CN110416133A - Etching device for manufacturing semiconductor chip and using method thereof - Google Patents
Etching device for manufacturing semiconductor chip and using method thereof Download PDFInfo
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- CN110416133A CN110416133A CN201910799299.4A CN201910799299A CN110416133A CN 110416133 A CN110416133 A CN 110416133A CN 201910799299 A CN201910799299 A CN 201910799299A CN 110416133 A CN110416133 A CN 110416133A
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- circuit board
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- semiconductor chip
- high pressure
- etaching device
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 38
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000005530 etching Methods 0.000 title abstract description 12
- 230000007246 mechanism Effects 0.000 claims abstract description 133
- 238000006243 chemical reaction Methods 0.000 claims abstract description 59
- 238000007639 printing Methods 0.000 claims abstract description 39
- 239000012295 chemical reaction liquid Substances 0.000 claims abstract description 12
- 238000003756 stirring Methods 0.000 claims description 24
- 238000001816 cooling Methods 0.000 claims description 21
- 239000007921 spray Substances 0.000 claims description 21
- 238000001035 drying Methods 0.000 claims description 16
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 10
- 238000009738 saturating Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 abstract description 11
- 230000006872 improvement Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 238000009835 boiling Methods 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000003319 supportive effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Die Bonding (AREA)
- Weting (AREA)
Abstract
The invention discloses an etching device for manufacturing a semiconductor chip and a using method thereof, wherein the etching device comprises a supporting mechanism, a conveying mechanism, a printing mechanism, an air supply mechanism and a reaction mechanism; the conveying mechanism is connected with the supporting mechanism and used for driving the circuit board to be etched to move along a preset track; the printing mechanism, the gas supply mechanism and the reaction mechanism are sequentially arranged, the three are arranged above the transportation mechanism, the output end of the gas supply mechanism is connected with the input end of the reaction mechanism, when the circuit board moves to the lower part of the reaction mechanism, the gas supply mechanism provides high-pressure gas for the reaction mechanism, and the reaction mechanism blows gas for the circuit board. According to the invention, the conveying mechanism is used for driving the circuit board to move along the preset track, the printing mechanism is used for printing the circuit board, the gas supply mechanism is used for providing high-pressure gas for the reaction mechanism, and when the circuit board moves to the reaction mechanism, the high-pressure gas is used for cleaning the circuit board, so that the excessive etching of reaction liquid is avoided, and the yield is greatly improved.
Description
Technical field
The invention belongs to semiconductor chip manufacturing fields, and in particular to a kind of semiconductor chip manufacture Etaching device and its
Application method.
Background technique
Etching is the technology by materials'use chemical reaction or physical shock effect and removal.Etching technique can be divided into wet
Etching and two class of dry ecthing.It may be utilized in fabricating the printing embossing plate such as copperplate, photo zincography earliest, be also widely used for mitigating weight
The processing of the thin type workpiece that instrument panelling, nameplate and traditional processing method are difficult to etc.；It is sent out by constantly improveing with process equipment
Exhibition, can also be used for aviation, machinery, in chemical industry electronics sheet parts fine etching product processing, especially in semiconductor
On processing procedure, etching is even more indispensable technology.
But generally when being etched processing, after semiconductor board reacts in reaction solution, if cleaning reaction not in time
Liquid, it may occur that the phenomenon that transition etches, it is serious to improve defect rate, and also need to clean after cleaning and also clear up, such as
Fruit is air-dried using common, and working efficiency can be lower.
Summary of the invention
In view of the above-mentioned problems, the present invention proposes a kind of semiconductor chip manufacture Etaching device and its application method, use
High pressure gas cleans semiconductor circuit board, avoids the transition etching of reaction solution, improves yields, and after cleaning
Can flash baking and cooling, improve processing efficiency.
In order to achieve the above technical purposes, reach above-mentioned technical effect, the invention is realized by the following technical scheme:
In a first aspect, the present invention provides a kind of semiconductor chip manufacture Etaching device, including supporting mechanism, transporter
Structure, printing mechanism, gas supply mechanism and reaction mechanism；
The transport establishment is connected with the supporting mechanism, for driving circuit board to be etched to transport along preset track
It is dynamic；
The printing mechanism, gas supply mechanism and reaction mechanism are sequentially arranged, and three is set to the top of the transport establishment,
The output end of the gas supply mechanism is connected with the input terminal of the reaction mechanism, when below circuit board motion to reaction mechanism,
The gas supply mechanism provides high pressure gas to reaction mechanism, and the reaction mechanism is blown to circuit board.
