pure water, wastewater can flow out through the water outlet pipe 62.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered as the technical solutions and the inventive concepts of the present invention within the technical scope of the present invention.
Claims (10)
1. A cleaning apparatus for semiconductor substrates, comprising: the cleaning device comprises a workbench (1) provided with a cleaning tank (2), wherein a machine head (3) for adsorbing and taking a wafer into the cleaning tank to realize cleaning is fixedly arranged on the upper surface of the workbench (1), and a drainage hole (6) for draining cleaning waste liquid is formed in the inner wall of the bottom of the cleaning tank (2);
a sealing part used for sealing the cleaning tank (2) in a left-right sliding manner is arranged at the edge of the top of the cleaning tank (2), and the sealing part comprises a supporting plate (44) sliding left and right along the width direction of the workbench (1) and a supporting column (47) used for placing the wafer temporarily;
the inside of washing tank (2) is provided with and is used for right the rotatory wafer belt cleaning device who washes of wafer lower surface, wafer belt cleaning device include with the axis of washing tank (2) is circumference pivoted wash bowl (52) and ten edges the circumference of wash bowl (52) produces cleaning roller (511) of rotation, wash bowl (52) circumference rotation drives cleaning roller (511) rotation is right the lower surface of wafer carries out rotatory washing.
2. A cleaning apparatus for semiconductor substrates as recited in claim 1, wherein: the sealing component further comprises a placing groove (4) arranged on the inner walls of two sides of the cleaning groove (2), two second sliding grooves (41) which are symmetrically distributed are formed in the inner top wall of the placing groove (4), two sealing plates (42) are inserted into the inner walls of the placing groove (4), two sealing plates (42) are opened and closed to seal the machine head (3), one end of each second sliding groove (41) penetrates through and extends to the upper surface of the workbench (1), two sliding strips (43) which are symmetrically distributed are fixedly connected to the upper surface of each sealing plate (42), and the two sliding strips (43) are fixedly connected to the upper surface of each sliding strip (43) and the lower surface of the supporting plate (44).
3. A cleaning apparatus for semiconductor substrates as recited in claim 1, wherein: the equal fixedly connected with otic placode (45) in both sides surface of backup pad (44), the last fixed surface of workstation (1) installs four cylinders (46) that are the distribution of rectangle array, four the one end of the pneumatic rod of cylinder (46) respectively with four one side fixed surface of otic placode (45) is connected, and through four the flexible drive two of cylinder (46) backup pad (44) are followed the width direction of workstation (1) is removed.
4. A cleaning apparatus for semiconductor substrates as recited in claim 1, wherein: wafer cleaning device is still including support ring (5) that is fixed in washing tank (2) inner wall, the last fixed surface of support ring (5) is connected with installation section of thick bamboo (51), the upper end inner wall of installation section of thick bamboo (51) pass through the bearing with the rotatory cup joint of surface of wash bowl (52), the lower extreme inner wall fixedly connected with total inlet tube (53) of installation section of thick bamboo (51), the first link ring (54) of the lower fixed surface of wash bowl (52) are connected with, the first ring channel (55) that the inner wall is T shape structure are seted up to the upper surface of total inlet tube (53), the surface of first link ring (54) with the inner wall rotation of first ring channel (55) cup joints.
5. A cleaning apparatus for semiconductor substrates as recited in claim 4, wherein: the inner surface of the support ring (5) is fixedly sleeved with the outer surface of the main water inlet pipe (53), and the main water inlet pipe (53) is further supported and fixed.
6. A cleaning apparatus for semiconductor substrates as recited in claim 5, wherein: the inside wall fixedly connected with joint piece (56) of installation cylinder (51), the inner wall fixed mounting of joint piece (56) has driving motor (57), the outer fixed surface of main shaft of driving motor (57) is connected with drive gear (58), the fixed cover of lower extreme surface of wash bowl (52) has connected drive ring gear (59), drive gear (58) with drive ring gear (59) meshing transmission, the upper end inside wall of wash bowl (52) seted up ten with the axis of wash bowl (52) is first interface (510) that the central line was the annular array and distributes, ten the one end surface of cleaning roller (511) passes through the bearing respectively with ten the inner wall fixed connection of first interface (510).
7. A cleaning apparatus for semiconductor substrates as recited in claim 6, wherein: second annular groove (512) have been seted up to the upper end inside wall of washing tank (2), the interior diapire fixed mounting of second annular groove (512) has walking ring gear (513), ten the end of cleaning roller (511) all extends to in second annular groove (512) and fixed the cup jointing walking gear (514), walking gear (514) with walking ring gear (513) meshing transmission.
8. A cleaning apparatus for semiconductor substrates as recited in claim 7, wherein: washing tank (2) are located third ring channel (515), two have all been seted up to the inside wall of the top of second ring channel (512) and below sealing ring (516) have been cup jointed in the inner wall rotation of third ring channel (515), the week side of sealing ring (516) seted up with socket joint (517) of cleaning roller (511) surface looks adaptation, just the surface of cleaning roller (511) with the inner wall rotation of socket joint (517) is cup jointed, and washing mouth (518) have all been seted up to the upper surface of wash bowl (52) and the week side of cleaning roller (511), just the equal fixed mounting of inner wall of washing mouth (518) has shower nozzle (519).
9. A cleaning apparatus for semiconductor substrates as recited in claim 4, wherein: the lower extreme inner wall of total inlet tube (53) has seted up three evenly distributed's second connector (520), just the one end of second connector (520) runs through to the inside wall of washing tank (2), the inner wall fixed intercommunication of second connector (520) has first minute pipe (521) of intaking, and is three first solenoid valve (522) are all installed to the inner wall of first minute pipe (521) of intaking, and are three first opening (523) have all been seted up to the inner wall of second connector (520), the inner wall of first opening (523) install with second minute pipe (524) of intaking the fixed intercommunication of one end of first minute pipe (521).
10. A cleaning apparatus for semiconductor substrates as recited in claim 4, wherein: the inner wall of the drain hole (6) is fixedly communicated with a water outlet pipe (62), the inner wall of the bottom of the cleaning groove (2) is fixedly connected with a filter cover (61) used for preventing fragments generated after the wafer bursts from falling into the water outlet pipe (62), the outer surface of the bottom of the main water inlet pipe (53) is fixedly connected with the inner wall of the filter cover (61), and the bottom of the main water inlet pipe (53) is vertically supported through the filter cover (61).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211483285.XA CN115921389B (en) | 2022-11-24 | 2022-11-24 | Cleaning equipment suitable for semiconductor substrate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211483285.XA CN115921389B (en) | 2022-11-24 | 2022-11-24 | Cleaning equipment suitable for semiconductor substrate |
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| Publication Number | Publication Date |
|---|---|
| CN115921389A true CN115921389A (en) | 2023-04-07 |
| CN115921389B CN115921389B (en) | 2024-03-12 |
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| CN202211483285.XA Active CN115921389B (en) | 2022-11-24 | 2022-11-24 | Cleaning equipment suitable for semiconductor substrate |
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| CN212883752U (en) * | 2020-08-28 | 2021-04-06 | 刘静 | Ultrasonic image probe belt cleaning device |
| CN114114806A (en) * | 2021-11-06 | 2022-03-01 | 江苏金狮堂视觉科技有限公司 | Digital exhibition room projection presentation device |
| CN216064584U (en) * | 2021-10-25 | 2022-03-18 | 楚楠 | Chemical production is with industrial chemicals rinsing device |
| CN114669548A (en) * | 2022-05-26 | 2022-06-28 | 智程半导体设备科技(昆山)有限公司 | Single-chip type semiconductor substrate cleaning machine |
| CN114682345A (en) * | 2022-04-01 | 2022-07-01 | 江西英特科胜动保科技有限公司 | Dust clearing device is used in animal remedy powder production |
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2022
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| CN108435616A (en) * | 2018-06-01 | 2018-08-24 | 四川益泽丰信息科技有限公司 | A kind of outdoor LED screen auto dust cleaning machine |
| CN212883752U (en) * | 2020-08-28 | 2021-04-06 | 刘静 | Ultrasonic image probe belt cleaning device |
| CN216064584U (en) * | 2021-10-25 | 2022-03-18 | 楚楠 | Chemical production is with industrial chemicals rinsing device |
| CN114114806A (en) * | 2021-11-06 | 2022-03-01 | 江苏金狮堂视觉科技有限公司 | Digital exhibition room projection presentation device |
| CN114682345A (en) * | 2022-04-01 | 2022-07-01 | 江西英特科胜动保科技有限公司 | Dust clearing device is used in animal remedy powder production |
| CN114669548A (en) * | 2022-05-26 | 2022-06-28 | 智程半导体设备科技(昆山)有限公司 | Single-chip type semiconductor substrate cleaning machine |
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| CN115921389B (en) | 2024-03-12 |
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Address after: 215000, No. 889 Zhonghua Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region after: China Address before: Room 3, 299 Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region before: China |