CN110508996A - Timing control surface micro-structure array processing unit (plant) and method - Google Patents

Timing control surface micro-structure array processing unit (plant) and method Download PDF

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Publication number
CN110508996A
CN110508996A CN201910904223.3A CN201910904223A CN110508996A CN 110508996 A CN110508996 A CN 110508996A CN 201910904223 A CN201910904223 A CN 201910904223A CN 110508996 A CN110508996 A CN 110508996A
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axis
accurate positioning
positioning unit
unit
test specimen
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黄虎
李轩
王馗沣
杨智鑫
孙午向
徐智
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Jilin University
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Jilin University
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P9/00Treating or finishing surfaces mechanically, with or without calibrating, primarily to resist wear or impact, e.g. smoothing or roughening turbine blades or bearings; Features of such surfaces not otherwise provided for, their treatment being unspecified
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02NELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N2/00Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
    • H02N2/02Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing linear motion, e.g. actuators; Linear positioners ; Linear motors
    • H02N2/06Drive circuits; Control arrangements or methods

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Control Of Position Or Direction (AREA)

Abstract

The present invention relates to a kind of timing control surface micro-structure array processing unit (plant) and method, processing unit (plant) includes that base support unit, z-axis adjustment unit, test specimen accurate positioning unit and processing main motion generate unit.Z-axis adjustment unit and test specimen accurate positioning unit are mounted on base support unit, and processing main motion generates unit and is mounted on z-axis adjustment unit, and test specimen is adhered on the guide rail slide block component of test specimen accurate positioning unit by melt paraffin.The surface micro-structure array processing method: the driving voltage timing between unit, x-axis, y-axis accurate positioning unit piezoelectric stack is generated by control processing main motion, implementation tool head is contacted and is separated with the timing of test specimen, forms controlled surface micro structure array in surface of test piece.Advantage is: utilizing sequential control method, processing micro structure shape, size, spacing can facilitate control, and process is simple, efficient, has potential application foreground in terms of the functions such as controlled material surface optical, tribology, wetability.

Description

Timing control surface micro-structure array processing unit (plant) and method
Technical field
The present invention relates to a kind of timing control surface micro-structure array processing unit (plant) and methods, can be used for the micro- knot of material surface The processing of structure array, with characteristics such as the optics on controlled material surface, tribology, wetabilitys, enhances it in optics, photoelectron, biology The functional application in the fields such as medicine, machinery, micro-fluidic.
Background technique
Surface micro-structure array (such as dimple hole, tapered array, very low power, micro-pillar array) is for controlled material surface The characteristics such as optics, tribology, wetability play a significant role, in aerospace, micro-nano-fluidic control technology, solar battery, surface The fields such as enhancing Raman spectroscopy, biomedicine have a wide range of applications.How to be processed on the surface of different materials specific Micro structure array also result in the concern of scholars come the application for meeting in related fields.So far, scholars it is also proposed that Many different processing methods, " AIP Advanced " in 035110 (High-resolution of volume 7 in 2017 nanopatterning of biodegradable polylactide by thermal nanoimprint Lithography using gas permeable mold) a kind of refer to nano impression method, this method is will be hot Plastic macromolecule glue, which is spun in matrix, forms thin film, the mould that covering on it is made with electron-beam lithography system later Plate and the straight high molecular material softening of continuous heating, then pressurize, keep temperature and pressure decrease temperature and pressure after a period of stabilisation, take off Subsequent processing is carried out after mould and removes remnant layer, and the shape opposite with template can be obtained.This method is to functional material Directly processing aspect has significant advantage, however this method needs to implement preceding supporting process to manufacture template and rear supporting process Remnant layer is removed, results in that its process is complicated, efficiency lower cost is higher."Accounts of Chemical Research " in 2016 in 2596-2604 pages of volume 49 (Confined Chemical Etching for Electrochemical Machining with Nanoscale Accuracy) a kind of method of electrical-chemistry method is proposed, This method realizes chemical attack close to material surface using the limited etch layer formed on tool-electrode surface, and then in material The micro-structure of surface processing specific shape.This method not only can be with finished surface micro structure array, can also be to material surface Polished and planarized, disadvantage thereof however is that process is complicated and higher cost, and only to can chemical attack material Material works." Journal of Materials Processing Technology " is in 2017 in the 236-248 of volume 248 Page (AFM tip-based mechanical nanomachining of 3D micro and nano-structures via The control of the scratching trajectory) it proposes and a kind of processes micro- knot using atomic force microscope The method of structure, this method are on the cantilever beam that diamond tool head is mounted in atomic force microscope and as cutting element pair Surface of test piece carries out Mechanical lithography, in conjunction with existing precisely locating platform, passes through control machining locus and probe Specimen Normal pressure when surface obtains the micro-structure with specific shape and depth.Although it is micro- that this method can process three-dimensional surface Structure, but since using delineation mode, tool heads serious wear is only suitable only for the micro- of soft material surface slight depth Structure processing.Further, since needing using atomic force microscope, processing cost is high, limits its extensive use.It to sum up, can be with Find out, further develop new micro structure array processing unit (plant) and method, for pushing the functional application of micro-structure surface to have Significance.
