CN110591564A - Wet CMP mirror polishing solution and preparation method thereof - Google Patents
Wet CMP mirror polishing solution and preparation method thereof Download PDFInfo
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- CN110591564A CN110591564A CN201910902179.2A CN201910902179A CN110591564A CN 110591564 A CN110591564 A CN 110591564A CN 201910902179 A CN201910902179 A CN 201910902179A CN 110591564 A CN110591564 A CN 110591564A
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- 238000005498 polishing Methods 0.000 title claims abstract description 57
- 238000002360 preparation method Methods 0.000 title abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000008367 deionised water Substances 0.000 claims abstract description 20
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 20
- 238000003756 stirring Methods 0.000 claims abstract description 16
- 239000001993 wax Substances 0.000 claims abstract description 16
- 239000003112 inhibitor Substances 0.000 claims abstract description 12
- 239000002518 antifoaming agent Substances 0.000 claims abstract description 11
- 230000007797 corrosion Effects 0.000 claims abstract description 11
- 238000005260 corrosion Methods 0.000 claims abstract description 11
- 239000003995 emulsifying agent Substances 0.000 claims abstract description 11
- 150000007524 organic acids Chemical class 0.000 claims abstract description 11
- 239000013556 antirust agent Substances 0.000 claims abstract description 10
- 238000002156 mixing Methods 0.000 claims abstract description 8
- 239000000375 suspending agent Substances 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 6
- 238000010438 heat treatment Methods 0.000 claims abstract description 4
- 238000002844 melting Methods 0.000 claims abstract description 4
- 230000008018 melting Effects 0.000 claims abstract description 4
- 239000000203 mixture Substances 0.000 claims abstract description 4
- 230000007704 transition Effects 0.000 claims abstract description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 9
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 9
- 239000003208 petroleum Substances 0.000 claims description 8
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims description 8
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 claims description 8
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 6
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 claims description 6
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 6
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 claims description 6
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 6
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 6
- 229910052788 barium Inorganic materials 0.000 claims description 5
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 claims description 5
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 5
- 239000012964 benzotriazole Substances 0.000 claims description 5
- 239000010432 diamond Substances 0.000 claims description 5
- 229910003460 diamond Inorganic materials 0.000 claims description 5
- GCLGEJMYGQKIIW-UHFFFAOYSA-H sodium hexametaphosphate Chemical compound [Na]OP1(=O)OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])O1 GCLGEJMYGQKIIW-UHFFFAOYSA-H 0.000 claims description 5
- 235000019982 sodium hexametaphosphate Nutrition 0.000 claims description 5
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 claims description 4
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 claims description 4
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 claims description 4
- 239000005642 Oleic acid Substances 0.000 claims description 4
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 4
- 239000004203 carnauba wax Substances 0.000 claims description 4
- 239000010431 corundum Substances 0.000 claims description 4
- 229910052593 corundum Inorganic materials 0.000 claims description 4
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 claims description 4
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 claims description 4
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 claims description 4
- 239000012188 paraffin wax Substances 0.000 claims description 4
- 229920002545 silicone oil Polymers 0.000 claims description 4
- FJLUATLTXUNBOT-UHFFFAOYSA-N 1-Hexadecylamine Chemical compound CCCCCCCCCCCCCCCCN FJLUATLTXUNBOT-UHFFFAOYSA-N 0.000 claims description 3
- AEQDJSLRWYMAQI-UHFFFAOYSA-N 2,3,9,10-tetramethoxy-6,8,13,13a-tetrahydro-5H-isoquinolino[2,1-b]isoquinoline Chemical compound C1CN2CC(C(=C(OC)C=C3)OC)=C3CC2C2=C1C=C(OC)C(OC)=C2 AEQDJSLRWYMAQI-UHFFFAOYSA-N 0.000 claims description 3