As a further improvement of the present invention, the supporting mechanism includes pedestal, the first support base, the second support base,
Three support bases, first support base, the second support base, third support base are sequentially set on the pedestal.
As a further improvement of the present invention, the printing mechanism include lifting cylinder, it is lifting seat, printing stencil, electronic
Sliding block, adjustment and round brush；
The lifting cylinder is connected with the supporting mechanism；The lifting seat is connected with the lifting cylinder, and inside is set
There is sliding rail；The printing stencil is set on the lifting seat；The electronic sliding block be set to the sliding rail in, and with the print cartridge phase
Even, the round brush is connected with the print cartridge lower end, and contacts with the printing stencil.
As a further improvement of the present invention, the transport establishment include track, Mobile base, fixed frame, motor, idler wheel and
Support wheel；The track is set on the supporting mechanism；The Mobile base is connected with track sliding；The fixed frame is set to
On the Mobile base；The motor is connected with the fixed frame；The roller housing is set to the outside of the motor, by the motor
Driving；The support wheel is oppositely arranged with the idler wheel, and is connected with the Mobile base.
As a further improvement of the present invention, the semiconductor chip manufacture Etaching device further includes fixed mechanism, institute
Stating fixed mechanism includes the plate conveyor and fixing clamp for placing circuit board, and the plate conveyor is connected with the Mobile base, described
Fixing clamp is set in the plate conveyor.
As a further improvement of the present invention, the gas supply mechanism includes tracheae, transfer tube and air pump；Described tracheae one end
The reaction mechanism is connected, the other end is connect by the transfer tube with the air pump.
As a further improvement of the present invention, the reaction mechanism includes the first high pressure spray gas tank being sequentially arranged, second
High pressure spray gas tank, drying box, cooling box, and reaction liquid bath and sink；The first high pressure spray gas tank, the second high-pressure jet
Isocon, the saturating warm frame of isocon lower end connection are provided in case, drying box and cooling box；The reaction liquid bath and water
Slot is respectively arranged on the lower section of the first high pressure spray gas tank and the second high pressure spray gas tank.
As a further improvement of the present invention, rabbling mechanism, the blender are equipped in the reaction liquid bath and sink
Structure includes stirring motor, connecting shaft and stirring seat；The stirring motor is connected by the connecting shaft with the stirring seat.
As a further improvement of the present invention, it is provided with heating wire in the drying box, system is provided in the cooling box
Cold.
Second aspect, the present invention provides a kind of application methods of semiconductor chip manufacture Etaching device, comprising:
Circuit board to be etched is placed in transport establishment；
Transport establishment drives below circuit board motion to be etched to printing mechanism, and dressing is coated in circuit by printing mechanism
On plate；
When transport establishment drives below circuit board motion to reaction mechanism, the gas supply mechanism provides high pressure to reaction mechanism
Gas, the reaction mechanism are blown to circuit board.
Compared with prior art, beneficial effects of the present invention:
1, structure of the invention is reasonable, is cleaned using high pressure gas to circuit board, avoids the transition etching of reaction solution,
Improve yields.
