CN210908792U - Time sequence control surface microstructure array processing device - Google Patents
Time sequence control surface microstructure array processing device Download PDFInfo
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- CN210908792U CN210908792U CN201921593206.4U CN201921593206U CN210908792U CN 210908792 U CN210908792 U CN 210908792U CN 201921593206 U CN201921593206 U CN 201921593206U CN 210908792 U CN210908792 U CN 210908792U
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Abstract
The utility model relates to a sequential control surface microstructure array processingequipment, processingequipment include basic support element, z axle adjustment unit, test piece precision positioning unit and processing owner motion production unit. The z-axis adjusting unit and the test piece precision positioning unit are installed on the basic supporting unit, the machining main motion generating unit is installed on the z-axis adjusting unit, and the test piece is adhered to a guide rail sliding block assembly of the test piece precision positioning unit through molten paraffin. By controlling the time sequence of the driving voltage among the piezoelectric stacks of the main motion generating unit, the x-axis precision positioning unit and the y-axis precision positioning unit, the time sequence contact and separation of the machining tool head and the test piece are realized, and thus a controllable surface microstructure array is formed on the surface of the test piece. Has the advantages that: the device utilizes a time sequence control method, the shape, the size and the distance of the processed microstructure can be conveniently controlled, the processing process is simple and efficient, and the device has potential application prospects in the aspects of regulating and controlling functions of material surface optics, tribology, wettability and the like.
Description
Technical Field
The utility model relates to a sequential control surface microstructure array processingequipment can be used to material surface microstructure array processing to characteristics such as optics, tribology, the wettability on regulation and control material surface strengthen its function application in fields such as optics, photoelectron, biomedicine, machinery, micro-fluidic.
Background
The surface microstructure array (such as a micro-pit, a conical array, a micro-groove, a micro-column array and the like) plays an important role in regulating and controlling the characteristics of the surface of the material, such as optics, tribology, wettability and the like, and is widely applied to the fields of aerospace, micro-nano fluidic technology, solar cells, surface enhanced Raman spectroscopy, biomedicine and the like. The attention of scholars has also been paid to how to process specific microstructure arrays on the surfaces of different materials to meet the application in the related field. So far, a number of different processing methods have been proposed by the scholars, and "AIP Advanced" at 2017, volume 7, 035110(High-resolution nanopatterning of biodegradable polymeric by thermal nanoimprinting method) mentioned a nanoimprinting method in which a thermoplastic polymer is spin-coated on a substrate to form a thin film, then a template made by an electro-lithography system is coated thereon and heated continuously until the polymer is softened, then the substrate is pressurized, the temperature and pressure are maintained stable for a while, and then the temperature and pressure are reduced, and the residual layer is removed by post-treatment after demolding, so that the shape opposite to that of the template can be obtained. This method has significant advantages in direct processing of functional materials, however, it requires pre-and post-assist processes to fabricate the template and remove the residual layer, resulting in a complex, less efficient and more costly process. Account of Chemical research, 2016 (defined Chemical Etching for electrochemical Machining with Nanoscale Accuracy) at 2596 and 2604, volume 49, proposes an electrochemical Machining method, which utilizes a limited Etching layer formed on the surface of a tool electrode to approach the surface of a material to achieve Chemical Etching, thereby Machining a microstructure with a specific shape on the surface of the material. This method not only can process the surface microstructure array, but also can polish and planarize the material surface, however, it has the disadvantages of complex and costly process and only works with chemically corrodible materials. Journal of Materials Processing Technology in 2017 at volume 236. page 248 (AFM tip-based mechanical machining of 3D micro and nano-structures view control of the machining project) proposes a method for machining a microstructure using an atomic force microscope, in which a diamond tool head is mounted on a cantilever beam of the atomic force microscope and used as a cutting tool to mechanically etch the surface of a specimen, and a microstructure having a specific shape and depth is obtained by controlling a machining trajectory and a positive pressure when a probe is pressed into the surface of the specimen in combination with an existing precision positioning stage. Although the method can process three-dimensional surface microstructures, the tool head is seriously worn due to the adoption of a scribing mode, and the method is only suitable for processing the microstructures with a shallow depth on the surface of the soft material. In addition, the high processing cost due to the atomic force microscope is required, which limits its wide application. In conclusion, it can be seen that further development of new microstructure array processing apparatuses is of great significance for promoting functional applications of microstructure surfaces.
Disclosure of Invention
An object of the utility model is to provide a sequential control surface microstructure array processingequipment has solved the above-mentioned problem that prior art exists, can realize having potential application prospect in fields such as aerospace, ocean boats and ships, nanotechnology, biomedicine, accurate ultra-precision machining to micro-structure arrays such as little pit, toper precision, high efficiency, low-cost processing.
The above object of the utility model is realized through following technical scheme:
the time sequence control surface microstructure array processing device comprises a z-axis adjusting unit 9, a processing main motion generating unit, a test piece precision positioning unit and a foundation supporting unit. The basic supporting unit consists of a base a1 and a gantry upright post 2, a z-axis adjusting unit 9 is a manual coarse adjustment displacement platform, the z-axis adjusting unit 9 is installed on the gantry upright post 2, a test piece precision positioning unit is installed on the base a1, a processing main motion generating unit is installed on the z-axis adjusting unit 9, and a test piece 5 is bonded on a guide rail sliding block component a14 of the test piece precision positioning unit through molten paraffin.
The main processing motion generating unit comprises a bridge type flexible hinge mechanism 8, a piezoelectric stack a7, a wedge block combination a6, a force sensor 10, a tool head mounting column 11, a pretightening screw a12 and a tool head 13. The force sensor 10 is used for detecting whether the tool head 13 is in contact with the surface of the test piece 5 or not, the piezoelectric stack a7 is installed in a square groove of the bridge-type flexible hinge 8 and is pre-tightened through the wedge block combination a6, and the bridge-type flexible hinge 8 amplifies the output of the piezoelectric stack a7 so as to generate main machining movement.
The test piece precision positioning unit is a novel two-degree-of-freedom stick-slip inertial type piezoelectric driver and comprises an x-axis precision positioning unit 4 and a y-axis precision positioning unit 3. The x-axis precision positioning unit 4 is composed of a lever type flexible hinge mechanism a20, a piezoelectric stack b19, a wedge block combination b17, a guide rail slider assembly a14 and a base b 15. The lever-type flexible hinge mechanism a20 is mounted on a base b15 through a pre-tightening screw c18, and the piezoelectric stack b19 is mounted in a square groove of the lever-type flexible hinge mechanism a20 and is pre-tightened through a wedge block combination b 17. The y-axis precise positioning unit 3 is composed of a lever-type flexible hinge mechanism b27, a piezoelectric stack c26, a wedge block combination c24, a guide rail slider assembly b21 and a base c22, wherein the lever-type flexible hinge mechanism b27 is installed on the base c22 through a pretightening screw d25, and the piezoelectric stack c26 is installed in a square groove of the lever-type flexible hinge mechanism b27 and is pretightened through the wedge block combination c 24. The base b15 of the x-axis precision positioning unit 4 is mounted on the guide rail slide block component b21 of the y-axis precision positioning unit 3 through a pretightening screw b16, the y-axis precision positioning unit 3 is mounted on the base a2 of the basic supporting unit through a mounting hole 23 on the base c22 matched with a screw, and the movement which does not interfere with each other on the x-axis and the y-axis can be realized through the stacked arrangement mode of the x-axis precision positioning unit 4 and the y-axis precision positioning unit 3. The test piece is adhered to the guide rail sliding block assembly a14 of the x-axis precision positioning unit through molten paraffin, and the precision positioning of the test piece on the x-axis and the y-axis can be realized by applying driving voltage to the piezoelectric stacks b19 and c26 on the x-axis precision positioning unit 4 and the y-axis precision positioning unit 3 and controlling the amplitude and frequency of the voltage.