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 3
- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 3
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 claims description 3
- 101150096185 PAAS gene Proteins 0.000 claims description 3
- 229920000805 Polyaspartic acid Polymers 0.000 claims description 3
- 239000002202 Polyethylene glycol Substances 0.000 claims description 3
- 229920001213 Polysorbate 20 Polymers 0.000 claims description 3
- 229920001214 Polysorbate 60 Polymers 0.000 claims description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 3
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 claims description 3
- BCKXLBQYZLBQEK-KVVVOXFISA-M Sodium oleate Chemical compound [Na+].CCCCCCCC\C=C/CCCCCCCC([O-])=O BCKXLBQYZLBQEK-KVVVOXFISA-M 0.000 claims description 3
- 229920002125 Sokalan® Polymers 0.000 claims description 3
- NWGKJDSIEKMTRX-AAZCQSIUSA-N Sorbitan monooleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O NWGKJDSIEKMTRX-AAZCQSIUSA-N 0.000 claims description 3
- 235000021355 Stearic acid Nutrition 0.000 claims description 3
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 3
- 150000001412 amines Chemical class 0.000 claims description 3
- 235000013871 bee wax Nutrition 0.000 claims description 3
- 239000012166 beeswax Substances 0.000 claims description 3
- 150000001735 carboxylic acids Chemical class 0.000 claims description 3
- 235000013869 carnauba wax Nutrition 0.000 claims description 3
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 3
- 239000002270 dispersing agent Substances 0.000 claims description 3
- 235000019253 formic acid Nutrition 0.000 claims description 3
- RBNPOMFGQQGHHO-UHFFFAOYSA-N glyceric acid Chemical compound OCC(O)C(O)=O RBNPOMFGQQGHHO-UHFFFAOYSA-N 0.000 claims description 3
- 239000004312 hexamethylene tetramine Substances 0.000 claims description 3
- 235000010299 hexamethylene tetramine Nutrition 0.000 claims description 3
- 239000004200 microcrystalline wax Substances 0.000 claims description 3
- 235000019808 microcrystalline wax Nutrition 0.000 claims description 3
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 claims description 3
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 3
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 3
- 235000019809 paraffin wax Nutrition 0.000 claims description 3
- 235000019271 petrolatum Nutrition 0.000 claims description 3
- 239000004584 polyacrylic acid Substances 0.000 claims description 3
- 108010064470 polyaspartate Proteins 0.000 claims description 3
- 229920001223 polyethylene glycol Polymers 0.000 claims description 3
- 229940051841 polyoxyethylene ether Drugs 0.000 claims description 3
- 229920000056 polyoxyethylene ether Polymers 0.000 claims description 3
- 239000000256 polyoxyethylene sorbitan monolaurate Substances 0.000 claims description 3
- 235000010486 polyoxyethylene sorbitan monolaurate Nutrition 0.000 claims description 3
- 229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 claims description 3
- -1 polyoxypropylene glycerol Polymers 0.000 claims description 3
- 239000000344 soap Substances 0.000 claims description 3
- 229910052708 sodium Inorganic materials 0.000 claims description 3
- 239000011734 sodium Substances 0.000 claims description 3
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 claims description 3
- 235000012207 sodium gluconate Nutrition 0.000 claims description 3
- 239000000176 sodium gluconate Substances 0.000 claims description 3
- 229940005574 sodium gluconate Drugs 0.000 claims description 3
- 229940048086 sodium pyrophosphate Drugs 0.000 claims description 3
- 239000008117 stearic acid Substances 0.000 claims description 3
- 239000001384 succinic acid Substances 0.000 claims description 3
- 235000019818 tetrasodium diphosphate Nutrition 0.000 claims description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 3
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 claims description 3
- 241000238631 Hexapoda Species 0.000 claims description 2
- 239000012182 japan wax Substances 0.000 claims description 2
- AYAUBWSUZRFVQO-UHFFFAOYSA-N 2-[2-(4-phenyl-5-sulfanylidene-1h-1,2,4-triazol-3-yl)ethyl]benzo[de]isoquinoline-1,3-dione Chemical compound O=C1C(C=23)=CC=CC3=CC=CC=2C(=O)N1CCC1=NNC(=S)N1C1=CC=CC=C1 AYAUBWSUZRFVQO-UHFFFAOYSA-N 0.000 claims 1
- IVKNZCBNXPYYKL-UHFFFAOYSA-N 2-[2-[2-[2-[2-[2-[2-[2-[2-[2-[4-(2,4,4-trimethylpentan-2-yl)phenoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethanol Chemical compound CC(C)(C)CC(C)(C)C1=CC=C(OCCOCCOCCOCCOCCOCCOCCOCCOCCOCCO)C=C1 IVKNZCBNXPYYKL-UHFFFAOYSA-N 0.000 claims 1