Summary of the invention
The purpose of the present invention is to provide a kind of timing control surface micro-structure array processing unit (plant) and method, solve existing There is the above problem existing for technology, accurate, efficient, the inexpensive processing to micro structure arrays such as dimple hole, tapers may be implemented, There is potential application prospect in fields such as aerospace, marine ship, nanotechnology, biomedicine, precision and ultra-precision machinings.
Above-mentioned purpose of the invention is achieved through the following technical solutions:
Timing control surface micro-structure array processing unit (plant), including z-axis adjustment unit 9, processing main motion generate unit, examination Part accurate positioning unit, base support unit.The base support unit is made of pedestal a1 and gantry upright post 2, z-axis adjustment Unit 9 is the whole displacement platform of manual coarse adjustment, and z-axis adjustment unit 9 is mounted in gantry upright post 2, test specimen accurate positioning unit It is mounted on pedestal a1, processing main motion generates unit and is mounted on z-axis adjustment unit 9, and test specimen 5 is bonded to by melt paraffin On the guide rail slide block component a14 of test specimen accurate positioning unit.
It includes bridge type flexible linkage 8, piezoelectric stack a7, wedge block combination that the processing main motion, which generates unit, A6, force snesor 10, tool heads mounting post 11, pre-loading screw a12, tool heads 13.Wherein force snesor 10 is used to detection instrument Whether first 13 contact with 5 surface of test specimen, and piezoelectric stack a7 is mounted in the square groove of bridge type flexible hinge 8 and is combined by wedge block A6, which is realized, to be pre-tightened, and bridge type flexible linkage 8 amplifies the output of piezoelectric stack a7, and then generates processing main motion.
The test specimen accurate positioning unit is a kind of Novel two-freedom-degree stick-slip inertia-type piezoelectric actuator, including x-axis Accurate positioning unit 4, y-axis accurate positioning unit 3.X-axis accurate positioning unit 4 is by lever flexure hinge mechanism a20, piezo stack Heap b19, wedge block combination b17, guide rail slide block component a14, pedestal b15 composition.Wherein lever flexure hinge mechanism a20 passes through Pre-loading screw c18 is mounted on pedestal b15, and piezoelectric stack b19 is mounted in the square groove of lever flexure hinge mechanism a20, and B17 is combined by wedge block to be pre-tightened.Y-axis accurate positioning unit 3 is by lever flexure hinge mechanism b27, piezoelectric stack C26, wedge block combination c24, guide rail slide block component b21, pedestal c22 composition, wherein lever flexure hinge mechanism b27 passes through pre- Tight screw d25 is mounted on pedestal c22, and piezoelectric stack c26 is mounted in the square groove of lever flexure hinge mechanism b27, and is led to Wedge block combination c24 is crossed to be pre-tightened.The pedestal b15 of x-axis accurate positioning unit 4 is mounted on y-axis precision by pre-loading screw b16 On the guide rail slide block component b21 of positioning unit 3, y-axis accurate positioning unit 3 passes through 23 attachment screw of mounting hole on pedestal c22 It is mounted on the pedestal a2 of base support unit, passes through the stack to x-axis accurate positioning unit 4 and y-axis accurate positioning unit 3 Arrangement, the non-interfering movement in x-axis and y-axis may be implemented.Test specimen, which is adhered to x-axis precision by melt paraffin, to be determined On the guide rail slide block component a14 of bit location, by the piezoelectric stack on x-axis accurate positioning unit 4, y-axis accurate positioning unit 3 B19, piezoelectric stack c26 apply driving voltage and control voltage magnitude and frequency, and it is fixed in x-axis, the precision of y-axis that test specimen may be implemented Position.
