CN110416133B - Etching device for manufacturing semiconductor chip and application method thereof - Google Patents
Etching device for manufacturing semiconductor chip and application method thereof Download PDFInfo
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- CN110416133B CN110416133B CN201910799299.4A CN201910799299A CN110416133B CN 110416133 B CN110416133 B CN 110416133B CN 201910799299 A CN201910799299 A CN 201910799299A CN 110416133 B CN110416133 B CN 110416133B
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- 238000005530 etching Methods 0.000 title claims abstract description 41
- 239000004065 semiconductor Substances 0.000 title claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title claims abstract description 18
- 230000007246 mechanism Effects 0.000 claims abstract description 161
- 238000006243 chemical reaction Methods 0.000 claims abstract description 54
- 238000007639 printing Methods 0.000 claims abstract description 42
- 239000012295 chemical reaction liquid Substances 0.000 claims abstract description 19
- 230000007723 transport mechanism Effects 0.000 claims abstract description 11
- 238000003756 stirring Methods 0.000 claims description 28
- 238000001816 cooling Methods 0.000 claims description 17
- 238000001035 drying Methods 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 15
- 230000005540 biological transmission Effects 0.000 claims description 11
- 238000005096 rolling process Methods 0.000 claims description 9
- 238000002347 injection Methods 0.000 claims description 8
- 239000007924 injection Substances 0.000 claims description 8
- 238000005485 electric heating Methods 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 description 11
- 230000006872 improvement Effects 0.000 description 9
- 239000000243 solution Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 238000009835 boiling Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Die Bonding (AREA)
- Weting (AREA)
Abstract
The invention discloses an etching device for manufacturing a semiconductor chip and a using method thereof, wherein the etching device comprises a supporting mechanism, a conveying mechanism, a printing mechanism, a gas supply mechanism and a reaction mechanism; the transport mechanism is connected with the supporting mechanism and is used for driving the circuit board to be etched to move along a preset track; the printing mechanism, the air supply mechanism and the reaction mechanism are sequentially arranged, the printing mechanism, the air supply mechanism and the reaction mechanism are all arranged above the transportation mechanism, the output end of the air supply mechanism is connected with the input end of the reaction mechanism, when the circuit board moves to the lower part of the reaction mechanism, the air supply mechanism supplies high-pressure air to the reaction mechanism, and the reaction mechanism blows air to the circuit board. According to the invention, the transportation mechanism is used for driving the circuit board to move along the preset track, the printing mechanism is used for printing the circuit board, the air supply mechanism is used for supplying high-pressure air to the reaction mechanism, and when the circuit board moves to the reaction mechanism, the circuit board is cleaned by the high-pressure air, so that the transitional etching of reaction liquid is avoided, and the yield is greatly improved.
Description
Technical Field
The invention belongs to the field of semiconductor chip manufacturing, and particularly relates to an etching device for semiconductor chip manufacturing and a use method thereof.
Background
Etching is a technique in which material is removed using a chemical reaction or physical impact. Etching techniques can be classified into wet etching and dry etching. The method can be used for manufacturing printing embossing plates such as copper plates, zinc plates and the like at the earliest time, and is also widely used for processing weight-reducing instrument panels, nameplates, thin workpieces which are difficult to process by the traditional processing method and the like; the method can be used for processing electronic sheet parts precision etching products in aviation, machinery and chemical industries through continuous improvement and development of process equipment, and particularly is an indispensable technology in the semiconductor manufacturing process.
However, generally, when etching is performed, after the semiconductor board reacts in the reaction liquid, if the reaction liquid is not cleaned in time, a transitional etching phenomenon occurs, the defective rate is seriously increased, cleaning is also required after cleaning, and if ordinary air drying is adopted, the working efficiency is lowered.
Disclosure of Invention
In view of the above problems, the invention provides an etching device for manufacturing a semiconductor chip and a use method thereof, wherein high-pressure gas is used for cleaning a semiconductor circuit board, so that transitional etching of reaction liquid is avoided, the yield is improved, and after cleaning, the etching device can be dried and cooled quickly, and the processing efficiency is improved.