2, further, the present invention is also provided with drying box and cooling box, realize after cleaning can flash baking and
Cooling improves processing efficiency；
3, further, the present invention improves the boiling of reaction solution and cleaning solution using rabbling mechanism, improves reaction rate.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this hair
Bright some embodiments for those of ordinary skill in the art without any creative labor, can be with
It obtains other drawings based on these drawings:
Fig. 1 is the first structure diagram of semiconductor chip manufacture Etaching device of the present invention；
Fig. 2 is the second structural schematic diagram of semiconductor chip manufacture Etaching device of the present invention；
Fig. 3 is printing mechanism's structural schematic diagram of semiconductor chip manufacture Etaching device of the present invention；
Fig. 4 is transport establishment's structural schematic diagram of semiconductor chip manufacture Etaching device of the present invention；
Fig. 5 is the high-pressure jet box structure schematic diagram of semiconductor chip manufacture Etaching device of the present invention；
Fig. 6 is the drying box structural schematic diagram of semiconductor chip manufacture Etaching device of the present invention；
Fig. 7 is the cooling box structural schematic diagram of semiconductor chip manufacture Etaching device of the present invention；
Fig. 8 is the rabbling mechanism structural schematic diagram of semiconductor chip manufacture Etaching device of the present invention；
Wherein, 1, supporting mechanism；2, printing mechanism；3, transport establishment；4, fixed mechanism；5, gas supply mechanism；6, machine is reacted
Structure；7, rabbling mechanism；11, pedestal；12, the first support base；13, the second support base；14, third support base；21, lifting cylinder；
22, lifting seat；23, printing stencil；24, shelves item；25, print cartridge；26, round brush；27, sliding rail；28, electronic sliding block；31, track；32,
Mobile base；33, fixed frame；34, motor；35, idler wheel；36, support wheel；41, plate conveyor；42, fixing clamp；51, tracheae；52, it passes
Defeated pipe；53, air pump；61, the first high pressure spray gas tank；62, drying box；63, cooling box；64, isocon；65, saturating warm frame；66,
Heating wire；67, cooling piece；68, liquid bath is reacted；69, sink；70, the second high pressure spray gas tank；71, stirring motor；72, connecting shaft；
73, stirring seat.
Specific embodiment
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", "upper", "lower",
The orientation or positional relationship of the instructions such as "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" is
It is based on the orientation or positional relationship shown in the drawings, is merely for convenience of description of the present invention and simplification of the description, rather than instruction or dark
Show that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as pair
Limitation of the invention.In addition, term " first ", " second " etc. are used for description purposes only, it is not understood to indicate or imply phase
To importance or implicitly indicate the quantity of indicated technical characteristic.The feature for defining " first ", " second " etc. as a result, can
To explicitly or implicitly include one or more of the features.In the description of the present invention, unless otherwise indicated, " multiple "
It is meant that two or more.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected；It can be directly connected, can also can be indirectly connected through an intermediary
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood by concrete condition
Concrete meaning in the present invention.
Application principle of the invention is explained in detail with reference to the accompanying drawing.
Embodiment 1
The embodiment of the invention provides a kind of semiconductor chip manufacture Etaching devices, as shown in Figs. 1-2, specifically include branch
Support mechanism 1, transport establishment 3, printing mechanism 2, gas supply mechanism 5 and reaction mechanism 6；
The supporting mechanism 1 plays a supportive role；
The transport establishment 3 is connected with the supporting mechanism 1, for driving circuit board to be etched to transport along preset track
It is dynamic；
The printing mechanism 2, gas supply mechanism 5 and reaction mechanism 6 are sequentially arranged, and three is set to the transport establishment 3
Top；Printing plays in the printing mechanism 2；The gas supply mechanism 5 is for providing gas source, output end and the reaction mechanism
6 input terminal is connected, and when circuit board motion to 6 lower section of reaction mechanism, the gas supply mechanism 5 provides high pressure to reaction mechanism 6
Gas, the reaction mechanism 6 are blown to circuit board.
Semiconductor chip manufacture in the present embodiment course of work of Etaching device specifically:
Circuit board to be etched is placed in transport establishment 3；
Transport establishment 3 drives circuit board motion to be etched to 2 lower section of printing mechanism, is coated in dressing by printing mechanism 2
On circuit board；
When transport establishment 3 drives circuit board motion to 6 lower section of reaction mechanism, the gas supply mechanism 5 is provided to reaction mechanism 6
High pressure gas, the reaction mechanism 6 are blown to circuit board.
In a kind of specific embodiment of the embodiment of the present invention, the supporting mechanism 1 includes pedestal 11, the first support base
12, the second support base 13, third support base 14；The pedestal 11 plays carrying；First support base 12, the second support base
13, third support base 14 is sequentially set on the pedestal 11, and three plays a supportive role, in the specific implementation, can between three
To be connected by bolt with pedestal 11, guarantee bonding strength.
