CN110446341A - A kind of resistive conductor is attached to the wiring board and preparation method thereof of double-sided circuit back - Google Patents
A kind of resistive conductor is attached to the wiring board and preparation method thereof of double-sided circuit back Download PDFInfo
- Publication number
- CN110446341A CN110446341A CN201810445850.0A CN201810445850A CN110446341A CN 110446341 A CN110446341 A CN 110446341A CN 201810445850 A CN201810445850 A CN 201810445850A CN 110446341 A CN110446341 A CN 110446341A
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- CN
- China
- Prior art keywords
- resistive conductor
- circuit
- attached
- conducting
- double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The present invention relates to the wiring boards and preparation method thereof that a kind of resistive conductor is attached to double-sided circuit back, specifically, after Double-side line back cover film punching, resistive conductor is attached to glue surface with line machine is covered, then cover film is attached to route back again, resistive conductor is clipped in film, hole location and the front-side circuit conducting that resistive conductor passes through dual platen, either pad of the resistive conductor overleaf at cover film hole location and hole location forms conducting, it has been fabricated to the wiring board that resistive conductor is attached to double-sided circuit back, resistive conductor is clipped between back-side circuit and the back side cover film Chip-R or straight cutting resistance when replacing the production of postorder light bar by the present invention in advance, it is at low cost, heat dispersion, appearance is more beautiful.
Description
Technical field
The present invention relates to field of circuit boards, and in particular to a kind of resistive conductor be attached to double-sided circuit back wiring board and its
Production method.
Background technique
Traditional LED light strip is all to take to form welding of connecting with LED with Chip-R either pin resistance, plays partial pressure
Effect, it is at high cost, and also resistance heating is concentrated very much, is easy to cause the LED close to resistance to overheat and dead lamp, and light bar surface has
Resistance appearance is unsightly.
For the defect more than overcoming the shortcomings of, the present invention in advance by resistive conductor be clipped in back-side circuit and back side cover film it
Between Chip-R or straight cutting resistance when replacing the production of postorder light bar, at low cost, heat dispersion, appearance is more beautiful.
Summary of the invention
The present invention relates to the wiring boards and preparation method thereof that a kind of resistive conductor is attached to double-sided circuit back, specifically,
After Double-side line back cover film punching, resistive conductor is attached to glue surface with line machine is covered, cover film is then attached to route again
Back, resistive conductor are clipped in film, and resistive conductor is existed by hole location and the front-side circuit conducting of dual platen or resistive conductor
Pad at back side cover film hole location and hole location forms conducting, that is, has been fabricated to resistive conductor and has been attached to double-sided circuit back
Resistive conductor is clipped between back-side circuit and the back side cover film patch electricity when replacing the production of postorder light bar by wiring board, the present invention in advance
Resistance or straight cutting resistance, at low cost, heat dispersion, appearance is more beautiful.
Provide the production method that a kind of resistive conductor is attached to the wiring board of double-sided circuit back according to the present invention, it is specific and
Speech, after Double-side line back cover film punching, sticks resistive conductor, cover film is then attached to route back, resistance again
In film, resistive conductor is connected by the hole location and front-side circuit of dual platen or is resistive conductor overleaf cover film wire clamp
Backside pads at hole location and hole location form conducting, and conducting of the resistive conductor between hole location and circuit board is to use conductive oil
Ink or conductive glue connection board metal surface are connected or are to weld conducting with welding manner and circuit board solder joint, that is, make
The wiring board of double-sided circuit back is attached at resistive conductor.
The wiring board that a kind of resistive conductor is attached to double-sided circuit back is additionally provided according to the present invention, comprising: back side covering
Film；The resistive conductor being clipped in the cover film of the back side；The copper foil circuit being clipped under the cover film of the back side；Intermediate insulating layer；Front-side circuit layer；
Front solder mask；It is characterized in that, resistive conductor is clipped in back side film, resistive conductor passes through the hole location and front-side circuit of dual platen
The pad of conducting or resistive conductor overleaf at cover film hole location and hole location forms conducting, and resistive conductor is in hole location
Conducting between circuit board be with electrically conductive ink or the conducting of conductive glue connection board metal surface or be with welding manner and
The welding conducting of circuit board solder joint, wiring board are made of a cycle of the above structure, or by multiple weeks of the above structure
Phase joins end to end composition.
According to a preferred embodiment of the invention, a kind of resistive conductor is attached to the wiring board of double-sided circuit back,
It is characterized in that, the resistive conductor is either parallel arrangement on circuit boards a plurality of, it is more when having in a cycle
When the resistive conductor of item parallel arrangement, first resistive conductor is passed through with welding or be mutually bonded and be connected on electrically conductive ink or conducting resinl
Together, resistance is connected to welding or electrically conductive ink or conducting resinl again after perhaps putting up a bridge at hole by circuit board copper circuit
Line and copper circuit, make resistive conductor be connected together in series, then after series connection resistive conductor both ends and board circuit layer formation lead
It is logical.
According to a preferred embodiment of the invention, a kind of resistive conductor is attached to the wiring board of double-sided circuit back,
It is characterized in that, the resistive conductor is wound around the either pure metallic resistance line of the winding metallic resistance line on insulated wire.
According to a preferred embodiment of the invention, a kind of resistive conductor is attached to the wiring board of double-sided circuit back,
It is characterized in that, the resistive conductor is the enamel-cover metal wire that there is coast of paint on surface, paint removal is gone in both ends junction.
According to a preferred embodiment of the invention, a kind of resistive conductor is attached to the wiring board of double-sided circuit back,
It is characterized in that, the resistive conductor is nichrome or is nichrome or is nichrome aluminum alloy or is iron
Cr-Al alloy or copper alloy silk.
In the description below to the drawings and specific embodiments, the thin of one or more embodiments of the invention will be illustrated
Section.
Detailed description of the invention
By reading this specification in conjunction with the following drawings, features, objects and advantages of the invention will become more to show and easy
See, it is as follows to the brief description of accompanying drawing.
Fig. 1 is the floor map for the wiring board that resistive conductor is attached to double-sided circuit back.
Fig. 2 is section of the resistive conductor in conducting connection hole after resistive conductor is clipped between back side cover film and back-side circuit
Schematic diagram.
Fig. 3 is after resistive conductor is clipped between back side cover film and back-side circuit, and section of the resistive conductor at conducting pad shows
It is intended to.
Specific embodiment
The present invention will be described in detail by taking preferred embodiment as an example below.
It should be appreciated to those skilled in the art that as described below be merely illustrative and describe some preferred implementation sides
Formula to claim of the invention and does not have any restrictions.
After Double-side line back cover film 1.1 is gone out hole with mold, then with covering line machine for 2.1 alignment hole of resistive conductor
Position is attached to the one side that cover film 1.1 has glue in parallel, is formed at 2.1 through hole of resistive conductor vacantly, then again by back side cover film
1.1 contrapositions are attached on the back-side circuit 1.2 of wiring board, and resistive conductor 2.1 is clipped between back side cover film 1.1 and back-side circuit 1.2,
Expose at the hole of back side cover film 1.1 in end or close to the resistive conductor 2.1 at tip position, exposes at resistive conductor 2.1
One is conductings connecting hole (as shown in Figure 2) above, and one is conductings to connect pad (as shown in Figure 3), in the resistive conductor of exposing
Conductive silver oil 2.2 is printed into hole with steel mesh at 2.1, one is resistive conductors 2.1 to pass through the hole location of dual platen and front
Circuit 1.4 is by the 2.2 bonding conducting (as shown in Figure 2) of conductive silver oil, and one is the overleaf cover film hole locations of resistive conductor 2.1
With conducting pad by the 2.2 bonding conducting (as shown in Figure 3) of conductive silver oil, when the resistance for having a plurality of parallel arrangement in a cycle
When line 2.1, first resistive conductor 2.1 is passed through and is cascaded with bonding, or through circuit board copper circuit after bridging at hole, then
It is connected to resistive conductor 2.1 and back-side circuit 1.2 with conductive silver oil 2.2, so that resistive conductor string 2.1 is connected together, then after series connection
Resistive conductor both ends and board circuit layer formed conducting, be placed in 150 degree of ovens and be heating and curing, make back side glue and silver oil together
Solidification, then surface anti-oxidation processing is carried out by the pad 1.6 of OSP production line pair, it is fabricated to resistive conductor and is attached to double-sided PCB
The wiring board (as shown in Figure 1, Figure 2, Figure 3 shows) at the back side, in Fig. 1, Fig. 2, mark 1.3 is intermediate insulating layer, and mark 1.5 is front
Circuit layer.
Resistive conductor is clipped between back-side circuit and the back side cover film patch when replacing the production of postorder light bar by the present invention in advance
Resistance or straight cutting resistance, at low cost, heat dispersion, appearance is more beautiful.
Above in conjunction with attached drawing by a kind of resistive conductor be attached to double-sided circuit back wiring board and preparation method thereof it is specific
The present invention is described in detail in embodiment.It will be understood by those skilled in the art, however, that described above is only to illustrate
Some specific embodiments are illustrated and described, to this with novel range, especially the scope of the claims, and are not had any
Limitation.
Claims (6)
1. the production method that a kind of resistive conductor is attached to the wiring board of double-sided circuit back, specifically, by Double-side line backboard
After the cover film punching of face, resistive conductor is sticked, cover film is then attached to route back again, resistive conductor is clipped in film, resistive conductor
It by the conducting of the hole location and front-side circuit of dual platen or is resistive conductor overleaf at cover film hole location and hole location
Backside pads form conducting, and conducting of the resistive conductor between hole location and circuit board is with electrically conductive ink or conductive glue connection circuit
Sheet metal metal surface be connected or be with welding manner and circuit board solder joint welding conducting, that is, be fabricated to resistive conductor be attached to it is two-sided
The wiring board of back of circuit board.
2. the wiring board that a kind of resistive conductor is attached to double-sided circuit back, comprising:
Back side cover film；
The resistive conductor being clipped in the cover film of the back side；
The copper foil circuit being clipped under the cover film of the back side；
Intermediate insulating layer；
Front-side circuit layer；
Front solder mask；
It is characterized in that, resistive conductor is clipped in back side film, resistive conductor is connected by the hole location and front-side circuit of dual platen, or
Person is that pad of the resistive conductor overleaf at cover film hole location and hole location forms conducting, and resistive conductor is in hole location and circuit board
Between conducting be with electrically conductive ink or the conducting of conductive glue connection board metal surface or welded with welding manner and circuit board
Spot welding conducting, wiring board are made of a cycle of the above structure, or by multiple period head and the tail phases of the above structure
Even form.
3. the wiring board that a kind of resistive conductor according to claim 1 or 2 is attached to double-sided circuit back, which is characterized in that
The resistive conductor is either parallel arrangement on circuit boards a plurality of, when having a plurality of parallel arrangement in a cycle
When resistive conductor, first resistive conductor is passed through with welding or be mutually bonded and be cascaded with electrically conductive ink or conducting resinl, Huo Zhetong
Oversampling circuit plate copper circuit is connected to resistive conductor and copper circuit after bridging at hole, then with welding or electrically conductive ink or conducting resinl,
So that resistive conductor is connected together in series, then after series connection resistive conductor both ends and board circuit layer formed conducting.
4. the wiring board that a kind of resistive conductor according to claim 1 or 2 is attached to double-sided circuit back, which is characterized in that
The resistive conductor is wound around the either pure metallic resistance line of the winding metallic resistance line on insulated wire.
5. the wiring board that a kind of resistive conductor according to claim 1 or 2 is attached to double-sided circuit back, which is characterized in that
The resistive conductor is the enamel-cover metal wire that there is coast of paint on surface, goes paint removal in both ends junction.
6. the wiring board that a kind of resistive conductor according to claim 1 or 2 is attached to double-sided circuit back, which is characterized in that
The resistive conductor be nichrome or be nichrome or be nichrome aluminum alloy or be Aludirome or
Person's copper alloy silk.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810445850.0A CN110446341A (en) | 2018-05-05 | 2018-05-05 | A kind of resistive conductor is attached to the wiring board and preparation method thereof of double-sided circuit back |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810445850.0A CN110446341A (en) | 2018-05-05 | 2018-05-05 | A kind of resistive conductor is attached to the wiring board and preparation method thereof of double-sided circuit back |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110446341A true CN110446341A (en) | 2019-11-12 |
Family
ID=68427333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810445850.0A Pending CN110446341A (en) | 2018-05-05 | 2018-05-05 | A kind of resistive conductor is attached to the wiring board and preparation method thereof of double-sided circuit back |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110446341A (en) |
-
2018
- 2018-05-05 CN CN201810445850.0A patent/CN110446341A/en active Pending
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