CN207038057U - Full-color LED display unit - Google Patents

Abstract

The utility model provides a kind of full-color LED display unit.The full-color LED display unit includes substrate,IC chip,Transparent dielectric layer,First LED chip group,Second LED chip group and the 3rd LED chip group,Transparent dielectric layer is arranged on the first surface of substrate,The first LED chip in first LED chip group sets on the first surface and covered by transparent dielectric layer,The second LED chip in second LED chip group is arranged on more than first LED chip group and covered by transparent dielectric layer,The 3rd LED chip in 3rd LED chip group is arranged on more than second LED chip group and covered by transparent dielectric layer,Or it is arranged on the 4th surface,And each first LED chip,Each second LED chip and the LED chips of Ge tri- electrically connect with IC chip,First LED chip,Second LED chip is different with the emission wavelength of the 3rd LED chip.

Description

Full-color LED display unit

Technical field

Display technology field is the utility model is related to, in particular to a kind of full-color LED display unit.

Background technology

At present, the main way that RGB three-primary color LEDs form full-color LED display array has two kinds, and one kind is by three independences Direct insertion LED form, the full-color array that this mode is formed is more because single LEDs size and adjacent LED spacing are larger For outdoor display screen；Another kind is that tri- kinds of LED grain parallel arrangeds of RGB are encapsulated in same substrate, to form independence Pixel, the all-colour LED pixelated array size that this mode is formed is smaller, and pel spacing can adjust according to use demand and environment, Therefore it is widely used in indoor high-definition display screen.

In recent years, LED, which is shown, relies on its excellent color representation, extra long life and it is energy-efficient the advantages that attract increasingly More researchers and the concern of major display manufacturer, it is desirable to this Display Technique is applied into the smaller spacing of more high density Product in, such as computer, mobile phone, Intelligent worn device, this certainly will require that LED chip is smaller, such as 50 μm or less, often Individual Pixel Dimensions are at 200 μm or less.In the case, the first above-mentioned all-colour LED Array Construction mode does not obviously apply to, and Using the second way, higher requirement can be proposed to LED grain preparation technology and LED chip packaging technology.

Utility model content

Main purpose of the present utility model is to provide a kind of full-color LED display unit, full-color in the prior art to solve LED display unit is difficult to the problem of super-small pixel and big packaging technology difficulty.

To achieve these goals, according to one side of the present utility model, there is provided a kind of full-color LED display unit, Including substrate and IC chip, full-color LED display unit also includes：Transparent dielectric layer, it is arranged on the first surface of substrate, it is transparent The surface of the remote substrate of dielectric layer is the 4th surface；First LED chip group, set on the first surface and by transparent dielectric layer Covering, plane where the surface of the remote first surface of the first LED chip group is second surface；Second LED chip group, is arranged on Covered more than second surface and by transparent dielectric layer, plane where the surface of the remote first surface of the first LED chip group is the Three surfaces；3rd LED chip group, it is arranged on more than 3rd surface and is covered by transparent dielectric layer, or is arranged on the 4th surface, First LED chip group includes at least one first LED chip, and the second LED chip group includes at least one second LED chip, the Three LED chip groups include at least one 3rd LED chip, and each first LED chip, each second LED chip and the LED cores of Ge tri- Piece electrically connects with IC chip, and the first LED chip, the second LED chip are different with the emission wavelength of the 3rd LED chip.

Further, transparent dielectric layer includes：First transparent dielectric layer, substrate and the first LED chip surface are covered in, the There is the first connecting hole, each second LED chip is electrically connected by the first connecting hole with IC chip in one transparent dielectric layer；Second is saturating Bright dielectric layer, it is covered in the first transparent dielectric layer and the second LED chip surface, the second transparent dielectric layer and the first transparent dielectric layer In there is the second connecting hole, each 3rd LED chip is electrically connected by the second connecting hole with IC chip.

Further, transparent dielectric layer also includes the 3rd transparent dielectric layer, and it is transparent that the 3rd transparent dielectric layer is covered in second Dielectric layer and the 3rd LED chip surface.

Further, the one of the remote substrate of the first transparent dielectric layer, the second transparent dielectric layer and the 3rd transparent dielectric layer Side surface is plane.

Further, IC chip is located at the side away from the first LED chip of substrate, and substrate has the 3rd connecting hole, the One LED chip is electrically connected by the 3rd connecting hole with IC chip, the second LED chip by the first connecting hole and the 3rd connecting hole with IC chip is electrically connected, and the 3rd LED chip is electrically connected by the second connecting hole and the 3rd connecting hole with IC chip.

Further, the first LED chip includes the first electrode set along the direction order away from substrate and the first son is outer Prolong layer, and full-color LED display unit also includes：First electrode wiring layer, it is arranged between substrate and the first LED chip, is used for 3rd connecting hole is electrically connected with first electrode；Second LED chip includes the second electricity set along the direction order away from substrate Pole and the second sub- epitaxial layer, and full-color LED display unit also includes：Second electrode wiring layer, it is arranged at the first transparent dielectric layer Between the second LED chip, for the first connecting hole to be electrically connected with second electrode；3rd LED chip is included along away from substrate Direction order the 3rd electrode and the 3rd sub- epitaxial layer that set, and full-color LED display unit also includes：3rd electrode wiring Layer, is arranged between the second transparent dielectric layer and the 3rd LED chip, for the second connecting hole to be electrically connected with the 3rd electrode.

Further, first electrode, second electrode and the 3rd electrode independently are ITO layer, ZnO layer or graphene layer.

