CN206076230U - LED display - Google Patents

Abstract

This utility model provides a kind of LED display.Multiple sub-pixel units that the LED display is included circuit board and is arranged on circuit board and electrically connected with circuit board, sub-pixel unit includes arranged in arrays four LED wafer, the glow color of each LED wafer is respectively selected from any one in redness, green and blueness, three LED wafers in each sub-pixel unit have different glow colors, there is identical spacing with the LED wafer of a line, and be spaced with the LED wafer of identical glow color in a line.After to above-mentioned LED display input frequency multiplication transmitted image signal, virtual pixel can be produced using human eye " persistence of vision " phenomenon, real image element and virtual pixel can double resolution than prior art when individual picture is shown, so as to obtain apparent image, so that double width picture is transmitted by real image element and virtual pixel, realize the double display functions needed for 3D rendering.

Description

LED display

Technical field

This utility model is related to optical technical field, in particular to a kind of LED display.

Background technology

Existing 3D Display Techniques be by two width image of right and left eyes is presented on screen, by the effect of polaroid glasses, Make the change frequency of glasses consistent with the change frequency on display, so that our eyes can only see a figure Picture, and another eyes see the image of another diverse location, both alternate position spikes can change our visual focusing point, Let us mistake display content is judged into depart from indicator screen beyond space, just embody 3D effect, it is existing Technology be using using three LED wafers as array arrangement by the way of a pixel cell on circuit boards, and by control system System transmission 3D rendering.

However, there is problems with above-mentioned 3D Display Techniques of the prior art：1) the minimum display of common 3D TVs Unit is that, with three-in-one lamp as minimum unit, the pixel on such screen is fixed quantity；2) a piece of common 3D TVs The pixel of screen needs to show two width images, then the resolution of corresponding single image just has loss halve.

Utility model content

Main purpose of the present utility model is to provide a kind of LED display, shows skill to solve 3D in prior art The problem that art causes resolution relatively low due to the restriction of pixel quantity.

To achieve these goals, according to one side of the present utility model, there is provided a kind of LED display, including Circuit board and the multiple sub-pixel units for being arranged on circuit board and electrically connecting with circuit board, sub-pixel unit include arranging in matrix Four LED wafers of row, the glow color of each LED wafer are respectively selected from any one in redness, green and blueness, each sub-pixel Three LED wafers in unit have different glow colors, have identical spacing, and same a line with the LED wafer of a line In the LED wafer of identical glow color be spaced.

Further, LED wafer is upside-down mounting LED wafer on circuit boards.

Further, circuit board includes the wafer face being oppositely arranged and pad face, and sub-pixel unit is arranged in wafer face, Circuit board also includes the conductive welding disk and signal pad being arranged on pad face, and conductive welding disk is connected with the positive pole of LED wafer, is believed Number pad is connected with the negative pole of LED wafer.

Further, it is connected with same signal pad with the negative pole of the LED wafer with identical glow color in a line.

Further, it is connected with same conductive welding disk with the positive pole of the LED wafer in a line.

Further, LED display also includes transparent insulation shell, and transparent insulation clamshell is located at the outer of each sub-pixel unit Side.

Further, the outer surface of the circuit board in addition to conductive welding disk and signal pad is located at transparent insulation shell It is interior.

Further, LED display also includes transparent insulation implant, and implant is arranged on transparent insulation shell with sub- picture In space between plain unit.

Further, insulation filler is insulation-encapsulated glue.

Further, it is smaller than 2.5mm with two LED wafers adjacent in a line.

Using the technical solution of the utility model, there is provided a kind of LED display, as the LED display includes Circuit board and the multiple sub-pixel units for being arranged on circuit board and being electrically connected with circuit board, each sub-pixel unit are included in matrix Four LED wafers of arrangement, the glow color of each LED wafer are respectively selected from any one in redness, green and blueness, each sub- picture Three LED wafers in plain unit have different glow colors, and the LED wafer with a line has identical spacing, so as to Make the LED display that sub-pixel unit is arranged in the manner described above compared in prior art by LED wafer three-in-one group Conjunction mode can produce more pixels；Also, after to above-mentioned LED display input frequency multiplication transmitted image signal, using people Eye " persistence of vision " phenomenon can also produce virtual pixel, and real image element and virtual pixel can compare when individual picture is shown Prior art doubles resolution, so as to obtain apparent image, so as to transmit double width by real image element and virtual pixel Picture, realizes the double display functions needed for 3D rendering.

In addition to objects, features and advantages described above, this utility model also has other purposes, feature and excellent Point.Below with reference to figure, this utility model is described in further detail.

Description of the drawings

The Figure of description for constituting a part of the present utility model is used for providing further understanding to of the present utility model, this The schematic description and description of utility model is used to explain this utility model, does not constitute to improper limit of the present utility model It is fixed.In the accompanying drawings：

Fig. 1 shows that a kind of sub-pixel unit arrangement of LED display that this utility model embodiment is provided is shown It is intended to；

Fig. 2 shows a kind of generalized section of LED display that this utility model embodiment is provided；

Fig. 3 shows a kind of structural representation of the wafer face of LED display that this utility model embodiment is provided Figure；

Fig. 4 shows a kind of structural representation in the pad face of LED display that this utility model embodiment is provided Figure；And

Fig. 5 shows a kind of LED wafer encapsulation unit row of LED display that this utility model embodiment is provided List intention.

Wherein, above-mentioned accompanying drawing includes the following drawings labelling：

10th, circuit board；110th, wafer face；120th, pad face；121st, conductive welding disk；122nd, signal pad；130th, metal is led Electric hole；20th, sub-pixel unit；210th, LED wafer；211st, positive pole；212nd, negative pole；30th, transparent insulation shell；40th, insulation filler； 50th, metal wire；A, real image element；B, virtual pixel.

Specific embodiment

It should be noted that in the case where not conflicting, the feature in embodiment and embodiment in this utility model can To be mutually combined.Below with reference to the accompanying drawings and in conjunction with the embodiments describing this utility model in detail.

In order that those skilled in the art more fully understand this utility model scheme, below in conjunction with this utility model reality The accompanying drawing in example is applied, the technical scheme in this utility model embodiment is clearly and completely described, it is clear that described Embodiment is only the embodiment of this utility model part, rather than the embodiment of whole.Based on the reality in this utility model Example is applied, the every other embodiment obtained under the premise of creative work is not made by those of ordinary skill in the art is all answered When the scope for belonging to this utility model protection.

It should be noted that specification and claims of the present utility model and the term " first " in above-mentioned accompanying drawing, " second " etc. is for distinguishing similar object, without being used to describe specific order or precedence.It should be appreciated that so The data for using can be exchanged in the appropriate case, so as to embodiment of the present utility model described herein.Additionally, term " bag Include " and " having " and their any deformation, it is intended that covering is non-exclusive to be included, and for example, contains series of steps Or the process of unit, method, system, product or equipment are not necessarily limited to those steps or the unit clearly listed, but can wrap Include other steps clearly do not list or intrinsic for these processes, method, product or equipment or unit.

From background technology, in prior art there is the caused resolution due to the restriction of pixel quantity in 3D Display Techniques The relatively low problem of rate.This utility model is studied for the problems referred to above, there is provided a kind of LED display, such as the institutes of Fig. 1 to 5 Show, including circuit board 10 and the multiple sub-pixel units 20 for being arranged on circuit board 10 and electrically connecting with circuit board 10, sub-pixel Unit 20 includes arranged in arrays four LED wafer 210, and the glow color of each LED wafer 210 is respectively selected from redness, green With any one in blueness, three in each sub-pixel unit 20 LED wafer 210 has different glow colors, with a line LED wafer 210 has identical spacing, and is spaced with the LED wafer 210 of identical glow color in a line.