- BTJIUGUIPKRLHP-UHFFFAOYSA-N 4-nitrophenol Chemical compound OC1=CC=C([N+]([O-])=O)C=C1 BTJIUGUIPKRLHP-UHFFFAOYSA-N 0.000 claims 1
- 239000006061 abrasive grain Substances 0.000 claims 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 5
- 238000004064 recycling Methods 0.000 abstract description 3
- 238000004140 cleaning Methods 0.000 abstract description 2
- 239000000725 suspension Substances 0.000 abstract description 2
- 239000006185 dispersion Substances 0.000 abstract 1
- 229910001220 stainless steel Inorganic materials 0.000 description 10
- 239000010935 stainless steel Substances 0.000 description 10
- 230000036541 health Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 239000010985 leather Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 210000002268 wool Anatomy 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000001238 wet grinding Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a wet CMP mirror polishing solution, which consists of A, B two components, wherein the component A is prepared from the following components in parts by weight: 5-30 parts of organic acid, 20-50 parts of wax, 4-20 parts of emulsifier and 30-100 parts of deionized water. The component B is prepared from the following components in parts by weight: 50-80 parts of abrasive, 5-15 parts of suspending agent, 1-5 parts of corrosion inhibitor, 3-10 parts of antirust agent, 5-10 parts of defoaming agent and 20-80 parts of deionized water, wherein the preparation method comprises the following steps: 1) preparing a component A: mixing organic acid, wax and emulsifier of component A together by adopting a phase transition agent-in-oil method, heating to 80-120 ℃ for complete melting, adding hot deionized water at about 100 ℃ and stirring at high speed until the mixture becomes aqueous water; 2) preparing a component B: taking deionized water, adding an abrasive and uniformly stirring, then sequentially adding a suspending agent, a corrosion inhibitor, an antirust agent and a defoaming agent, and uniformly stirring for later use; 3) uniformly stirring and mixing the cooled component A and the component B; 4) adjusting the pH value to 7-10. The polishing solution prepared by the invention has the advantages of good dispersion and suspension properties, good lubricity, easy cleaning, good light emitting effect, low cost and recycling.
Description
Technical Field
The invention belongs to the technical field of materials, and particularly relates to an improvement of a formula of a Polishing consumable used in a Chemical Mechanical Polishing process (Chemical Mechanical Polishing), in particular to a Polishing solution for wet grinding and Polishing.
Background
Since the release of the iPhone4 mobile phone, the beautiful appearance of the iPhone4 mobile phone becomes the classic design, and the stainless steel middle frame design also becomes the model for the mobile phone world to imitate. Although the stainless steel has high strength, the stainless steel has the characteristics of high toughness, strong abrasive adhesion, poor thermal conductivity, difficult dissipation of frictional heat and the like, so that the stainless steel middle frame has higher processing difficulty. The traditional processing methods include electrolytic polishing, chemical polishing, mechanical polishing and the like. The polishing solution adopted by the electrolytic polishing and the chemical polishing mostly adopts strong acid solution, which has great pollution to the environment and damages the health of operators. The mechanical polishing mostly adopts abrasive paper consumables, the metal dust pollution is serious, and the working environment is severe. Most importantly, the stainless steel surface processed by the above methods is difficult to achieve the required mirror effect. Wet CMP polishing: the polishing medium (such as polyurethane foaming leather strip/wool wheel, etc.) rotates at high speed, and the polishing liquid is sprayed on the surface of the polished stainless steel at extremely high pressure, so that the high temperature generated by the contact of the surface of the stainless steel middle frame and the polishing medium can be taken away, and the burning is avoided. The polishing solution has high cutting force and good surface effect due to the comprehensive action of various components, can prevent workers from sucking dust, and is beneficial to body health. The polishing solution is provided with the circulating system for recycling, and the polishing solution is added when the concentration is reduced, so that the polishing solution is more economical and convenient. The waste liquid treatment is simpler.
