CN1106328A - 激光照射装置 - Google Patents

激光照射装置 Download PDF

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Publication number
CN1106328A
CN1106328A CN94107555A CN94107555A CN1106328A CN 1106328 A CN1106328 A CN 1106328A CN 94107555 A CN94107555 A CN 94107555A CN 94107555 A CN94107555 A CN 94107555A CN 1106328 A CN1106328 A CN 1106328A
Authority
CN
China
Prior art keywords
laser
workpiece
energy intensity
processing
predetermined
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN94107555A
Other languages
English (en)
Chinese (zh)
Inventor
近藤昌树
古田守
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of CN1106328A publication Critical patent/CN1106328A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/705—Beam measuring device

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Recrystallisation Techniques (AREA)
  • Laser Surgery Devices (AREA)
CN94107555A 1993-07-13 1994-07-11 激光照射装置 Pending CN1106328A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5172896A JPH0724587A (ja) 1993-07-13 1993-07-13 レーザ照射装置
JP172896/93 1993-07-13

Publications (1)

Publication Number Publication Date
CN1106328A true CN1106328A (zh) 1995-08-09

Family

ID=15950349

Family Applications (1)

Application Number Title Priority Date Filing Date
CN94107555A Pending CN1106328A (zh) 1993-07-13 1994-07-11 激光照射装置

Country Status (3)

Country Link
JP (1) JPH0724587A (ja)
KR (1) KR950002910A (ja)
CN (1) CN1106328A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100396424C (zh) * 2002-08-09 2008-06-25 Tdk株式会社 激光加工设备、加工方法及利用其制造电路板的方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10286098A (ja) * 1997-02-14 1998-10-27 Daicel Chem Ind Ltd Ｄ−アミノ酸の製造方法、ならびにアミンの製造方法
JP2002158186A (ja) * 2000-11-21 2002-05-31 Toshiba Corp レーザアニール方法およびその装置
EP2355270A3 (en) 2001-10-16 2012-05-09 Kataoka Corporation Pulse oscillating type solid laser unit and laser process unit
JP2006135251A (ja) * 2004-11-09 2006-05-25 Hitachi Ltd レーザ結晶化装置
KR101248964B1 (ko) 2005-03-29 2013-03-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 레이저 조사 장치 및 반도체 소자의 제조 방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100396424C (zh) * 2002-08-09 2008-06-25 Tdk株式会社 激光加工设备、加工方法及利用其制造电路板的方法

Also Published As

Publication number Publication date
JPH0724587A (ja) 1995-01-27
KR950002910A (ko) 1995-02-16

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C01 Deemed withdrawal of patent application (patent law 1993)
WD01 Invention patent application deemed withdrawn after publication