CN110649143A - Etching piece frame, packaging support and LED device - Google Patents
Etching piece frame, packaging support and LED device Download PDFInfo
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- CN110649143A CN110649143A CN201910911549.9A CN201910911549A CN110649143A CN 110649143 A CN110649143 A CN 110649143A CN 201910911549 A CN201910911549 A CN 201910911549A CN 110649143 A CN110649143 A CN 110649143A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses an etching sheet frame, a packaging bracket and an LED device, wherein the etching sheet frame comprises: a first metal etching sheet having a chip placement layer and a first electrode which are stacked; a second metal etching sheet having a connection layer and a second electrode which are stacked; the first long edge of the chip placing layer is flush with the end part of the first long edge of the first electrode, and the connecting layer is flush with the end part of the first long edge of the second electrode, so that a convex isolation groove is formed between the first metal etching sheet and the second metal etching sheet; the top angle on the first long edge of the chip placing layer and the top angle on the first long edge of the connecting layer are respectively provided with an L-shaped connecting pin so as to respectively wrap the side walls of the corresponding top angles. The etching piece frame, the packaging support and the LED device can enhance the connection strength and stress between the etching piece frames and avoid the deformation of the etching piece frames in the subsequent process.
Description
Technical Field
The invention relates to the technical field of LEDs, in particular to an etching sheet frame, a packaging support and an LED device.
Background
As shown in fig. 1, the etching sheet frame in the conventional package support is generally etched into a first electrode 11 and a second electrode 12 separated from each other by using a full etching process, an isolation trench 13 is formed between the first electrode 11 and the second electrode 12, and meanwhile, in order to enable a single etching sheet frame to be connected to an adjacent etching sheet frame, a connection pin 14 is respectively provided on a long side of the first electrode 11 and the second electrode 12 of the etching sheet frame, which is far from the isolation trench 13, and on all short sides thereof. However, since the connecting pins 14 are usually arranged in the middle of the edges, and the width of the connecting pins is very small, the connection strength between the etching sheet frames is small, and the stress is small, so that the edges of the etching sheet frames are easy to deform in the subsequent process, which causes the deviation of the injection molding process, further reduces the air tightness of the package support and the LED device manufactured by using the etching sheet frames, and reduces the service life of the package support and the LED device.
Disclosure of Invention
Aiming at the problems, the etching sheet frame, the packaging support and the LED device can effectively enhance the connection strength and stress between the etching sheet frames, avoid the etching sheet frame from deforming in the subsequent process, further avoid the injection molding process from deviating, improve the air tightness and prolong the service life.
In order to solve the above technical problem, an etching sheet frame according to the present invention includes:
the chip mounting structure comprises a first metal etching sheet and a second metal etching sheet, wherein the first metal etching sheet is provided with a chip mounting layer and a first electrode which are stacked, the long side of the chip mounting layer is longer than the long side of the first electrode, and the short side of the chip mounting layer is longer than the short side of the first electrode;
a second metal etching sheet having a connection layer and a second electrode stacked, a long side of the connection layer being longer than a long side of the second electrode, and a short side of the connection layer being longer than a short side of the second electrode;
the first long edge of the chip placement layer is flush with the end part of the first long edge of the first electrode, and the connecting layer is flush with the end part of the first long edge of the second electrode, so that a convex isolation groove is formed between the first metal etching sheet and the second metal etching sheet;
the apex angle on the first long side of the chip placing layer and the apex angle on the first long side of the connecting layer are respectively provided with an L-shaped connecting pin so as to respectively wrap the side walls of the corresponding apex angles.
As an improvement of the scheme, the upper surface and/or the lower surface of each L-shaped connecting foot is/are a roughened surface.
The present invention also provides a package support, comprising: in any one of the etching sheet frames, EMC material is filled between the convex isolation trenches to form an insulation isolation trench, a light reflecting cup is arranged around the etching sheet frame, and the bottom of the light reflecting cup covers the side wall of the etching sheet frame and is flush with the surfaces of the first electrode and the second electrode.
As an improvement of the scheme, a cavity with a conical structure is formed by the inner wall of the light reflecting cup on the etching sheet frame in a surrounding mode, and the outer wall of the light reflecting cup is in a rectangular cup shape.
