CN110614580B - 抛光垫及其制备方法、化学机械研磨设备 - Google Patents
抛光垫及其制备方法、化学机械研磨设备 Download PDFInfo
- Publication number
- CN110614580B CN110614580B CN201911006629.6A CN201911006629A CN110614580B CN 110614580 B CN110614580 B CN 110614580B CN 201911006629 A CN201911006629 A CN 201911006629A CN 110614580 B CN110614580 B CN 110614580B
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- polishing pad
- transition structure
- liquid polymer
- mold
- temperature threshold
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- 238000005498 polishing Methods 0.000 title claims abstract description 152
- 239000000126 substance Substances 0.000 title claims abstract description 16
- 238000002360 preparation method Methods 0.000 title abstract description 13
- 239000002105 nanoparticle Substances 0.000 claims abstract description 56
- 230000007704 transition Effects 0.000 claims abstract description 49
- 239000007788 liquid Substances 0.000 claims abstract description 43
- 229920000642 polymer Polymers 0.000 claims abstract description 38
- 238000000034 method Methods 0.000 claims abstract description 21
- 238000011049 filling Methods 0.000 claims abstract description 15
- 239000000203 mixture Substances 0.000 claims abstract description 9
- 238000005086 pumping Methods 0.000 claims abstract description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 48
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 28
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 28
- 239000000377 silicon dioxide Substances 0.000 claims description 24
- 239000002245 particle Substances 0.000 claims description 19
- 239000003795 chemical substances by application Substances 0.000 claims description 13
- 235000012239 silicon dioxide Nutrition 0.000 claims description 11
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 10
- -1 Polydimethylsiloxane Polymers 0.000 claims description 6
- 239000004408 titanium dioxide Substances 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 8
- 230000008901 benefit Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- 238000005265 energy consumption Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
- B24D11/003—Manufacture of flexible abrasive materials without embedded abrasive particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/44—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles
- B29C33/52—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles soluble or fusible
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/42—Casting under special conditions, e.g. vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/02—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/44—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles
- B29C33/52—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles soluble or fusible
- B29C2033/525—Cores made of frozen liquids, e.g. ice
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
- B29K2083/005—LSR, i.e. liquid silicone rubbers, or derivatives thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/0005—Condition, form or state of moulded material or of the material to be shaped containing compounding ingredients
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/25—Solid
- B29K2105/251—Particles, powder or granules
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/736—Grinding or polishing equipment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911006629.6A CN110614580B (zh) | 2019-10-22 | 2019-10-22 | 抛光垫及其制备方法、化学机械研磨设备 |
US16/918,041 US11839945B2 (en) | 2019-10-22 | 2020-07-01 | Polishing pad, method for preparing the same, and chemical and mechanical polishing equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911006629.6A CN110614580B (zh) | 2019-10-22 | 2019-10-22 | 抛光垫及其制备方法、化学机械研磨设备 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110614580A CN110614580A (zh) | 2019-12-27 |