Wet CMP polishing: the polishing medium (such as polyurethane foaming leather strip/wool wheel, etc.) rotates at high speed, and the polishing liquid is sprayed on the surface of the polished stainless steel at extremely high pressure, so that the high temperature generated by the contact of the surface of the stainless steel middle frame and the polishing medium can be taken away, and the burning is avoided. The polishing solution has high cutting force and good surface effect due to the comprehensive action of various components, can prevent workers from sucking dust, and is beneficial to body health. The polishing solution is provided with the circulating system for recycling, and the polishing solution is added when the concentration is reduced, so that the polishing solution is more economical and convenient. The waste liquid treatment is simpler.
The invention aims to provide a wet CMP mirror polishing solution specially used for processing a stainless steel mobile phone middle frame.
Disclosure of Invention
In order to achieve the above object, the present invention provides the following technical solutions:
the wet CMP mirror polishing solution consists of A, B components, wherein the component A is prepared from the following components in parts by weight: 5-30 parts of organic acid, 20-50 parts of wax, 4-20 parts of emulsifier and 30-100 parts of deionized water. The component B is prepared from the following components in parts by weight: 50-80 parts of abrasive, 5-15 parts of suspending agent, 1-5 parts of corrosion inhibitor, 3-10 parts of antirust agent, 5-10 parts of defoaming agent and 20-80 parts of deionized water.
Preferably, the organic acids in the a component are: one or more of formic acid, acetic acid, carboxylic acid, oleic acid, citric acid, stearic acid, glycolic acid, polyacrylic acid and succinic acid.
Preferably, the wax in the component A is one or more of carnauba wax, paraffin wax, beeswax, microcrystalline wax, Japan wax and Chinese insect wax.
Preferably, the emulsifier in the component A is: triethanolamine, triethanolamine contains one or more of acid soap, sodium dodecyl sulfate, sodium oleate, OP-10, AEO, NPO, polyethylene glycol, nonylphenol polyoxyethylene ether, tween-20, tween-60, and Span-80.
Preferably, the abrasive in the component B is: one or more of diamond, cubic boron nitride, white corundum, chromium oxide and iron oxide.
Preferably, the abrasive particle size in the B component is 1um or less.
Preferably, the dispersing agent in the component B is: one or more of sodium hexametaphosphate, sodium pyrophosphate and PAAS.
Preferably, the corrosion inhibitor in the component B is: one or more of hexamethylenetetramine, benzotriazole, hexadecylamine, polyaspartic acid and sodium gluconate.
Preferably, the antirust agent in the component B is: one or more of barium petroleum sulfonate, rosin and sodium petroleum sulfonate.
Preferably, the defoaming agent in the component B is: one or more of dimethyl silicone oil, tributyl phosphate, polyoxyethylene polyoxypropylene amine ether and polyoxypropylene glycerol ether.
The preparation method of the polishing solution comprises the following steps:
1) preparing a component A: mixing organic acid, wax and emulsifier of component A together by adopting a phase transition agent-in-oil method, heating to 80-120 ℃ for complete melting, adding hot deionized water at about 100 ℃ and stirring at high speed until the mixture becomes aqueous water;
3) preparing a component B: taking deionized water, adding an abrasive and uniformly stirring, then sequentially adding a suspending agent, a corrosion inhibitor, an antirust agent and a defoaming agent, and uniformly stirring for later use;
3) uniformly stirring and mixing the cooled component A and the component B;
4) adjusting the pH value to 7-10.
Preferably, the deionized water in the step 2) is 20-80 parts; the ratio of the component A to the component B in the step 3) is 59/200-200/84.
The invention has the beneficial technical effects that the components of the aqueous wax emulsion are optimally added in the formula, the component proportion is reasonable, and the emulsion is fine and uniform. The grinding material has good suspension property and dispersibility, can not agglomerate or block-shaped precipitate after being placed for half a year, and can be recovered to a homogeneous state after being slightly shaken. The production method has simple preparation process and low cost, is suitable for batch production, and can change the performance of the polishing solution by slightly adjusting the components to prepare a series of products.