In a kind of specific embodiment of the embodiment of the present invention, the printing mechanism 2 includes lifting cylinder 21, lifting seat
22, printing stencil 23, electronic sliding block 28, adjustment and round brush 26；The lifting cylinder 21 is connected with the supporting mechanism 1, raising
Drop effect, specifically, the lifting cylinder 21 is connected with first support base 12；The lifting seat 22 and the lifting cylinder
21 are connected, and inside is equipped with sliding rail 27, play connection function；The printing stencil 23 is set on the lifting seat 22, specific machine
Structure is determined according to figure to be printed, can be achieved by the prior art, therefore is not done in the embodiment of the present invention and excessively repeated；The electricity
Movable slider 28 is set in the sliding rail 27, and is connected with the print cartridge 25, and the round brush 26 is connected with 25 lower end of print cartridge, and
It is contacted with the printing stencil 23；Further, the printing mechanism 2 further includes two blend stops 24, and two blend stops 24 are opposite to be set
It sets, the both ends of the printing stencil 23 are connected by screw to corresponding blend stop 24；In the specific implementation process, in order to guarantee to connect
Intensity, the logical bolt of all parts in the printing mechanism 2 is connected with corresponding component, referring specifically to Fig. 3.
In a kind of specific embodiment of the embodiment of the present invention, the transport establishment 3 include track 31, Mobile base 32,
Fixed frame 33, motor 34, idler wheel 35 and support wheel 36；The track 31 is set on the supporting mechanism 1, plays position-limiting action, tool
Body, it is set on the pedestal 11；The Mobile base 32 is connected with the track 31 sliding, plays migration；The fixed frame
33 are set on the Mobile base 32, play fixed function；The motor 34 is connected with the fixed frame 33；The idler wheel 35 is sheathed on
The outside of the motor 34 is driven by the motor 34, specifically, the idler wheel 35 is keyed on the outside of the motor 34；It is described
Support wheel 36 is oppositely arranged with the idler wheel 35, and is connected with the Mobile base 32, referring specifically to Fig. 4.
Further, the semiconductor chip manufacture Etaching device further includes fixed mechanism 4, and the fixed mechanism 4 wraps
The plate conveyor 41 for placing circuit board is included, the plate conveyor 41 is connected with the Mobile base 32, further, the transport
Plate 41 is equipped with groove, and both ends are equipped with fixing clamp 42, plays fixed function, it is logical snap connection it is easy to disassemble.
In a kind of specific embodiment of the embodiment of the present invention, the gas supply mechanism 5 includes tracheae 51,52 and of transfer tube
Air pump 53；Described 51 one end of tracheae connects the reaction mechanism 6, when it is implemented, can be threaded connection therebetween；It is another
End is connect by the transfer tube 52 with the air pump 53, and the air pump 53 is connected with the supporting mechanism 1.The tracheae 51,
Transfer tube 52 plays transmitting effect, ensure that leakproofness by being welded to connect.
The reaction mechanism 6 includes the first high pressure spray gas tank 61, the second high pressure spray gas tank 70, drying box being sequentially arranged
62, cooling box 63, and reaction liquid bath 68 and sink 69；The first high pressure spray gas tank 61, the second high pressure spray gas tank 70, drying
Isocon 64, the saturating warm frame 65 of 64 lower end of isocon connection, the saturating temperature frame are provided in case 62 and cooling box 63
Frame 65 refers to the frame that can have ventilative gap, which is the prior art；The reaction liquid bath 68 and sink 69 are distinguished
Set on the lower section of the first high pressure spray gas tank 61 and the second high pressure spray gas tank 70；Heating wire is provided in the drying box 62
66, cooling piece 67 is provided in the cooling box 63.The isocon 64 plays shunting function, and the temperature frame 65 plays thermally conductive work
With being connected through a screw thread and ensure that leakproofness, referring specifically to Fig. 5-7.