Another object of the present invention is to provide a method for processing a surface microstructure array by sequential control, comprising the following steps:
a) adhering the prepared test piece 5 to a guide rail sliding block component a14 of the x-axis precision positioning unit 4 by using molten paraffin, and keeping the test piece 5 flat as much as possible in the installation process;
b) applying a driving voltage to the piezoelectric stacks in the x-axis precise positioning unit 4 and the y-axis precise positioning unit 3, controlling the amplitude and frequency of the voltage to position the center point of a first microstructure to be processed on the test piece 5 right below the tool head, namely the position at the moment is the initial position of the x-axis precise positioning unit 4 and the y-axis precise positioning unit 3, and then stopping the x-axis precise positioning unit 4 and the y-axis precise positioning unit 3;
c) adjusting the z-axis adjusting unit 9 to be close to the surface of the test piece 5, judging the contact between the tool head 13 and the test piece 5 by using the indication number of the force sensor 10, and if the indication number changes, indicating that the tool head 13 is already in contact with the test piece 5, and then reversely adjusting the z-axis adjusting unit 9 to enable the tool head 13 to be away from the surface of the test piece 5 by a certain distance (1-5 microns);
d) as shown in fig. 6, the voltage sequence is controlled, and a sawtooth waveform driving voltage is first applied to the piezoelectric stack a7 in the processing main motion generating unit to start processing the first microstructure. Since there is a certain distance between the tool head 13 and the test piece 5, the output of the main motion generating unit is processed to compensate for this distance, mainly from time 0 to t1, the test piece 5 and the tool head 13 are not in contact, and the output signal of the force sensor 10 is zero. At time t1, contact occurs between the test piece 5 and the tool bit 13, and the force sensor 10 starts outputting a signal. From time t1 to time t2, the tool tip 13 starts to be pressed into the surface of the test piece 5, and the output signal of the force sensor 10 gradually increases. At time t2, the output displacement of the piezo stack a7 is maximized, the tool tip 13 is pressed into the surface of the test piece 5 to the greatest depth, and the output signal of the force sensor 10 is maximized. From time t2 to time t3, the piezoelectric stack a7 gradually returns to the initial state, and the tool tip 13 gradually moves away from the test piece 5. At time t3, the piezoelectric stack a7 returns to the initial state, the tool head 13 returns to the initial position, and the first microstructure is machined;
e) at the time t3 to t4, a sawtooth waveform driving voltage is applied to the piezoelectric stack b19 of the x-axis precision positioning unit 4, so that the test piece 5 moves a distance Lx (larger than the size of the previous microstructure) in the positive direction of the x-axis, and at the time t4, the center point of the next microstructure is positioned right below the tool head 13;
f) continuously repeating the steps d) and e) from t4 to t5 until the processing of the microstructure array on the first single line along the x axis is completed;
g) at time t5, the last microstructure on the first single line along the x-axis is processed, and the processing of the main motion generating unit is stopped. At the time t5 to t6, applying sawtooth waveform driving voltage to the piezoelectric stacks on the x-axis precision positioning unit 4 and the y-axis precision positioning unit 3, controlling the amplitude and frequency of the voltage applied to the two piezoelectric stacks to enable the x-axis precision positioning unit 4 to return to the initial position in the step b), enabling the y-axis precision positioning unit 3 to move forward by a distance Ly (larger than the size of the previous microstructure) relative to the initial position, and enabling the center of the first microstructure on the upper array line and the lower array line of the test piece to be located right below the tool head 13 at the time t 6;
h) and continuously repeating the steps d), e), f) and g) until the last microstructure is processed, and disconnecting the driving voltage on all the piezoelectric stacks after the tool head 13 returns to the initial position.
The beneficial effects of the utility model reside in that: through the utility model provides a sequential control surface microstructure array processingequipment can realize the test piece in the accurate positioning of x, y axle, can realize the accurate of little pit array, little conical array, high efficiency, low-cost processing at the diamond instrument head of the different most advanced shape of z axle configuration. The distance between the microstructures can be conveniently changed by controlling the driving voltage and frequency of the piezoelectric stack b19 and the piezoelectric stack c26 in the x-axis precision positioning unit 4 and the y-axis precision positioning unit 3; the depth of the microstructure can be changed by changing the control voltage and frequency of the piezoelectric stack a7 in the machining main motion generation unit; by controlling the timing of the driving voltages on the three stacks, microstructure arrays with different shapes and depths can be obtained to meet the application requirements of different fields.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate example embodiments of the invention and together with the description serve to explain the invention without limitation.