Another object of the present invention is to provide a kind of timing control surface micro-structure array processing methods, including following step It is rapid:
A) test specimen is adhered to the guide rail slide block group of x-axis accurate positioning unit 4 by ready test specimen 5 using melt paraffin On part a14, installation process allows test specimen 5 to keep smooth as far as possible;
B) apply driving voltage to the piezoelectric stack in x-axis accurate positioning unit 4 and y-axis accurate positioning unit 3, pass through Control voltage magnitude and frequency so that the location of the core of first micro-structure being processed on test specimen 5 tool heads just under Side, i.e., position at this time are the initial position of x-axis accurate positioning unit 4 and y-axis accurate positioning unit 3, and it is accurate then to stop x-axis Positioning unit 4 and y-axis accurate positioning unit 3;
C) adjustment z-axis adjustment unit 9 is close to 5 surface of test specimen, judged using the registration of force snesor 10 tool heads 13 with The contact of test specimen 5, when registration changes, specification tool head 13 has been contacted with test specimen 5, reversely adjusts z-axis adjustment unit at this time 9 make tool heads 13 leave 5 surface certain distance of test specimen (1 μm to 5 μm);
D) voltage timing is controlled as shown in Figure 6, applies to the piezoelectric stack a7 in processing main motion generation unit saw first Tooth waveform drive voltage starts to process first micro-structure.Because there are a certain distance between tool heads 13 and test specimen 5, therefore 0 To the t1 time, process main motion generate unit output mainly compensate this distance, test specimen 5 and tool heads 13 and not in contact with, The output signal of force snesor 10 is zero.The t1 moment is in contact between test specimen 5 and tool heads 13, and force snesor 10 is begun with Signal output.T1 to t2 moment, tool heads 13 start to press against 5 surface of test specimen, and the output signal of force snesor 10 is gradually increased.t2 Moment, the output displacement of piezoelectric stack a7 reach maximum, and 13 Specimen of tool heads, 5 surfaces are most deep, while force snesor 10 Output signal reaches maximum.T2 to t3 moment, piezoelectric stack a7 gradually reply original state, and tool heads 13 gradually leave test specimen 5. T3 moment piezoelectric stack a7 is returned to original state, and tool heads 13 return to initial position, and first micro-structure completes the process;
E) t3 to the t4 moment applies zig-zag driving voltage to the piezoelectric stack b19 of x-axis accurate positioning unit 4, so that Test specimen 5 moves a distance Lx (greater than the size of a upper micro-structure) along x-axis forward direction, arrives the t4 moment, next micro-structure Immediately below location of the core to tool heads 13;
F) t4 to the t5 moment continuously repeats step d), e) until completing the micro structure array on first single line of x-axis Processing;
G) the t5 moment processes the last one micro-structure on first single line of x-axis, stops processing main motion and generates list Member.T5 to the t6 moment applies zig-zag driving to the piezoelectric stack on x-axis accurate positioning unit 4, y-axis accurate positioning unit 3 Voltage, by the amplitude and frequency of voltage suffered by two piezoelectric stacks of control, so that x-axis accurate positioning unit 4 returns to step b) The initial position, 3 relative initial position forward direction moving distance Ly of y-axis accurate positioning unit is (greater than a upper micro-structure Size), the t6 moment is arrived, the center of first micro-structure on test specimen on next strip array line is in the underface of tool heads 13;
H) continuously repeat step d), e), f), g) until process the last one micro-structure, returned to initially to tool heads 13 Position disconnects the driving voltage on all piezoelectric stacks.