To sum up, in a kind of specific embodiment of the present embodiment, the course of work of described device specifically:
A, the circuit board etched will be needed to be placed in the slot in plate conveyor 41, starting fixed using two fixing clamps 42
Etaching device is used in the semiconductor chip manufacture；
B, lifting cylinder 21 drives lifting seat 22 to decline, after lifting seat 22 drops to 41 upside of plate conveyor, electronic sliding block
28 startings, drive print cartridge 25 and 26 transverse shifting of round brush, on circuit boards by dressing coating；
C, after the completion of coating, the contraction of lifting cylinder 21 rises lifting seat 22, and the starting of motor 34 drives idler wheel 35, idler wheel
35 drive Mobile base 32 and plate conveyor 41 mobile, and Mobile base 32 is mobile along the track of track 31；
D, pass through etching solution inside reaction liquid bath 68 when plate conveyor 41 reaches, stirring motor 71 drives connecting shaft 72, connecting shaft 72
Stirring seat 73 is driven, reaction solution is made to boil, accelerates reaction rate, impregnates after a certain period of time, moves again, when first height of arrival
When pressing 61 downside of jet case, transfer tube 52 starts, and high pressure gas is blown by first saturating warm frame 65 to circuit board, will react
Liquid is blown off, and avoids erosion；
E, plate conveyor 41 reaches 69 inside of sink, while the stirring seat 73 of 69 inside of sink by the drive of Mobile base 32 again
Stir cleaning solution, circuit board is cleaned, using the transmission of Mobile base 32, respectively by second high pressure spray gas tank 61,
Drying box 62, cooling box 63 blow off cleaning solution by high pressure gas, High Temperature Gas drying, the cooling of low temperature gas, and reaction is completed.
Embodiment 2
The boiling efficiency by improving reaction solution and cleaning solution (water) is proposed in the embodiment of the present invention, to improve entire dress
The reaction rate set is equipped with stirring in the reaction liquid bath 68 and sink 69 in embodiments of the present invention based on embodiment 1
Mechanism 7, the rabbling mechanism 7 include stirring motor 71, connecting shaft 72 and stirring seat 73；The stirring motor 71 passes through the company
Spindle 72 is connected with the stirring seat 73, when it is implemented, the connecting shaft 72 connects stirring motor 71 by shaft coupling, passes through connection
Axis device connects the effective transmission that ensure that power, referring specifically to Fig. 8.
Embodiment 3
The embodiment of the invention provides a kind of application methods of semiconductor chip manufacture Etaching device, comprising:
Circuit board to be etched is placed in transport establishment 3；
Transport establishment 3 drives circuit board motion to be etched to 2 lower section of printing mechanism, is coated in dressing by printing mechanism 2
On circuit board；
When transport establishment 3 drives circuit board motion to 6 lower section of reaction mechanism, the gas supply mechanism 5 is provided to reaction mechanism 6
High pressure gas, the reaction mechanism 6 are blown to circuit board.
More specifically, when the application method of the semiconductor chip manufacture Etaching device in the present embodiment is applied to implementation
When device in example 1, specifically includes the following steps:
A, the circuit board etched will be needed to be placed in the slot in plate conveyor 41, starting fixed using two fixing clamps 42
Etaching device is used in the semiconductor chip manufacture；
B, lifting cylinder 21 drives lifting seat 22 to decline, after lifting seat 22 drops to 41 upside of plate conveyor, electronic sliding block
28 startings, drive print cartridge 25 and 26 transverse shifting of round brush, on circuit boards by dressing coating；
C, after the completion of coating, the contraction of lifting cylinder 21 rises lifting seat 22, and the starting of motor 34 drives idler wheel 35, idler wheel
35 drive Mobile base 32 and plate conveyor 41 mobile, and Mobile base 32 is mobile along the track of track 31；
D, pass through etching solution inside reaction liquid bath 68 when plate conveyor 41 reaches, stirring motor 71 drives connecting shaft 72, connecting shaft 72
Stirring seat 73 is driven, reaction solution is made to boil, accelerates reaction rate, impregnates after a certain period of time, moves again, when first height of arrival
When pressing 61 downside of jet case, transfer tube 52 starts, and high pressure gas is blown by first saturating warm frame 65 to circuit board, will react
Liquid is blown off, and avoids erosion；
E, plate conveyor 41 reaches 69 inside of sink, while the stirring seat 73 of 69 inside of sink by the drive of Mobile base 32 again
Stir cleaning solution, circuit board is cleaned, using the transmission of Mobile base 32, respectively by second high pressure spray gas tank 61,
Drying box 62, cooling box 63 blow off cleaning solution by high pressure gas, High Temperature Gas drying, the cooling of low temperature gas, and reaction is completed.
The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this
The principle of invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes
Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and its
Equivalent thereof.
