CN110446796A - Cu-Ni-Si series copper alloy strip and its manufacturing method - Google Patents
Cu-Ni-Si series copper alloy strip and its manufacturing method Download PDFInfo
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- CN110446796A CN110446796A CN201880022125.0A CN201880022125A CN110446796A CN 110446796 A CN110446796 A CN 110446796A CN 201880022125 A CN201880022125 A CN 201880022125A CN 110446796 A CN110446796 A CN 110446796A
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- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 36
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 title claims abstract description 27
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000007864 aqueous solution Substances 0.000 claims abstract description 11
- 229910017604 nitric acid Inorganic materials 0.000 claims abstract description 11
- 239000010949 copper Substances 0.000 claims abstract description 10
- 239000012535 impurity Substances 0.000 claims abstract description 5
- 230000032683 aging Effects 0.000 claims description 33
- 238000012545 processing Methods 0.000 claims description 21
- 238000005097 cold rolling Methods 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 14
- 238000005266 casting Methods 0.000 claims description 5
- 238000005098 hot rolling Methods 0.000 claims description 5
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 229910052749 magnesium Inorganic materials 0.000 claims description 4
- 229910052748 manganese Inorganic materials 0.000 claims description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 abstract description 21
- 229920005989 resin Polymers 0.000 abstract description 21
- 230000005764 inhibitory process Effects 0.000 abstract description 3
- 230000006978 adaptation Effects 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 239000002244 precipitate Substances 0.000 description 11
- 238000005554 pickling Methods 0.000 description 9
- 230000035882 stress Effects 0.000 description 9
- 229910005883 NiSi Inorganic materials 0.000 description 8
- 238000000137 annealing Methods 0.000 description 8
- 229910018098 Ni-Si Inorganic materials 0.000 description 7
- 229910018529 Ni—Si Inorganic materials 0.000 description 7
- 229910052759 nickel Inorganic materials 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000002390 adhesive tape Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 238000001556 precipitation Methods 0.000 description 5
- 238000004873 anchoring Methods 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 239000002210 silicon-based material Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000036961 partial effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229910021332 silicide Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000004061 bleaching Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005480 shot peening Methods 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0016—Apparatus or processes specially adapted for manufacturing conductors or cables for heat treatment
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Abstract
The present invention, which provides, makes intensity raising and the generation of moderate inhibition dirt, Cu-Ni-Si series copper alloy strip and its manufacturing method with the excellent adhesion of resin.Cu-Ni-Si series copper alloy strip of the invention, it contains mass %, Si:0.4 of Ni:1.5 ~ 4.5 ~ 1.1 mass %, and surplus is made of Cu and inevitable impurity, conductivity is 30%IACS or more, tensile strength is 800MPa or more, after impregnating it 10 seconds in 40wt% aqueous solution of nitric acid at room temperature, the L of JIS-Z8781:2013 defined*a*b*Brightness L in color specification system*It is 50 ~ 75.
Description
Technical field
The present invention relates to can be suitable for manufacturing the Cu-Ni-Si series copper alloy strip and its system of the electronic components such as electronic material
Make method.
Background technique
In recent years, with the miniaturization of IC package body, it is desirable that lead frame, the various terminals of electronic equipment, connector etc.
Miniaturization and then more pins.Especially, referred to as QFN(quad flat non-pin package, Quad Flat Non- are developed
Leaded package) configure electrode pad on the ground pad of LSI packaging body and do not expose the structure of lead pin, into
One step requires more pins, thin space.It needs to carry out using etching micro- to make these lead frames etc. realize more pins
Fining-off it is therefore desirable to improve the intensity of the copper alloy as material, and improves etching, plating adaptation, resin closed
Deng.From such case, the Cu-Ni-Si series copper alloy of Precipitation type is developed.
However, implement pickling as pre-treatment when Cu-Ni-Si series copper alloy is used for the electronic components such as lead frame, but
Sometimes in pickling, Ni-Si based compound is occurred oxidation and is remained on material surface in the form of dirt.If the residual of the dirt
Object become it is more, then sometimes be clipped in the assembling procedure of IC package body between lead frame and mold resin and make resin closed reduce
Or reduce the adaptation of slicken solder, plating.
Thus propose following technology: by controlling the partial size of the Ni-Si system precipitate of Cu-Ni-Si series copper alloy, limiting
The content of Ni and Si inhibits dirt when pickling to remain, and thus improves soft soldering adaptation and plating (patent document 1).
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 8-319527 bulletin.
Summary of the invention
Subject to be solved by the invention
However, in the case where technology described in Patent Document 1, in order to improve soft soldering adaptation and plating, it is desirable to utilize acid
It washes and substantially completely removes NiSi dirts.Therefore there are the following problems: the material surface exposed after pickling hardly because
Precipitate and generate bumps, by bumps realize anchoring effect reduce, it is poor with the adaptation of resin.Thus, for example to above-mentioned IC
The adaptation of lead frame and mold resin in the assembling procedure of packaging body impacts.
That is, the present invention makes in order to solve the above problems, intensity and moderate inhibition are improved it is intended that providing
The generation of dirt, Cu-Ni-Si series copper alloy strip and its manufacturing method with the excellent adhesion of resin.
The method used for solving the problem
The inventors of the present invention have carried out various researchs, as a result, it has been found that: dirt is excessively generated in the pickling of Cu-Ni-Si series copper alloy strip
State of the object until stratiform is presented can make resin closed reduction, real by NiSi precipitate even if dirt is excessively removed
Existing bumps can also disappear, and be reduced by the anchoring effect that bumps are realized, reduce with the adaptation of resin.In other words it finds: passing through
Remain dirt moderately, concave-convex surface can remain, and improve with the adaptation of resin.In addition it finds: as in this wise
The method for inhibiting dirt to generate, adjustment manufacture solutionizing treatment conditions when copper alloy bar.
That is, Cu-Ni-Si series copper alloy strip of the invention contains mass %, Si:0.4 of Ni:1.5 ~ 4.5 ~ 1.1 mass %, and remaining
Amount is made of Cu and inevitable impurity, and conductivity is 30%IACS or more, tensile strength is 800MPa or more, makes it in room
After being impregnated 10 seconds in 40wt% aqueous solution of nitric acid under temperature, the L of JIS-Z8781:2013 defined*a*b*Brightness L in color specification system*
It is 50 ~ 75.
In turn, preferably comprise add up to 0.005 ~ 0.8 mass % one or more of selected from Mg, Fe, P, Mn, Co and Cr.
In the manufacturing method of Cu-Ni-Si series copper alloy strip of the invention, to containing mass %, Si:0.4 of Ni:1.5 ~ 4.5 ~
The ingot casting for the Cu-Ni-Si series copper alloy strip that 1.1 mass % and surplus are made of Cu and inevitable impurity carries out hot rolling, cold rolling
Afterwards, it successively carries out solutionizing processing, ageing treatment, and then cold rolling after ageing treatment is carried out with 40% or more degree of finish, in adjustment
Solutionizing processing is stated, so that by the material after above-mentioned solutionizing processing and before above-mentioned ageing treatment at room temperature in 40wt% nitric acid
After impregnating 10 seconds in aqueous solution, the L of JIS-Z8781:2013 defined is measured*a*b*Brightness L in color specification system*When reach 40 ~
70。
The effect of invention
In accordance with the invention it is possible to obtain intensity height, the generation of moderate inhibition dirt, the Cu-Ni-Si with the excellent adhesion of resin
Series copper alloy strip.
Specific embodiment
Hereinafter, being illustrated for Cu-Ni-Si series copper alloy strip described in embodiments of the present invention.It needs to illustrate
It is that in the present invention, % indicates quality % in case of no particular description.
Firstly, being illustrated for the restriction reason of the composition of copper alloy bar.
<Ni and Si>
Ni and Si is formed by carrying out ageing treatment, Ni and Si with fine Ni2The precipitation grain of intermetallic compound based on Si
Son dramatically increases the intensity of alloy.In addition, with the Ni in ageing treatment2The precipitation of Si, electric conductivity improve.Wherein, in Ni
In the case that the case where concentration is less than 1.5% or Si concentration are less than 0.4%, even if adding another ingredient, also it cannot get desired
Intensity.In addition, the case where Ni concentration is more than 4.5% or in the case that Si concentration is more than 1.1%, although can obtain adequately strong
Degree, but electric conductivity is lower, and then coarse Ni-Si system particle (crystal and the precipitation for being helpless to improve intensity are generated in parent phase
Object), cause bendability, etching and plating to reduce.Thus, the content of Ni is set as 1.5 ~ 4.5%, by the content of Si
It is set as 0.4 ~ 1.1%.It is preferred that the content of Ni is set as 1.6 ~ 3.0%, the content of Si is set as 0.4 ~ 0.7%.
<other elements>
In turn, for intensity, the heat resistance, proof stress slackness for improving alloy the purpose of, above-mentioned alloy can further contain
Add up to 0.005 ~ 0.8 mass % is selected from one or more of Mg, Fe, P, Mn, Co and Cr.If the total amount of these elements is small
In 0.005 mass %, then said effect is not generated, if more than 0.8 mass %, it is conductive although desired characteristic can be obtained
Property, bendability reduce sometimes.
<conductivity and tensile strength TS>
The conductivity of Cu-Ni-Si series copper alloy strip described in embodiments of the present invention is 30%IACS or more, tensile strength TS
For 800MPa or more.
With the increase of the working frequency of semiconductor element, the fever caused by being powered increases, therefore, by copper alloy bar
Conductivity is set as 30%IACS or more.
In addition, the deformation of lead frame etc. when routing engages in order to prevent, maintaining shape, tensile strength TS is set as
800MPa or more.
<brightness L*>
Cu-Ni-Si series copper alloy strip described in embodiments of the present invention impregnates 10 in 40wt% aqueous solution of nitric acid at room temperature
After second, the L of JIS-Z8781:2013 defined*a*b*Brightness L in color specification system*It is 50 ~ 75.
If sample is made to be impregnated in aqueous solution of nitric acid, become in the color of specimen surface generation, entrapped contaminants, specimen surface
Secretly.Thus, by measuring the tone of specimen surface, it is capable of deciding whether to generate dirt.
If brightness L*Close to 0 blackening, if close to bleaching if 100.
After impregnating Cu-Ni-Si series copper alloy strip described in embodiments of the present invention in aqueous solution of nitric acid
Brightness L*It is 50 ~ 75, the concavo-convex surface that material surface after pickling moderately remains NiSi precipitate can be obtained, passed through
Anchoring effect and keep it good with the adaptation of resin.
On the other hand, if brightness L*Less than 50, then dirt is largely generated after pickling and with stratiform covering material surface, because of dirt
The removing of nitride layer and copper alloy layer and cause resin closed reduction.Brightness L*When more than 75, cause dirt by mistake because of pickling
Degree removal, the NiSi precipitate on surface become smaller, and concave-convex surface becomes smaller.As a result, cannot get anchoring effect or because of material surface
The surface area of copper alloy (matrix) improve and promote the oxide growth of Cu, which drops with the adaptation of resin
It is low.
As by the brightness L of copper alloy bar*It controls to 50 ~ 75 method, the aftermentioned solutionizing processing item of adjustment can be enumerated
The method of part.It is detailed in for solutionizing treatment conditions aftermentioned.
<manufacture of Cu-Ni-Si series copper alloy strip>
Cu-Ni-Si series copper alloy strip described in embodiments of the present invention usually can be by successively carrying out hot rolling, cold to ingot casting
It rolls, solutionizing processing, ageing treatment, cold rolling after timeliness, stress relief annealing manufacture.Cold rolling before solutionizing processing not must
Must, it can also implement as needed.In addition, also cold rolling can be implemented as needed after solutionizing processing and before ageing treatment.
Grinding, grinding, shot-peening, the pickling etc. for removing surface scale can be suitably carried out between above-mentioned each process.
Solutionizing processing is to be solid-solution in the silicides such as Ni-Si based compound in Cu matrix, while making Cu matrix that weight occur
The heat treatment of crystallization.
In the manufacturing method of Cu-Ni-Si series copper alloy strip described in embodiments of the present invention, adjustment solutionizing handles item
Part, so that after the material after solutionizing is handled and before ageing treatment impregnates 10 seconds in 40wt% aqueous solution of nitric acid at room temperature,
Measure the L of JIS-Z8781:2013 defined*a*b*Brightness L in color specification system*When reach 40 ~ 70.
By adjusting solutionizing treatment conditions as described above, so that the Ni and Si that become dirt reason are moderately dissolved extremely
In Cu, the amount of NiSi precipitate is controlled neither too much nor too little, as a result, it is possible to by the brightness of gained Cu-Ni-Si series copper alloy strip
L*It controls to 50 ~ 75.
The brightness L of solutionizing treated material*When less than 40, solutionizing processing is insufficient, becomes the NiSi analysis of dirt
The amount of object becomes excessive out.
The brightness L of solutionizing treated material*When more than 70, solutionizing processing is become over, and becomes the NiSi of dirt
The amount of precipitate becomes very few.
It should be noted that the temperature and time of solutionizing processing is controlled in order to change solutionizing treatment conditions, but
Do not provide specific solutionizing processing temperature and time be because are as follows: the amount of the Ni-Si based compound before solutionizing processing, partial size
Before the additive amount of Ni, Si in copper alloy bar etc., solutionizing processing the condition of process due to it is different.
<ageing treatment>
In ageing treatment, make to handle the silicide being dissolved as with Ni by solutionizing2Change between metal based on Si
It closes the minuteness particle of object and is precipitated.Increase intensity and conductivity by the ageing treatment.Ageing treatment is using such as 375
~ 625 DEG C, 1 ~ 50 hour condition carry out, thus, it is possible to improve intensity.
In the case of aging time is small less than 1, the amount of precipitation of Ni-Si system precipitate is few sometimes, and intensity is insufficient.Separately
Outside, in the case of aging temp is more than 625 DEG C or aging time is more than 50 small, sometimes occur precipitate coarsening,
It is dissolved again, dirt yield increases or intensity becomes inadequate, and conductivity is lower.
<cold rolling>
Then, after ageing treatment, cold rolling (cold rolling after ageing treatment) is carried out with 40% or more degree of finish.
If carry out degree of finish be 40% or more cold rolling, by processing hardening make tensile strength reach 800MPa with
On.
If degree of finish is less than 40%, intensity is insufficient sometimes.
More preferably with cold rolling after 40 ~ 90% or more degree of finish progress ageing treatment.If degree of finish is more than 90%, sometimes by
Conductivity caused by processing strains significantly reduces, even if carrying out stress relief annealing, conductivity is also low.
The degree of finish of cold rolling is cold rolling generates after ageing treatment thickness relative to will carry out at timeliness after ageing treatment
The change rate of material thickness after reason before cold rolling.
The thickness of Cu-Ni-Si series copper alloy strip of the invention is not particularly limited, and can be set to such as 0.03 ~ 0.6mm.
<stress relief annealing>
Stress relief annealing can be carried out after cold rolling after ageing treatment.Stress relief annealing is using general condition
Can, it can be carried out under conditions of such as 300 DEG C ~ 550 DEG C, retention time are 5 seconds ~ 300 seconds.Thus, it is possible to remove in material
Residual stress.
Embodiment 1
The sample of each embodiment and each comparative example is made as follows.
Using cathode copper as raw material, the copper alloy of composition shown in melting table 1, table 2 is carried out using air melting furnace, is cast as thickness
Spend 20mm × width 60mm ingot casting.Hot rolling is carried out at 950 DEG C to the ingot casting, until plate thickness reaches 10mm.In hot rolling
Afterwards, it is successively ground, carries out cold rolling.
Then, using condition shown in table 1, table 2, solutionizing processing and ageing treatment are successively carried out.Thereafter, with table 1, table
Degree of finish shown in 2 carries out cold rolling after ageing treatment, until plate thickness reaches 0.150mm, carries out at 450 DEG C disappearing for 30 seconds
De-stress annealing, thus obtains sample.
<conductivity (%IACS)>
For gained sample, based on JIS H0505 and four-terminal method is utilized, the conductivity (%IACS) of 25 DEG C of measurement.
<tensile strength (TS)>
For gained sample, using cupping machine, according to JIS-Z2241, measure on the direction parallel with rolling direction respectively
Tensile strength (TS).Firstly, making JIS13B by each sample using pressuring machine in such a way that draw direction becomes rolling direction
Number test film.The condition of tension test is set as: the wide 12.7mm of test film, room temperature (15 ~ 35 DEG C), tensile speed 5mm/min, measurement
Length 50mm.
<brightness L*>
For solutionizing processing after and above-mentioned ageing treatment before sample and the sample after stress relief annealing single side, in room
After being impregnated 10 seconds in 40wt% aqueous solution of nitric acid under temperature, rinsed with flowing water.For treated specimen surface, colour difference meter is used
Find out brightness L*.
Colour difference meter is measured using the CR-200 of KONICA MINOLTA INC..
<adaptation with resin>
It is 100mm and after width is 20mm that sample after stress relief annealing, which is cut into the length of rolling parallel direction, for examination
The single side of sample is rinsed after impregnating 10 seconds in 40wt% aqueous solution of nitric acid at room temperature with flowing water.Then, for the sample, In
Implement atmosphere heating in 5 minutes at 240 DEG C.After atmosphere heating, acidproof glue is pasted in the range of the length 60mm of above-mentioned single side
It is removed after band, the adhesive surface of acidproof adhesive tape is found out by image procossing, and whether there is or not attachments.Specifically, by acidproof adhesive tape
Adhesive surface image carry out binaryzation, calculate become attachment black image region the gross area relative to acidproof adhesive tape
The area ratio of adhesive surface is evaluated according to following benchmark.Excellent adhesion if being evaluated as zero, with resin.
Zero: the gross area of attachment is 10% or less the area of adhesive tape adhesive surface
×: the gross area of attachment is more than the 10% of the area of adhesive tape adhesive surface
Acquired results are shown in table 1.
It can be defined by table 1: in brightness L*For 50 ~ 75 each embodiment in the case where, intensity is high, and the adaptation with resin
It is excellent.
On the other hand, in brightness L*It is poor with the adaptation of resin in the case where comparative example 1 more than 75.It can consider this
Be because are as follows: the NiSi precipitate of material surface is very few, and the Cu on surface oxidation is obvious, and surface film oxide is peeling-off, with resin
Adaptation reduces.
In brightness L*In the case where comparative example 2 less than 50, dirt generation quantitative change is more, poor with the adaptation of resin.
In the case that the degree of finish of cold rolling is more than 90% comparative example 3 after ageing treatment, conductivity is less than 30%IACS.
After ageing treatment in the case where comparative example 4 of the degree of finish of cold rolling less than 40%, tensile strength is less than 800MPa.
In the case where the content of Ni and Si is more than comparative example 5 of prescribed limit, conductivity is less than 30%IACS.
Containing total comparative example 7 selected from one or more of Mg, Fe, P, Mn, Co and Cr more than 0.8 mass %
In the case of, conductivity is less than 30%IACS.
In the case where comparative example 10 less than 1 hour of comparative example 8 of the aging temp less than 625 DEG C and aging time, it is in
Existing Asia timeliness, tensile strength are less than 800MPa.
In the case where aging temp is more than 625 DEG C of comparative example 9 and aging time is more than 50 hours comparative example 11, it is in
Existing overaging, tensile strength are less than 800MPa.In addition, Ni-Si system precipitate is precipitated significantly, brightness L*It is less than
50, dirt generation quantitative change is more, poor with the adaptation of resin.
Claims (3)
1. Cu-Ni-Si series copper alloy strip, containing Ni:1.5 ~ 4.5 mass %, Si:0.4 ~ 1.1 mass %, and surplus by Cu and
Inevitable impurity composition,
Conductivity is 30%IACS or more, and tensile strength is 800MPa or more,
After impregnating it 10 seconds in 40wt% aqueous solution of nitric acid at room temperature, the L of JIS-Z8781:2013 defined*a*b*Table color
Brightness L in system*It is 50 ~ 75.
2. Cu-Ni-Si series copper alloy strip according to claim 1 also contains the choosing for adding up to 0.005 ~ 0.8 mass %
From one or more of Mg, Fe, P, Mn, Co and Cr.
3. the manufacturing method of Cu-Ni-Si series copper alloy strip, wherein to contain mass %, Si:0.4 of Ni:1.5 ~ 4.5 ~ 1.1 matter
After the ingot casting for the Cu-Ni-Si series copper alloy strip that amount % and surplus are made of Cu and inevitable impurity carries out hot rolling, cold rolling, according to
Secondary progress solutionizing processing, ageing treatment, so with 40% or more degree of finish carry out ageing treatment after cold rolling,
The solutionizing processing is adjusted, so that the material after solutionizing processing and before the ageing treatment is existed at room temperature
After impregnating 10 seconds in 40wt% aqueous solution of nitric acid, the L of JIS-Z8781:2013 defined is measured*a*b*Brightness L in color specification system*When
Reach 40 ~ 70.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210264105.2A CN114606410A (en) | 2017-03-30 | 2018-03-23 | Cu-Ni-Si-based copper alloy strip and method for producing same |
| CN202311529623.3A CN117551910A (en) | 2017-03-30 | 2018-03-23 | Cu-Ni-Si copper alloy strip and method for producing same |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017067999A JP6811136B2 (en) | 2017-03-30 | 2017-03-30 | Cu-Ni-Si based copper alloy strip and its manufacturing method |
| JP2017-067999 | 2017-03-30 | ||
| PCT/JP2018/011573 WO2018180940A1 (en) | 2017-03-30 | 2018-03-23 | Cu-Ni-Si-BASED COPPER ALLOY STRIP AND METHOD FOR MANUFACTURING SAME |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210264105.2A Division CN114606410A (en) | 2017-03-30 | 2018-03-23 | Cu-Ni-Si-based copper alloy strip and method for producing same |
| CN202311529623.3A Division CN117551910A (en) | 2017-03-30 | 2018-03-23 | Cu-Ni-Si copper alloy strip and method for producing same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110446796A true CN110446796A (en) | 2019-11-12 |
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| CN202311529623.3A Pending CN117551910A (en) | 2017-03-30 | 2018-03-23 | Cu-Ni-Si copper alloy strip and method for producing same |
| CN201880022125.0A Pending CN110446796A (en) | 2017-03-30 | 2018-03-23 | Cu-Ni-Si series copper alloy strip and its manufacturing method |
| CN202210264105.2A Pending CN114606410A (en) | 2017-03-30 | 2018-03-23 | Cu-Ni-Si-based copper alloy strip and method for producing same |
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| JP (1) | JP6811136B2 (en) |
| KR (1) | KR102285168B1 (en) |
| CN (3) | CN117551910A (en) |
| TW (1) | TWI647320B (en) |
| WO (1) | WO2018180940A1 (en) |
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| KR102640972B1 (en) | 2021-05-28 | 2024-02-23 | 부산대학교 산학협력단 | Manufacturing method for copper with surface coated silicon, copper with permanent oxidation resistance by silicon-coated surface thereof and semiconductor system thereof |
| KR20230153295A (en) | 2022-04-28 | 2023-11-06 | 부산대학교 산학협력단 | Iron with permanent oxidation resistance by silicon-coated surface and manufacturing method for iron with permanent oxidation resistance by silicon-coated surface |
| KR20230153296A (en) | 2022-04-28 | 2023-11-06 | 부산대학교 산학협력단 | Nickel with permanent oxidation resistance by silicon-coated surface and manufacturing method for nickel with permanent oxidation resistance by silicon-coated surface |
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| JP3056394B2 (en) | 1995-05-25 | 2000-06-26 | 株式会社神戸製鋼所 | Copper alloy excellent in solder adhesion and plating properties and easy to clean, and method for producing the same |
| JP5468423B2 (en) * | 2010-03-10 | 2014-04-09 | 株式会社神戸製鋼所 | High strength and high heat resistance copper alloy material |
| JP6223057B2 (en) * | 2013-08-13 | 2017-11-01 | Ｊｘ金属株式会社 | Copper alloy sheet with excellent conductivity and bending deflection coefficient |
| JP6301618B2 (en) * | 2013-09-17 | 2018-03-28 | 古河電気工業株式会社 | Copper alloy material and method for producing the same |
| TWI621721B (en) * | 2014-07-10 | 2018-04-21 | Furukawa Electric Co Ltd | Copper alloy sheet, connector, and method for manufacturing copper alloy sheet |
| JP6328166B2 (en) * | 2015-03-30 | 2018-05-23 | Ｊｘ金属株式会社 | Cu-Ni-Si rolled copper alloy and method for producing the same |
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2017
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- 2018-03-23 CN CN202210264105.2A patent/CN114606410A/en active Pending
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| KR20190112059A (en) | 2019-10-02 |
| TWI647320B (en) | 2019-01-11 |
| CN117551910A (en) | 2024-02-13 |
| KR102285168B1 (en) | 2021-08-04 |
| WO2018180940A1 (en) | 2018-10-04 |
| TW201840870A (en) | 2018-11-16 |
| JP2018168437A (en) | 2018-11-01 |
| JP6811136B2 (en) | 2021-01-13 |
| CN114606410A (en) | 2022-06-10 |
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