Meanwhile, the polishing solution has excellent polishing performance and dirt-removing capacity, the polished surface is fine and smooth, the finish degree is high, the polishing solution has water solubility, and the cleaning is simple without adding a wax removal link. The polishing solution can be recycled, the concentration can be reduced only by adding a proper amount of polishing solution, the polishing solution is suitable for a production mode with higher automation degree, the labor is saved, and special maintenance is not needed. The formula has no toxic and harmful components, and does not cause harm to the health of workers.
Detailed Description
Example one
The wet CMP mirror polishing solution consists of A, B components, wherein the component A is prepared from the following components in parts by weight: 5-30 parts of organic acid, 20-50 parts of wax, 4-20 parts of emulsifier and 30-100 parts of deionized water. The component B is prepared from the following components in parts by weight: 50-80 parts of abrasive, 5-15 parts of suspending agent, 1-5 parts of corrosion inhibitor, 3-10 parts of antirust agent, 5-10 parts of defoaming agent and 20-80 parts of deionized water.
The organic acid in the component A is: one or more of formic acid, acetic acid, carboxylic acid, oleic acid, citric acid, stearic acid, glycolic acid, polyacrylic acid and succinic acid. Oleic acid, 3 parts, is preferably used in this example.
The wax in the component A is one or more of carnauba wax, paraffin wax, beeswax, microcrystalline wax, Japan wood wax, and Cera chinensis. In this example, 15 parts of palm wax and 10 parts of paraffin wax are preferably used.
Preferably, the emulsifier in the component A is: triethanolamine, triethanolamine contains one or more of acid soap, sodium dodecyl sulfate, sodium oleate, OP-10, AEO, NPO, polyethylene glycol, nonylphenol polyoxyethylene ether, tween-20, tween-60, and Span-80. In this embodiment, 5 parts of triethanolamine OP-104 parts are preferably used
Preferably, the abrasive in the component B is: one or more of diamond, cubic boron nitride, white corundum, chromium oxide and iron oxide. In the present embodiment, 20 parts of diamond is preferably used and the particle size of diamond is 1um or less.
Preferably, the dispersing agent in the component B is: one or more of sodium hexametaphosphate, sodium pyrophosphate and PAAS. In this example, 0.4 part of sodium hexametaphosphate is preferably used
Preferably, the corrosion inhibitor in the component B is: one or more of hexamethylenetetramine, benzotriazole, hexadecylamine, polyaspartic acid and sodium gluconate. In this embodiment, 0.3 part of benzotriazole is preferably used
Preferably, the antirust agent in the component B is: one or more of barium petroleum sulfonate, rosin and sodium petroleum sulfonate. In this example, 0.3 part of barium petroleum sulfonate is preferably used
Preferably, the defoaming agent in the component B is: one or more of dimethyl silicone oil, tributyl phosphate, polyoxyethylene polyoxypropylene amine ether and polyoxypropylene glycerol ether. In this embodiment, 0.8 part of dimethylsilicone oil is preferably used.
60 parts of deionized water of the component A and the component B, and the proportion can be 30/30, 20/40, 10/50 and the like.
The preparation method of the polishing solution comprises the following steps:
1) preparing a component A: mixing 3 parts of organic acid, 25 parts of wax and 4 parts of emulsifier (OP-10) of the component A together by adopting a phase transition agent-in-oil method, heating to 80-120 ℃ for complete melting, adding 30 parts of hot deionized water at about 100 ℃ and stirring at high speed until the mixture becomes aqueous water;
4) preparing a component B: taking 30 parts of deionized water, adding 20 parts of abrasive (white corundum) and uniformly stirring, then sequentially adding 0.4 part of suspending agent (sodium hexametaphosphate), 0.3 part of corrosion inhibitor (benzotriazole), 0.3 part of antirust agent (barium petroleum sulfonate) and 0.8 part of defoaming agent (dimethyl silicone oil), and uniformly stirring for later use;
3) uniformly stirring and mixing the cooled component A and the component B;
4) adjusting the pH value to 7-10.