The beneficial effects of the present invention are: the timing control surface micro-structure array processing unit (plant) that provides through the invention with Method, may be implemented test specimen in x, the precision positioning of y-axis, the diamond tool head that z-axis configures different pointed shapes can be real Accurate, efficient, the inexpensive processing of existing micro- pit array, micro- tapered array.Pass through control x-axis accurate positioning unit 4, y-axis essence Piezoelectric stack b19, the driving voltage of piezoelectric stack c26 and frequency in close positioning unit 3, it is convenient to change between micro-structure Away from;The control voltage and frequency that piezoelectric stack a7 in unit is generated by changing processing main motion, can be changed the depth of micro-structure; By controlling three driving voltage timing stacked, the micro structure array of different shape and depth can be obtained to meet different necks The application demand in domain.
Detailed description of the invention
The drawings described herein are used to provide a further understanding of the present invention, constitutes part of this application, this hair Bright illustrative example and its explanation is used to explain the present invention, and is not constituted improper limitations of the present invention.
Fig. 1 is the overall structure diagram of timing control surface micro-structure array processing unit (plant) of the invention;
Fig. 2 is test specimen accurate positioning unit structural schematic diagram of the invention;
Fig. 3 is y-axis accurate positioning unit structural schematic diagram of the invention;
Fig. 4 is that processing main motion of the invention generates cellular construction schematic diagram;
Fig. 5 is that timing control surface micro-structure array processing unit (plant) of the invention realizes that rapidoprint surface indentation array is micro- The schematic diagram of structure;
Fig. 6 is the driving voltage timing control figure of piezoelectric stack a7 of the invention, piezoelectric stack b19, piezoelectric stack c26;
In figure: 1, pedestal a;2, gantry upright post;3, y-axis accurate positioning unit;4, x-axis accurate positioning unit;5, test specimen;6, Wedge block combines a;7, piezoelectric stack a;8, bridge type flexible linkage;9, z-axis adjustment unit;10, force snesor;11, tool Head mounting post;12, pre-loading screw a;13, tool heads;14, guide rail slide block component a;15, pedestal b;16, pre-loading screw b;17, wedge Shape block combines b;18, pre-loading screw c;19, piezoelectric stack b;20, lever flexure hinge mechanism a;21, guide rail slide block component b; 22, pedestal c;23, mounting hole;24, wedge block combines c;25;Pre-loading screw d;26, piezoelectric stack c;27, lever flexible hinge Mechanism b.
Specific embodiment
Detailed content and its specific embodiment of the invention are further illustrated with reference to the accompanying drawing.
Referring to FIG. 1 to FIG. 4, the timing control surface micro-structure array processing unit (plant) and method in the present invention, including z Axial adjustment unit 9, processing main motion generate unit, test specimen accurate positioning unit, base support unit.The base support list Member includes pedestal a1 and gantry upright post 2, and the two is all made of the processing of 45 Steel materials, ensure that overall rigidity.Z-axis adjustment unit 9 It is mounted in gantry upright post 2, test specimen accurate positioning unit is mounted on pedestal a1, and processing main motion generates unit and is mounted on z-axis On adjustment unit 9, test specimen 5 is bonded on the guide rail slide block component a14 of test specimen accurate positioning unit by melt paraffin.
The test specimen accurate positioning unit is a kind of Novel two-freedom-degree stick-slip inertia-type piezoelectric actuator, including x-axis Accurate positioning unit 4, y-axis accurate positioning unit 3, the two structure having the same and driving method, design feature all pass through Lever flexure hinge mechanism amplifies the output displacement of piezoelectric stack and is transmitted on guide rail slide block component.X-axis precision is determined Bit location 4 and y-axis accurate positioning unit 3 are placed in stack, and the non-interfering movement in x-axis and y-axis may be implemented.X-axis Accurate positioning unit 4 combines b17, guide rail slide block component by lever flexure hinge mechanism a20, piezoelectric stack b19, wedge block A14, pedestal b15 composition.Wherein lever flexure hinge mechanism a20 is mounted on pedestal b15 by pre-loading screw c18, piezoelectricity It stacks b19 to be mounted in the square groove of lever flexure hinge mechanism a20, and b17 is combined by wedge block and is pre-tightened.Y-axis essence Close positioning unit by lever flexure hinge mechanism b27, piezoelectric stack c26, wedge block combine c24, guide rail slide block component b21, Pedestal c22 composition, wherein lever flexure hinge mechanism b27 is mounted on pedestal c22 by pre-loading screw d25, piezoelectric stack C26 is mounted in the square groove of lever flexure hinge mechanism b27, and is combined c24 by wedge block and pre-tightened.X-axis precision is fixed The bottom plate b15 of bit location 4 is mounted on the guide rail slide block component b21 of y-axis accurate positioning unit 3 by pre-loading screw b16, y-axis Accurate positioning unit 3 is mounted on the pedestal a2 of base support unit by 23 attachment screw of mounting hole on bottom plate c22.Test specimen It is adhered on the guide rail slide block component a14 of x-axis accurate positioning unit by melt paraffin.By to x-axis accurate positioning unit 4, y Piezoelectric stack b19, piezoelectric stack c26 on axis accurate positioning unit 3 apply driving voltage and control voltage magnitude and frequency, can To realize that test specimen in the precision positioning of x-axis, y-axis, can be such that test specimen moves according to desired guiding trajectory.
It includes bridge type flexible linkage 8, piezoelectric stack a7, wedge block combination that the processing main motion, which generates unit, A6, force snesor 10, tool heads mounting post 11, pre-loading screw a12, tool heads 13.Wherein it is soft to be mounted on bridge-type for force snesor 10 On property linkage 8.Tool heads mounting post 11 is mounted on force snesor 10.Tool heads 13 are mounted on tool heads mounting post 11 On, and pre-tightened by pre-loading screw a12.Piezoelectric stack a7 is mounted in the square groove of bridge type flexible linkage 8, and is led to Wedge block combination a6 is crossed to be pre-tightened.Piezoelectric stack a7 obtain it is electric after, it is corresponding that output will be extended under the action of inverse piezoelectric effect Displacement, bridge type flexible linkage 8 will amplify and then generate the processing main motion of z-axis to the output of piezoelectric stack a7.
Referring to shown in Fig. 5 and Fig. 6, timing control surface micro-structure array processing method of the invention, comprising the following steps:
A) test specimen is adhered to the guide rail slide block group of x-axis accurate positioning unit 4 by ready test specimen 5 using melt paraffin On part a14, installation process allows test specimen 5 to keep smooth as far as possible;
B) apply driving voltage to the piezoelectric stack in x-axis accurate positioning unit 4 and y-axis accurate positioning unit 3, pass through Control voltage magnitude and frequency so that the location of the core of first micro-structure being processed on test specimen 5 tool heads 13 just Lower section, i.e., position at this time are the initial position of x-axis accurate positioning unit 4 and y-axis accurate positioning unit 3, then stop x-axis essence Close positioning unit 4 and y-axis accurate positioning unit 3;
C) adjustment z-axis adjustment unit 9 is close to 5 surface of test specimen, judged using the registration of force snesor 10 tool heads 13 with The contact of test specimen 5, when registration changes, specification tool head 13 has been contacted with test specimen 5, reversely adjusts z-axis adjustment unit at this time 9 make tool heads 13 leave 5 surface certain distance of test specimen (1 μm to 5 μm);
D) voltage timing is controlled as shown in Figure 6, applies to the piezoelectric stack a7 in processing main motion generation unit saw first Tooth waveform drive voltage starts to process first micro-structure.Because there are a certain distance between tool heads 13 and test specimen 5, therefore 0 To the t1 time, process main motion generate unit output mainly compensate this distance, test specimen 5 and tool heads 13 and not in contact with, The output signal of force snesor 10 is zero.The t1 moment is in contact between test specimen 5 and tool heads 13, and force snesor 10 is begun with Signal output.T1 to t2 moment, tool heads 13 start to press against 5 surface of test specimen, and the output signal of force snesor 10 is gradually increased.t2 Moment, the output displacement of piezoelectric stack a7 reach maximum, and 13 Specimen of tool heads, 5 surfaces are most deep, while force snesor 10 Output signal reaches maximum.For t2 to the t3 moment, piezoelectric stack a7 gradually replys original state, and tool heads 13 gradually leave test specimen 5. T3 moment piezoelectric stack a7 is returned to original state, and tool heads 13 return to initial position, and first micro-structure completes the process;
E) t3 to the t4 moment applies zig-zag driving voltage to the piezoelectric stack b19 of x-axis accurate positioning unit 4, so that Test specimen 5 moves a distance Lx (greater than the size of a upper micro-structure) along x-axis forward direction, arrives the t4 moment, next micro-structure Immediately below location of the core to tool heads 13;
F) t4 to the t5 moment continuously repeats step d), e) until completing the micro structure array on first single line of x-axis Processing;
G) the t5 moment processes the last one micro-structure on first single line of x-axis, stops processing main motion and generates list Member.T5 to the t6 moment applies zig-zag driving to the piezoelectric stack on x-axis accurate positioning unit 4, y-axis accurate positioning unit 3 Voltage, by the amplitude and frequency of voltage suffered by two piezoelectric stacks of control, so that x-axis accurate positioning unit 4 returns to step b) The initial position, 3 relative initial position forward direction moving distance Ly of y-axis accurate positioning unit is (greater than a upper micro-structure Size), the t6 moment is arrived, the center of first micro-structure on test specimen on next strip array line is in the underface of tool heads 13;
H) continuously repeat step d), e), f), g) until process the last one micro-structure, returned to initially to tool heads 13 Position disconnects the driving voltage on all piezoelectric stacks.
The foregoing is merely preferred embodiments of the invention, are not intended to restrict the invention, for the technology of this field For personnel, the invention may be variously modified and varied.All any modification, equivalent substitution, improvement and etc. made for the present invention, It should all be included in the protection scope of the present invention.

Claims (4)

1. a kind of timing control surface micro-structure array processing unit (plant), it is characterised in that: by z-axis adjustment unit (9), the main fortune of processing Movable property gives birth to unit, test specimen accurate positioning unit, base support unit composition;The base support unit is by pedestal a (1) and gantry Column (2) composition, z-axis adjustment unit (9) are mounted on gantry upright post (2), and test specimen accurate positioning unit is mounted on pedestal a (1) On, processing main motion generates unit and is mounted on z-axis adjustment unit (9), and test specimen (5) is bonded to test specimen precision by melt paraffin On the guide rail slide block component a (14) of positioning unit.
2. timing control surface micro-structure array processing unit (plant) according to claim 1, it is characterised in that: the processing Main motion generate unit by wedge block combine a (6), piezoelectric stack a (7), bridge type flexible linkage (8), force snesor (10), Tool heads mounting post (11), pre-loading screw a (12), tool heads (13) composition;Wherein piezoelectric stack a (7) is mounted on bridge type flexible In the square groove of linkage (8), and pre-tightened by wedge block combination a (6);Force snesor (10) is mounted on bridge type flexible On linkage (8), tool heads mounting post (11) is mounted on force snesor (10), and tool heads (13) are mounted on tool heads installation On column (11), and pre-tightened by pre-loading screw a (12).
3. timing control surface micro-structure array processing unit (plant) according to claim 1, it is characterised in that: the test specimen Accurate positioning unit is a kind of novel two degrees of freedom stick-slip inertia-type Piezoelectric Driving precisely locating platform, by x-axis precision positioning Unit (4), y-axis accurate positioning unit (3) composition;X-axis accurate positioning unit (4) and y-axis accurate positioning unit (3) have identical Structure and driving method, be all to amplify the output displacement of piezoelectric stack by lever flexure hinge mechanism and be transmitted to On guide rail slide block component;X-axis accurate positioning unit (4) and y-axis accurate positioning unit (3) are stacked and placed, may be implemented in x-axis With movement non-interfering in y-axis;X-axis accurate positioning unit (4) is by lever flexure hinge mechanism a (20), piezoelectric stack b (19), wedge block combination b (17), guide rail slide block component a (14), pedestal b (15) composition;Wherein lever flexure hinge mechanism a (20) it is mounted on pedestal b (15) by pre-loading screw c (18), piezoelectric stack b (19) is mounted on lever flexure hinge mechanism a (20) it in square groove, and is pre-tightened by wedge block combination b (17);Y-axis accurate positioning unit (3) is by lever flexible hinge Mechanism b (27), piezoelectric stack c (26), wedge block combination c (24), guide rail slide block component b (21), pedestal c (22) composition, wherein Lever flexure hinge mechanism b (27) is mounted on pedestal c (22) by pre-loading screw d (25), and piezoelectric stack c (26) is mounted on In the square groove of lever flexure hinge mechanism b (27), and pre-tightened by wedge block combination c (24);X-axis accurate positioning unit (4) pedestal b (15) is mounted on the guide rail slide block component b (21) of y-axis accurate positioning unit (3) by pre-loading screw b (16), Y-axis accurate positioning unit (3) is mounted on the pedestal of base support unit by mounting hole (23) attachment screw on pedestal c (22) On a (2);The piezoelectric stack inner to x-axis accurate positioning unit (4) and y-axis accurate positioning unit (3) applies driving voltage, leads to Control voltage magnitude and frequency are crossed, the speed that test specimen can be made to set is moved along the track of setting, realizes test specimen in x-axis and y The precision positioning of axis.
4. a kind of timing control surface micro-structure array processing method, which comprises the following steps:
A) test specimen (5) is adhered on the guide rail slide block component a (14) of x-axis accurate positioning unit (4) using melt paraffin, is installed Process keeps test specimen (5) smooth;
B) apply driving voltage to the piezoelectric stack in x-axis accurate positioning unit (4) and y-axis accurate positioning unit (3), pass through Voltage magnitude and frequency are controlled, so that the location of the core of first micro-structure being processed on test specimen (5) is in tool heads (13) Underface, i.e., position at this time is the initial position of x-axis accurate positioning unit (4) and y-axis accurate positioning unit (3), then Stop x-axis accurate positioning unit (4) and y-axis accurate positioning unit (3);
C) adjustment z-axis adjustment unit (9) judges tool heads using the registration of force snesor (10) close to test specimen (5) surface (13) with the contact of test specimen (5), when registration changes, specification tool head (13) has been contacted with test specimen (5), reversed at this time to adjust Whole z-axis adjustment unit (9) makes tool heads (13) leave test specimen (5) surface certain distance (1 μm to 5 μm);
D) the piezoelectric stack a (7) in unit is generated to processing main motion and apply zig-zag driving voltage, start processing first Micro-structure;Because there are a certain distance between tool heads (13) and test specimen (5), therefore t0 to t1 time, processing main motion generate The output of unit mainly compensates this distance, test specimen (5) and tool heads (13) and not in contact with the output letter of force snesor (10) It number is zero;The t1 moment is in contact between test specimen (5) and tool heads (13), and force snesor (10) begins with signal output;T1 is arrived T2 moment, tool heads (13) start to press against test specimen (5) surface, and the output signal of force snesor (10) is gradually increased;T2 moment, pressure The output displacement that electricity stacks a (7) reaches maximum, and tool heads (13) Specimen (5) surface is most deep, while force snesor (10) Output signal reaches maximum;For t2 to the t3 moment, piezoelectric stack a (7) gradually replys original state, and tool heads (13) gradually leave examination Part (5);T3 moment piezoelectric stack a (7) is returned to original state, and tool heads (13) return to initial position, and first micro-structure adds Work is completed;
E) t3 to the t4 moment applies zig-zag driving voltage to the piezoelectric stack b (19) of x-axis accurate positioning unit (4), so that Test specimen (5) moves a distance Lx (greater than the size of a upper micro-structure) along x-axis forward direction, arrives the t4 moment, next micro-structure Location of the core to immediately below tool heads (13);
F) t4 to the t5 moment continuously repeats step d), e) until completing adding for the micro structure array on first single line of x-axis Work;
G) the t5 moment processes the last one micro-structure on first single line of x-axis, stops processing main motion and generates unit; T5 to the t6 moment applies timing sawtooth wave to the piezoelectric stack on x-axis accurate positioning unit (4), y-axis accurate positioning unit (3) Shape driving voltage, and the amplitude and frequency of voltage suffered by two piezoelectric stacks are controlled, so that x-axis accurate positioning unit (4) returns to Initial position described in step b), y-axis accurate positioning unit (3) relative initial position forward direction moving distance Ly (are greater than upper one The size of micro-structure);To the t6 moment, the center of first micro-structure on test specimen on next micro structure array line is in tool The underface of head (13);
H) continuously repeat step d), e), f), g) until process the last one micro-structure, return to initial bit to tool heads (13) It sets, disconnects the driving voltage on all piezoelectric stacks.
CN201910904223.3A 2019-09-24 2019-09-24 Timing control surface micro-structure array processing unit (plant) and method Pending CN110508996A (en)

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