CN215209611U - Substrate heating and cooling system - Google Patents

Substrate heating and cooling system Download PDF

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Publication number
CN215209611U
CN215209611U CN202121581342.9U CN202121581342U CN215209611U CN 215209611 U CN215209611 U CN 215209611U CN 202121581342 U CN202121581342 U CN 202121581342U CN 215209611 U CN215209611 U CN 215209611U
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China
Prior art keywords
cooling
plate
vacuum cavity
fixedly connected
cooling system
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Active
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CN202121581342.9U
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Chinese (zh)
Inventor
张耀辉
宗璐
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Hefei Liandunke Intelligent Technology Co ltd
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Hefei Liandunke Intelligent Technology Co ltd
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Abstract

The utility model discloses a base plate heating cooling system, including the vacuum cavity, be used for holding in the palm the support of putting a plurality of base plates along vertical direction fixedly connected with in the vacuum cavity, install the heating device that heats to the evaporation coating face of every base plate in the vacuum cavity, still install in the vacuum cavity and carry out refrigerated cooling body to the non-evaporation coating face of every base plate, cooling body includes the cooling plate of liftable, have the intermediate layer that is used for flourishing water in the cooling plate, fixedly connected with heat insulating board on the cooling plate orientation heating device's the wall. The device has the advantages of simple structure, multiple functions and convenient use.

Description

Substrate heating and cooling system
Technical Field
The utility model belongs to the technical field of the evaporation equipment and specifically relates to a base plate heating and cooling system is related to.
Background
A glass substrate for display, a wafer substrate for semiconductor, and other sheet-mounted substrates need to be heated and cooled after vapor deposition; at present, two devices are used for heating and cooling the substrate respectively, and pollution is easily caused and the yield of products is reduced in the transfer process.
Disclosure of Invention
In view of the above, it is desirable to provide a substrate heating and cooling system with simple structure and multiple functions.
In order to solve the technical problem, the technical scheme of the utility model is that: the utility model provides a base plate heating cooling system, includes the vacuum cavity, be used for holding in the palm the support of putting a plurality of base plates along vertical direction fixedly connected with in the vacuum cavity, install the heating device that heats to the evaporation coating face of every base plate in the vacuum cavity, still install in the vacuum cavity and carry out refrigerated cooling body to the non-evaporation coating face of every base plate, cooling body includes the cooling plate of liftable, have the intermediate layer that is used for flourishing water in the cooling plate, fixedly connected with heat insulating board on the wall of cooling plate orientation heating device.
Further, the heat insulation plate is composed of a plurality of layers of thin plates which are arranged in parallel.
Furthermore, the heating device comprises a supporting plate and an electric heater fixedly connected to the supporting plate.
Furthermore, a lifting mechanism for lifting the cooling plate is fixedly connected in the vacuum cavity.
Furthermore, the cooling plate further comprises a water supply pipeline for supplying cooling water to all the cooling plate inner interlayers, wherein one end of each interlayer is provided with a water inlet, and the other end of each interlayer is provided with a water outlet.
Compared with the prior art, the utility model discloses following beneficial effect has: this device has integrateed and has cooled off and heat the function to the base plate, simple structure, and the function is various, convenient to use.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of the present invention.
In the figure: 1-vacuum chamber, 2-support, 3-substrate, 4-supporting plate, 41-electric heater, 42-power line, 5-cooling plate, 51-heat insulation plate, 52-water supply pipeline.
Detailed Description
To further illustrate the technical means and effects of the present invention adopted to achieve the predetermined objects, the following detailed description of the embodiments, structures, features and effects according to the present invention will be made with reference to the accompanying drawings and preferred embodiments.
As shown in fig. 1, a substrate heating and cooling system includes a vacuum chamber 1.
Fixedly connected with support 2 in the vacuum chamber 1, this support 2 is gone up the interval of parallel and is held in the palm and put polylith base plate 3, and four angles of base plate 3 are held in support 2.
A heating device for heating the deposition surface of each substrate 3 is supported by the holder 2, and the heating device includes a support plate 4 and an electric heater 41 fixedly connected to the support plate. The capacitor 41 is formed of an electric bar or an electric wire. The vacuum chamber 1 further has a power line 42 electrically connected to the positive and negative electrodes of the capacitor and connected to an external power source.
Install in the vacuum cavity 1 and carry out refrigerated cooling body to every piece base plate 3's non-evaporation coating face, cooling body includes the cooling plate 5 of liftable, have the intermediate layer that is used for flourishing water in the cooling plate 5, fixedly connected with heat insulating board 51 on the wall of cooling plate 5 orientation heating device, this heat insulating board 51 can avoid the hot plate to exert an influence to the cooling plate, reduce the heat input of heating device to the cooling plate, keep apart through the heat insulating board in the middle of heating device and the cooling device, this heat insulating board 51 is kept apart fixedly for the multilayer sheet metal and forms, form the isolation region between the sheet metal, thereby form effectual thermal-insulated.
One end of the interlayer has a water inlet and the other end has a water outlet, and a water supply pipeline 52 for supplying water to the interlayer is arranged in the vacuum chamber 1. The carriage 2 has a stroke groove for passing and lifting the water supply line 52. The water supply line 52 may be a hose.
And a lifting mechanism for lifting the cooling plate is fixedly connected in the vacuum cavity 1. The lifting mechanism can be an air cylinder and a push rod driven by the air cylinder, the air cylinder is positioned outside the vacuum cavity and avoids gas leakage, and the push rod is connected to the bottom of each cooling plate and used for lifting the cooling plates.
Four corners of the cooling plate 5 are provided with avoidance grooves for avoiding the support, so that the cooling plate can be attached to the non-evaporation surface of the substrate when the substrate is cooled by the cooling plate.
The heating device heats the evaporation surface of each substrate by heat radiation.
The above description is only a preferred embodiment of the present invention, and the present invention is not limited to the above description, and although the present invention has been disclosed by the preferred embodiment, it is not limited to the present invention, and any person skilled in the art can make modifications or changes equivalent to the equivalent embodiments by utilizing the above disclosed technical contents without departing from the technical scope of the present invention, but all the modifications, changes and changes of the technical spirit of the present invention made to the above embodiments are also within the scope of the technical solution of the present invention.

