CN110612602B - 浮动晶片夹盘 - Google Patents

浮动晶片夹盘 Download PDF

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Publication number
CN110612602B
CN110612602B CN201880029392.0A CN201880029392A CN110612602B CN 110612602 B CN110612602 B CN 110612602B CN 201880029392 A CN201880029392 A CN 201880029392A CN 110612602 B CN110612602 B CN 110612602B
Authority
CN
China
Prior art keywords
wafer
chuck
edge
bend
edge grippers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201880029392.0A
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English (en)
Chinese (zh)
Other versions
CN110612602A (zh
Inventor
A·巴朗
V·维尚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KLA Corp
Original Assignee
KLA Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KLA Tencor Corp filed Critical KLA Tencor Corp
Publication of CN110612602A publication Critical patent/CN110612602A/zh
Application granted granted Critical
Publication of CN110612602B publication Critical patent/CN110612602B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
CN201880029392.0A 2017-05-12 2018-05-11 浮动晶片夹盘 Active CN110612602B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201762505248P 2017-05-12 2017-05-12
US62/505,248 2017-05-12
US15/652,659 2017-07-18
US15/652,659 US10083852B1 (en) 2017-05-12 2017-07-18 Floating wafer chuck
PCT/US2018/032175 WO2018209160A1 (en) 2017-05-12 2018-05-11 Floating wafer chuck

Publications (2)

Publication Number Publication Date
CN110612602A CN110612602A (zh) 2019-12-24
CN110612602B true CN110612602B (zh) 2021-06-29

Family

ID=63557076

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880029392.0A Active CN110612602B (zh) 2017-05-12 2018-05-11 浮动晶片夹盘

Country Status (5)

Country Link
US (1) US10083852B1 (cg-RX-API-DMAC10.html)
JP (1) JP7014817B2 (cg-RX-API-DMAC10.html)
KR (1) KR102351354B1 (cg-RX-API-DMAC10.html)
CN (1) CN110612602B (cg-RX-API-DMAC10.html)
WO (1) WO2018209160A1 (cg-RX-API-DMAC10.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111725129B (zh) * 2020-06-29 2023-02-14 北京北方华创微电子装备有限公司 晶圆承载装置及半导体工艺设备
CN216389313U (zh) * 2020-09-15 2022-04-26 无锡华瑛微电子技术有限公司 半导体处理装置
EP4053634A1 (en) * 2021-03-02 2022-09-07 ASML Netherlands B.V. Substrate restraining system
US12706281B2 (en) * 2022-07-25 2026-08-11 Micron Technology, Inc. Erosion rate monitoring for wafer fabrication equipment

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004115872A (ja) * 2002-09-26 2004-04-15 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3217323B2 (ja) 1999-03-03 2001-10-09 保 目崎 半導体材料の遠心処理装置
US20020066475A1 (en) * 2000-06-26 2002-06-06 Steven Verhaverbeke Chuck for holding wafer
JP4405048B2 (ja) * 2000-07-11 2010-01-27 Ｏｋｉセミコンダクタ株式会社 位置合せ用治具
JP4488646B2 (ja) 2001-04-23 2010-06-23 株式会社トプコン ウェーハ保持装置
JP3890025B2 (ja) * 2003-03-10 2007-03-07 東京エレクトロン株式会社 塗布処理装置及び塗布処理方法
DE102004036435B4 (de) 2003-08-07 2007-08-30 Nanophotonics Ag Haltevorrichtung für scheibenförmige Objekte
JP4189663B2 (ja) 2003-09-10 2008-12-03 株式会社安川電機 ウエハ把持装置
US7703823B2 (en) * 2004-07-12 2010-04-27 Rudolph Technologies, Inc. Wafer holding mechanism
KR20060074559A (ko) * 2004-12-27 2006-07-03 동부일렉트로닉스 주식회사 스핀 척의 웨이퍼 고정장치
JP4814731B2 (ja) * 2006-08-30 2011-11-16 株式会社日立ハイテクノロジーズ 基板保持装置、検査または処理の装置、基板保持方法、検査または処理の方法および検査装置
US7607647B2 (en) 2007-03-20 2009-10-27 Kla-Tencor Technologies Corporation Stabilizing a substrate using a vacuum preload air bearing chuck
KR20090029407A (ko) * 2007-09-18 2009-03-23 세메스 주식회사 지지부재 및 이를 구비하는 기판 처리 장치
US8714169B2 (en) * 2008-11-26 2014-05-06 Semes Co. Ltd. Spin head, apparatus for treating substrate, and method for treating substrate
JP5301505B2 (ja) 2009-08-27 2013-09-25 東京エレクトロン株式会社 液処理装置および液処理方法
JP5327144B2 (ja) 2010-06-16 2013-10-30 東京エレクトロン株式会社 処理装置及び処理方法
US8646767B2 (en) * 2010-07-23 2014-02-11 Lam Research Ag Device for holding wafer shaped articles
KR20120105669A (ko) * 2011-03-16 2012-09-26 주식회사 로보스타 에지 그립식 프리-얼라이너
US9421617B2 (en) * 2011-06-22 2016-08-23 Tel Nexx, Inc. Substrate holder
JP6019516B2 (ja) 2012-08-24 2016-11-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
US9653338B2 (en) 2013-12-23 2017-05-16 Kla-Tencor Corporation System and method for non-contact wafer chucking
JP6562507B2 (ja) 2015-09-28 2019-08-21 株式会社Ｓｃｒｅｅｎホールディングス 基板保持装置およびこれを備える基板処理装置
US10283396B2 (en) * 2016-06-27 2019-05-07 Asm Nexx, Inc. Workpiece holder for a wet processing system

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004115872A (ja) * 2002-09-26 2004-04-15 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
JP2020520105A (ja) 2020-07-02
WO2018209160A1 (en) 2018-11-15
JP7014817B2 (ja) 2022-02-01
CN110612602A (zh) 2019-12-24
KR20190141259A (ko) 2019-12-23
US10083852B1 (en) 2018-09-25
KR102351354B1 (ko) 2022-01-13

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