In order to achieve the technical purpose and achieve the technical effect, the invention is realized by the following technical scheme:
In a first aspect, the present invention provides an etching apparatus for manufacturing a semiconductor chip, comprising a supporting mechanism, a transporting mechanism, a printing mechanism, a gas supply mechanism, and a reaction mechanism;
the conveying mechanism is connected with the supporting mechanism and is used for driving the circuit board to be etched to move along a preset track;
The printing mechanism, the air supply mechanism and the reaction mechanism are sequentially arranged, the printing mechanism, the air supply mechanism and the reaction mechanism are all arranged above the transportation mechanism, the output end of the air supply mechanism is connected with the input end of the reaction mechanism, when the circuit board moves to the lower part of the reaction mechanism, the air supply mechanism supplies high-pressure air to the reaction mechanism, and the reaction mechanism blows air to the circuit board.
As a further improvement of the invention, the supporting mechanism comprises a base, a first supporting seat, a second supporting seat and a third supporting seat, wherein the first supporting seat, the second supporting seat and the third supporting seat are sequentially arranged on the base.
As a further improvement of the invention, the printing mechanism comprises a lifting cylinder, a lifting seat, a printing template, an electric sliding block, an ink box and a rolling brush;
The lifting cylinder is connected with the supporting mechanism; the lifting seat is connected with the lifting cylinder, and a sliding rail is arranged on the inner side of the lifting seat; the printing template is arranged on the lifting seat; the electric sliding block is arranged in the sliding rail and is connected with the ink box, and the rolling brush is connected with the lower end of the ink box and is in contact with the printing template.
As a further improvement of the invention, the transport mechanism comprises a track, a movable seat, a fixed frame, a motor, rollers and supporting wheels; the track is arranged on the supporting mechanism; the movable seat is connected with the track in a sliding manner; the fixed mount is arranged on the movable seat; the motor is connected with the fixing frame; the roller is sleeved on the outer side of the motor and driven by the motor; the supporting wheels are arranged opposite to the rollers and connected with the movable seat.
As a further improvement of the present invention, the etching apparatus for manufacturing semiconductor chips further includes a fixing mechanism including a transport plate for placing a circuit board and a fixing clip, the transport plate being connected to the movable base, the fixing clip being provided on the transport plate.
As a further improvement of the present invention, the air supply mechanism includes an air pipe, a transfer pipe, and an air pump; one end of the air pipe is connected with the reaction mechanism, and the other end of the air pipe is connected with the air pump through the transmission pipe.
As a further improvement of the invention, the reaction mechanism comprises a first high-pressure air jet tank, a second high-pressure air jet tank, a drying tank, a cooling tank, a reaction liquid tank and a water tank which are sequentially arranged; the first high-pressure air jet box, the second high-pressure air jet box, the drying box and the cooling box are respectively internally provided with a split-flow pipe, and the lower ends of the split-flow pipes are connected with a temperature-penetrating frame; the reaction liquid tank and the water tank are respectively arranged below the first high-pressure air injection tank and the second high-pressure air injection tank.
As a further improvement of the invention, stirring mechanisms are arranged in the reaction liquid tank and the water tank, and each stirring mechanism comprises a stirring motor, a connecting shaft and a stirring seat; the stirring motor is connected with the stirring seat through the connecting shaft.
As a further improvement of the invention, the heating wire is arranged in the drying box, and the cooling plate is arranged in the cooling box.
In a second aspect, the present invention provides a method for using an etching apparatus for manufacturing a semiconductor chip, comprising:
Placing a circuit board to be etched on a transport mechanism;
The transport mechanism drives the circuit board to be etched to move below the printing mechanism, and the printing mechanism coats the dressing on the circuit board;
when the transportation mechanism drives the circuit board to move to the lower part of the reaction mechanism, the gas supply mechanism supplies high-pressure gas to the reaction mechanism, and the reaction mechanism blows gas to the circuit board.
Compared with the prior art, the invention has the beneficial effects that:
1. the invention has reasonable structure, adopts high-pressure gas to clean the circuit board, avoids transitional etching of reaction liquid, and improves the yield.
2. Furthermore, the invention also provides a drying box and a cooling box, which can realize rapid drying and cooling after cleaning and improve the processing efficiency;
3. Furthermore, the invention improves the boiling of the reaction liquid and the cleaning liquid by using the stirring mechanism, and improves the reaction rate.