20-80 parts of deionized water in the step 2); the ratio of the component A to the component B in the step 3) is 59/200-200/84.
Example two
The wet CMP mirror polishing solution can also be prepared from the following components:
EXAMPLE III
The wet CMP mirror polishing solution can also be prepared from the following components:
the above-described embodiments are intended to facilitate the understanding and practice of the invention by those skilled in the art. It will be apparent to those skilled in the art that various modifications to these embodiments are possible, and that the generic principles defined herein may be applied to other embodiments without the use of the inventive faculty. Therefore, the scope of the present invention is not limited to the embodiments described herein, and those skilled in the art should understand that they can make modifications and variations without departing from the scope of the present invention.
Claims (12)
1. The wet CMP mirror polishing solution is characterized by consisting of A, B components, wherein the component A is prepared from the following components in parts by weight: 5-30 parts of organic acid, 20-50 parts of wax, 4-20 parts of emulsifier and 30-100 parts of deionized water. The component B is prepared from the following components in parts by weight: 50-80 parts of abrasive, 5-15 parts of suspending agent, 1-5 parts of corrosion inhibitor, 3-10 parts of antirust agent, 5-10 parts of defoaming agent and 20-80 parts of deionized water.
2. The wet CMP mirror polishing solution according to claim 1, wherein the organic acid in the a component is: one or more of formic acid, acetic acid, carboxylic acid, oleic acid, citric acid, stearic acid, glycolic acid, polyacrylic acid and succinic acid.
3. The wet CMP mirror polishing solution according to claim 1, wherein the wax in the a component is one or more of carnauba wax, paraffin wax, beeswax, microcrystalline wax, japan wax, insect wax.
4. The wet CMP mirror polishing solution according to claim 1, wherein the emulsifier in the a component is: triethanolamine, triethanolamine contains one or more of acid soap, sodium dodecyl sulfate, sodium oleate, OP-10, AEO, NPO, polyethylene glycol, nonylphenol polyoxyethylene ether, tween-20, tween-60, and Span-80.
5. The wet CMP mirror polishing solution according to claim 1, wherein the abrasive in the B component is: one or more of diamond, cubic boron nitride, white corundum, chromium oxide and iron oxide.
6. The wet-type CMP mirror polishing solution according to claim 5, wherein the abrasive grain size in the B component is 1um or less.
7. The wet CMP mirror polishing solution according to claim 1, wherein the dispersant in the group B component is: one or more of sodium hexametaphosphate, sodium pyrophosphate and PAAS.
8. The wet CMP mirror polishing solution according to claim 1, wherein the corrosion inhibitor in the component B is: one or more of hexamethylenetetramine, benzotriazole, hexadecylamine, polyaspartic acid and sodium gluconate.
9. The wet CMP mirror polishing solution according to claim 1, wherein the rust inhibitor in the B component is: one or more of barium petroleum sulfonate, rosin and sodium petroleum sulfonate.
10. The polishing solution according to claim 1, wherein the defoaming agent in the component B is: one or more of dimethyl silicone oil, tributyl phosphate, polyoxyethylene polyoxypropylene amine ether and polyoxypropylene glycerol ether.
11. The polishing solution according to claim 1, which is prepared by:
1) preparing a component A: mixing organic acid, wax and emulsifier of component A together by adopting a phase transition agent-in-oil method, heating to 80-120 ℃ for complete melting, adding hot deionized water at about 100 ℃ and stirring at high speed until the mixture becomes aqueous water;
2) preparing a component B: taking deionized water, adding an abrasive and uniformly stirring, then sequentially adding a suspending agent, a corrosion inhibitor, an antirust agent and a defoaming agent, and uniformly stirring for later use;
3) uniformly stirring and mixing the cooled component A and the component B;
4) adjusting the pH value to 7-10.
12. The method for preparing polishing solution according to claim 11, wherein the deionized water in step 2) is 20 to 80 parts; the ratio of the component A to the component B in the step 3) is 59/200-200/84.
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