As an improvement of the scheme, the end part of the L-shaped connecting leg is flush with the outer wall of the reflecting cup.
As an improvement of the above scheme, the surfaces of the chip placement layer and the connection layer are provided with a light reflecting layer.
The present invention also provides an LED device comprising: the LED packaging structure comprises any one of the packaging supports and an LED chip arranged on the chip placing layer, wherein the LED chip is connected with the chip placing layer and the connecting layer respectively.
In an improvement of the above, the reflector cup is filled with a phosphor.
Compared with the prior art, the etching sheet frame, the packaging bracket and the LED device have the following effective effects:
the first metal etching sheet is provided with the chip placing layer and the first electrode which are arranged in a stacked mode, the second metal etching sheet is provided with the connecting layer and the second electrode which are arranged in a stacked mode, and the top angle of the first long edge of the chip placing layer and the top angle of the first long edge of the connecting layer are respectively provided with the L-shaped connecting pins, so that the inner side wall of each connecting pin can wrap the side wall of the corresponding top angle; meanwhile, the connecting pins are only arranged at the top angle of the first long edge of the chip placing layer and the top angle of the first long edge of the connecting layer and are half-etched connecting pins, so that the thickness of the connecting pins is smaller than that of the connecting pins in the existing etched wafer frame, and the loss of a cutter during cutting of the connecting pins in the subsequent cutting process can be reduced.
In addition, since the long side of the chip placement layer is longer than the long side of the first electrode, the short side of the chip placement layer is longer than the short side of the first electrode, the long side of the connection layer is longer than the long side of the second electrode, the short side of the connection layer is longer than the short side of the second electrode, the first long edge of the chip placing layer is flush with the end part of the first long edge of the first electrode, the connecting layer is flush with the end part of the first long edge of the second electrode, so that a convex isolation trench is formed between the first metal etching sheet and the second metal etching sheet, and thus, when the convex isolation groove is filled with EMC material to form the insulation isolation groove, the combination area between the insulation isolation groove and the etching piece frame can be effectively increased, and increasing the gas path from the junction of the isolation trench and the wafer frame, such that, the air tightness of the packaging bracket and the LED device manufactured by the etching sheet frame can be further improved.
Drawings
Fig. 1 is a schematic structural diagram of an etched wafer frame in a conventional package support.
Fig. 2 is a schematic structural diagram of an etching sheet frame according to an embodiment of the present invention.
Fig. 3 is a perspective view of a package support according to an embodiment of the invention.
Fig. 4(a) is a cross-sectional view of the package support of fig. 3 taken along a1-a 2.
Fig. 4(B) is a cross-sectional view of the package support of fig. 3 taken along B1-B2.
Fig. 5(a) is a cross-sectional view along a1-a2 of an LED device fabricated using the package support of fig. 3.
Fig. 5(B) is a cross-sectional view along B1-B2 of an LED device fabricated using the package support of fig. 3.
Detailed Description
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
The technical solution of the present invention will be clearly and completely described below with reference to the specific embodiments and the accompanying drawings.
Fig. 2 is a schematic structural diagram of an etching sheet frame according to an embodiment of the invention.
As shown in fig. 2, the etching sheet frame includes: a first metal etching sheet 100 having a chip placement layer 101 and a first electrode 102 stacked, a long side of the chip placement layer 101 being longer than a long side of the first electrode 102, a short side of the chip placement layer 101 being longer than a short side of the first electrode 102; a second metal etching sheet 200 having a connection layer 201 and a second electrode 202 stacked, a long side of the connection layer 201 being longer than a long side of the second electrode 202, a short side of the connection layer 201 being longer than a short side of the second electrode 202; the first long edge of the chip placement layer 101 is flush with the end of the first long edge of the first electrode 102, and the connection layer 201 is flush with the end of the first long edge of the second electrode 202, so that a convex isolation trench 301 is formed between the first metal etching sheet 100 and the second metal etching sheet 200; the apex angle on the first long side of the chip placement layer 101 and the apex angle on the first long side of the connection layer 201 are respectively provided with an L-shaped connecting pin 401 to wrap the side walls of the corresponding apex angles respectively.
The chip placement layer 101 is a layer for placing an LED chip, and the connection layer 201 is a layer for routing the LED chip.
In this embodiment, since the first metal etching sheet 100 has the chip placement layer 101 and the first electrode 102 in a stacked arrangement, the second metal etching sheet 200 has the connection layer 201 and the second electrode 202 in a stacked arrangement, and the top corner of the first long side of the chip placement layer 101 and the top corner of the first long side of the connection layer 201 are respectively provided with an L-shaped connecting pin 401, so that the inner side wall of the L-shaped connecting pin 401 can wrap the side wall of the corresponding top corner, l-shaped connecting feet 401 capable of being connected with adjacent etching piece frames are formed at 4 top corners of the etching frames, the connecting area of the L-shaped connecting feet 401 is large, can effectively enhance the connection strength and stress between the etching sheet frames, avoid the deformation of the etching sheet frames in the subsequent process, thereby avoiding the deviation of the subsequent injection molding process, and improving the air tightness and the service life of the packaging bracket and the LED device which are made of the etching sheet frame; meanwhile, since the L-shaped connecting pin 401 is only arranged at the vertex angle of the first long side of the chip placement layer 101 and the vertex angle of the first long side of the connection layer 201, which is the half-etched L-shaped connecting pin 401, the thickness of the L-shaped connecting pin 401 is smaller than that of the L-shaped connecting pin 401 in the existing etched wafer frame, and the loss of the cutter when the L-shaped connecting pin 401 is cut in the subsequent cutting process can be reduced.
In addition, since the long side of the die-attach layer 101 is longer than the long side of the first electrode 102, the short side of the die-attach layer 101 is longer than the short side of the first electrode 102, the long side of the connection layer 201 is longer than the long side of the second electrode 202, the short side of the connection layer 201 is longer than the short side of the second electrode 202, and the first long side of the die-attach layer 101 is flush with the end of the first long side of the first electrode 102, and the connection layer 201 is flush with the end of the first long side of the second electrode 202, so that the convex isolation trench 301 is formed between the first metal etching sheet 100 and the second metal etching sheet 200, and thus, when the convex isolation trench 301 is filled with an EMC (epoxy molding compound, EMC for short) material to form the isolation trench 302, it is possible to effectively increase the bonding area between the isolation trench 302 and the etching sheet frame and increase the path of gas entering from the junction of the isolation trench 302 and the etching sheet frame, therefore, the air tightness of the packaging bracket and the LED device manufactured by the etching sheet frame can be further improved.
Preferably, the upper surface and/or the lower surface of each L-shaped connecting leg 401 is a roughened surface, and the shape of the roughened surface can be corrugated, convex, concave or irregular. Therefore, the bonding force between the reflection cup and the etching sheet frame can be increased, the path of gas entering from the joint of the reflection cup and the etching sheet frame is prolonged, and the air tightness of the packaging support and the LED device made of the etching sheet frame can be improved.
Referring to fig. 3, an embodiment of the invention further provides a perspective view of a package support.
As shown in fig. 3, 4(a) and 4(b), the package support includes: in any etching sheet frame, EMC material is filled between the convex isolation trenches 301 to form the insulating isolation trench 302, a light reflecting cup 501 is arranged around the etching sheet frame, and the bottom of the light reflecting cup 501 covers the side wall of the etching sheet frame and is flush with the surfaces of the first electrode 102 and the second electrode 202, so that the L-shaped connecting pin 401 on the etching sheet frame is embedded into the cup wall of the light reflecting cup 501 to enhance the connection strength between the light reflecting cup 501 and the etching sheet frame; moreover, since the insulation isolation trench 302 is convex and is matched with the second long edge of the first metal etching sheet 100 and the second long edge of the second metal etching sheet 200, the connection strength between the insulation isolation trench 302 and the etching sheet frame can be effectively enhanced, and the path of gas entering the package support through the connection part of the insulation isolation trench 302 and the etching sheet frame can be prolonged, so that the air tightness of the package support can be improved.
Further, the inner wall of the light reflecting cup 501 surrounds the etching sheet frame to form a cavity with a conical structure, and the outer wall of the light reflecting cup 501 is in a rectangular cup shape.
Further, the end of the L-shaped connecting leg 401 is flush with the outer wall of the reflector cup 501.
Preferably, the surfaces of the chip placement layer 101 and the connection layer 201 are provided with a light reflection layer to improve the light reflection performance of the package support. Wherein, the material of the light reflecting layer can be Ag.
Referring to fig. 5(a) and 5(b), cross-sectional views of LED devices fabricated by using the package support of fig. 3
As shown in fig. 5(a) and (b), the LED device includes any one of the package supports described above, and an LED chip 601 disposed on the chip placement layer 101, wherein the LED chip 601 is connected to the chip placement layer 101 and the connection layer 201, respectively, and the reflective cup 501 is filled with a phosphor 602.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, so that any simple modification, equivalent change and modification made to the above embodiment according to the technical spirit of the present invention will still fall within the scope of the technical solution of the present invention without departing from the content of the technical solution of the present invention.
Claims (8)
1. An etch sheet frame, comprising:
the chip mounting structure comprises a first metal etching sheet and a second metal etching sheet, wherein the first metal etching sheet is provided with a chip mounting layer and a first electrode which are stacked, the long side of the chip mounting layer is longer than the long side of the first electrode, and the short side of the chip mounting layer is longer than the short side of the first electrode;
a second metal etching sheet having a connection layer and a second electrode stacked, a long side of the connection layer being longer than a long side of the second electrode, and a short side of the connection layer being longer than a short side of the second electrode;
the first long edge of the chip placement layer is flush with the end part of the first long edge of the first electrode, and the connecting layer is flush with the end part of the first long edge of the second electrode, so that a convex isolation groove is formed between the first metal etching sheet and the second metal etching sheet;
the apex angle on the first long side of the chip placing layer and the apex angle on the first long side of the connecting layer are respectively provided with an L-shaped connecting pin so as to respectively wrap the side walls of the corresponding apex angles.
2. The etching sheet frame according to claim 1, wherein an upper surface and/or a lower surface of each of the L-shaped connecting legs is a roughened surface.
3. A package support, comprising: the etching chip frame of claim 1 or 2, wherein EMC material is filled between the convex isolation trenches to form insulation isolation trenches, a light reflecting cup is arranged around the etching chip frame, and the bottom of the light reflecting cup covers the side walls of the etching chip frame and is flush with the surfaces of the first electrode and the second electrode.
4. The package support of claim 3, wherein the inner wall of the reflector cup forms a cavity with a conical structure on the etched sheet frame, and the outer wall of the reflector cup forms a rectangular cup shape.
5. The package holder as in claim 4, wherein the ends of said L-shaped legs are flush with the outer wall of said reflector cup.
6. The package support according to any one of claims 3 to 5, wherein a light reflecting layer is provided on the surfaces of the chip placement layer and the connection layer.
7. An LED device, comprising: the package support according to any one of claims 3 to 6, and an LED chip disposed on the chip placement layer, the LED chip being connected to the chip placement layer and the connection layer, respectively.
8. The LED device of claim 7, wherein said reflector cup is filled with a phosphor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910911549.9A CN110649143A (en) | 2019-09-25 | 2019-09-25 | Etching piece frame, packaging support and LED device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910911549.9A CN110649143A (en) | 2019-09-25 | 2019-09-25 | Etching piece frame, packaging support and LED device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110649143A true CN110649143A (en) | 2020-01-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910911549.9A Pending CN110649143A (en) | 2019-09-25 | 2019-09-25 | Etching piece frame, packaging support and LED device |
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| CN (1) | CN110649143A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114335296A (en) * | 2021-10-25 | 2022-04-12 | 华南理工大学 | Deep ultraviolet LED packaging device and preparation method thereof |
-
2019
- 2019-09-25 CN CN201910911549.9A patent/CN110649143A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114335296A (en) * | 2021-10-25 | 2022-04-12 | 华南理工大学 | Deep ultraviolet LED packaging device and preparation method thereof |
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