CN110614580B true CN110614580B (zh) | 2021-11-19 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201911006629.6A Active CN110614580B (zh) | 2019-10-22 | 2019-10-22 | 抛光垫及其制备方法、化学机械研磨设备 |
Country Status (2)
Country | Link |
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US (1) | US11839945B2 (zh) |
CN (1) | CN110614580B (zh) |
Families Citing this family (1)
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CN114701105B (zh) * | 2021-04-27 | 2024-04-19 | 宁波赢伟泰科新材料有限公司 | 一种化学机械抛光垫及其制备方法 |
Citations (8)
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JP2005019886A (ja) * | 2003-06-27 | 2005-01-20 | Asahi Kasei Electronics Co Ltd | 研磨パッドとその製法 |
CN101554758A (zh) * | 2009-04-09 | 2009-10-14 | 上海交通大学 | 利用纳米材料改性pdms制作热模压模具的方法 |
CN104440519A (zh) * | 2013-09-18 | 2015-03-25 | 德州仪器公司 | Cmp抛光垫中的渗透式开凹槽 |
CN105556642A (zh) * | 2013-07-19 | 2016-05-04 | 国立大学法人名古屋工业大学 | 金属制研磨衬垫及其制造方法 |
CN107553313A (zh) * | 2017-08-31 | 2018-01-09 | 湖北鼎龙控股股份有限公司 | 一种抛光垫、聚氨酯抛光层及其制备方法 |
CN107571144A (zh) * | 2016-07-05 | 2018-01-12 | 智胜科技股份有限公司 | 研磨层及其制造方法以及研磨方法 |
CN107627202A (zh) * | 2015-06-26 | 2018-01-26 | 罗门哈斯电子材料Cmp控股股份有限公司 | 化学机械抛光垫复合抛光层配制品 |
CN207788624U (zh) * | 2017-12-15 | 2018-08-31 | 苏州新美光纳米科技有限公司 | 抛光垫及其抛光装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5232470A (en) * | 1990-05-21 | 1993-08-03 | Wiand Ronald C | Flexible one-piece diamond sheet material with spaced apart abrasive portions |
US5609517A (en) * | 1995-11-20 | 1997-03-11 | International Business Machines Corporation | Composite polishing pad |
US7846008B2 (en) * | 2004-11-29 | 2010-12-07 | Semiquest Inc. | Method and apparatus for improved chemical mechanical planarization and CMP pad |
KR20100082770A (ko) * | 2007-09-03 | 2010-07-19 | 세미퀘스트, 인코포레이티드 | 폴리싱 패드 |
KR101618273B1 (ko) * | 2008-04-29 | 2016-05-04 | 세미퀘스트, 인코포레이티드 | 연마 패드 조성물, 및 이의 제조 방법 및 용도 |
KR101281076B1 (ko) * | 2008-05-15 | 2013-07-09 | 세미퀘스트, 인코포레이티드 | 종결점 윈도우를 구비하는 연마 패드와, 이 연마 패드를 이용하는 시스템 및 방법 |
JP5596030B2 (ja) * | 2008-06-26 | 2014-09-24 | スリーエム イノベイティブ プロパティズ カンパニー | 多孔質エレメントを有する研磨パッド及びその製造方法と使用方法 |
US8292692B2 (en) * | 2008-11-26 | 2012-10-23 | Semiquest, Inc. | Polishing pad with endpoint window and systems and method using the same |
US9156124B2 (en) * | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
US20120302148A1 (en) * | 2011-05-23 | 2012-11-29 | Rajeev Bajaj | Polishing pad with homogeneous body having discrete protrusions thereon |
CN205703794U (zh) * | 2015-06-29 | 2016-11-23 | 智胜科技股份有限公司 | 研磨垫的研磨层 |
-
2019
- 2019-10-22 CN CN201911006629.6A patent/CN110614580B/zh active Active
-
2020
- 2020-07-01 US US16/918,041 patent/US11839945B2/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2005019886A (ja) * | 2003-06-27 | 2005-01-20 | Asahi Kasei Electronics Co Ltd | 研磨パッドとその製法 |
CN101554758A (zh) * | 2009-04-09 | 2009-10-14 | 上海交通大学 | 利用纳米材料改性pdms制作热模压模具的方法 |
CN105556642A (zh) * | 2013-07-19 | 2016-05-04 | 国立大学法人名古屋工业大学 | 金属制研磨衬垫及其制造方法 |
CN104440519A (zh) * | 2013-09-18 | 2015-03-25 | 德州仪器公司 | Cmp抛光垫中的渗透式开凹槽 |
CN107627202A (zh) * | 2015-06-26 | 2018-01-26 | 罗门哈斯电子材料Cmp控股股份有限公司 | 化学机械抛光垫复合抛光层配制品 |
CN107571144A (zh) * | 2016-07-05 | 2018-01-12 | 智胜科技股份有限公司 | 研磨层及其制造方法以及研磨方法 |
CN107553313A (zh) * | 2017-08-31 | 2018-01-09 | 湖北鼎龙控股股份有限公司 | 一种抛光垫、聚氨酯抛光层及其制备方法 |
CN207788624U (zh) * | 2017-12-15 | 2018-08-31 | 苏州新美光纳米科技有限公司 | 抛光垫及其抛光装置 |
Also Published As
Publication number | Publication date |
---|---|
CN110614580A (zh) | 2019-12-27 |
US20210114165A1 (en) | 2021-04-22 |
US11839945B2 (en) | 2023-12-12 |
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Effective date of registration: 20211021 Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Applicant after: Xi'an yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1323, block a, city gate, No.1 Jinye Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
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Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |