CN110459537A - Display device - Google Patents
Display device Download PDFInfo
- Publication number
- CN110459537A CN110459537A CN201910389008.4A CN201910389008A CN110459537A CN 110459537 A CN110459537 A CN 110459537A CN 201910389008 A CN201910389008 A CN 201910389008A CN 110459537 A CN110459537 A CN 110459537A
- Authority
- CN
- China
- Prior art keywords
- led wafer
- electrode
- display device
- pixel unit
- color
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 235000012431 wafers Nutrition 0.000 claims description 160
- 239000011521 glass Substances 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 17
- 230000000694 effects Effects 0.000 description 15
- 238000000034 method Methods 0.000 description 9
- 238000012545 processing Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 238000005286 illumination Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 3
- 229910002601 GaN Inorganic materials 0.000 description 3
- 229910005540 GaP Inorganic materials 0.000 description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000004568 cement Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- -1 at this point Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The disclosure provides a kind of display device, including LED wafer array, including N1 row N2 column LED wafer, and according to the first color, the second color, third color, sequentially equidistant cycle arrangement, the cathode and anode of LED wafer are located at upper and lower surfaces to every row LED wafer；Show screen, the N1 first electrode including the setting of parallel equidistant in a first direction, each first electrode is electrically connected the upper surface of a line LED wafer；Substrate, the N2 second electrode including the setting of parallel equidistant in a second direction, each second electrode are electrically connected the lower surface of a column LED wafer；Control module, it is electrically connected N1 first electrode and N2 second electrode, for lighting simultaneously to first electrode and second electrode output electric signal using the part LED wafer in two row LED wafer of a secondary control as multiple pixel units, each pixel unit includes three arrangements triangular in shape and the LED wafer that color is all different.The display device that the embodiment of the present disclosure provides can reduce cost, improve manufacture reliability.
Description
Technical field
This disclosure relates to which field of display technology, includes more pixels and energy in unit area in particular to one kind
Overcome the display device of small size, the puzzlement of small spacing LED processing procedure.
Background technique
With the development of display technology, improving resolution ratio becomes the important topic studied in field.Reduce LED wafer body
Product reduces LED wafer spacing to increase the LED wafer quantity in unit area as the conventional hand for improving display device resolution ratio
Section.
Industry makes microminiature LED using the transfer of flip-chip (Flip Chip) cooperation flood tide at present, in this technology
In, when wafer size is less than 30 μm, the pad size of the bottom Flip Chip will less than 10 μm, in technique using being not easy, and
It is easy to happen that die bond is not easy, die pads closely cause to climb the problem of tin short circuit excessively.It is difficult in prior art basis as a result, into one
Step increases the LED wafer quantity in unit area, and then makes the resolution limitations of display device.
It should be noted that information is only used for reinforcing the reason to the background of the disclosure disclosed in above-mentioned background technology part
Solution, therefore may include the information not constituted to the prior art known to persons of ordinary skill in the art.
Summary of the invention
The disclosure is designed to provide a kind of display device, for being overcome at least to a certain extent due to the relevant technologies
Limitation and defect caused by pixel quantity is limited, reduces LED size and spacing is easy to cause system in certain display area
The problem of connecting weldering in journey.
According to one aspect of the disclosure, a kind of display device is provided, comprising:
LED wafer array, including N1 row N2 column LED wafer, LED wafer described in every row is according to the first color, the second color, third
Sequentially equidistant cycle arrangement, the cathode and anode of the LED wafer are located at upper and lower surfaces to color；
Show screen, the N1 first electrode including the setting of parallel equidistant in a first direction, each first electrode
It is electrically connected the upper surface of LED wafer described in a line；
Substrate, the N2 second electrode including the setting of parallel equidistant in a second direction, each second electrode are electrically connected
Connect the lower surface of the column LED wafer；
Control module, N1 first electrodes of electrical connection and the N2 second electrodes, are used for the first electrode
With second electrode output electric signal using the part LED wafer in LED wafer described in two row of a secondary control as multiple pixels
Unit is lighted simultaneously, and each pixel unit includes three arrangements triangular in shape and the LED wafer that color is all different.
In a kind of exemplary embodiment of the disclosure, each pixel unit includes three for adhering to two rows three column separately
LED wafer, including two uplink LED wafers and a downlink LED wafer, or including under a uplink LED wafer and two
Row LED wafer, in same pixel unit two with including a LED wafer not being lit between a line LED wafer.
In a kind of exemplary embodiment of the disclosure, between pixel unit described in every two between be separated with and be not lit
LED wafer, the interval include prolonging the first direction interval and prolonging the second direction interval.
In a kind of exemplary embodiment of the disclosure, the control module setting are as follows: determined according to display control signal
The quantity of the LED wafer not being lit at two pixel unit intervals.
In a kind of exemplary embodiment of the disclosure, the LED wafer not being lit at two pixel unit intervals
For a row or column.
In a kind of exemplary embodiment of the disclosure, the LED wafer in the pixel unit is belonging respectively to line n and
N+2 row, alternatively, the LED wafer in the pixel unit is belonging respectively to line n and the (n+1)th row, wherein [1, N1] n ∈.
In a kind of exemplary embodiment of the disclosure, the control module setting are as follows: determined according to display control signal
The scanning times and scan frequency of LED wafer described in every row.
In a kind of exemplary embodiment of the disclosure, the first electrode and/or the second electrode are ITO conduction glass
Glass.
In a kind of exemplary embodiment of the disclosure, the substrate is transparent substrate.
In a kind of exemplary embodiment of the disclosure, first color, second color, the third color are respectively red
Color, green, blue.
According to one aspect of the disclosure, a kind of display device is provided, comprising:
LED wafer array, including N1 row N2 column LED wafer, wherein the LED wafer is provided only on the friendship of odd-numbered line odd column
Position or the LED wafer that the position of fork and even number line even column intersect are provided only on the position of odd-numbered line even column intersection
The position intersected with even number line odd column is set, the color and the color of adjacent LED chip of each LED wafer are different, institute
The anode and cathode for stating LED wafer is located at upper and lower surfaces；
Show screen, the N1 first electrode including the setting of parallel equidistant in a first direction, each first electrode
It is electrically connected the upper surface of LED wafer described in a line；
Substrate, the N2 second electrode including the setting of parallel equidistant in a second direction, each second electrode are electrically connected
Connect the lower surface of the column LED wafer.
In a kind of exemplary embodiment of the disclosure, further includes:
Control module, N1 first electrodes of electrical connection and the N2 second electrodes, are used for the first electrode
With second electrode output electric signal using the part LED wafer in LED wafer described in two row of a secondary control as multiple pixels
Unit is lighted simultaneously, and each pixel unit includes three arrangements triangular in shape and the LED wafer that color is all different.
In a kind of exemplary embodiment of the disclosure, between pixel unit described in every two between be separated with and be not lit
LED wafer, the interval include being spaced and being spaced in said first direction in this second direction.
In a kind of exemplary embodiment of the disclosure, the control module setting are as follows: determined according to display control signal
The number for the LED wafer not being lit being spaced between pixel described in every two.
In a kind of exemplary embodiment of the disclosure, the LED wafer not being lit at two pixel unit intervals
For one or two.
In a kind of exemplary embodiment of the disclosure, the control module setting are as follows: determined according to display control signal
The scanning times and scan frequency of LED wafer described in every row.
In a kind of exemplary embodiment of the disclosure, the first electrode and/or the second electrode are ITO conduction glass
Glass.
In a kind of exemplary embodiment of the disclosure, the substrate is transparent substrate.
In a kind of exemplary embodiment of the disclosure, the line space of the LED wafer array is more than or equal to column pitch.
In a kind of exemplary embodiment of the disclosure, the LED wafer includes red, blue, the LED wafer of green.
In a kind of exemplary embodiment of the disclosure, the display screen includes glass screen, plastic cement screen, sapphire
Screen or flexible screen.
In a kind of exemplary embodiment of the disclosure, substrate is opaque substrate, including printed circuit board, ceramic base
Plate, semiconductor substrate, plastic substrate or flexible base board.
In a kind of exemplary embodiment of the disclosure, the manufacture material of the LED wafer include nitride, gallium nitride,
GaAs, gallium phosphide or silicon.
The display device that the embodiment of the present disclosure provides constitutes one by using three LED wafers for being located at two rows three column
Pixel unit can realize more pixels using same amount of LED wafer in identical unit area；In addition, passing through
In the upper and lower surfaces of each LED wafer, common electrode is set, it can be to avoid LED wafer size in processing procedure and spacing is too small leads
The company of cause welds, and provides technical guarantee to further reduce size and the spacing of LED wafer.Therefore, the embodiment of the present disclosure provides
Smaller size of chip, smaller chip spacing can be set in technical solution, and more pictures are realized in identical unit area
Element substantially increases resolution ratio, reduces costs as far as possible, improves manufacturing reliability.
It should be understood that above general description and following detailed description be only it is exemplary and explanatory, not
The disclosure can be limited.
Detailed description of the invention
The drawings herein are incorporated into the specification and forms part of this specification, and shows the implementation for meeting the disclosure
Example, and together with specification for explaining the principles of this disclosure.It should be evident that the accompanying drawings in the following description is only the disclosure
Some embodiments for those of ordinary skill in the art without creative efforts, can also basis
These attached drawings obtain other attached drawings.
Figure 1A and Figure 1B schematically shows the structural schematic diagram of display device 100 in disclosure exemplary embodiment.
Fig. 2 is the floor map of the electrical connection of display device 100 in the embodiment of the present disclosure.
Fig. 3 A~Fig. 3 D is the composition schematic diagram of the pixel unit of display device 100 in disclosure exemplary embodiment.
Fig. 4 A and Fig. 4 B are the effect diagrams of pixel unit shown in Fig. 3 A~Fig. 3 D.
Fig. 5 is the composition schematic diagram of another pixel unit in the embodiment of the present disclosure.
Fig. 6 is the schematic diagram being spaced between pixel unit in an embodiment of the present disclosure.
Fig. 7 A and Fig. 7 B are the structural schematic diagrams for another display device 700 that the disclosure provides.
Fig. 8 is the floor map of the electrical connection of display device 700 in the embodiment of the present disclosure.
Fig. 9 is the effect diagram of 700 intermediate cam shape pixel unit of display device in the embodiment of the present disclosure.
Figure 10 A and Figure 10 B are the schematic diagrames of the pixel unit arrangement of display device 700 in the embodiment of the present disclosure.
Specific embodiment
Example embodiment is described more fully with reference to the drawings.However, example embodiment can be with a variety of shapes
Formula is implemented, and is not understood as limited to example set forth herein；On the contrary, thesing embodiments are provided so that the disclosure will more
Fully and completely, and by the design of example embodiment comprehensively it is communicated to those skilled in the art.Described feature, knot
Structure or characteristic can be incorporated in any suitable manner in one or more embodiments.In the following description, it provides perhaps
More details fully understand embodiment of the present disclosure to provide.It will be appreciated, however, by one skilled in the art that can
It is omitted with technical solution of the disclosure one or more in the specific detail, or others side can be used
Method, constituent element, device, step etc..In other cases, be not shown in detail or describe known solution to avoid a presumptuous guest usurps the role of the host and
So that all aspects of this disclosure thicken.
In addition, attached drawing is only the schematic illustrations of the disclosure, identical appended drawing reference indicates same or similar portion in figure
Point, thus repetition thereof will be omitted.Some block diagrams shown in the drawings are functional entitys, not necessarily necessary and object
The entity managed or be logically independent is corresponding.These functional entitys can be realized using software form, or in one or more
These functional entitys are realized in hardware module or integrated circuit, or in heterogeneous networks and/or processor device and/or microcontroller
These functional entitys are realized in device.
Disclosure example embodiment is described in detail with reference to the accompanying drawing.
Figure 1A and Figure 1B schematically shows the structural schematic diagram of display device in disclosure exemplary embodiment.
With reference to Figure 1A and Figure 1B, display device 100 may include:
LED wafer array 11, including N1 row N2 column LED wafer 111, every row LED wafer is according to the first color, the second color,
Sequentially equidistant cycle arrangement, the cathode and anode of LED wafer are located at upper and lower surfaces to three colors；
Show screen 12, the N1 first electrode 121 including the setting of parallel equidistant in a first direction, each first electrode
It is electrically connected the upper surface of a line LED wafer；
Substrate 13, the N2 second electrode 131 including the setting of parallel equidistant in a second direction, each second electrode are electrically connected
Connect the lower surface of a column LED wafer；
Control module 14 is electrically connected N1 first electrode 121 and N2 second electrode 131, is used for 121 He of first electrode
Second electrode 131 export electric signal using the part LED wafer in two row LED wafer of a secondary control as multiple pixel units simultaneously
It lights, each pixel unit includes three arrangements triangular in shape and the LED wafer that color is all different.
Wherein, display screen 12 for example can be glass screen, plastic cement screen, sapphire screen or flexible screen；LED is brilliant
The manufacture material of piece includes nitride, gallium nitride, GaAs, gallium phosphide or silicon.
In some embodiments, first electrode 121 and second electrode 131 are ITO electro-conductive glass, at this point, substrate 13 can
Think transparent substrate.In further embodiments, first electrode 121 can be ITO electro-conductive glass, and second electrode 131 can be
Copper or other conductive materials, substrate 13 can be opaque substrate, including printed circuit board, ceramic substrate, semiconductor at this time
Substrate, plastic substrate or flexible base board etc..The embodiment of the present disclosure not with show screen, substrate, LED wafer material be limited.
Fig. 2 is the floor map of 100 electrical connection of display device in the embodiment of the present disclosure.
With reference to Fig. 2, in one embodiment, the first color, the second color, third color are respectively red, green, blue.First
Electrode 121 is connected to control module 14 as the common electrode of connection LED wafer cathode or anode, accordingly, second electrode 131
Common electrode as connection LED wafer anode or cathode is connected to control module 14.In the embodiments of the present disclosure, LED wafer
Upper surface both can for anode may be cathode, accordingly, LED wafer lower surface both can for cathode may be sun
Pole.The disclosure to the polarity of LED wafer upper and lower surface with no restriction.
Since first electrode 121 and second electrode 131 are separately connected the upper and lower surface of LED wafer, can overcome due to crystalline substance
Chip size is too small or the too small bring of spacing connects tin short circuit problem, can be substantially reduced the limit to wafer size or chip spacing
System has greatly expanded a possibility that increasing resolution ratio.
Fig. 3 A~Fig. 3 D is the composition schematic diagram of pixel unit in disclosure exemplary embodiment.
With reference to Fig. 3 A~Fig. 3 D, in a kind of exemplary embodiment of the disclosure, each pixel unit includes adhering to two rows separately
The LED wafer of three different colours of three column, or include two uplink LED wafers and downlink LED wafer (such as Fig. 3 A with
Fig. 3 C), or including a uplink LED wafer and two downlink LED wafers (such as Fig. 3 B and Fig. 3 D), two in same pixel unit
It include a LED wafer not being lit between a same a line LED wafer.
In Fig. 3 A~Fig. 3 D illustrated embodiment, three LED wafers in pixel unit are located at the line n in array
With the (n+1)th row, n ∈ [1, N1].At this time in order to make pixel unit obtain good illumination effect, LED wafer array can be set
Line space be greater than column pitch, thus make triangular pixel unit have three more balanced sides.
There is Fig. 3 A~Fig. 3 D illustrated embodiment to can be seen that using same amount of nine LED wafers, in the related art
Three pixel units can only be constituted, can but constitute four pixel lists with different centers in the embodiments of the present disclosure
The quantity and density of pixel unit can be significantly greatly increased in member, this effect after amplifying by quantity.
Fig. 4 A and Fig. 4 B are the effect diagrams of pixel unit shown in Fig. 3 A~Fig. 3 D.
With reference to Fig. 4 A, in the case where being provided with 6*4 totally 24 LED wafers, it is only able to achieve 2*4 totally 8 in the prior art
A pixel unit.
And in figure 4b, tetra- pixel units of A1~A4 laterally may be implemented, each unit there can be upper triangle under
Two kinds of implementations of triangle；Tri- row pixel unit of A1~C1 may be implemented in longitudinal direction, and 4*3=12 pixel list may be implemented in one kind
Member, and each pixel unit, there are two types of implementation, 12*2=24 kind pixel unit may be implemented in one kind, to increase resolution ratio
Provide advantageous condition.Since common electrode is connected to the upper and lower surface of LED wafer, the company's of effectively preventing tin short circuit is asked
Topic can cooperate the pixel unit side of being formed as shown in Figure 4 B to be arranged in unit area compared with the more LED wafers of the prior art
Formula can be arranged by more highdensity LED wafer and realize more pixel units, greatly increase the resolution ratio of display device.
Fig. 5 is the composition schematic diagram of another pixel unit in the embodiment of the present disclosure.
In the embodiment shown in fig. 5, three LED wafers in pixel unit 12 are located at the line n and n-th in array
+ 2 rows, n ∈ [1, N1].At this time in order to make pixel unit obtain good illumination effect, LED wafer array can be set in the ranks
Away from column pitch is equal to, to make triangular pixel unit that there are three more balanced sides.
Similarly, pixel unit constituted mode shown in fig. 5 also can be realized more dense pixel distribution, mating connection LED
The common electrode of chip upper and lower surface greatly increases the resolution ratio of display device.
In some embodiments, in order to realize better illumination effect, can between every two pixel unit between be separated with
The LED wafer not being lit, interval include prolonging first direction interval and prolonging second direction interval.
Fig. 6 is the schematic diagram being spaced between pixel unit in an embodiment of the present disclosure.
With reference to Fig. 6, in a first direction on (i.e. line direction), a column LED wafer, In can be spaced between two pixel units
Second direction (i.e. on column direction) can be spaced a line LED wafer between two pixel units, to obtain the effect that preferably shines
Fruit.In addition it is also possible to which the adjustment being spaced between pixel unit is realized in the setting by line space and column pitch.
Due to the intensive setting of LED wafer, control module 14 can determine two pixel units according to display control signal
The quantity of the LED wafer not being lit at interval adjusts the interval between pixel unit, realizes finer and smoother show by short interval
Show effect or the more display effects of type are realized by long interval.In addition, in a kind of exemplary embodiment of the disclosure, control
Molding block can also determine the scanning times and scan frequency of every row LED wafer according to display control signal, more aobvious to realize
Show effect.
In conclusion being total to by setting connection LED wafer upper and lower surface of display device 100 that the embodiment of the present disclosure provides
Connect tin short circuit when can be avoided and be welded caused by LED wafer is undersized or spacing is too small with electrode, to allow in unit plane
Smaller, the smaller LED wafer of setting spacing, that is, increase the distribution density of LED wafer in product；In addition, passing through setting triangle
Shape pixel unit can realize the distribution of more pixel units on the basis of same amount of LED wafer quantity, provide more pictures
The spacing of plain unit, position setting, can further increase the resolution ratio of display device.
Fig. 7 A and Fig. 7 B are the structural schematic diagrams for another display device 700 that the disclosure provides.
With reference to Fig. 7 A and Fig. 7 B, display device 700 may include:
LED wafer array 71, including N1 row N2 column LED wafer 711, wherein LED wafer is provided only on odd-numbered line odd column
Position or LED wafer that the position of intersection and even number line even column intersect are provided only on the position of odd-numbered line even column intersection
The position intersected with even number line odd column, the color and the color of adjacent LED chip of each LED wafer are different, LED wafer
Anode and cathode is located at upper and lower surfaces；
Show screen 72, the N1 first electrode including the setting of parallel equidistant in a first direction, each first electrode electricity
Connect the upper surface of a line LED wafer；
Substrate 73, the N2 second electrode including the setting of parallel equidistant in a second direction, each second electrode electrical connection
The lower surface of one column LED wafer.
Wherein, display screen 72 for example can be glass screen, plastic cement screen, sapphire screen or flexible screen；LED is brilliant
The manufacture material of piece 711 includes nitride, gallium nitride, GaAs, gallium phosphide or silicon.
In some embodiments, first electrode 721 and second electrode 731 are ITO electro-conductive glass, at this point, substrate 73 can
Think transparent substrate.In further embodiments, first electrode 721 can be ITO electro-conductive glass, and second electrode 731 can be
Copper or other conductive materials, substrate 73 can be opaque substrate, including printed circuit board, ceramic substrate, semiconductor at this time
Substrate, plastic substrate or flexible base board etc..The embodiment of the present disclosure not with show screen, substrate, LE chip material be limited.
Fig. 8 is the floor map of the electrical connection of display device 700 in the embodiment of the present disclosure.
With reference to Fig. 8, in some embodiments, the LED wafer in LED wafer array 71 is provided only on the friendship of odd-numbered line odd column
The position that the position of fork and even number line even column intersect, such as the first row first row, the first row third arrange, the first row the 5th arranges,
Second row secondary series, the second column of row the 4th, the third line first row, the third line third column, the column of the third line the 5th etc..
In further embodiments, the LED wafer in LED wafer array 71 can also be provided only on the friendship of odd-numbered line even column
The position that the position of fork and even number line odd column intersect, for example, the first row secondary series, the first row the 4th column, the second row first row,
Second row third column, the second column of row the 5th, the third line secondary series, the third line the 4th column etc..
In the embodiment shown in fig. 8, display device further includes being electrically connected the control of N1 first electrode and N2 second electrode
Molding block 74, for brilliant with the part LED in two row LED wafer of a secondary control to first electrode and second electrode output electric signal
Piece is lighted simultaneously as multiple pixel units, and each pixel unit includes three arrangements triangular in shape and color is all different
LED wafer.
In LED wafer arrangement mode as shown in Figure 8, LED wafer color is, for example, red, green, blue, it is adjacent up and down
The adjacent LED chip color of two rows is all different, and three LED wafers that two rows three column are located in adjacent two rows up and down constitute one
Triangular pixel unit.
Consider to improve display effect or processing procedure, in some cases, those skilled in the art can tend to using compared with
Large-sized LED wafer, multi-wafer was arranged in same a line at this time, and to will lead to chip spacing too small and cause difficulty in process, because
This, can realize triangular pixel unit by the way that the LED wafer pixel unit of triangular pitch is arranged.
Fig. 9 is the effect diagram of 700 intermediate cam shape pixel unit of display device in the embodiment of the present disclosure.
With reference to Fig. 9, compared with the prior art, totally 27 LED wafers are capable of forming C1~C7 etc. seven to six rows in the horizontal direction
A triangular pixel unit can be realized five triangular pixel units of A1~E1 in vertical direction, i.e., 35 may be implemented altogether
Pixel unit, compared with the prior art, can be realized more highdensity pixel unit setting, (prior art passes through 27 LED wafers
Only it is able to achieve 9 pixel unit settings), save cost.
Figure 10 A and Figure 10 B are the schematic diagrames of the pixel unit arrangement of display device 700 in the embodiment of the present disclosure.
It, in some embodiments, can be between pixel unit in order to realize better illumination effect with reference to Figure 10 A
Several non-lit up LED wafers, such as one or two are separated between on one direction or second direction.In addition, control module
74 can also determine the number for the LED wafer not being lit being spaced between every two pixel according to display control signal, such as scheme
10B.Control module 74 can also determine the scanning times and scan frequency of every row LED wafer according to display control signal, thus
Realize more display effects.
In conclusion display device shown in Fig. 7 A~Figure 10 B can be real by the pixel unit of setting triangular pitch
Now more pixel units, in addition, can be to avoid LED by the common electrode of setting connection LED wafer upper and lower surfaces
Wafer size and spacing reduce bring process difficulties, greatly improve the resolution ratio of display device.
In addition, above-mentioned attached drawing is only the schematic theory of processing included by method according to an exemplary embodiment of the present invention
It is bright, rather than limit purpose.It can be readily appreciated that the time that above-mentioned processing shown in the drawings did not indicated or limited these processing is suitable
Sequence.In addition, be also easy to understand, these processing, which can be, for example either synchronously or asynchronously to be executed in multiple modules.
Those skilled in the art after considering the specification and implementing the invention disclosed here, will readily occur to its of the disclosure
Its embodiment.This application is intended to cover any variations, uses, or adaptations of the disclosure, these modifications, purposes or
Person's adaptive change follows the general principles of this disclosure and including the undocumented common knowledge in the art of the disclosure
Or conventional techniques.The description and examples are only to be considered as illustrative, and the true scope of the disclosure and design are wanted by right
It asks and points out.
Claims (20)
1. a kind of display device characterized by comprising
LED wafer array, including N1 row N2 column LED wafer, LED wafer described in every row are suitable according to the first color, the second color, third color
Secondary equidistant cycle arrangement, the cathode and anode of the LED wafer are located at upper and lower surfaces；
Show screen, the N1 first electrode including the setting of parallel equidistant in a first direction, each first electrode is electrically connected
Connect the upper surface of LED wafer described in a line；
Substrate, the N2 second electrode including the setting of parallel equidistant in a second direction, each second electrode electrical connection one
Arrange the lower surface of the LED wafer；
Control module, N1 first electrodes of electrical connection and the N2 second electrodes, are used for the first electrode and institute
Second electrode output electric signal is stated using the part LED wafer in LED wafer described in two row of a secondary control as multiple pixel units
It lights simultaneously, each pixel unit includes three arrangements triangular in shape and the LED wafer that color is all different.
2. display device as described in claim 1, which is characterized in that each pixel unit includes adhering to what two rows three arranged separately
Three LED wafers, including two uplink LED wafers and a downlink LED wafer, or including a uplink LED wafer and two
A downlink LED wafer, in same pixel unit two with including a LED wafer not being lit between a line LED wafer.
3. display device as claimed in claim 2, which is characterized in that the LED wafer in the pixel unit is belonging respectively to n-th
Capable and the n-th+2 row, alternatively, the LED wafer in the pixel unit is belonging respectively to line n and the (n+1)th row, wherein [1, N1] n ∈.