Further, the first LED chip, the second LED chip and the 3rd LED chip are respectively selected from red LED chips, green LED chip and blue LED die.

Further, the first LED chip is red LED chips, and the second LED chip is green LED chip and the 3rd LED core Piece is blue LED die, or the second LED chip is blue LED die and the 3rd LED chip is green LED chip.

Further, full-color LED display unit also includes TFT structure and TFT electrode wiring layers, TFT structure and TFT electrodes Wiring layer may be contained between substrate and the first LED chip group, and TFT electrode wiring layers are arranged at the remote substrate of TFT structure Side, TFT structure, each first LED chip, each second LED chip, each 3rd LED chip and IC chip with TFT electrode cloth Line layer electrically connects.

Further, substrate has CMOS structure, full-color LED display unit close to a side surface of the first LED chip group Also include CMOS electrode wiring layers, CMOS electrode wiring layers are arranged between CMOS structure and the first LED chip group, and CMOS is tied Structure, each first LED chip, each second LED chip, each 3rd LED chip and IC chip electrically connect with CMOS electrode wiring layers.

Using the technical solution of the utility model, there is provided a kind of all-colour LED including transparency carrier and IC chip is shown Unit, the full-color LED display unit also include order stacking the first LED chip, the first transparent dielectric layer, the second LED chip, Second transparent dielectric layer and the 3rd LED chip, and the first LED chip, the second LED chip and the 3rd LED chip be respectively selected from it is red Color LED chip, green LED chip and blue LED die, because the LED chip with different glow colors is by transparent dielectric layer Separate and be located in different layers, so as to be turned the chip structure on same chip simultaneously by chip transfer techniques Move, and then the LED display unit with tri- kinds of glow colors of RGB, above-mentioned LED display unit are obtained by shifting process three times It can not only realize full-color light-emitting, but also can be by preparing the basal body structure of reduced size on chip, in shifting process Make the LED chip in LED display unit that there is super-small afterwards, effectively reduce the Pixel Dimensions of LED display unit；Also, Each display unit is respectively provided with transparent dielectric layer as protection, so that LED display unit can have higher reliability.

In addition to objects, features and advantages described above, the utility model also has other purposes, feature and excellent Point.Below with reference to figure, the utility model is described in further detail.

Brief description of the drawings

A part of Figure of description of the present utility model is formed to be used for providing further understanding to of the present utility model, this The schematic description and description of utility model is used to explain the utility model, does not form to improper limit of the present utility model It is fixed.In the accompanying drawings：

Fig. 1 shows a kind of volume rendering diagram for full-color LED display unit that the utility model embodiment is provided It is intended to；

Fig. 2 shows schematic cross-section of the full-color LED display unit shown in Fig. 1 in x-z-plane and x-x ' positions；

Fig. 3 shows the schematic top plan view of the second transparent dielectric layer upper surface in full-color LED display unit shown in Fig. 1；

Fig. 4 shows schematic cross-section of the full-color LED display unit shown in Fig. 1 in y-z plane and y-y ' positions；

Fig. 5 shows the schematic top plan view of the first transparent dielectric layer upper surface in full-color LED display unit shown in Fig. 1；

Fig. 6 shows the schematic flow sheet of the preparation method for the full-color LED display unit that the application embodiment is provided；

Fig. 7 is shown in the preparation method for the full-color LED display unit that the application embodiment is provided, in the first lining The wafer cross-sectional view formed on bottom after n the first LED chips；

Fig. 8 shows the matrix cross-sectional view being arranged at the first LED chip group behind the side of transparency carrier；

Fig. 9 is shown form the first transparent dielectric layer on the transparency carrier shown in Fig. 8 and the first LED chip surface after Matrix cross-sectional view；

Figure 10 is shown forms the first connecting hole in the first transparent dielectric layer shown in Fig. 9, and by the second LED chip Group is arranged at the matrix cross-sectional view behind the surface of the first transparent dielectric layer；

Figure 11 is shown forms the second transparent medium in the first transparent dielectric layer shown in Figure 10 and the second LED chip surface Matrix cross-sectional view after layer；

Figure 12 is shown forms the second connecting hole in the first transparent dielectric layer and the second transparent dielectric layer shown in Figure 11, And the 3rd LED chip group is arranged to the matrix cross-sectional view behind the surface of the second transparent dielectric layer；And

Figure 13 is shown forms the 3rd transparent medium in the second transparent dielectric layer shown in Figure 12 and the 3rd LED chip surface Matrix cross-sectional view after layer.

Wherein, above-mentioned accompanying drawing marks including the following drawings：

100th, substrate；101st, the first transparent dielectric layer；102nd, the second transparent dielectric layer；103rd, the 3rd transparent dielectric layer；11、 First LED chip；111st, first electrode；112nd, first electrode wiring layer；113rd, the first sub- epitaxial layer；12nd, the second LED chip； 121st, second electrode；122nd, second electrode wiring layer；123rd, the first connecting hole；13rd, the 3rd LED chip；131st, the 3rd electrode； 132nd, the 3rd electrode wiring layer；133rd, the second connecting hole；200th, the first substrate.

Embodiment

It should be noted that in the case where not conflicting, the feature in embodiment and embodiment in the utility model can To be mutually combined.Describe the utility model in detail below with reference to the accompanying drawings and in conjunction with the embodiments.