Drawings
For a clearer description of embodiments of the invention or of the solutions of the prior art, the drawings that are used in the description of the embodiments or of the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, from which, without inventive faculty, other drawings can be obtained for a person skilled in the art:
FIG. 1 is a schematic view of a first structure of an etching apparatus for manufacturing a semiconductor chip according to the present invention;
FIG. 2 is a schematic view showing a second structure of an etching apparatus for manufacturing a semiconductor chip according to the present invention;
FIG. 3 is a schematic view of a printing mechanism of an etching apparatus for manufacturing semiconductor chips according to the present invention;
FIG. 4 is a schematic view showing a transport mechanism of an etching apparatus for manufacturing a semiconductor chip according to the present invention;
FIG. 5 is a schematic view of a high pressure jet box of the etching device for manufacturing semiconductor chips;
FIG. 6 is a schematic diagram showing a structure of a drying box of the etching apparatus for manufacturing semiconductor chips according to the present invention;
FIG. 7 is a schematic diagram of a cooling box of the etching apparatus for manufacturing semiconductor chips according to the present invention;
FIG. 8 is a schematic view showing the structure of a stirring mechanism of an etching apparatus for manufacturing a semiconductor chip according to the present invention;
1, a supporting mechanism; 2. a printing mechanism; 3. a transport mechanism; 4. a fixing mechanism; 5. a gas supply mechanism; 6. a reaction mechanism; 7. a stirring mechanism; 11. a base; 12. a first support base; 13. a second support base; 14. a third support base; 21. a lifting cylinder; 22. a lifting seat; 23. printing a template; 24. a stop bar; 25. an ink cartridge; 26. a rolling brush; 27. a slide rail; 28. an electric slide block; 31. a track; 32. a movable seat; 33. a fixing frame; 34. a motor; 35. a roller; 36. a support wheel; 41. a transport plate; 42. a fixing clamp; 51. an air pipe; 52. a transmission tube; 53. an air pump; 61. a first high pressure jet box; 62. a drying box; 63. a cooling box; 64. a shunt; 65. a temperature-permeable frame; 66. heating wires; 67. a cooling sheet; 68. a reaction liquid tank; 69. a water tank; 70. a second high pressure jet box; 71. a stirring motor; 72. a connecting shaft; 73. and a stirring seat.
Detailed Description
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art in a specific case.
The principle of application of the invention is described in detail below with reference to the accompanying drawings.
Example 1
The embodiment of the invention provides an etching device for manufacturing a semiconductor chip, which is shown in fig. 1-2, and specifically comprises a supporting mechanism 1, a conveying mechanism 3, a printing mechanism 2, a gas supply mechanism 5 and a reaction mechanism 6;
The supporting mechanism 1 plays a supporting role;
The conveying mechanism 3 is connected with the supporting mechanism 1 and is used for driving the circuit board to be etched to move along a preset track;
the printing mechanism 2, the air supply mechanism 5 and the reaction mechanism 6 are sequentially arranged, and all three are arranged above the conveying mechanism 3; the printing mechanism 2 plays a role in printing; the air supply mechanism 5 is used for providing an air source, the output end of the air supply mechanism 5 is connected with the input end of the reaction mechanism 6, when the circuit board moves to the lower part of the reaction mechanism 6, the air supply mechanism 5 provides high-pressure air for the reaction mechanism 6, and the reaction mechanism 6 blows air to the circuit board.
The working procedure of the etching device for manufacturing semiconductor chips in this embodiment is specifically as follows:
placing a circuit board to be etched on the transport mechanism 3;
The transport mechanism 3 drives the circuit board to be etched to move below the printing mechanism 2, and the printing mechanism 2 coats the dressing on the circuit board;
When the transportation mechanism 3 drives the circuit board to move to the lower part of the reaction mechanism 6, the gas supply mechanism 5 supplies high-pressure gas to the reaction mechanism 6, and the reaction mechanism 6 blows the circuit board.
In one specific implementation of the embodiment of the present invention, the support mechanism 1 includes a base 11, a first support seat 12, a second support seat 13, and a third support seat 14; the base 11 plays a bearing role; the first supporting seat 12, the second supporting seat 13 and the third supporting seat 14 are sequentially arranged on the base 11, and all the three play a supporting role, and when the device is specifically implemented, the first supporting seat, the second supporting seat and the third supporting seat can be connected with the base 11 through bolts, so that the connection strength is ensured.
In one specific implementation of the embodiment of the present invention, the printing mechanism 2 includes a lifting cylinder 21, a lifting seat 22, a printing template 23, an electric slider 28, an ink cartridge and a rolling brush 26; the lifting cylinder 21 is connected with the supporting mechanism 1 and plays a role in lifting and lowering, and in particular, the lifting cylinder 21 is connected with the first supporting seat 12; the lifting seat 22 is connected with the lifting cylinder 21, and the inner side of the lifting seat is provided with a sliding rail 27 for connection; the printing template 23 is disposed on the lifting seat 22, and its specific mechanism is determined according to the pattern to be printed, and can be implemented by the prior art, so that redundant description is omitted in the embodiment of the present invention; the electric sliding block 28 is arranged in the sliding rail 27 and is connected with the ink box 25, and the rolling brush 26 is connected with the lower end of the ink box 25 and is contacted with the printing template 23; further, the printing mechanism 2 further comprises two barrier strips 24, the two barrier strips 24 are oppositely arranged, and two ends of the printing template 23 are connected with the corresponding barrier strips 24 through screws; in the implementation process, in order to ensure the connection strength, each component in the printing mechanism 2 is connected with a corresponding component through bolts, and particularly, see fig. 3.
In one embodiment of the present invention, the transportation mechanism 3 includes a rail 31, a moving seat 32, a fixed frame 33, a motor 34, rollers 35, and supporting wheels 36; the track 31 is arranged on the supporting mechanism 1 to play a limiting role, and is specifically arranged on the base 11; the movable seat 32 is slidably connected with the track 31 and plays a role in movement; the fixed frame 33 is arranged on the movable seat 32 and plays a role in fixation; the motor 34 is connected with the fixing frame 33; the roller 35 is sleeved on the outer side of the motor 34 and driven by the motor 34, and specifically, the outer side of the motor 34 is connected with the roller 35 in a key manner; the supporting wheel 36 is disposed opposite to the roller 35 and is connected to the movable seat 32, see fig. 4 in particular.
Further, the etching device for manufacturing the semiconductor chip further comprises a fixing mechanism 4, the fixing mechanism 4 comprises a conveying plate 41 for placing a circuit board, the conveying plate 41 is connected with the movable seat 32, further, grooves are formed in the conveying plate 41, fixing clips 42 are arranged at two ends of the conveying plate, and the fixing device is fixed and convenient to detach through buckle connection.
In one specific implementation of the embodiment of the present invention, the air supply mechanism 5 includes an air pipe 51, a transmission pipe 52 and an air pump 53; one end of the air pipe 51 is connected with the reaction mechanism 6, and the two can be in threaded connection when the reaction mechanism is in practical implementation; the other end is connected with the air pump 53 through the transmission pipe 52, and the air pump 53 is connected with the supporting mechanism 1. The air pipe 51 and the transmission pipe 52 play a role in transmission, and the tightness is ensured by welding connection.
The reaction mechanism 6 comprises a first high-pressure air jet box 61, a second high-pressure air jet box 70, a drying box 62, a cooling box 63, a reaction liquid groove 68 and a water groove 69 which are sequentially arranged; the first high-pressure air injection box 61, the second high-pressure air injection box 70, the drying box 62 and the cooling box 63 are respectively provided with a split pipe 64, the lower ends of the split pipes 64 are connected with a temperature-permeable frame 65, the air permeable Wen Kuangjia is a frame which can have an air permeable gap, and the structure is the prior art; the reaction liquid tank 68 and the water tank 69 are respectively arranged below the first high-pressure air injection tank 61 and the second high-pressure air injection tank 70; an electric heating wire 66 is arranged in the drying box 62, and a refrigerating sheet 67 is arranged in the cooling box 63. The shunt tube 64 acts as a shunt and the temperature permeable frame 65 acts as a heat conducting element, ensuring tightness by means of a threaded connection, see in particular figures 5-7.
In summary, in a specific implementation manner of this embodiment, the working process of the device specifically includes:
a. Placing a circuit board to be etched in a groove on a transport plate 41, fixing the circuit board by using two fixing clamps 42, and starting the etching device for manufacturing the semiconductor chip;
b. The lifting cylinder 21 drives the lifting seat 22 to descend, and when the lifting seat 22 descends to the upper side of the conveying plate 41, the electric sliding block 28 is started to drive the ink box 25 and the rolling brush 26 to transversely move, so that the dressing is coated on the circuit board;
c. when the coating is completed, the lifting cylinder 21 is contracted to enable the lifting seat 22 to be lifted, the motor 34 is started to drive the roller 35, the roller 35 drives the movable seat 32 and the conveying plate 41 to move, and the movable seat 32 moves along the track of the track 31;
d. When the transport plate 41 reaches the lower side of the first high-pressure air jet box 61, the transport pipe 52 is started, high-pressure air blows to the circuit board through the first temperature-penetrating frame 65, and the reaction liquid is blown off to avoid overetching;
e. the transport plate 41 is driven by the movable seat 32 to reach the inner side of the water tank 69, meanwhile, the stirring seat 73 on the inner side of the water tank 69 stirs the cleaning solution, the circuit board is cleaned, and then the cleaning solution is blown off by high-pressure air through the second high-pressure air jet box 61, the drying box 62 and the cooling box 63 respectively through the transmission of the movable seat 32, the high-temperature air is dried, the low-temperature air is cooled, and the reaction is completed.
Example 2
In the embodiment of the present invention, it is proposed to increase the reaction rate of the whole device by increasing the boiling efficiency of the reaction liquid and the cleaning liquid (water), and based on embodiment 1, in the embodiment of the present invention, stirring mechanisms 7 are disposed in the reaction liquid tank 68 and the water tank 69, and the stirring mechanisms 7 include a stirring motor 71, a connecting shaft 72 and a stirring seat 73; the stirring motor 71 is connected with the stirring seat 73 through the connecting shaft 72, and in specific implementation, the connecting shaft 72 is connected with the stirring motor 71 through a coupling, and effective transmission of force is ensured through the coupling connection, and particularly, see fig. 8.
Example 3
The embodiment of the invention provides a use method of an etching device for manufacturing a semiconductor chip, which comprises the following steps:
placing a circuit board to be etched on the transport mechanism 3;
The transport mechanism 3 drives the circuit board to be etched to move below the printing mechanism 2, and the printing mechanism 2 coats the dressing on the circuit board;
When the transportation mechanism 3 drives the circuit board to move to the lower part of the reaction mechanism 6, the gas supply mechanism 5 supplies high-pressure gas to the reaction mechanism 6, and the reaction mechanism 6 blows the circuit board.
More specifically, when the method of using the etching apparatus for semiconductor chip manufacturing in the present embodiment is applied to the apparatus in embodiment 1, the following steps are specifically included:
a. Placing a circuit board to be etched in a groove on a transport plate 41, fixing the circuit board by using two fixing clamps 42, and starting the etching device for manufacturing the semiconductor chip;
b. The lifting cylinder 21 drives the lifting seat 22 to descend, and when the lifting seat 22 descends to the upper side of the conveying plate 41, the electric sliding block 28 is started to drive the ink box 25 and the rolling brush 26 to transversely move, so that the dressing is coated on the circuit board;
c. when the coating is completed, the lifting cylinder 21 is contracted to enable the lifting seat 22 to be lifted, the motor 34 is started to drive the roller 35, the roller 35 drives the movable seat 32 and the conveying plate 41 to move, and the movable seat 32 moves along the track of the track 31;
d. When the transport plate 41 reaches the lower side of the first high-pressure air jet box 61, the transport pipe 52 is started, high-pressure air blows to the circuit board through the first temperature-penetrating frame 65, and the reaction liquid is blown off to avoid overetching;
e. the transport plate 41 is driven by the movable seat 32 to reach the inner side of the water tank 69, meanwhile, the stirring seat 73 on the inner side of the water tank 69 stirs the cleaning solution, the circuit board is cleaned, and then the cleaning solution is blown off by high-pressure air through the second high-pressure air jet box 61, the drying box 62 and the cooling box 63 respectively through the transmission of the movable seat 32, the high-temperature air is dried, the low-temperature air is cooled, and the reaction is completed.
The foregoing has shown and described the basic principles and main features of the present invention and the advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (7)
1. An etching apparatus for manufacturing a semiconductor chip, characterized in that: comprises a supporting mechanism, a transporting mechanism, a printing mechanism, an air supply mechanism and a reaction mechanism;
the conveying mechanism is connected with the supporting mechanism and is used for driving the circuit board to be etched to move along a preset track;
The printing mechanism, the air supply mechanism and the reaction mechanism are sequentially arranged, the printing mechanism, the air supply mechanism and the reaction mechanism are all arranged above the transportation mechanism, the output end of the air supply mechanism is connected with the input end of the reaction mechanism, when the circuit board moves to the lower part of the reaction mechanism, the air supply mechanism supplies high-pressure air to the reaction mechanism, and the reaction mechanism blows air to the circuit board;
The air supply mechanism comprises an air pipe, a transmission pipe and an air pump; one end of the air pipe is connected with the reaction mechanism, and the other end of the air pipe is connected with the air pump through the transmission pipe;
The reaction mechanism comprises a first high-pressure air jet box, a second high-pressure air jet box, a drying box, a cooling box, a reaction liquid tank and a water tank which are sequentially arranged; the first high-pressure air jet box, the second high-pressure air jet box, the drying box and the cooling box are respectively internally provided with a split-flow pipe, and the lower ends of the split-flow pipes are connected with a temperature-penetrating frame; the reaction liquid tank and the water tank are respectively arranged below the first high-pressure air injection tank and the second high-pressure air injection tank;
Stirring mechanisms are arranged in the reaction liquid tank and the water tank, and each stirring mechanism comprises a stirring motor, a connecting shaft and a stirring seat; the stirring motor is connected with the stirring seat through the connecting shaft.
2. The etching apparatus for manufacturing a semiconductor chip according to claim 1, wherein: the supporting mechanism comprises a base, a first supporting seat, a second supporting seat and a third supporting seat, wherein the first supporting seat, the second supporting seat and the third supporting seat are sequentially arranged on the base.
3. The etching apparatus for manufacturing a semiconductor chip according to claim 1, wherein: the printing mechanism comprises a lifting cylinder, a lifting seat, a printing template, an electric sliding block, an ink box and a rolling brush;
The lifting cylinder is connected with the supporting mechanism; the lifting seat is connected with the lifting cylinder, and a sliding rail is arranged on the inner side of the lifting seat; the printing template is arranged on the lifting seat; the electric sliding block is arranged in the sliding rail and is connected with the ink box, and the rolling brush is connected with the lower end of the ink box and is in contact with the printing template.
4. The etching apparatus for manufacturing a semiconductor chip according to claim 1, wherein: the conveying mechanism comprises a track, a movable seat, a fixed frame, a motor, rollers and supporting wheels; the track is arranged on the supporting mechanism; the movable seat is connected with the track in a sliding manner; the fixed mount is arranged on the movable seat; the motor is connected with the fixing frame; the roller is sleeved on the outer side of the motor and driven by the motor; the supporting wheels are arranged opposite to the rollers and connected with the movable seat.
5. The etching apparatus for manufacturing a semiconductor chip according to claim 4, wherein: the etching device for manufacturing the semiconductor chip further comprises a fixing mechanism, wherein the fixing mechanism comprises a conveying plate for placing a circuit board and a fixing clamp, the conveying plate is connected with the movable seat, and the fixing clamp is arranged on the conveying plate.
6. The etching apparatus for manufacturing a semiconductor chip according to claim 1, wherein: the drying box is internally provided with an electric heating wire, and the cooling box is internally provided with a refrigerating sheet.
7. A method of using the etching apparatus for manufacturing a semiconductor chip according to any one of claims 1 to 6, comprising:
placing a circuit board to be etched on a conveying mechanism;
The transport mechanism drives the circuit board to be etched to move below the printing mechanism, and the printing mechanism coats the dressing on the circuit board;
when the transportation mechanism drives the circuit board to move to the lower part of the reaction mechanism, the gas supply mechanism supplies high-pressure gas to the reaction mechanism, and the reaction mechanism blows gas to the circuit board.
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| CN110653208B (en) * | 2019-11-14 | 2022-01-11 | 深圳市三德盈电子有限公司 | PCB printed circuit board washing pond |
| CN113546896B (en) * | 2021-06-21 | 2022-09-20 | 南京信息职业技术学院 | Valve cabinet self-cleaning equipment |
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