In above-mentioned LED display due to including circuit board and be arranged on circuit board and electrically connect with circuit board it is multiple Sub-pixel unit, each sub-pixel unit include arranged in arrays four LED wafer, and the glow color of each LED wafer is selected respectively Any one from red, green and blueness, three in each sub-pixel unit LED wafer has different glow colors, and There is identical spacing with the LED wafer of a line, so that the LED display phase that sub-pixel unit is arranged in the manner described above Than LED wafer three-in-one compound mode can be produced more pixels in prior art；Also, above-mentioned LED is being shown After device input frequency multiplication transmitted image signal, virtual pixel B, real pixel A can also be produced using human eye " persistence of vision " phenomenon Resolution can be doubled than prior art with virtual pixel B when individual picture is shown, it is apparent so as to obtain Image, so as to transmit double width picture by real pixel A and virtual pixel B, realizes the double display functions needed for 3D rendering.

In above-mentioned LED display of the present utility model, draw due to transmitting double width by real pixel A and virtual pixel B Face (as shown in Figure 1 and Figure 5), it is achieved thereby that the double display functions needed for 3D rendering, and then makes LED display on 3D shows Can be on the basis of the spacing for not expanding LED wafer 210, with larger resolution, now, with two adjacent in a line LED wafer 210 is smaller than 2.5mm；Also, by the combination of above-mentioned real pixel A and virtual pixel B, without increase LED The quantity of chip 210, that is, ensure that LED display has larger resolution on 3D shows.

In above-mentioned LED display of the present utility model, those skilled in the art can be brilliant to LED according to prior art The set-up mode on the circuit board 10 of piece 210 is chosen, in order to improve the safety and reliability of LED wafer 210, in one kind In preferred embodiment, LED wafer 210 is upside-down mounting LED wafer 210 on the circuit board 10.By LED wafer 210 is existed Upside-down mounting is carried out on circuit board 10, the both positive and negative polarity of LED wafer 210 and the connection of circuit board 10 is facilitated.

It is above-mentioned preferred embodiment in, circuit board 10 can include the wafer face 110 that is oppositely arranged and pad face 120, sub-pixel unit 20 is arranged in wafer face 110, and circuit board 10 also includes the conductive welding disk being arranged on pad face 120 121 and signal pad, conductive welding disk 121 is connected with the positive pole 211 of LED wafer 210, the negative pole of signal pad and LED wafer 210 212 connections, as shown in Figure 2.By conductive welding disk 121 being connected with the positive pole 211 of LED wafer 210 to supply to LED wafer 210 Electricity, and by signal pad is connected with the negative pole 212 of LED wafer 210, to provide voltage difference to LED wafer 210, make LED brilliant Piece 210 sends the light of required color.

When above-mentioned LED display works, operated height by the hardware control device and software of LED display front end Double display signals required for clear signal and 3D show are sent to corresponding metal pad (conduction on the pad face 120 of circuit board 10 Pad and signal pad), LED wafer 210 is shown according to image demand, so as to realize high-definition image and 3D pictures.

Specifically, the mode that foregoing circuit plate 10 is connected with sub-pixel unit 20 may comprise steps of：First, plant Metal ball is planted to the both positive and negative polarity of LED wafer 210, and plant metal ball to circuit board 10 and 210 corresponding wafer face of LED wafer On 110, both positive and negative polarity is connected in pressure welding mode with circuit board 10 by ultrasonic bonding, but and be confined to aforesaid way, such as may be used Make 210 both positive and negative polarity of LED wafer and circuit with by the way of Eutectic Layer being covered in 210 both positive and negative polarity of LED wafer under preset temperature Plate 10 connects, it is also possible to 210 both positive and negative polarity of LED wafer is connected with circuit board 10 by way of conductive rubber is bonded；Then, The negative pole 212 of LED wafer 210 is connected with the signal pad in pad face 120 using metal wire 50, and in the profit of wafer face 110 Metallic conduction hole 130 is formed at wiring, passes through metallic conduction hole 130 by the positive pole 211 of LED wafer 210 using metal wire 50 It is connected with the conductive welding disk 121 in pad face 120, as shown in Figure 3.

In order to ensure the uniformity of color, it is preferable that with the negative of the LED wafer 210 in a line with identical glow color Pole 212 is connected with same signal pad 122, as shown in Figure 4.Now, can just be controlled by a signal pad 122 same Glow color identical LED wafer 210 in row；Also, for the uniformity for ensureing to power, it is preferable that with the LED in a line The positive pole 211 of chip 210 is connected with same conductive welding disk 121, as shown in Figure 4.Now, by a conductive welding disk 121 just The LED wafer 210 that can be controlled in same a line lights, and the metal wire 50 being connected with each LED wafer 210 in same a line can lead to Cross a metallic conduction hole 130 to be connected on the conductive welding disk 121 in pad face 120, as shown in Figure 3.Also, it is above-mentioned preferred Embodiment reduce the quantity of conductive welding disk 121 and signal pad 122 on pad face 120, so as to simplify circuit board 10 The preparation technology in upper pad face 120, and then simplify the preparation technology of LED display.

In above-mentioned LED display of the present utility model, can equidistant multiple LED of matrix arrangement on the circuit board 10 Wafer package unit, as shown in figure 5, each LED wafer encapsulation unit includes into multiple sub-pixel units 20 of matrix arrangement, respectively The quantity of LED wafer encapsulation unit sub-pixel unit is identical, the LED wafer 210 of different glow colors in each sub-pixel unit Arranged with identical order, and inside the spacing between each LED wafer encapsulation unit and encapsulation unit LED wafer 210 spacing Identical, LED wafer 210 is preferably LED flip chips, and above-mentioned LED wafer encapsulation unit can be by welding, leading with circuit board 10 The modes such as electric rubber adhesion connect.

In above-mentioned LED display of the present utility model, it is preferable that LED display also includes transparent insulation shell 30, Transparent insulation shell 30 covers at the outside of each sub-pixel unit 20, as shown in Figure 2.Above-mentioned transparent insulation shell 30 can be to each sub- picture Plain unit 20 is effectively protected, and improves the reliability of LED display.It is further preferable that transparent insulation shell 30 also sets On the outer surface of the circuit board 10 being placed in addition to conductive welding disk 121 and signal pad 122.Now, above-mentioned transparent insulation shell 30 Whole circuit board 10 in addition to conductive welding disk 121 and signal pad 122 can be coated, it is aobvious to LED so as to serve Showing device is more effectively protected.

In above-mentioned LED display of the present utility model, it is preferable that LED display is also filled including transparent insulation Thing 40, implant are arranged in the space between transparent insulation shell 30 and sub-pixel unit 20, as shown in Figure 2.It is above-mentioned transparent exhausted Edge implant 40 plays a part of to insulate sub-pixel unit 20, so as to ensure that each LED wafer 210 in sub-pixel unit 20 It is normal to run.In order to improve the insulation effect to sub-pixel unit 20, it is preferable that above-mentioned insulation filler 40 is insulation-encapsulated Glue.

The LED display of this utility model offer is further illustrated below in conjunction with embodiment.

Embodiment 1

The present embodiment provide LED display as shown in figure 5, including circuit board and be arranged on circuit board 1024 × 540 encapsulation units into matrix arrangement, encapsulation unit include four sub-pixel units into matrix arrangement, each sub-pixel unit Including four LED wafers arranged in arrays, the glow color of each LED wafer in sub-pixel unit is respectively selected from red, green Any one in normal complexion blueness, the glow color of two diagonally arranged in sub-pixel unit LED wafer is redness, circuit There is identical spacing with the LED wafer of a line on plate, and be spaced with the LED wafer of identical glow color in a line, on State LED wafer upside-down mounting to arrange on circuit boards.

Comparative example 1

The LED display that this comparative example is provided includes circuit board and 12960 row sub-pixel lists being arranged on circuit board Element array, each row array of sub-pixel elements include the red, green, blue LED wafer that 8192 groups of orders are arranged, each row sub-pixel unit battle array In row, the color of LED wafer is correspondingly arranged, and has identical spacing with the LED wafer of a line on circuit board, and above-mentioned LED wafer is fallen Installing is put on circuit boards.

In above-described embodiment and comparative example 1, LED display can reach 4096 × 2160 resolution, wherein, it is real Apply horizontal 1024 encapsulation units (1024 × 16=16384) used in example 1 and amount to 16384 chips, longitudinal direction uses 540 Encapsulation unit (540 × 16=8640) amounts to 8640 chips, and real image element and virtual pixel realize jointly 3D and show effect Really；The quantity of red, green, blue LED wafer transversely arranged in comparative example 1 is 4096 twice (4096 × 3 × 2=24576) Amount to 24576, red, green, LED lan chips the quantity of longitudinal arrangement is 2160 twice (2160 × 3 × 2=12960) Amount to 12960, it is as shown in the table：

LED display in comparative example 1 be can be seen that from above-mentioned comparing result more than half is saved compared to comparative example 1 LED wafer quantity, LED display of the proving by the same methods in comparative example 1 in same number of wafers can produce what is doubled Pixel.

As can be seen from the above description, this utility model the above embodiments realize following technique effect：

1st, LED wafer three-in-one compound mode can be produced more pictures compared in prior art by LED display Element；

2nd, after to above-mentioned LED display input frequency multiplication transmitted image signal, using human eye " persistence of vision " phenomenon also Virtual pixel can be produced, real image element and virtual pixel can be doubled point than prior art when individual picture is shown Resolution, so as to obtain apparent image, so as to transmit double width picture by real image element and virtual pixel, realizes 3D rendering institute The double display functions for needing；

3rd, make LED display that there is higher resolution in the case where real image element is constant；

4th, make the LED display can be on the basis of the spacing for not expanding LED wafer, with larger on 3D shows Resolution；

5th, by the combination of above-mentioned real image element and virtual pixel, without the quantity for increasing LED wafer, that is, ensure that LED display has larger resolution on 3D shows.

Preferred embodiment of the present utility model is the foregoing is only, this utility model is not limited to, for this For the technical staff in field, this utility model can have various modifications and variations.It is all it is of the present utility model spirit and principle Within, any modification, equivalent substitution and improvements made etc. are should be included within protection domain of the present utility model.

Claims (10)

1. a kind of LED display, it is characterised in that including circuit board (10) and be arranged on the circuit board (10) and with institute Multiple sub-pixel units (20) that circuit board (10) is electrically connected are stated, the sub-pixel unit (20) is including arranged in arrays four LED wafer (210), the glow color of each LED wafer (210) are respectively selected from any one in redness, green and blueness, respectively Three LED wafers (210) in the sub-pixel unit (20) with different glow colors, with the LED of a line Chip (210) is with identical spacing, and is spaced with the LED wafer (210) of identical glow color in a line.

2. LED display according to claim 1, it is characterised in that the LED wafer (210) is described to be inverted in LED wafer (210) on circuit board (10).

3. LED display according to claim 2, it is characterised in that the circuit board (10) is including what is be oppositely arranged Wafer face (110) and pad face (120), the sub-pixel unit (20) are arranged in the wafer face (110), the circuit board (10) conductive welding disk (121) and signal pad (122) being arranged on the pad face (120), the conductive welding disk are also included (121) it is connected with the positive pole (211) of the LED wafer (210), the signal pad (122) and the LED wafer (210) Negative pole (212) connects.

4. LED display according to claim 3, it is characterised in that with the institute with identical glow color in a line The negative pole (212) for stating LED wafer (210) is connected with the same signal pad (122).

5. LED display according to claim 3, it is characterised in that the LED wafer (210) in a line Positive pole (211) is connected with the same conductive welding disk (121).

6. LED display according to claim 3, it is characterised in that the LED display also includes transparent insulation Shell (30), the transparent insulation shell (30) cover at the outside of each sub-pixel unit (20).

7. LED display according to claim 6, it is characterised in that except the conductive welding disk (121) and the signal The outer surface of the circuit board (10) outside pad (122) is located in the transparent insulation shell (30).

8. the LED display according to claim 6 or 7, it is characterised in that the LED display also includes transparent Insulation filler (40), the implant are arranged on the sky between the transparent insulation shell (30) and the sub-pixel unit (20) In gap.

9. LED display according to claim 8, it is characterised in that the insulation filler (40) is insulation-encapsulated Glue.

10. LED display according to claim 1, it is characterised in that brilliant with two LED adjacent in a line Piece (210) is smaller than 2.5mm.