4. display device as described in claim 1, which is characterized in that be separated between pixel unit described in every two not by point
Bright LED wafer, the interval include prolonging the first direction interval and prolonging the second direction interval.
5. display device as claimed in claim 4, which is characterized in that the control module setting are as follows: believed according to display control
Number determine two pixel unit intervals the LED wafer not being lit quantity.
6. display device as claimed in claim 4, which is characterized in that two pixel unit intervals are not lit
LED wafer is a row or column.
7. display device as described in claim 1, which is characterized in that the control module setting are as follows: believed according to display control
Number determine the scanning times and scan frequency of LED wafer described in every row.
8. display device as described in claim 1, which is characterized in that the first electrode and/or the second electrode are ITO
Electro-conductive glass.
9. display device as claimed in claim 8, which is characterized in that the substrate is transparent substrate.
10. display device as described in any one of claims 1 to 9, which is characterized in that first color, second color, institute
Stating third color is respectively red, green, blue.
11. a kind of display device characterized by comprising
LED wafer array, including N1 row N2 column LED wafer, wherein the LED wafer is provided only on odd-numbered line odd column intersection
The position or the LED wafer that position and even number line even column intersect be provided only on odd-numbered line even column intersection position and
The position that even number line odd column intersects, the color and the color of adjacent LED chip of each LED wafer are different, the LED
The anode and cathode of chip is located at upper and lower surfaces；
Show screen, the N1 first electrode including the setting of parallel equidistant in a first direction, each first electrode is electrically connected
Connect the upper surface of LED wafer described in a line；
Substrate, the N2 second electrode including the setting of parallel equidistant in a second direction, each second electrode electrical connection one
Arrange the lower surface of the LED wafer.
12. display device as claimed in claim 11, which is characterized in that further include:
Control module, N1 first electrodes of electrical connection and the N2 second electrodes, are used for the first electrode and institute
Second electrode output electric signal is stated using the part LED wafer in LED wafer described in two row of a secondary control as multiple pixel units
It lights simultaneously, each pixel unit includes three arrangements triangular in shape and the LED wafer that color is all different.
13. display device as claimed in claim 12, which is characterized in that be separated with not between equal between pixel unit described in every two
The LED wafer being lit, the interval include being spaced and being spaced in said first direction in this second direction.
14. display device as claimed in claim 13, which is characterized in that the control module setting are as follows: according to display control
Signal determines the number for the LED wafer not being lit being spaced between pixel described in every two.
15. display device as claimed in claim 13, which is characterized in that two pixel unit intervals are not lit
LED wafer is one or two.
16. display device as claimed in claim 12, which is characterized in that the control module setting are as follows: according to display control
Signal determines the scanning times and scan frequency of LED wafer described in every row.
17. display device as claimed in claim 11, which is characterized in that the first electrode and/or the second electrode are
ITO electro-conductive glass.
18. display device as claimed in claim 17, which is characterized in that the substrate is transparent substrate.
19. display device as claimed in claim 11, which is characterized in that the line space of the LED wafer array is more than or equal to
Column pitch.
20. such as the described in any item display devices of claim 11~19, which is characterized in that the LED wafer includes red, blue
The LED wafer of color, green.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862668403P | 2018-05-08 | 2018-05-08 | |
| US62/668,403 | 2018-05-08 | ||
| US201862721391P | 2018-08-22 | 2018-08-22 | |
| US62/721,391 | 2018-08-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110459537A true CN110459537A (en) | 2019-11-15 |
Family
ID=68480948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910389008.4A Pending CN110459537A (en) | 2018-05-08 | 2019-05-07 | Display device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110459537A (en) |