Fig. 1 is a schematic view of the overall structure of the sequential control surface microstructure array processing apparatus of the present invention;
FIG. 2 is a schematic view of the structure of the test piece precision positioning unit of the present invention;
FIG. 3 is a schematic structural view of the y-axis precision positioning unit of the present invention;
FIG. 4 is a schematic structural view of the main motion generating unit of the present invention;
FIG. 5 is a schematic diagram of the sequential control surface microstructure array processing device of the present invention for realizing an array microstructure of an indentation on a surface of a processing material;
fig. 6 is a timing control diagram of driving voltages of the piezoelectric stack a7, the piezoelectric stack b19, and the piezoelectric stack c26 according to the present invention;
in the figure: 1. a base a; 2. a gantry column; 3. a y-axis precision positioning unit; 4. an x-axis precision positioning unit; 5. a test piece; 6. a wedge block combination a; 7. a piezoelectric stack a; 8. a bridge-type flexible hinge mechanism; 9. a z-axis adjusting unit; 10. a force sensor; 11. a tool head mounting post; 12. pre-tightening the screw a; 13. a tool head; 14. a guide rail sliding block component a; 15. a base b; 16. pre-tightening a screw b; 17. a wedge block combination b; 18. pre-tightening a screw c; 19. a piezoelectric stack b; 20. a lever-type flexible hinge mechanism a; 21. a guide rail slider assembly b; 22. a base c; 23. mounting holes; 24. a wedge block combination c; 25; pre-tightening the screw d; 26. a piezoelectric stack c; 27. a lever-type flexible hinge mechanism b.
Detailed Description
The details of the present invention and its embodiments are further described below with reference to the accompanying drawings.
Referring to fig. 1 to 4, the device for processing a surface microstructure array by sequential control of the present invention comprises a z-axis adjusting unit 9, a main motion processing unit, a test piece precision positioning unit, and a basic supporting unit. The basic supporting unit comprises a base a1 and a gantry upright post 2, and the base a1 and the gantry upright post 2 are both made of 45-steel materials, so that the overall rigidity is ensured. The z-axis adjusting unit 9 is installed on the gantry upright post 2, the test piece precision positioning unit is installed on the base a1, the machining main motion generating unit is installed on the z-axis adjusting unit 9, and the test piece 5 is bonded to the guide rail slide block assembly a14 of the test piece precision positioning unit through molten paraffin.
The test piece precision positioning unit is a novel two-degree-of-freedom stick-slip inertial type piezoelectric actuator and comprises an x-axis precision positioning unit 4 and a y-axis precision positioning unit 3, the x-axis precision positioning unit and the y-axis precision positioning unit have the same structure and driving mode, and the structure is characterized in that the output displacement of a piezoelectric stack is amplified through a lever type flexible hinge mechanism and is transmitted to a guide rail sliding block component. The x-axis precise positioning unit 4 and the y-axis precise positioning unit 3 are placed in a stacked mode, and movement which does not interfere with each other on the x-axis and the y-axis can be achieved. The x-axis precision positioning unit 4 is composed of a lever type flexible hinge mechanism a20, a piezoelectric stack b19, a wedge block combination b17, a guide rail slider assembly a14 and a base b 15. The lever-type flexible hinge mechanism a20 is mounted on a base b15 through a pre-tightening screw c18, and the piezoelectric stack b19 is mounted in a square groove of the lever-type flexible hinge mechanism a20 and is pre-tightened through a wedge block combination b 17. The y-axis precise positioning unit is composed of a lever-type flexible hinge mechanism b27, a piezoelectric stack c26, a wedge block combination c24, a guide rail slider assembly b21 and a base c22, wherein the lever-type flexible hinge mechanism b27 is installed on the base c22 through a pre-tightening screw d25, and the piezoelectric stack c26 is installed in a square groove of the lever-type flexible hinge mechanism b27 and is pre-tightened through the wedge block combination c 24. The bottom plate b15 of the x-axis precision positioning unit 4 is mounted on the guide rail slide block assembly b21 of the y-axis precision positioning unit 3 through a pretension screw b16, and the y-axis precision positioning unit 3 is mounted on the base a2 of the basic supporting unit through a mounting hole 23 on the bottom plate c22 and a matching screw. The test piece was adhered to the guide rail slider assembly a14 of the x-axis precision positioning unit by molten paraffin. The driving voltage is applied to the piezoelectric stacks b19 and c26 on the x-axis precise positioning unit 4 and the y-axis precise positioning unit 3, and the voltage amplitude and frequency are controlled, so that the precise positioning of the test piece on the x-axis and the y-axis can be realized, and the test piece can move according to a preset track.