Claims (10)
1. a kind of semiconductor chip manufacture Etaching device, it is characterised in that: including supporting mechanism, transport establishment, printing mechanism,
Gas supply mechanism and reaction mechanism；
The transport establishment is connected with the supporting mechanism, for driving circuit board to be etched to move along preset track；
The printing mechanism, gas supply mechanism and reaction mechanism are sequentially arranged, and three is set to the top of the transport establishment, described
The output end of gas supply mechanism is connected with the input terminal of the reaction mechanism, described when below circuit board motion to reaction mechanism
Gas supply mechanism provides high pressure gas to reaction mechanism, and the reaction mechanism is blown to circuit board.
2. a kind of semiconductor chip manufacture Etaching device according to claim 1, it is characterised in that: the supporting mechanism
Including pedestal, the first support base, the second support base, third support base, first support base, the second support base, third support
Seat is sequentially set on the pedestal.
3. a kind of semiconductor chip manufacture Etaching device according to claim 1, it is characterised in that: the printing mechanism
Including lifting cylinder, lifting seat, printing stencil, electronic sliding block, adjustment and round brush；
The lifting cylinder is connected with the supporting mechanism；The lifting seat is connected with the lifting cylinder, and inside, which is equipped with, to be slided
Rail；The printing stencil is set on the lifting seat；The electronic sliding block is set in the sliding rail, and is connected with the print cartridge,
The round brush is connected with the print cartridge lower end, and contacts with the printing stencil.
4. a kind of semiconductor chip manufacture Etaching device according to claim 1, it is characterised in that: the transport establishment
Including track, Mobile base, fixed frame, motor, idler wheel and support wheel；The track is set on the supporting mechanism；The movement
Seat is connected with track sliding；The fixed frame is set on the Mobile base；The motor is connected with the fixed frame；It is described
Roller housing is set to the outside of the motor, by the motor driven；The support wheel is oppositely arranged with the idler wheel, and with it is described
Mobile base is connected.
5. a kind of semiconductor chip manufacture Etaching device according to claim 1, it is characterised in that: the semiconductor core
Piece manufacture Etaching device further includes fixed mechanism, and the fixed mechanism includes the plate conveyor and fixation for placing circuit board
Folder, the plate conveyor are connected with the Mobile base, and the fixing clamp is set in the plate conveyor.
6. a kind of semiconductor chip manufacture Etaching device according to claim 1, it is characterised in that: the gas supply mechanism
Including tracheae, transfer tube and air pump；Described tracheae one end connects the reaction mechanism, the other end by the transfer tube with it is described
Air pump connection.
7. a kind of semiconductor chip manufacture Etaching device according to claim 1, it is characterised in that: the reaction mechanism
Including the first high pressure spray gas tank, the second high pressure spray gas tank, drying box, cooling box being sequentially arranged, and reaction liquid bath and sink；
Isocon is provided in the first high pressure spray gas tank, the second high pressure spray gas tank, drying box and cooling box, under the isocon
The saturating warm frame of end connection；The reaction liquid bath and sink are respectively arranged on the first high pressure spray gas tank and the second high pressure spray gas tank
Lower section.
8. a kind of semiconductor chip manufacture Etaching device according to claim 7, it is characterised in that: the reaction liquid bath
With rabbling mechanism is equipped in sink, the rabbling mechanism includes stirring motor, connecting shaft and stirring seat；The stirring motor is logical
The connecting shaft is crossed to be connected with the stirring seat.
9. a kind of semiconductor chip manufacture Etaching device according to claim 7, it is characterised in that: in the drying box
It is provided with heating wire, is provided with cooling piece in the cooling box.
10. the application method that Etaching device is used in a kind of semiconductor chip manufacture characterized by comprising
Circuit board to be etched is placed in transport establishment；
Transport establishment drives below circuit board motion to be etched to printing mechanism, and dressing is coated in circuit board by printing mechanism
On；
When transport establishment drives below circuit board motion to reaction mechanism, the gas supply mechanism provides high pressure gas to reaction mechanism
Body, the reaction mechanism are blown to circuit board.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910799299.4A CN110416133B (en) | 2019-08-28 | 2019-08-28 | Etching device for manufacturing semiconductor chip and application method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910799299.4A CN110416133B (en) | 2019-08-28 | 2019-08-28 | Etching device for manufacturing semiconductor chip and application method thereof |
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| CN110416133B CN110416133B (en) | 2024-05-31 |
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| CN110416133B (en) | 2024-05-31 |
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