CN110534439B - 硅片垫片用于雪崩二极管降噪的封装方法 - Google Patents
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Abstract
本发明涉及一种雪崩二极管的封装方法，具体涉及硅片垫片用于雪崩二极管降噪的封装方法。本发明雪崩二极管降噪的封装方法，包括如下步骤：（a）提供雪崩二极管封装的管座；（b）在雪崩二极管管座上使用绝缘胶进行硅片垫片的粘接；（c）在硅片基座上使用银胶进行芯片的粘接；（d）进行键合、封帽；其中，步骤（b）中所述硅片垫片的下表面绝缘，上表面导通。本发明采用契合度更高，价格更便宜的硅片垫片代替陶瓷垫片进行垫接，能够使整个结构的契合度更高；且硅片垫片的生产工艺简单，成本较陶瓷垫片而言，有大幅的降低。
Description
技术领域
本发明涉及一种雪崩二极管的封装方法，具体涉及硅片垫片用于雪崩二极管降噪的封装方法。
背景技术
随着微电子技术的发展，雪崩二极管作为负阻器件，具有输出功率大的优点，雪崩二极管得到广泛的使用。但是由于雪崩倍增过程中产生电子和空穴对的无规则性，雪崩二极管会产生很大的噪声。按照正常方式封装，双管脚直接键合会遗留较大噪声，人们通常使用陶瓷垫片进行分隔封装。
发明内容
本发明所要解决的技术问题在于针对上述现有技术的不足，提供了一种硅片垫片用于雪崩二极管降噪的封装方法。本发明采用硅片垫片代替陶瓷垫片进行垫接，能够使整个结构的契合度更高；且硅片垫片的生产工艺简单，成本较陶瓷垫片而言，有大幅度的降低。
为解决上述技术问题，本发明采用的技术方案是：一种硅片垫片用于雪崩二极管降噪的封装方法，其特征在于，该封装方法具有以下特征：
一种硅片垫片用于雪崩二极管降噪的封装方法，使用硅片垫片代替陶瓷垫片，包括如下步骤：
（a）提供雪崩二极管封装的管座；
（b）在雪崩二极管管座上使用绝缘胶进行硅片垫片的粘接；
（c）在硅片垫片上使用导电粘接胶进行芯片的粘接；
（d）进行键合、封帽；
其中，步骤（b）中所述硅片垫片的下表面绝缘，上表面导通。
所述硅片垫片使用裸硅片，并对裸硅片的下表面进行绝缘处理，保证垫片下表面绝缘。
在所述硅片垫片的上表面镀一层导电金属层，保证垫片上表面导通。
所述导电金属层为铝层或银层。
与现有技术相比，本发明具有以下优点：
本发明采用契合度更高，价格更便宜的硅片垫片代替陶瓷垫片进行垫接，能够使整个结构的契合度更高；且硅片垫片的生产工艺简单，成本较陶瓷垫片而言，有大幅的降低。
附图说明
图1为本发明实施例1雪崩二极管降噪封装的结构示意图。
图2为本发明实施例1硅片垫片的截面结构示意图。
附图标记说明：1-管座；2-硅片垫片；3-芯片。
具体实施方式
实施例1
如图1所示，一种硅片垫片用于雪崩二极管降噪的封装方法，包括如下步骤：
（a）提供雪崩二极管封装的管座1；
（b）在雪崩二极管管座1上使用绝缘胶进行硅片垫片2的粘接；
（c）在硅片垫片2基座上使用银胶进行芯片3的粘接；
（d）进行键合、封帽；
步骤（b）中所述硅片垫片2使用裸硅片，并对裸硅片下表面进行热氧处理，保证垫片下表面绝缘，在裸硅片的上表面镀铝，保证垫片上表面导通，硅片垫片的结构如图2所示。
实施例2
一种硅片垫片用于雪崩二极管降噪的封装方法，包括如下步骤：
（a）提供雪崩二极管封装的管座1；
（b）在雪崩二极管管座1上使用绝缘胶进行硅片垫片2的粘接；
（c）在硅片垫片2基座上使用银胶进行芯片3的粘接；
（d）进行键合、封帽；
步骤（b）中所述硅片垫片2使用裸硅片，对裸硅片下表面进行热氧处理，保证垫片下表面绝缘，在裸硅片上表面镀银，保证垫片上表面导通。
以上所述，仅是本发明的较佳实施例，并非对本发明作任何限制。凡是根据本发明实质对以上实施例所作的任何简单修改、变更以及等效变化，均仍属于本发明技术方案的保护范围内。
Claims (2)
1.一种硅片垫片用于雪崩二极管降噪的封装方法，其特征在于，使用硅片垫片代替陶瓷垫片，包括如下步骤：
（a）提供雪崩二极管封装的管座（1）；
（b）在雪崩二极管管座（1）上使用绝缘胶进行硅片垫片（2）的粘接；
（c）在硅片垫片（2）上使用导电粘接胶进行芯片（3）的粘接；
（d）进行键合、封帽；
其中，步骤（b）中所述硅片垫片（2）的下表面绝缘，上表面导通，所述硅片垫片（2）的上表面镀一层导电金属层，所述导电金属层为铝层或银层。
2.根据权利要求1所述的硅片垫片用于雪崩二极管降噪的封装方法，其特征在于，所述硅片垫片（2）使用裸硅片，并对裸硅片的下表面进行绝缘处理，保证垫片下表面绝缘。
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Inventor after: Xin Qingle Inventor after: He Qi Inventor after: Zhang Ming Inventor after: Wang Tao Inventor after: Zhang Shiquan Inventor before: Xin Qingle Inventor before: Zhang Ming Inventor before: Wang Tao Inventor before: Zhang Shiquan |