The main processing motion generating unit comprises a bridge type flexible hinge mechanism 8, a piezoelectric stack a7, a wedge block combination a6, a force sensor 10, a tool head mounting column 11, a pretightening screw a12 and a tool head 13. Wherein the force sensor 10 is mounted on the bridge-type flexible hinge mechanism 8. The tool head mounting post 11 is mounted on the force sensor 10. The tool bit 13 is mounted on the tool bit mounting post 11 and is pre-tightened by a pre-tightening screw a 12. The piezoelectric stack a7 is mounted in the square groove of the bridge-type flexible hinge mechanism 8 and pre-tensioned by the wedge-shaped block combination a 6. After the piezoelectric stack a7 is electrified, the piezoelectric stack a7 extends under the action of the inverse piezoelectric effect to output corresponding displacement, and the bridge-type flexible hinge mechanism 8 amplifies the output of the piezoelectric stack a7 to generate the processing main motion of the z axis.
Referring to fig. 5 and 6, the method for processing a time-sequence controlled surface microstructure array of the present invention comprises the following steps:
a) adhering the prepared test piece 5 to a guide rail sliding block component a14 of the x-axis precision positioning unit 4 by using molten paraffin, and keeping the test piece 5 flat as much as possible in the installation process;
b) applying a driving voltage to the piezoelectric stacks in the x-axis precise positioning unit 4 and the y-axis precise positioning unit 3, controlling the amplitude and frequency of the voltage to position the center point of the first microstructure to be processed on the test piece 5 right below the tool head 13, namely the position at this time is the initial position of the x-axis precise positioning unit 4 and the y-axis precise positioning unit 3, and then stopping the x-axis precise positioning unit 4 and the y-axis precise positioning unit 3;
c) adjusting the z-axis adjusting unit 9 to be close to the surface of the test piece 5, judging the contact between the tool head 13 and the test piece 5 by using the indication number of the force sensor 10, and if the indication number changes, indicating that the tool head 13 is already in contact with the test piece 5, and then reversely adjusting the z-axis adjusting unit 9 to enable the tool head 13 to be away from the surface of the test piece 5 by a certain distance (1-5 microns);
d) as shown in fig. 6, the voltage sequence is controlled, and a sawtooth waveform driving voltage is first applied to the piezoelectric stack a7 in the processing main motion generating unit to start processing the first microstructure. Since there is a certain distance between the tool head 13 and the test piece 5, the output of the main motion generating unit is processed to compensate for this distance, mainly from time 0 to t1, the test piece 5 and the tool head 13 are not in contact, and the output signal of the force sensor 10 is zero. At time t1, contact occurs between the test piece 5 and the tool bit 13, and the force sensor 10 starts outputting a signal. From time t1 to time t2, the tool tip 13 starts to be pressed into the surface of the test piece 5, and the output signal of the force sensor 10 gradually increases. At time t2, the output displacement of the piezo stack a7 is maximized, the tool tip 13 is pressed into the surface of the test piece 5 to the greatest depth, and the output signal of the force sensor 10 is maximized. From time t2 to time t3, the piezoelectric stack a7 gradually returns to the initial state, and the tool tip 13 gradually moves away from the test piece 5. At time t3, the piezoelectric stack a7 returns to the initial state, the tool head 13 returns to the initial position, and the first microstructure is machined;
e) at the time t3 to t4, a sawtooth waveform driving voltage is applied to the piezoelectric stack b19 of the x-axis precision positioning unit 4, so that the test piece 5 moves a distance Lx (larger than the size of the previous microstructure) in the positive direction of the x-axis, and at the time t4, the center point of the next microstructure is positioned right below the tool head 13;
f) continuously repeating the steps d) and e) from t4 to t5 until the processing of the microstructure array on the first single line along the x axis is completed;
g) at time t5, the last microstructure on the first single line along the x-axis is processed, and the processing of the main motion generating unit is stopped. At the time t5 to t6, applying sawtooth waveform driving voltage to the piezoelectric stacks on the x-axis precision positioning unit 4 and the y-axis precision positioning unit 3, controlling the amplitude and frequency of the voltage applied to the two piezoelectric stacks to enable the x-axis precision positioning unit 4 to return to the initial position in the step b), enabling the y-axis precision positioning unit 3 to move forward by a distance Ly (larger than the size of the previous microstructure) relative to the initial position, and enabling the center of the first microstructure on the upper array line and the lower array line of the test piece to be located right below the tool head 13 at the time t 6;
h) and continuously repeating the steps d), e), f) and g) until the last microstructure is processed, and disconnecting the driving voltage on all the piezoelectric stacks after the tool head 13 returns to the initial position.
The above description is only a preferred example of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made to the present invention should be included in the protection scope of the present invention.