In order that those skilled in the art more fully understand the utility model, it is real below in conjunction with the utility model The accompanying drawing in example is applied, the technical scheme in the embodiment of the utility model is clearly and completely described, it is clear that be described Embodiment is only the embodiment of the utility model part, rather than whole embodiments.Based on the reality in the utility model Example is applied, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made, all should When the scope for belonging to the utility model protection.

It should be noted that term " first " in specification and claims of the present utility model and above-mentioned accompanying drawing, " second " etc. is for distinguishing similar object, without for describing specific order or precedence.It should be appreciated that so The data used can exchange in the appropriate case, so as to embodiment of the present utility model described herein.In addition, term " bag Include " and " having " and their any deformation, it is intended that cover it is non-exclusive include, for example, containing series of steps Or process, method, system, product or the equipment of unit are not necessarily limited to those steps or the unit clearly listed, but can wrap Include not listing clearly or for the intrinsic other steps of these processes, method, product or equipment or unit.

As described in background technology, full-color LED display unit is difficult to super-small pixel in the prior art And packaging technology difficulty is big.The utility model is studied regarding to the issue above, it is proposed that a kind of full-color LED display unit, such as Shown in Fig. 1 to 5, including substrate 100 and IC chip (being not shown), full-color LED display unit also includes：Transparent medium Layer, is arranged on the first surface of substrate 100, the surface of the remote substrate 100 of transparent dielectric layer is the 4th surface；First LED Chipset, set on the first surface and covered by transparent dielectric layer, the surface institute of the remote first surface of the first LED chip group It is second surface in plane；Second LED chip group, it is arranged on more than second surface and is covered by transparent dielectric layer, the first LED core Plane where the surface of the remote first surface of piece group is the 3rd surface；3rd LED chip group, be arranged on more than 3rd surface and Being covered, or be arranged on the 4th surface by transparent dielectric layer, the first LED chip group includes at least one first LED chip 11, the Two LED chip groups include at least one second LED chip 12, and the 3rd LED chip group includes at least one 3rd LED chip 13, And each first LED chip 11, each second LED chip 12 and the LED chips 13 of Ge tri- electrically connect with IC chip, the first LED core Piece 11, the second LED chip 12 are different with the emission wavelength of the 3rd LED chip 13.

In above-mentioned full-color LED display unit due to the LED chip with different glow colors by transparent dielectric layer separate and In different layers, so as to which the chip structure on same chip is shifted by chip transfer techniques simultaneously, and then The LED display unit with tri- kinds of glow colors of RGB is obtained by shifting process three times, above-mentioned LED display unit can not only Enough realize full-color light-emitting, but also LED can be made after the transfer process by preparing the basal body structure of reduced size on chip LED chip in display unit has super-small, effectively reduces the Pixel Dimensions of LED display unit；Also, each display Unit is respectively provided with transparent dielectric layer as protection, so that LED display unit can have higher reliability.

In above-mentioned full-color LED display unit of the present utility model, substrate 100 can be transparent material, such as resin, polyamides Imines, quartz, glass, sapphire etc. or opaque material, such as conventional has added the glass fibre of pigment, polyamides sub- Amine, Si etc., wherein, Si is conductive, remaining insulated with material；Aforesaid substrate 100 could be arranged to flexible material, such as flexible resin, soft Property polyimides and flexible glass.Transparent dielectric layer is insulating materials, can be selected from silica gel, glass fibre, polyimides and tree Fat etc., those skilled in the art can carry out Rational choice according to prior art to the species of above-mentioned transparent dielectric layer.

Above-mentioned first LED chip 11, the relative position of the second LED chip 12 and the 3rd LED chip 13 in vertical direction It could be arranged to be completely superposed, slightly deviation or triangle arrangement etc.；Also, in order to effectively realize full-color light-emitting, it is preferable that on State the first LED chip 11, the second LED chip 12 and the 3rd LED chip 13 be respectively selected from red LED chips, green LED chip and Blue LED die；It is further preferable that the first LED chip 11 is red LED chips, the second LED chip 12 is green LED chip And the 3rd LED chip 13 be blue LED die, or the second LED chip 12 is blue LED die and the 3rd LED chip 13 is green Color LED chip.The glow color of i.e. above-mentioned second LED chip 12 and above-mentioned 3rd LED chip 13 can mutual reversing of position, and Because the material for forming red LED chip is opaque, so as to by enabling above-mentioned first LED chip 11 to be red LED chip Avoid shading.

In above-mentioned full-color LED display unit of the present utility model, it is preferable that above-mentioned transparent dielectric layer includes：First is saturating Bright dielectric layer 101, the surface of 100 and first LED chip of substrate 11 is covered in, there is the first connection in the first transparent dielectric layer 101 Hole 123, each second LED chip 12 are electrically connected by the first connecting hole 123 with IC chip；Second transparent dielectric layer 102, is covered in Have in first transparent dielectric layer 101 and the surface of the second LED chip 12, the second transparent dielectric layer 102 and the first transparent dielectric layer 101 There is the second connecting hole 133, each 3rd LED chip 13 is electrically connected by the second connecting hole 133 with IC chip.On it is further preferable that Stating transparent dielectric layer also includes the 3rd transparent dielectric layer 103, and the 3rd transparent dielectric layer 103 is covered in the second transparent dielectric layer 102 With the surface of the 3rd LED chip 13.

In above-mentioned preferred embodiment, by forming the first connecting hole 123, energy in the first transparent dielectric layer 101 It is enough the second LED chip 12 is electrically connected with IC chip by the conductive material filled in the first connecting hole 123；Also, pass through The second connecting hole 133 is formed in the second transparent dielectric layer 102 and the first transparent dielectric layer 101, can be by the second connection The conductive material filled in hole 133 makes the 3rd LED chip 13 be electrically connected with IC chip, equivalent to by the second LED chip 12 and The conductive lead wire of three LED chips 13 is extended in the same layer being located at the conductive lead wire of the first LED chip 11, so as to simplify Electrical connection between IC chip and the first LED chip 11, the second LED chip 12 and the 3rd LED chip 13, makes structure more simple It is single.Above-mentioned conductive material can be gold, copper, ITO, ZnO, scolding tin, gold-tin alloy, different direction conducting resinl etc., people in the art It is one or more that member can carry out Rational choice according to prior art to above-mentioned conductive material.

In order to ensure the steady setting of the first LED chip group, the second LED chip group and the 3rd LED chip group, it is preferable that The side of the remote substrate 100 of above-mentioned first transparent dielectric layer 101, the second transparent dielectric layer 102 and the 3rd transparent dielectric layer 103 Surface is plane.Above-mentioned preferred embodiment improves the display effect and reliability of full-color LED display unit.

And, it is preferable that IC chip is located at the side away from the first LED chip 11 of substrate 100, and substrate 100 has the Three connecting holes (are not shown), and the first LED chip 11 is electrically connected by the 3rd connecting hole with IC chip, the second LED chip 12 are electrically connected by the first connecting hole 123 and the 3rd connecting hole with IC chip, and the 3rd LED chip 13 passes through the second connecting hole 133 Electrically connected with the 3rd connecting hole with IC chip.

In above-mentioned preferred embodiment, the side of the remote chip by the way that IC chip to be arranged to substrate 100, and lead to The 3rd connecting hole of formation in substrate 100 is crossed, the first LED chip can be made by the conductive material filled in the 3rd connecting hole 11 electrically connect with IC chip, make the second LED chip 12 by the conductive material filled in the first connecting hole 123 and the 3rd connecting hole Electrically connected with IC chip, by the conductive material filled in the second connecting hole 133 and the 3rd connecting hole make the 3rd LED chip 13 with IC chip electrically connects, so as to be driven by above-mentioned IC chip and the first LED chip 11 of control, the second LED chip 12 and the simultaneously Three LED chips 13 it is luminous, said structure need not again additional lead by IC chip respectively with the first LED chip 11, the 2nd LED The LED chip 13 of chip 12 and the 3rd connects, so as to be not only simple in structure and integrated level is high.

Those skilled in the art can be according to prior art to above-mentioned first LED chip 11, the second LED chip 12 and the 3rd The structure of LED chip 13 is rationally set, and above-mentioned first LED chip 11 can be included along the direction order away from substrate 100 The 111 and first sub- epitaxial layer 113 of first electrode of setting, above-mentioned second LED chip 12 include suitable along the direction away from substrate 100 The 121 and second sub- epitaxial layer of second electrode that sequence is set, above-mentioned 3rd LED chip 13 include suitable along the direction away from substrate 100 The 3rd electrode 131 and the 3rd sub- epitaxial layer that sequence is set.

Those skilled in the art can also be according to prior art to above-mentioned first electrode 111, the electricity of second electrode 121 and the 3rd The species of pole 131 carries out Rational choice, in order to improve electric conductivity, it is preferable that form above-mentioned first electrode 111, second electrode 121 and the 3rd the material of electrode 131 be transparent conductive material；It is further preferable that form above-mentioned first electrode 111, second electrode 121 and the 3rd electrode 131 material independently selected from ITO, ZnO or graphene.

The electrical connection of first LED chip 11 and IC chip for convenience, it is preferable that above-mentioned full-color LED display unit also wraps Include：First electrode wiring layer 112, it is arranged between the LED chip 11 of substrate 100 and first, for by the 3rd connecting hole and first Electrode 111 electrically connects；The electrical connection of second LED chip 12 and IC chip for convenience, it is preferable that second electrode wiring layer 122, It is arranged between the first transparent dielectric layer 101 and the second LED chip 12, for the first connecting hole 123 and second electrode 121 is electric Connection；Also, the 3rd LED chip 13 and the electrical connection of IC chip for convenience, the 3rd electrode wiring layer 132, are arranged at second Between the LED chip 13 of transparent dielectric layer 102 and the 3rd, for the second connecting hole 133 to be electrically connected with the 3rd electrode 131.

Except above-mentioned IC chip with LED chip by way of electrode wiring layer is directly electrically connected and is driven, in this reality With in new above-mentioned full-color LED display unit, LED type of drive can also be that TFT drives, i.e., in insulated substrate upper surface (the patch LED sides) forms TFT structure, then external IC controls.Now, full-color LED display unit also includes TFT structure and TFT Electrode wiring layer (is not shown), and TFT structure may be contained within the LED chip group of substrate 100 and first with TFT electrode wiring layers Between, and TFT electrode wiring layers are arranged at the side of the remote substrate 100 of TFT structure, TFT structure, each first LED chip 11, Each second LED chip 12, each 3rd LED chip 13 and IC chip electrically connect with TFT electrode wiring layers.

In above-mentioned full-color LED display unit of the present utility model, LED type of drive can also be that CMOS drives, i.e., CMOS structure, then external IC controls are formed on Si substrates.Now, substrate 100 has close to a side surface of the first LED chip group There is CMOS structure (being not shown), full-color LED display unit also includes CMOS electrode wiring layers (being not shown), CMOS electrode wiring layers are arranged between CMOS structure and the first LED chip group, and CMOS structure, each first LED chip 11, each Second LED chip 12, each 3rd LED chip 13 and IC chip electrically connect with CMOS electrode wiring layers.

According to further aspect of the application, there is provided a kind of preparation method of above-mentioned full-color LED display unit, such as scheme Shown in 6, comprise the following steps：S1, the first LED chip group is arranged at the side of substrate 100, and makes the first LED chip group First LED chip 11 electrically connects with IC chip；S2, the first transparent dielectric material is covered in the LED chip 11 of substrate 100 and first Surface is simultaneously formed by curing the first transparent dielectric layer 101；S3, the second LED chip group is arranged to the table of the first transparent dielectric layer 101 On face, and the second LED chip 12 of the second LED chip group is set to be electrically connected with IC chip；S4, the second transparent dielectric material is covered In the first transparent dielectric layer 101 and the surface of the second LED chip 12 and it is formed by curing the second transparent dielectric layer 102；S5, by the 3rd LED chip group is arranged on the surface of the second transparent dielectric layer 102, and makes the 3rd LED chip 13 and IC of the 3rd LED chip group Chip electrically connects.

Due to being shifted the chip structure on same chip simultaneously by chip transfer techniques in above-mentioned preparation method, It is located at so as to which the LED chip with different glow colors be separated by transparent dielectric layer in different layers, and then by turning three times Move technique and obtain the LED display unit with tri- kinds of glow colors of RGB, above-mentioned LED display unit can not only be realized full-color It is luminous, but also can be made after the transfer process in LED display unit by preparing the basal body structure of reduced size on chip LED chip there is super-small, effectively reduce LED display unit Pixel Dimensions；Also, each display unit is respectively provided with Transparent dielectric layer is as protection, so that LED display unit can have higher reliability.

The preparation according to full-color LED display unit provided by the utility model is more fully described below in conjunction with Fig. 1 to 5 The illustrative embodiments of method.However, these illustrative embodiments can be implemented by many different forms, and not It should be interpreted to be only limited to embodiments set forth herein.It should be appreciated that these embodiments are provided so that It is thoroughly and complete to obtain disclosure herein, and the design of these illustrative embodiments is fully conveyed to the common skill in this area Art personnel.

First, step S1 is performed：First LED chip group is arranged at the side of substrate 100, and makes the first LED chip group The first LED chip 11 electrically connected with IC chip.The luminous of the first LED chip 11 is driven and controlled by above-mentioned IC chip.

In a preferred embodiment, above-mentioned steps S1 includes procedure below：S11, in the surface shape of the first substrate 200 Into the first epitaxial layer, and n first electrode 111 is formed on the first epitaxial layer, the first epitaxial layer is divided into and each first electricity 111 one-to-one n of pole the first sub- epitaxial layers 113, to form n the first LED chips 11 on the first substrate 200, n is big It is as shown in Figure 7 in 0 integer, obtained structure；S12, forms first electrode wiring layer 112 on the surface of substrate 100, and by first The first electrode 111 of LED chip 11 is be bonded with first electrode wiring layer 112；S13, as n=1, the first substrate 200 is peeled off, So that the first LED chip group to be arranged to the side of substrate 100, or as n ＞ 1, by the first sub- extension of the first substrate 200 and m layers Layer 113 is peeled off, and the first LED chip group is arranged to the side of substrate 100,0≤m ＜ n, and obtained structure is as shown in Figure 8.

In above-mentioned preferred embodiment, the chip structure on same chip is carried out simultaneously using chip transfer techniques Transfer, so as to which the LED chip with identical glow color can be arranged in same layer by a shifting process, and then Simplify the preparation technology of full-color LED display unit.In order to more effectively realize the stripping of the first substrate 200, it is preferable that on It is laser lift-off to state stripping technology.

Spacing between above-mentioned first sub- epitaxial layer 113 may be configured as equal with display screen matrix spacing, or be arranged to The approximate number of display screen matrix spacing.If the spacing between above-mentioned first sub- epitaxial layer 113 is identical with LED display pel spacing, Whole first substrate 200 then can be directly peeled off, the first LED chip 11 is fixed on the upper surface of substrate 100, the process repeats, So that the first LED chip 11 is paved with whole substrate 100；If the spacing between above-mentioned first sub- epitaxial layer 113 is LED display picture The approximate number of plain spacing, then should be by the first LED chip 11 from the surface compartment of terrain (spacing distance=display screen matrix of the first substrate 200 Spacing) peel off, thus LED is still left on the first substrate 200 peeled off, to repeat the process, until nothing on the first substrate 200 First LED chip 11 and whole substrate 100 is paved with the first LED chip 11.

After execution of step S1, step S2 is performed：First transparent dielectric material is covered in substrate 100 and first The surface of LED chip 11 is simultaneously formed by curing the first transparent dielectric layer 101, and obtained structure is as shown in Figure 9.Above-mentioned first transparent medium Layer 101 is used for the LED chip set isolation of the first LED chip 11 and other colors in different layers.

After execution of step S2, step S3 is performed：Second LED chip group is arranged at the first transparent dielectric layer 101 Surface on, and the second LED chip 12 of the second LED chip group is electrically connected with IC chip.Above-mentioned IC chip can also drive Lighted with the second LED chip group of control.

In a preferred embodiment, above-mentioned steps S3 includes procedure below：S31, formed in the second substrate surface Second epitaxial layer, and n second electrode 121 is formed on the second epitaxial layer, the second epitaxial layer is divided into and each second electrode 121 one-to-one n the second sub- epitaxial layers, to obtain the 2nd LED that n the second LED chips 12 are formed on the second substrate Chipset, n are the integer more than 0；S32, forms second electrode wiring layer 122 on the surface of the first transparent dielectric layer 101, and by the The second electrode 121 of two LED chips 12 is be bonded with second electrode wiring layer 122；S33, as n=1, by the second substrate desquamation, So that the second LED chip group is arranged on the surface of the first transparent dielectric layer, or as n ＞ 1, by the second substrate and m layers second Sub- epitaxial layer is peeled off, and the second LED chip group is arranged on the surface of the first transparent dielectric layer, 0≤m ＜ n.Similarly, on State the spacing between the second sub- epitaxial layer and may be alternatively provided as equal with display screen matrix spacing, or be arranged between display screen matrix Away from approximate number.

It is further using chip transfer techniques that the chip structure on same chip is same in above-mentioned preferred embodiment Shi Jinhang is shifted, so as to which the LED chip of another glow color is arranged in same layer by second of shifting process, Jin Erjian The preparation technology of full-color LED display unit is changed.In order to more effectively realize the stripping of the second substrate, it is preferable that above-mentioned stripping Separating process is laser lift-off.

After above-mentioned steps S2, above-mentioned preparation method can also comprise the following steps：In the first transparent dielectric layer 101 The first connecting hole 123 is formed, now, in above-mentioned steps S3, each second LED chip 12 is passed through the first connecting hole 123 and IC Chip electrically connects, and obtained structure is as shown in Figure 10.By forming the first connecting hole 123, energy in the first transparent dielectric layer 101 It is enough the second LED chip 12 is electrically connected with IC chip by the conductive material filled in the first connecting hole 123.

After execution of step S3, step S4 is performed：Second transparent dielectric material is covered in the first transparent dielectric layer 101 and the surface of the second LED chip 12 and the second transparent dielectric layer 102 is formed by curing, obtained structure is as shown in figure 11.Above-mentioned Two transparent dielectric layers 102 are used for the LED chip set isolation of the second LED chip 12 and other colors in different layers.

After execution of step S4, step S5 is performed：3rd LED chip group is arranged at the second transparent dielectric layer 102 Surface on, and the 3rd LED chip 13 of the 3rd LED chip group is electrically connected with IC chip.By above-mentioned IC chip to drive With lighting for the 3rd LED chip 13 of control.

In a preferred embodiment, above-mentioned steps S5 includes procedure below：S51, formed in the 3rd substrate surface 3rd epitaxial layer, and n the 3rd electrodes 131 are formed on the 3rd epitaxial layer, the 3rd epitaxial layer is divided into and each 3rd electrode 131 one-to-one the 3rd sub- epitaxial layers of n-layer, to form n the 3rd basal body structures on the 3rd substrate, n is whole more than 0 Number；S52, the 3rd electrode wiring layer 132 is formed on the surface of the second transparent dielectric layer 102, and the 3rd basal body structure is had the The side of three electrodes 131 is be bonded with the 3rd electrode wiring layer 132；S53, as n=1, by the 3rd substrate from the 3rd electrode wiring 132 sur-face peeling of layer, to obtain the second LED chip 12, or as n ＞ 1, by the 3rd substrate and the 3rd sub- epitaxial layer of m layers from the The sur-face peeling of three electrode wiring layer 132, to obtain the 3rd LED chip 13,0≤m ＜ n.Similarly, above-mentioned 3rd sub- epitaxial layer it Between spacing may be alternatively provided as approximate number equal with display screen matrix spacing, or being arranged to display screen matrix spacing.

It is further using chip transfer techniques that the chip structure on same chip is same in above-mentioned preferred embodiment Shi Jinhang is shifted, and so as to which the LED chip of another glow color is arranged in same layer by third time shifting process, passes through three Secondary shifting process obtains the LED display unit with tri- kinds of glow colors of RGB, and then simplifies full-color LED display unit Preparation technology.In order to more effectively realize the stripping of the 3rd substrate, it is preferable that above-mentioned stripping technology is laser lift-off.

After step s4, above-mentioned preparation method can also comprise the following steps：In the first transparent dielectric layer 101 and second The second connecting hole 133 is formed in transparent dielectric layer 102, now, in above-mentioned steps S5, makes each 3rd LED chip 13 by Two connecting holes 133 electrically connect with IC chip, and obtained structure is as shown in figure 12.By in the second transparent dielectric layer 102 and first The second connecting hole 133 is formed in transparent dielectric layer 101, can be made by the conductive material filled in the second connecting hole 133 Three LED chips 13 electrically connect with IC chip.

After above-mentioned steps S5, it is preferable that above-mentioned preparation method is further comprising the steps of：S6, by the 3rd transparent medium Material is covered in the surface of the second transparent dielectric layer 102 and the 3rd LED chip 13 and is formed by curing the 3rd transparent dielectric layer 103, Obtained structure is as shown in figure 13.Above-mentioned 3rd transparent dielectric layer 103 is used to be sealed the 3rd LED chip 13, to improve The reliability of 3rd LED chip 13.

The material of above-mentioned first transparent dielectric layer 101, the second transparent dielectric layer 102 and the 3rd transparent dielectric layer 103 can be with For transparent insulation material commonly used in the prior art, those skilled in the art can be according to prior art to above-mentioned transparent dielectric layer Material carry out Rational choice；And it is possible to the first transparent dielectric layer 101, the second transparent dielectric layer are made using flatening process 102 and the 3rd transparent dielectric layer 103 there are flat surfaces, to ensure the first LED chip 11, second in each transparent medium layer surface The steady setting of the LED chip 13 of LED chip 12 and the 3rd.

The full-color LED display unit of the application offer is be provided below in conjunction with embodiment.

Embodiment 1

First, design and substrate processing 100, make lower surface that there is necessary metal wiring layer, and it is internal with necessary Electrical cable, these connecting lines and wiring layer are by the IC chip for UNICOM's LED chip and lower surface.

Using LED preparation technologies, red LED core of the positive and negative electrode in the same side is prepared in different wafer substrates respectively Piece, green LED chip and blue LED die, it is brilliant to obtain red-light LED crystal circle structure, green light LED crystal circle structure and blue-ray LED Circle structure.Wherein, the preparation technology of red LED chips includes：The first sub- epitaxial layer is formed on the surface of the first substrate 200 of wafer 113, and first electrode 111 is formed on the first sub- surface of epitaxial layer 113, using the discrete each LED core of technique such as etching or corrosion Piece, so as to the red-light LED crystal circle structure of the not yet cleavage of the first LED chip 11 being had, above-mentioned first LED chip 11 is Red LED chips, as shown in Figure 6.

As shown in fig. 7, first electrode wiring layer 112 is set on the substrate 100, by red-light LED crystal circle structure and the first electricity Pole wiring layer 112 is bonded；If the spacing of red LED chips is identical with LED display pel spacing, whole can be directly peeled off One substrate 200, red LED chip is fixed on the upper surface of substrate 100, the process repeats so that red LED chips be paved with it is whole Individual substrate 100；If the spacing of red LED chips be LED display pel spacing approximate number, answer compartment of terrain (spacing distance= Display screen matrix spacing) red LED chip is peeled off, thus red LED chip is still left on the first substrate 200 peeled off, with The process is repeated, until being paved with red LED chip without red LED chip and whole substrate 100 on the first substrate 200.

As shown in figure 8, covering layer of transparent dielectric material in the first LED chip 11 and being solidified, it is saturating to obtain first Bright dielectric layer 101, makes it have flat surface.

As shown in figure 9, forming the first connecting hole 123 in the first transparent dielectric layer 101, penetrate to substrate 100, and set Second electrode wiring layer 122 is then be bonded with second electrode wiring layer 122 by green light LED crystal circle structure；If green LED chip The spacing of (i.e. the second LED chip 12) is identical with LED display pel spacing, then can directly peel off whole substrate, make green light LED Chip is fixed on the upper surface of the first transparent dielectric layer 101, and the process repeats, so that green LED chip is paved with whole upper surface； If the spacing of green LED chip is the approximate number of LED display pel spacing, compartment of terrain (spacing distance=display screen matrix is answered Spacing) peel off green LED chip, thus on the substrate peeled off on still leave green LED chip, with repeat the process, until The upper surface of redgreen LED chip and whole first transparent dielectric layer 101 is paved with green LED chip on substrate.

As shown in Figure 10, layer of transparent dielectric material is covered in the second LED chip 12 and is solidified, it is saturating to obtain second Bright dielectric layer 102, makes it have flat surface.

As shown in figure 11, the second connecting hole 133 is formed in the first transparent dielectric layer 101 and the second transparent dielectric layer 102, Insertion sets the 3rd electrode wiring layer 132 to substrate 100, then by blue-ray LED crystal circle structure and the 3rd electrode wiring layer 132 bondings；If the spacing of blue LED die (i.e. the 3rd LED chip 13) is identical with LED display pel spacing, can be direct Whole substrate is peeled off, blue-light LED chip is fixed on the upper surface of the second transparent dielectric layer 102, the process repeats, so that blue light LED chip is paved with whole upper surface.If the spacing of blue-light LED chip is the approximate number of LED display pel spacing, compartment of terrain is answered (spacing distance=display screen matrix spacing) peels off blue-light LED chip, thus blue-ray LED core is still left on the substrate peeled off Piece, to repeat the process, until the upper surface without blue-light LED chip and whole second transparent dielectric layer 102 is paved with indigo plant on substrate Light LED chip.

As shown in figure 11, layer of transparent dielectric material is covered in the 3rd LED chip 13 and is solidified, it is saturating to obtain the 3rd Bright dielectric layer 103, makes it have flat surface.

As can be seen from the above description, the utility model the above embodiments realize following technique effect：Have The LED chip of different glow colors is separated and be located in different layers by transparent dielectric layer, so as to pass through chip transfer techniques Chip structure on same chip is shifted simultaneously, and then obtained by shifting process three times luminous with tri- kinds of RGB The LED display unit of color, above-mentioned LED display unit can not only realize full-color light-emitting, but also can be by chip The basal body structure of reduced size is prepared, makes the LED chip in LED display unit that there is super-small after the transfer process, effectively Ground reduces the Pixel Dimensions of LED display unit；Also, each display unit is respectively provided with transparent dielectric layer as protection, so that LED display unit can have higher reliability.

Preferred embodiment of the present utility model is the foregoing is only, is not limited to the utility model, for this For the technical staff in field, the utility model can have various modifications and variations.It is all in the spirit and principles of the utility model Within, any modification, equivalent substitution and improvements made etc., it should be included within the scope of protection of the utility model.

Claims (11)

1. a kind of full-color LED display unit, including substrate (100) and IC chip, it is characterised in that the all-colour LED display is single Member also includes：

Transparent dielectric layer, it is arranged on the first surface of the substrate (100), the remote substrate of the transparent dielectric layer (100) surface is the 4th surface；

First LED chip group, set on the first surface and covered by the transparent dielectric layer, first LED chip Plane where the surface of the remote first surface of group is second surface；

Second LED chip group, it is arranged on more than the second surface and is covered by the transparent dielectric layer, first LED core Plane where the surface of the remote first surface of piece group is the 3rd surface；

3rd LED chip group, it is arranged on more than 3rd surface and is covered by the transparent dielectric layer, or is arranged on described On four surfaces,

The first LED chip group includes at least one first LED chip (11), and the second LED chip group includes at least one Individual second LED chip (12), the 3rd LED chip group include at least one 3rd LED chip (13), and each described first LED chip (11), each second LED chip (12) and each 3rd LED chip (13) electrically connect with the IC chip, First LED chip (11), second LED chip (12) are different with the emission wavelength of the 3rd LED chip (13).

2. full-color LED display unit according to claim 1, it is characterised in that the transparent dielectric layer includes：

First transparent dielectric layer (101), is covered in the substrate (100) and first LED chip (11) surface, and described first There is the first connecting hole (123), each second LED chip (12) passes through first connecting hole in transparent dielectric layer (101) (123) electrically connected with the IC chip；

Second transparent dielectric layer (102), it is covered in first transparent dielectric layer (101) and second LED chip (12) table Face, there is the second connecting hole (133), each institute in second transparent dielectric layer (102) and first transparent dielectric layer (101) The 3rd LED chip (13) is stated to electrically connect with the IC chip by second connecting hole (133).

3. full-color LED display unit according to claim 2, it is characterised in that the transparent dielectric layer also includes the 3rd Transparent dielectric layer (103), the 3rd transparent dielectric layer (103) are covered in second transparent dielectric layer (102) and described Three LED chips (13) surface.

4. full-color LED display unit according to claim 3, it is characterised in that first transparent dielectric layer (101), One side surface of the remote substrate (100) of second transparent dielectric layer (102) and the 3rd transparent dielectric layer (103) For plane.

5. full-color LED display unit according to claim 2, it is characterised in that the IC chip is located at the substrate (100) side of remote first LED chip (11), the substrate (100) have the 3rd connecting hole, the first LED Chip (11) is electrically connected by the 3rd connecting hole with the IC chip, and second LED chip (12) passes through described first Connecting hole (123) and the 3rd connecting hole electrically connect with the IC chip, and the 3rd LED chip (13) passes through described second Connecting hole (133) and the 3rd connecting hole electrically connect with the IC chip.

6. full-color LED display unit according to claim 5, it is characterised in that first LED chip (11) includes edge The first electrode (111) and the first sub- epitaxial layer (113) that direction order away from the substrate (100) is set, and it is described full-color LED display unit also includes：

First electrode wiring layer (112), it is arranged between the substrate (100) and first LED chip (11), for by institute The 3rd connecting hole is stated to electrically connect with the first electrode (111)；

Second LED chip (12) include along away from the substrate (100) direction order set second electrode (121) and Second sub- epitaxial layer, and the full-color LED display unit also includes：

Second electrode wiring layer (122), be arranged at first transparent dielectric layer (101) and second LED chip (12) it Between, for first connecting hole (123) to be electrically connected with the second electrode (121)；

3rd LED chip (13) include along away from the substrate (100) direction order set the 3rd electrode (131) and 3rd sub- epitaxial layer, and the full-color LED display unit also includes：

3rd electrode wiring layer (132), be arranged at second transparent dielectric layer (102) and the 3rd LED chip (13) it Between, for second connecting hole (133) to be electrically connected with the 3rd electrode (131).

7. full-color LED display unit according to claim 6, it is characterised in that the first electrode (111), described Two electrodes (121) and the 3rd electrode (131) independently are ITO layer, ZnO layer or graphene layer.

8. full-color LED display unit according to claim 1, it is characterised in that first LED chip (11), described Second LED chip (12) and the 3rd LED chip (13) are respectively selected from red LED chips, green LED chip and blue led Chip.

9. full-color LED display unit according to claim 8, it is characterised in that first LED chip (11) is red LED chip, second LED chip (12) is green LED chip and the 3rd LED chip (13) is blue LED die, or Second LED chip (12) is blue LED die and the 3rd LED chip (13) is green LED chip.

10. full-color LED display unit according to claim 1, it is characterised in that the full-color LED display unit also wraps TFT structure and TFT electrode wiring layers are included, the TFT structure may be contained within the substrate (100) with the TFT electrode wiring layers Between the first LED chip group, and the TFT electrode wiring layers are arranged at the remote substrate of the TFT structure (100) side, the TFT structure, each first LED chip (11), each second LED chip (12), each described Three LED chips (13) and the IC chip electrically connect with the TFT electrode wiring layers.

11. full-color LED display unit according to claim 1, it is characterised in that the substrate (100) is close to described the One side surface of one LED chip group has CMOS structure, and the full-color LED display unit also includes CMOS electrode wiring layers, institute CMOS electrode wiring layers are stated to be arranged between the CMOS structure and the first LED chip group, and the CMOS structure, each institute State the first LED chip (11), each second LED chip (12), each 3rd LED chip (13) and the IC chip with The CMOS electrode wiring layers electrical connection.