Claims (5)

1. A substrate heating and cooling system, comprising: including the vacuum cavity, be used for holding in the palm the support of putting a plurality of base plates along vertical direction fixedly connected with in the vacuum cavity, install in the vacuum cavity and carry out the heating device that heats to the evaporation coating face of every base plate, still install in the vacuum cavity and carry out refrigerated cooling body to the non-evaporation coating face of every base plate, cooling body includes the cooling plate of liftable, have the intermediate layer that is used for flourishing water in the cooling plate, fixedly connected with heat insulating board on the wall of cooling plate orientation heating device.
2. The substrate heating and cooling system of claim 1, wherein: the heat insulation plate is composed of a plurality of layers of thin plates which are arranged in parallel.
3. The substrate heating and cooling system of claim 1, wherein: the heating device comprises a supporting plate and an electric heater fixedly connected to the supporting plate.
4. The substrate heating and cooling system of claim 1, wherein: and a lifting mechanism for lifting the cooling plate is fixedly connected in the vacuum cavity.
5. The substrate heating and cooling system of claim 1, wherein: the cooling plate is characterized by further comprising a water supply pipeline for supplying cooling water to all cooling plate inner interlayers, wherein one end of each interlayer is provided with a water inlet, and the other end of each interlayer is provided with a water outlet.
CN202121581342.9U 2021-07-09 2021-07-09 Substrate heating and cooling system Active CN215209611U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121581342.9U CN215209611U (en) 2021-07-09 2021-07-09 Substrate heating and cooling system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121581342.9U CN215209611U (en) 2021-07-09 2021-07-09 Substrate heating and cooling system

Publications (1)

Publication Number Publication Date
CN215209611U true CN215209611U (en) 2021-12-17

Family

ID=79429334

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202121581342.9U Active CN215209611U (en) 2021-07-09 2021-07-09 Substrate heating and cooling system

Country Status (1)

Country Link
CN (1) CN215209611U (en)

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