Claims (3)
1. A time sequence control surface microstructure array processing device is characterized in that: the device consists of a z-axis adjusting unit (9), a processing main motion generating unit, a test piece precision positioning unit and a foundation supporting unit; the basic supporting unit consists of a base a (1) and a gantry upright post (2), a z-axis adjusting unit (9) is installed on the gantry upright post (2), a test piece precision positioning unit is installed on the base a (1), a machining main motion generating unit is installed on the z-axis adjusting unit (9), and a test piece (5) is bonded to a guide rail sliding block assembly a (14) of the test piece precision positioning unit through molten paraffin.
2. The apparatus of claim 1, wherein: the main processing motion generating unit consists of a wedge block combination a (6), a piezoelectric stack a (7), a bridge type flexible hinge mechanism (8), a force sensor (10), a tool head mounting column (11), a pre-tightening screw a (12) and a tool head (13); the piezoelectric stack a (7) is arranged in a square groove of a bridge type flexible hinge mechanism (8) and is pre-tightened through a wedge block combination a (6); the force sensor (10) is arranged on the bridge type flexible hinge mechanism (8), the tool head mounting column (11) is arranged on the force sensor (10), and the tool head (13) is arranged on the tool head mounting column (11) and is pre-tightened through a pre-tightening screw a (12).
3. The apparatus of claim 1, wherein: the test piece precision positioning unit is a novel two-degree-of-freedom stick-slip inertial type piezoelectric driving precision positioning platform and consists of an x-axis precision positioning unit (4) and a y-axis precision positioning unit (3); the x-axis precise positioning unit (4) and the y-axis precise positioning unit (3) have the same structure and driving mode, and amplify the output displacement of the piezoelectric stack and transmit the amplified output displacement to the guide rail sliding block component through a lever-type flexible hinge mechanism; the x-axis precise positioning unit (4) and the y-axis precise positioning unit (3) are stacked, so that the movement which does not interfere with each other on the x-axis and the y-axis can be realized; the x-axis precise positioning unit (4) consists of a lever type flexible hinge mechanism a (20), a piezoelectric stack b (19), a wedge block combination b (17), a guide rail sliding block component a (14) and a base b (15); the lever-type flexible hinge mechanism a (20) is installed on a base b (15) through a pre-tightening screw c (18), and a piezoelectric stack b (19) is installed in a square groove of the lever-type flexible hinge mechanism a (20) and pre-tightened through a wedge block combination b (17); the y-axis precise positioning unit (3) is composed of a lever-type flexible hinge mechanism b (27), a piezoelectric stack c (26), a wedge block combination c (24), a guide rail sliding block component b (21) and a base c (22), wherein the lever-type flexible hinge mechanism b (27) is installed on the base c (22) through a pre-tightening screw d (25), and the piezoelectric stack c (26) is installed in a square groove of the lever-type flexible hinge mechanism b (27) and is pre-tightened through the wedge block combination c (24); a base b (15) of the x-axis precise positioning unit (4) is installed on a guide rail sliding block component b (21) of the y-axis precise positioning unit (3) through a pretightening screw b (16), and the y-axis precise positioning unit (3) is installed on a base a (1) of the basic supporting unit through a mounting hole (23) on a base c (22) in a matched manner through a screw; and driving voltage is applied to the piezoelectric stacks in the x-axis precise positioning unit (4) and the y-axis precise positioning unit (3), and the test piece can move along a set track at a set speed by controlling the amplitude and the frequency of the voltage, so that the precise positioning of the test piece on the x axis and the y axis is realized.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110508996A (en) * | 2019-09-24 | 2019-11-29 | 吉林大学 | Timing control surface micro-structure array processing unit (plant) and method |
| CN113114067A (en) * | 2021-05-08 | 2021-07-13 | 吉林大学 | Piezoelectric stick-slip type driving device capable of measuring distance in large stroke and distance measuring method |
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2019
- 2019-09-24 CN CN201921593206.4U patent/CN210908792U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110508996A (en) * | 2019-09-24 | 2019-11-29 | 吉林大学 | Timing control surface micro-structure array processing unit (plant) and method |
| CN113114067A (en) * | 2021-05-08 | 2021-07-13 | 吉林大学 | Piezoelectric stick-slip type driving device capable of measuring distance in large stroke and distance measuring method |
| CN113114067B (en) * | 2021-05-08 | 2022-05-10 | 吉林大学 | Distance measurement method of piezoelectric stick-slip type driving device capable of measuring distance in large stroke |
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