| TW (1) | TW201947760A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113012630A (en) * | 2020-12-11 | 2021-06-22 | 重庆康佳光电技术研究院有限公司 | Pixel array, manufacturing method of pixel array and display device |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5485293A (en) * | 1993-09-29 | 1996-01-16 | Honeywell Inc. | Liquid crystal display including color triads with split pixels |
| US6326981B1 (en) * | 1997-08-28 | 2001-12-04 | Canon Kabushiki Kaisha | Color display apparatus |
| CN101025893A (en) * | 2006-12-29 | 2007-08-29 | 北京巨数数字技术开发有限公司 | Scanning LED display device |
| US20100026728A1 (en) * | 2006-10-13 | 2010-02-04 | Sharp Kabushiki Kaisha | Display device and signal converting device |
| US20120268707A1 (en) * | 2009-12-24 | 2012-10-25 | Sharp Kabushiki Kaisha | Liquid crystal display device |
| US20160062196A1 (en) * | 2014-08-29 | 2016-03-03 | Japan Display Inc. | Liquid crystal display |
| CN106298753A (en) * | 2016-09-23 | 2017-01-04 | 利亚德光电股份有限公司 | LED display |
| CN206076230U (en) * | 2016-09-23 | 2017-04-05 | 利亚德光电股份有限公司 | LED display |
| US20180039114A1 (en) * | 2016-01-13 | 2018-02-08 | Shenzhen China Star Optoelectronics Technologyco., Ltd. | Liquid crystal display panel and drive method thereof |
-
2019
- 2019-05-07 CN CN201910389008.4A patent/CN110459537A/en active Pending
- 2019-05-08 TW TW108115901A patent/TW201947760A/en unknown
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5485293A (en) * | 1993-09-29 | 1996-01-16 | Honeywell Inc. | Liquid crystal display including color triads with split pixels |
| US6326981B1 (en) * | 1997-08-28 | 2001-12-04 | Canon Kabushiki Kaisha | Color display apparatus |
| US20100026728A1 (en) * | 2006-10-13 | 2010-02-04 | Sharp Kabushiki Kaisha | Display device and signal converting device |
| CN101025893A (en) * | 2006-12-29 | 2007-08-29 | 北京巨数数字技术开发有限公司 | Scanning LED display device |
| US20120268707A1 (en) * | 2009-12-24 | 2012-10-25 | Sharp Kabushiki Kaisha | Liquid crystal display device |
| US20160062196A1 (en) * | 2014-08-29 | 2016-03-03 | Japan Display Inc. | Liquid crystal display |
| US20180039114A1 (en) * | 2016-01-13 | 2018-02-08 | Shenzhen China Star Optoelectronics Technologyco., Ltd. | Liquid crystal display panel and drive method thereof |
| CN106298753A (en) * | 2016-09-23 | 2017-01-04 | 利亚德光电股份有限公司 | LED display |
| CN206076230U (en) * | 2016-09-23 | 2017-04-05 | 利亚德光电股份有限公司 | LED display |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113012630A (en) * | 2020-12-11 | 2021-06-22 | 重庆康佳光电技术研究院有限公司 | Pixel array, manufacturing method of pixel array and display device |
| CN113012630B (en) * | 2020-12-11 | 2022-05-31 | 重庆康佳光电技术研究院有限公司 | Pixel array, manufacturing method of pixel array and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201947760A (en) | 2019-12-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20210184084A1 (en) | Phosphor deposition system for leds | |
| CN105103313B (en) | Light-emitting element package | |
| CN109215516A (en) | Display device and its manufacturing method | |
| CN115700916A (en) | Light emitting diode package device and light emitting apparatus | |
| CN107078132A (en) | Silicon substrate colour ILED displays | |
| CN102214776B (en) | Light emitting diode package, lighting device and light emitting diode package substrate | |
| CN202795924U (en) | High-integration light-emitting diode (LED) display screen based on chip on board (COB) packaging technology | |
| CN108957852A (en) | Display module and display device | |
| JP2005159270A (en) | Led package | |
| CN110034105A (en) | Display panel and preparation method thereof | |
| CN211124837U (en) | Mini L ED lamp pearl and L ED display screen of convenient wiring | |
| CN110459537A (en) | Display device | |
| CN107910346A (en) | Micro light-emitting diode display panel and display device | |
| CN221327301U (en) | LED arrangement structure | |
| CN103427333A (en) | Laser diode matrix grain structure and packaging device thereof | |
| CN109411578A (en) | A kind of LED chip and LED module | |
| CN207651511U (en) | Flip LED chips and backlight module | |
| CN108877663B (en) | Display screen, manufacturing method thereof and display structure | |
| CN107633779A (en) | LED display based on COB technologies | |
| TW202224176A (en) | Light emitting display device having high aperture ratio and method of manufacturing the same | |
| CN114764997A (en) | LED display structure, display module and LED display screen | |
| CN111402751A (en) | L ED lamp pearl and L ED display screen | |
| CN217133948U (en) | Lamp bead arrangement structure for LED display | |
| CN111091787A (en) | Discrete element driven LED backlight unit, component, circuit and display device | |
| CN108230936B (en) | Packaging structure with data transmission function and processing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |