CN108642478A - A kind of coating system and coating process - Google Patents
A kind of coating system and coating process Download PDFInfo
- Publication number
- CN108642478A CN108642478A CN201810768151.XA CN201810768151A CN108642478A CN 108642478 A CN108642478 A CN 108642478A CN 201810768151 A CN201810768151 A CN 201810768151A CN 108642478 A CN108642478 A CN 108642478A
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- substrate
- process cavity
- even heat
- heat plate
- transmitting device
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- 238000000576 coating method Methods 0.000 title claims abstract description 54
- 239000011248 coating agent Substances 0.000 title claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 161
- 238000000034 method Methods 0.000 claims abstract description 143
- 230000008569 process Effects 0.000 claims abstract description 137
- 230000007246 mechanism Effects 0.000 claims description 109
- 238000012546 transfer Methods 0.000 claims description 65
- 238000010438 heat treatment Methods 0.000 claims description 43
- 238000001816 cooling Methods 0.000 claims description 33
- 238000005507 spraying Methods 0.000 claims description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 239000010408 film Substances 0.000 abstract description 87
- 238000004519 manufacturing process Methods 0.000 abstract description 19
- 239000010409 thin film Substances 0.000 abstract description 6
- 238000006243 chemical reaction Methods 0.000 abstract description 5
- 239000002131 composite material Substances 0.000 abstract description 5
- 238000002360 preparation method Methods 0.000 abstract description 5
- 230000003197 catalytic effect Effects 0.000 abstract description 4
- 239000012535 impurity Substances 0.000 abstract description 4
- 230000003647 oxidation Effects 0.000 abstract description 4
- 238000007254 oxidation reaction Methods 0.000 abstract description 4
- 239000011521 glass Substances 0.000 description 22
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 16
- 230000005540 biological transmission Effects 0.000 description 12
- 239000011787 zinc oxide Substances 0.000 description 8
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000007921 spray Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 230000032258 transport Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- JUGMVQZJYQVQJS-UHFFFAOYSA-N [B+3].[O-2].[Zn+2] Chemical compound [B+3].[O-2].[Zn+2] JUGMVQZJYQVQJS-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000033764 rhythmic process Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/407—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
- C23C16/463—Cooling of the substrate
Abstract
This application involves thin film solar production technical fields, and in particular to a kind of coating system and coating process.Coating system provided by the present application can support the film layer that multiple and different types are plated to substrate, to obtain the performance preferably substrate with composite film；Compared with existing coating system, coating system provided by the present application substrate when preparing stratified film on substrate does not have to take out out of system, therefore breaking vacuum and exposure air will not be contacted with ambient atmosphere, it can avoid because of film layer and air catalytic oxidation, cause to lead to the problem of impurity in film layer, the film quality on substrate is more preferable；And temperature adjustment chamber there are one being set between two neighboring process cavity, pass through the temperature of temperature adjustment intonation integral basis plate, so that the temperature of substrate is met the needs of next process cavity preparation temperature, reduce the temperature settling tune into next reaction chamber, greatly improves production efficiency, improves production capacity.
Description
Technical field
This application involves thin film solar production technical fields, and in particular to a kind of coating system and coating process.
Background technology
The demand of thin-film solar cells is just gradually being increased currently on the market, is manufacturing the technology of thin-film solar cells more
As research hotspot in recent years, LPCVD (Low Pressure Chemical Vapor Deposition- low pressure chemicals
It is vapor-deposited) method is primarily formed as film day sun energy battery film layer, it is widely used in thin-film solar cells production
Field；It is existing to disclose a kind of LPCVD systems, equipped with the transmission backing plate for placing several plate bases, by transmitting backing plate
By the heat transmission of heating plate to the substrate for needing plated film；It is additionally provided with reaction chamber in system, is used to carry out plated film to substrate, such as
ZnO (zinc oxide) film.Since the manufacture temperature needed for each film layer is different, existing LPCVD systems can only once prepare one
Film layer causes technique underaction.
Invention content
(1) technical problems to be solved in this application are：Existing LPCVD systems can only once produce a kind of film layer, cause
Quantity-produced rhythm control and low production efficiency.
(2) technical solution
In order to solve the above-mentioned technical problem, the embodiment of the present application provides a kind of coating system, and the coating system includes：
The temperature adjustment chamber being equipped between transmitting device, multiple process cavities and the two neighboring process cavity；
Wherein, the transmitting device is configured to substrate transport to the process cavity and the temperature adjustment intracavitary；It is each described
Process cavity is configured to be passed through corresponding process gas to carry out plated film to the substrate；
The temperature adjustment chamber is configured to the substrate temperature adjustment after plated film to the corresponding assigned temperature of next process cavity.
Advantageous effect：Coating system provided by the embodiments of the present application can be supported to form multiple and different types on substrate
Film layer, with obtain performance preferably with composite film substrate；Compared with existing coating system, the embodiment of the present application carries
The coating system of confession substrate when preparing stratified film on substrate does not have to take out out of system, therefore will not be contacted with ambient atmosphere
Breaking vacuum and exposure air can avoid, because of film layer and air catalytic oxidation, causing to lead to the problem of impurity in film layer,
Film quality on substrate is more preferable；And temperature adjustment chamber there are one being set between two neighboring process cavity, passes through temperature adjustment intonation integral basis plate
Temperature, so that the temperature of substrate is met the needs of next process cavity preparation temperature, reduce into next reaction chamber
Temperature settling tune greatly improves production efficiency, improves production capacity.
Further, the temperature adjustment chamber is heating chamber or the first cooling chamber.
Further, the first even heat plate and the first handling device are equipped in the heating chamber, first handling device is used
In by the workpiece handling on the transmitting device to first even heat plate, or by the workpiece handling on first even heat plate
Onto the transmitting device.
Further, first handling device includes the first ejector pin mechanism and the first driving mechanism, the first even heat
Plate is mounted on the lower part of the heating chamber, and first ejector pin mechanism includes that the first mounting bracket is pacified with being vertically installed at described first
The multiple first thimble ontologies shelved, multiple first thimble ontologies pass through first even heat plate from the bottom to top；
First driving mechanism is connected with first mounting bracket, to drive first mounting bracket to move up and down；
Transmitting device in the heating chamber is arranged in the upside of first even heat plate.
Further, the second even heat plate and the second handling device are equipped in first cooling chamber, described second carries dress
Set for by the workpiece handling on the transmitting device to second even heat plate, or by the workpiece on second even heat plate
It is transported on the transmitting device.
Further, second handling device includes the second ejector pin mechanism and the second driving mechanism, the second even heat
Plate is mounted on the lower part of first cooling chamber, and second ejector pin mechanism includes the second mounting bracket and is vertically installed at described the
Multiple second thimble ontologies on two mounting brackets, multiple second thimble ontologies pass through second even heat plate from the bottom to top；
Second driving mechanism is connected with second mounting bracket, to drive second mounting bracket to move up and down；
Transmitting device in first cooling chamber is arranged in the upside of second even heat plate.
Further, third even heat plate and third handling device are equipped in the process cavity, the third handling device is used
In by the workpiece handling on the transmitting device to the third even heat plate, or by the workpiece handling on the third even heat plate
Onto the transmitting device.
Further, the third handling device includes third ejector pin mechanism and third driving mechanism, the even heat of third
Plate is mounted on the lower part of the process cavity, and the third ejector pin mechanism includes that third mounting bracket is pacified with the third is vertically installed at
The multiple third thimble ontologies shelved, multiple third thimble ontologies pass through the third even heat plate from the bottom to top；
The third driving mechanism is connected with the third mounting bracket, to drive the third mounting bracket to move up and down；
Transmitting device in the process cavity is arranged in the upside of the third even heat plate.
Further, spraying mechanism is additionally provided in the process cavity, the spraying mechanism is fixed on the third even heat plate
Upside, and be connected to the gas box outside the process cavity by pipeline.
Further, the transmitting device includes multiple horizontally disposed transfer rollers, and multiple transfer rollers are mutually parallel
And it rotates synchronously.
Further, further include loading stage, preheating cavity, the second cooling chamber and relieving platform, the transmitting device passes sequentially through
Loading stage, preheating cavity, process cavity, the second cooling chamber and relieving platform.
Further, heating fluorescent tube is equipped in the preheating cavity, the heating fluorescent tube is fixed on the lower part of the preheating cavity,
Transfer roller in the preheating cavity is located at the upside of the heating fluorescent tube.
The embodiment of the present application also provides a kind of coating process, the coating process includes the following steps：
Substrate enters in a process cavity and carries out plated film；
To the corresponding assigned temperature of next process cavity, the substrate after temperature adjustment enters next work for substrate temperature adjustment after plated film
Skill intracavitary simultaneously carries out plated film, until substrate completes plated film in the last one process cavity.
Further, plated film is carried out to substrate in process cavity in the following way：
Substrate is transported by transmitting device into first process cavity, is located at the substrate on the transmitting device described in
Third handling device in process cavity is transported on the third even heat plate in the process cavity, and plated film is carried out to substrate.
Further, the substrate temperature adjustment after the plated film is to the corresponding assigned temperature of next process cavity, including：
Substrate after plated film, which is transported by transmitting device to temperature adjustment intracavitary, carries out temperature adjustment, and substrate is adjusted to next process cavity pair
It is transported in next process cavity by transmitting device after the assigned temperature answered.
Description of the drawings
The advantages of the application is above-mentioned and/or additional aspect will be apparent from combining in description of the following accompanying drawings to embodiment
Be readily appreciated that, wherein：
Fig. 1 is the structural schematic diagram of coating system in one embodiment in the application；
Fig. 2 is the structural schematic diagram of another embodiment coating system in the application；
Fig. 3 is the structural schematic diagram of the first process cavity in the application one embodiment；
Fig. 4 is the structural schematic diagram of heating chamber in the application one embodiment；
Fig. 5 is the structural schematic diagram of the first cooling chamber in the application one embodiment
Fig. 6 is the flow chart of coating process in the application one embodiment；
Fig. 7 is the flow chart of coating process in the application another embodiment.
Correspondence in wherein Fig. 1 to Fig. 5 between reference numeral and component names is：
1, loading stage, 2, preheating cavity, 21, heating fluorescent tube, 3, process cavity, the 31, first process cavity, 311, third carry dress
It sets, 3111, third driving mechanism, 3112, third ejector pin mechanism, 31121, mounting bracket, 31122, third thimble ontology, 312,
Three even heat plates, 313, spraying mechanism, the 32, second process cavity, 4, temperature adjustment chamber, 41, heating chamber, the 411, first handling device, 4111,
First driving mechanism, the 4112, first ejector pin mechanism, the 41121, first mounting bracket, the 41122, first thimble ontology, 412, first is even
Hot plate, the 42, first cooling chamber, the 421, second handling device, the 4211, second driving mechanism, the 4212, second ejector pin mechanism,
42121, the second mounting bracket, the 42122, second thimble ontology, the 422, second even heat plate, 5, gas box, the 6, second cooling chamber, 7, unloading
Platform, 8, transmitting device, 9, gate valve.
Specific implementation mode
It is below in conjunction with the accompanying drawings and specific real in order to be more clearly understood that the above objects, features, and advantages of the application
Mode is applied the application is further described in detail.It should be noted that in the absence of conflict, the implementation of the application
Feature in example and embodiment can be combined with each other.
As shown in Figure 1, the embodiment of the present application provides a kind of coating system, including transmitting device 8,3 and of multiple process cavities
The temperature adjustment chamber 4 being equipped between two neighboring process cavity 3.
Wherein, be configured to will be in substrate transport to process cavity 3 and temperature adjustment chamber 4 for transmitting device 8；Each process cavity 3 is configured to
Corresponding process gas is passed through to carry out plated film to substrate；Temperature adjustment chamber 4 is configured to the substrate temperature adjustment after plated film to next
3 corresponding assigned temperature of a process cavity.
Coating system provided by the embodiments of the present application can support the film layer that multiple and different types are plated to substrate, to obtain
Performance preferably has the substrate of composite film；Compared with existing coating system, coating system provided by the present application is in substrate
On when preparing stratified film substrate do not have to take out out of system, therefore breaking vacuum will not be contacted with ambient atmosphere and exposure is big
Gas can avoid, because of film layer and air catalytic oxidation, causing to lead to the problem of impurity in film layer, the film quality on substrate
More preferably；And it is set between two neighboring process cavity 3 there are one temperature adjustment chamber 4, the temperature of substrate is adjusted by temperature adjustment chamber 4, makes substrate
Temperature meet the needs of next 3 preparation temperature of process cavity, reduce into the temperature settling tune in next reaction chamber,
It greatly improves production efficiency, improve production capacity.
A kind of coating system provided by the embodiments of the present application can be applied to LPCVD (low pressure chemical vapor deposition) system,
Or other need the equipment for carrying out composite film coating.
According to one embodiment of the application, as shown in Fig. 2, coating system further includes that loading stage 1, preheating cavity 2, second are cold
But chamber 6 and relieving platform 7, transmitting device 8 pass sequentially through loading stage 1, preheating cavity 2, process cavity 3, the second cooling chamber 6 and relieving platform 7.
In one embodiment of the application, as depicted in figs. 1 and 2, transmitting device 8 includes multiple horizontally disposed transmission
Roller, multiple transfer rollers are mutually parallel and rotate synchronously.
In another embodiment of the application, transmitting device 8 further includes the 4th driving mechanism and supporting mechanism.Multiple transmission
Roller is separately mounted on supporting rack, and the 4th driving mechanism is for driving multiple transfer rollers to rotate synchronously.
Wherein, supporting mechanism can be supporting rack, and multiple transfer rollers are horizontally disposed with and are mounted side by side on supporting rack, and more
It is mutually parallel between a transfer roller.
Wherein, the 4th driving mechanism can be driving motor, and driving motor drives transfer roller rotation, and then drives to be located at and pass
The substrate on roller is sent to move.
Wherein, it is equipped with transfer roller in multiple process cavities 3 and temperature adjustment chamber 4.
In another embodiment of the application, each transfer roller is sequentially connected with the 4th driving mechanism.Such as one
Driving motor drives the rotation of supporting mechanism upper belt, and belt connects with the end of each transfer roller, and then drives each transmission
Roller rotates；Or be sequentially connected with the 4th driving mechanism on each transfer roller, it can realize in the application by the
Four driving mechanisms drive the purpose of all transfer roller rotations.
It should be noted that in one embodiment of the application, a part of transfer roller and the 4th driving mechanism are sequentially connected,
If at least one transfer roller in process cavity 3 and the 4th driving mechanism are sequentially connected, in temperature adjustment chamber 4 at least one transfer roller with
4th driving mechanism is sequentially connected.
By taking temperature adjustment chamber 4 as an example, it is sequentially connected in the transfer roller and the 4th driving mechanism positioned at 4 both ends of temperature adjustment chamber and centre,
Other transfer rollers are driven transfer roller.
By taking the transfer roller on loading stage 1 as an example, the transfer roller and the 4th driving mechanism at both ends and middle part pass on loading stage 1
Dynamic connection, others are driven transfer roller.
In one embodiment of the application, only the transfer roller at both ends and the 4th driving mechanism are sequentially connected, or only one
A transfer roller and the 4th driving mechanism are sequentially connected, as long as it can realize the next station of substrate feeding on transfer roller
It can achieve the object of the present invention；Similarly drive connection mode and the temperature adjustment of the transfer roller in process cavity 3 and the 4th driving mechanism
The situation of chamber 4 is identical, and details are not described herein.
In one embodiment of the application, what transfer roller can pull and push is connected on supporting rack, i.e., transfer roller can be passed from support
It send position to extract out, transmission position can also be inserted into.
It, in this way can be to large-sized in such a way that transfer roller directly transports substrate in one embodiment of the application
Substrate is conveyed, transmission efficiency higher, is solved the presence due to backing plate in the prior art and is transmitted effect for large-size substrate
The low problem of rate, while when heating the substrate plated film in process cavity 3, substrate can be contacted directly with heating plate,
Heat in heating plate can be directly passed to substrate, require no backing plate, heat transference efficiency higher, at the same also avoid due to
Easily cause the non-uniform problem of substrate temperature using the mode of backing plate this multilayer conduction, and the temperature uniformity of substrate
Last quality of forming film is directly affected in the technique of plated film, therefore can improve quality of forming film；And it is applicable in without using backing plate
In transmission of the hard substrates such as glass in production system.
In one embodiment of the application, as shown in Figure 4 and Figure 5, temperature adjustment chamber 4 be heating chamber 41 or the first cooling chamber 42,
Heating chamber 41 makes the temperature of substrate meet next work for being heated to the substrate completed in 3 plated film of a upper process cavity
The temperature requirements of skill chamber 3；First cooling chamber 42 makes base for being cooled down to the substrate completed in 3 plated film of a upper process cavity
The temperature of plate meets the temperature requirements of next process cavity 3.Temperature adjustment chamber 4 is heating chamber 41 or the first cooling chamber 42, can be passed through
Heating chamber 41 increases the temperature of substrate, and passing through cooling chamber reduces the temperature of substrate, and wherein temperature adjustment chamber 4 uses heating chamber 41 or the
One cooling chamber 42 can be judged by the production requirement of next process cavity 3, if the coating process temperature of next process cavity 3
As soon as more than the coating process temperature of upper process cavity 3, temperature adjustment chamber 4 selects heating chamber 41, on the contrary then the first cooling of selection at this time
Chamber 42.
As shown in figure 4, being equipped with the first even heat plate 412 and the first handling device 411, the first handling device in heating chamber 41
411 for by the workpiece handling on transmitting device to the first even heat plate 412, or by the workpiece handling on the first even heat plate 412
Onto transmitting device.First handling device 411 includes the first ejector pin mechanism 4112 and the first driving mechanism 4111, the first even heat plate
412 are mounted on the lower part of heating chamber 41, and the first ejector pin mechanism 4112 includes the first mounting bracket 41121 and is vertically installed at the first peace
Multiple first thimble ontologies 41122 on 41121 are shelved, multiple first thimble ontologies 41122 pass through the first even heat from the bottom to top
Plate 412；First driving mechanism 4111 is connected with the first mounting bracket 41121, to drive the first mounting bracket 41121 to move up and down；Position
It is arranged in the upside of the first even heat plate 412 in the transfer roller in heating chamber 41.
As shown in figure 4, the first driving mechanism 4111 is located at the outside of heating chamber 41, the output end of the first driving mechanism 4111
It is sequentially connected across heating chamber 41 and the first ejector pin mechanism 4112.
In one embodiment of the application, the first driving mechanism 4111 can be cylinder or hydraulic cylinder；In heating chamber 41
Transfer roller be located at the upside of the first even heat plate 412；When substrate enters heating in heating chamber 41, the first driving mechanism is first passed through
4111 the first mounting brackets 41121 of drive move up, and then drive the multiple first thimble sheets being located on the first mounting bracket 41121
Body 41122 passes through the first even heat plate 412, multiple first thimble ontologies 41122 that the gap on transfer roller is passed through to be resisted against substrate
Lower surface, multiple first thimble ontologies 41122 continue to move up the upper surface for jacking up substrate and being detached from transfer roller, will pass at this time
Roller is sent to be withdrawn from the downside of substrate, multiple first thimble ontologies 41122 are supported substrate, at this time the first driving mechanism 4111
It drives the first mounting bracket 41121 to move down, the first thimble ontology 41122 and substrate is driven to move down until the first thimble sheet
In through-hole on the upper end retraction even heat plate of body 41122, substrate is just placed on the first even heat plate 412 at this time, even by first
Hot plate 412 heats the substrate, until substrate is heated to assigned temperature (i.e. next 3 required temperature of process cavity)；Lead at this time
Crossing the first driving mechanism 4111 drives the first mounting bracket 41121 to move up, multiple first thimble ontologies 41122 push substrates to
Multiple transfer rollers are stretched out reset at this time, then passed through again by upper movement until substrate is increased to the upside of transfer roller installation site
First driving mechanism 4111 drives the first mounting bracket 41121 and multiple first thimble ontologies 41122 thereon to move down reset,
Substrate is fallen on transfer roller at this time, and substrate is sent into next process cavity 3 by transfer roller.
In one embodiment of the application, the first cooling chamber 42 is used to cool down to entering its internal coated basal plate,
As shown in figure 5, being equipped with the second even heat plate 422 and the second handling device 421 in the first cooling chamber 42, the second handling device 421 is used
In by the workpiece handling on transmitting device to the second even heat plate 422, or by the workpiece handling on the second even heat plate 422 to transmission
On device.Second handling device 421 includes the second ejector pin mechanism 4212 and the second driving mechanism 4211, the second even heat plate 422 peace
Mounted in the lower part of the first cooling chamber 42, the second ejector pin mechanism 4212 includes the second mounting bracket 42121 and is vertically installed at the second peace
Multiple second thimble ontologies 42122 on 42121 are shelved, multiple second thimble ontologies 42122 pass through the second even heat from the bottom to top
Plate 422；Second driving mechanism 4211 is connected with the second mounting bracket 42121, to drive the second mounting bracket 42121 to move up and down；Position
It is arranged in the upside of the second even heat plate 422 in the transfer roller in the first cooling chamber 42；By the second even heat plate 422 to coated basal plate
It is cooled down.
As depicted in figs. 1 and 2, in one embodiment of the application, there are two process cavity 3 is set, respectively the first process cavity
31 and second process cavity 32, the first process cavity 31 be located at the front end of the second process cavity 32, the first process cavity 31 is used to plate substrate
ZnO (zinc oxide) film layer, the second process cavity 32 are used to plate BZO (boron zinc oxide) film layer (i.e. in ZnO film layer to glass substrate
Form BZO film layers), since the production technology temperature of BZO film layers is more than the production technology temperature of ZnO, temperature adjustment chamber 4 is heating
Chamber 41, if the first process cavity 31 is for producing BZO film layers, the second process cavity 32 is for producing ZnO, then temperature adjustment chamber 4 is just
First cooling chamber 42.
It should be noted that in one embodiment of the application, process cavity 3 can also be there are three settings, four, five or
Six, the type of temperature adjustment chamber 4 is selected for the demand of temperature according to two adjacent process cavities 3, plates membrane system at one in this way
A variety of film layers can be produced in system simultaneously, can equally realize the purpose of the application, design of the objective without departing from the application
Thought should belong to the protection domain of the application.
In one embodiment of the application, the structure of multiple process cavities 3 is identical, is had by taking the first process cavity 31 as an example
Body illustrates the structure of process cavity 3, as shown in figure 3, third even heat plate 312 and third handling device 311 are equipped in process cavity 31, the
Three handling devices 311 are used for the workpiece handling on transmitting device to third even heat plate 312, or will be on third even heat plate 312
Workpiece handling to transmitting device on.
As shown in figure 3, third handling device 311 includes third ejector pin mechanism 3112 and third driving mechanism 3111, third
Even heat plate 312 is mounted on the lower part of process cavity 3, and third ejector pin mechanism 3112 includes third mounting bracket 31121 and is vertically installed at
Multiple third thimble ontologies 31122 on third mounting bracket 31121, multiple third thimble ontologies 31122 pass through the from the bottom to top
Three even heat plates 312；Third driving mechanism 3111 is connected with third mounting bracket 31121, is moved down on third mounting bracket 31121 with driving
It is dynamic；Transfer roller in process cavity 3 is arranged in the upside of third even heat plate 312.
As shown in figure 3, third driving mechanism 3111 is connected with third mounting bracket 31121, to drive third mounting bracket 31121
It moves up and down, third driving mechanism 3111 is located at the outside of process cavity 3, and the output end of third driving mechanism 3111 passes through process cavity
3 are sequentially connected with third ejector pin mechanism 3112.
In one embodiment of the application, third driving mechanism 3111 can be cylinder or hydraulic cylinder；It is set in process cavity 3
There are spraying mechanism 313, spraying mechanism 313 to be connected to technique air source, specific spraying mechanism 313 is by pipeline and is located at process cavity
3 outside gas boxes 5 are connected to, and spraying mechanism 313 is fixed on the upside of third even heat plate 312, and the transfer roller in process cavity 3 is located at spray
Between mechanism 313 and third even heat plate 312.
When substrate enters in 3 plated film of process cavity, first pass through third driving mechanism 3111 drive third mounting bracket 31121 to
Upper movement, and then the multiple third thimble ontologies 31122 being located on third mounting bracket 31121 is driven to pass through third even heat plate 312,
Gap of multiple third thimble ontologies 31122 on transfer roller is resisted against the lower surface of substrate, multiple third thimble ontologies
31122 continue to move up the upper surface for jacking up substrate and being detached from transfer roller, at this time withdraw from transfer roller on the downside of substrate, more
A third thimble ontology 31122 is supported substrate, and third driving mechanism 3111 drives third mounting bracket 31121 downwards at this time
It is mobile, drive third thimble ontology 31122 and substrate to move down until the upper end of third thimble ontology 31122 is retracted even heat plate
On through-hole in, substrate is just placed on third even heat plate 312 at this time, is heated the substrate by third even heat plate 312, directly
It is heated to assigned temperature (plated film required temperature in process cavity 3) to substrate；Then process gas is sprayed by spraying mechanism 313,
Plated film is carried out to substrate, wherein spraying mechanism 313 is shower plate, and shower plate is connected to by pipeline with corresponding gas box 5, by gas box
Process gas in 5 is sent into process cavity 3.Third mounting bracket 31121 is driven by third driving mechanism 3111 after the completion of plated film
It moves up, multiple third thimble ontologies 31122 push substrate to move up, until substrate is increased to transfer roller installation site
Multiple transfer rollers are stretched out reset at this time by upside, are then driving 31121 He of third mounting bracket by third driving mechanism 3111
Multiple third thimble ontologies 31122 thereon move down reset, and substrate is fallen on transfer roller at this time, by transfer roller by substrate
It is sent into the temperature adjustment chamber 4 of lower end.
As shown in Fig. 2, being equipped with heating fluorescent tube 21 in preheating cavity 2, heating fluorescent tube 21 is fixed on the lower part of preheating cavity 2, preheating
Transfer roller in chamber 2 is located at the upside of heating fluorescent tube 21, and base can be reduced in this way by being preheated to substrate by heating fluorescent tube 21
Heating-up time of the plate in process cavity 3, and then improve production efficiency.
In one embodiment of the application, gate valve 9 is equipped between two components that are connected, as loading stage 1 and preheating cavity 2 it
Between be equipped with gate valve 9, the connection or disconnection between loading stage 1 and preheating cavity 2 are realized by gate valve 9, i.e., loaded when gate valve 9 is opened
Platform 1 is connected to preheating cavity 2, the substrate on loading stage 1 can transmitting device be delivered in preheating cavity 2, and gate valve 9 disconnect when load
Platform 1 is separated with preheating cavity 2, can ensure to maintain airtight vacuum state in preheating cavity 2 in this way；Similarly preheating cavity 2 and technique
It is also provided with gate valve 9 between chamber 3, process cavity 3 and the second cooling chamber 6, the second cooling chamber 6 and relieving platform 7.
The temperature for the substrate that wherein the second cooling chamber 6 is completed for reducing the plated film out of process cavity 3 out, prevents substrate
It is directly entered temperature decrease in ambient atmosphere, the performance of substrate is caused defect occur.
As shown in fig. 6, this application provides a kind of coating process, using the plated film of any of the above-described embodiment, including it is following
Step：
S1, substrate enter in a process cavity and carry out plated film；
S2, to the corresponding assigned temperature of next process cavity, the substrate after temperature adjustment enters next the substrate temperature adjustment after plated film
In a process cavity and plated film is carried out, until substrate completes plated film in the last one process cavity.
Coating process provided by the present application carries out plated film using multiple process cavities, can support to plate substrate multiple and different
The film layer of type, to obtain the performance preferably substrate with composite film；Compared with existing coating system, the application provides
Coating system when preparing stratified film on substrate substrate will not be taken out out of system, therefore will not be contacted brokenly with ambient atmosphere
Except vacuum and exposure air, film layer and air catalytic oxidation can be avoided, causes to generate impurity in film layer, the film layer matter on substrate
Amount is more preferable；And set between two neighboring process cavity makes base there are one temperature adjustment chamber by the temperature of the whole glass substrate of temperature adjustment intonation
The temperature of plate meets the needs of next process cavity preparation temperature, when reducing the temperature adjustment into next reaction chamber
Between, it greatly improves production efficiency, improve production capacity.
In one embodiment of the application, plated film is carried out to substrate in process cavity in the following way：Substrate passes through biography
Defeated device is transported into a process cavity, and third even heat plate and third handling device are equipped in process cavity, is located on transmitting device
Substrate be transported on the third even heat plate in this process cavity by third handling device, to substrate carry out plated film.
As shown in fig. 7, step S2 specifically includes following sub-step：S2-1, the substrate after plated film are transported by transmitting device
Temperature adjustment is carried out to temperature adjustment intracavitary, substrate is transported to next by transmitting device after adjusting to the corresponding assigned temperature of next process cavity
In a process cavity；S2-2, the substrate on transmitting device are transported to by the third handling device in process cavity in process cavity
Third even heat plate on, to substrate carry out plated film.
Substrate is in the detailed process of process cavity plated film：Substrate is jacked up by the third ejector pin mechanism in process cavity, withdraws from biography
Transfer roller on defeated device, third ejector pin mechanism reset, and substrate is placed on third even heat plate, the spraying mechanism on process cavity top
Process gas is sprayed, plated film is carried out to substrate；Third ejector pin mechanism jacks up substrate after the completion of plated film, the transmission on transmitting device
Roller stretches out, and third ejector pin mechanism resets, and substrate is placed on the transfer roller of transmitting device.
Specifically, when substrate is entered in process cavity plated film, first passes through third driving mechanism and drive third mounting bracket to moving up
It is dynamic, and then the multiple third thimble ontologies being located on third mounting bracket is driven to pass through third even heat plate, multiple third thimble ontologies
Gap on transfer roller is resisted against the lower surface of substrate, and multiple third thimble ontologies, which continue to move up to jack up substrate, to be taken off
Upper surface from transfer roller at this time withdraws from transfer roller on the downside of substrate, and multiple third thimble ontologies are supported substrate,
Third driving mechanism drives third mounting bracket to move down at this time, and third thimble ontology and substrate is driven to move down until third
In through-hole on the upper end retraction third even heat plate of thimble ontology, substrate is just placed on third even heat plate at this time, passes through third
Even heat plate heats the substrate, until substrate is heated to assigned temperature (plated film required temperature in process cavity)；Then pass through spray
Drench mechanism spray process gas, to substrate carry out plated film, wherein spraying mechanism be shower plate, shower plate by pipeline with it is corresponding
Gas box is connected to, and the process gas in gas box is sent into process cavity.Third peace is driven by third driving mechanism after the completion of plated film
It shelves and moves up, multiple third thimble ontologies push substrate to move up, until substrate is increased to transfer roller installation site
Multiple transfer rollers are stretched out reset at this time, then drive third mounting bracket and thereon more by third driving mechanism again by upside
A third thimble ontology moves down reset, and substrate is fallen on transfer roller at this time, and substrate is sent into the tune of lower end by transfer roller
The second cooling chamber in warm chamber or system.
Below by process cavity set there are two and temperature adjustment chamber it is provided by the embodiments of the present application to illustrate for heating chamber
The technical process of coating process.
Glass substrate is put into loading stage：The glass substrate for having plated CIGS thin film is put into loading by manual or automatic transmission line
On platform, then it is transferred to preheating cavity；
Glass substrate preheats in preheating cavity：After glass substrate is heated to predetermined temperature in preheating cavity, filled by transmitting
Setting will be in board transport to the first process cavity；
The plated film in the first process cavity, third ejector pin mechanism jack up glass substrate, and transfer roller is withdrawn from, third ejector pin mechanism
It resets, glass substrate is placed on third even heat plate, and the shower plate on chamber top sprays process gas, carries out preparing ZnO film layer
Coating process, third ejector pin mechanism jacks up glass substrate after the completion of plated film, and transfer roller stretches out, and third ejector pin mechanism resets,
Substrate will be transferred in heating chamber.
Glass substrate heats again in heating chamber, and the first ejector pin mechanism jacks up glass substrate, and transfer roller is withdrawn from, and first
Ejector pin mechanism resets, and glass substrate is placed on the first even heat plate, by the preparation BZO of glass substrate reheating to technological requirement
Film temperature.Glass substrate will be transferred in the second process cavity；
The plated film in the second process cavity, third ejector pin mechanism jack up glass substrate, and transfer roller is withdrawn from, third ejector pin mechanism
It resets, glass substrate is placed on third even heat plate, and the shower plate on chamber top sprays process gas, carries out preparing BZO film layers
Coating process, third ejector pin mechanism jacks up glass substrate after the completion of plated film, and transfer roller stretches out, and third ejector pin mechanism resets,
Glass substrate will be transferred in cooling chamber.
Glass substrate is cooled down and is purged in cooling chamber, and the glass substrate for having plated film is cooled to certain temperature and goes forward side by side
It went after purging, was passed in relieving platform.
After glass substrate passes to relieving platform, entire technological process is completed.Substrate is passed to by manual or automatic transmission line
Line downstream equipment.
In the description of the present application, it should be noted that the orientation or positional relationship of the instructions such as term "upper", "lower" is base
In orientation or positional relationship shown in the drawings, it is merely for convenience of description the application and simplifies to describe, rather than indicate or imply
Signified device or element must have a particular orientation, with specific azimuth configuration and operation, therefore should not be understood as to this
The limitation of application.In addition, term " first ", " second " are used for description purposes only, it is not understood to indicate or imply relatively heavy
The property wanted.
In the description of the present application, it should be noted that unless otherwise clearly defined and limited, term " installation " " connects
It is logical ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
Can also be electrical connection to be mechanical connection；Can directly be connected to, intermediary indirect communication, Ke Yishi can also be passed through
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
Concrete meaning in application.In addition, in the description of the present application, unless otherwise indicated, the meaning of " plurality " is two or two
More than.
The foregoing is merely the preferred embodiments of the application, not to limit the application, it is all in spirit herein and
Within principle, any modification, equivalent replacement, improvement and so on should be included within the protection domain of the application.
Claims (15)
1. a kind of coating system, which is characterized in that the coating system includes：Transmitting device, multiple process cavities and two neighboring
The temperature adjustment chamber being equipped between the process cavity；
Wherein, the transmitting device is configured to substrate transport to the process cavity and the temperature adjustment intracavitary；
Each process cavity is configured to be passed through corresponding process gas to carry out plated film to the substrate；
The temperature adjustment chamber is configured to the substrate temperature adjustment after plated film to the corresponding assigned temperature of next process cavity.
2. coating system according to claim 1, it is characterised in that：The temperature adjustment chamber is heating chamber or the first cooling chamber.
3. coating system according to claim 2, it is characterised in that：The first even heat plate and first are equipped in the heating chamber
Handling device, first handling device are used for the workpiece handling on the transmitting device to first even heat plate, or
It will be on the workpiece handling to the transmitting device on first even heat plate.
4. coating system according to claim 3, it is characterised in that：First handling device includes the first ejector pin mechanism
With the first driving mechanism, first even heat plate is mounted on the lower part of the heating chamber, and first ejector pin mechanism includes first
Mounting bracket and the multiple first thimble ontologies being vertically installed on first mounting bracket, multiple first thimble ontologies are under
It is supreme to pass through first even heat plate；
First driving mechanism is connected with first mounting bracket, to drive first mounting bracket to move up and down；
Transmitting device in the heating chamber is arranged in the upside of first even heat plate.
5. coating system according to claim 2, it is characterised in that：Be equipped in first cooling chamber the second even heat plate and
Second handling device, second handling device are used for the workpiece handling on the transmitting device to second even heat plate
On, or will be on the workpiece handling to the transmitting device on second even heat plate.
6. coating system according to claim 5, it is characterised in that：Second handling device includes the second ejector pin mechanism
With the second driving mechanism, second even heat plate is mounted on the lower part of first cooling chamber, and second ejector pin mechanism includes
Second mounting bracket and the multiple second thimble ontologies being vertically installed on second mounting bracket, multiple second thimble ontologies
Second even heat plate is passed through from the bottom to top；
Second driving mechanism is connected with second mounting bracket, to drive second mounting bracket to move up and down；
Transmitting device in first cooling chamber is arranged in the upside of second even heat plate.
7. coating system according to claim 1, it is characterised in that：Third even heat plate and third are equipped in the process cavity
Handling device, the third handling device are used for the workpiece handling on the transmitting device to the third even heat plate, or
It will be on the workpiece handling to the transmitting device on the third even heat plate.
8. coating system according to claim 7, it is characterised in that：The third handling device includes third ejector pin mechanism
With third driving mechanism, the third even heat plate is mounted on the lower part of the process cavity, and the third ejector pin mechanism includes third
Mounting bracket and the multiple third thimble ontologies being vertically installed on the third mounting bracket, multiple third thimble ontologies are under
It is supreme to pass through the third even heat plate；
The third driving mechanism is connected with the third mounting bracket, to drive the third mounting bracket to move up and down；
Transmitting device in the process cavity is arranged in the upside of the third even heat plate.
9. coating system according to claim 7, it is characterised in that：Spraying mechanism is additionally provided in the process cavity, it is described
Spraying mechanism is fixed on the upside of the third even heat plate, and is connected to the air source outside the process cavity.
10. according to claim 1 to 9 any one of them coating system, it is characterised in that：The transmitting device includes multiple water
The transfer roller of flat setting, multiple transfer rollers are mutually parallel and rotate synchronously.
11. coating system according to claim 10, it is characterised in that：Further include loading stage, preheating cavity, the second cooling chamber
And relieving platform, the transmitting device pass sequentially through loading stage, preheating cavity, process cavity, the second cooling chamber and relieving platform.
12. coating system according to claim 11, it is characterised in that：Heating fluorescent tube is equipped in the preheating cavity, it is described
Heating fluorescent tube is fixed on the lower part of the preheating cavity, and the transfer roller in the preheating cavity is located at the upside of the heating fluorescent tube.
13. a kind of coating process, which is characterized in that the coating process includes the following steps：
Substrate enters in a process cavity and carries out plated film；
To the corresponding assigned temperature of next process cavity, the substrate after temperature adjustment enters next process cavity for substrate temperature adjustment after plated film
It is interior and carry out plated film, until substrate completes plated film in the last one process cavity.
14. coating system according to claim 13, which is characterized in that in the following way in process cavity to substrate into
Row plated film：
Substrate is transported by transmitting device in process cavity, and the substrate on the transmitting device in the process cavity by setting
Some third handling devices are transported on the third even heat plate in the process cavity, and plated film is carried out to substrate.
15. coating system according to claim 13, it is characterised in that：Substrate temperature adjustment after the plated film is to next technique
The corresponding assigned temperature of chamber, including：
Substrate after plated film, which is transported by transmitting device to temperature adjustment intracavitary, carries out temperature adjustment, and substrate adjusts corresponding to next process cavity
It is transported in next process cavity by transmitting device after assigned temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810768151.XA CN108642478A (en) | 2018-07-13 | 2018-07-13 | A kind of coating system and coating process |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810768151.XA CN108642478A (en) | 2018-07-13 | 2018-07-13 | A kind of coating system and coating process |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111471965A (en) * | 2020-04-30 | 2020-07-31 | 苏州迈正科技有限公司 | Conveying carrier plate, vacuum coating equipment and vacuum coating method |
| CN111485229A (en) * | 2020-05-28 | 2020-08-04 | 深圳市捷佳伟创新能源装备股份有限公司 | Battery piece coating equipment and battery piece coating method |
| CN112403837A (en) * | 2020-11-11 | 2021-02-26 | 上饶市光耀光学设备制造有限公司 | Coating device is used in processing of high accuracy optical lens piece |
| CN114032528A (en) * | 2021-11-08 | 2022-02-11 | 江西汉可泛半导体技术有限公司 | GW-level heterojunction HWCVD equipment |
| CN114657537A (en) * | 2022-03-25 | 2022-06-24 | 厦门韫茂科技有限公司 | Continuous ALD coating equipment |
| CN115852335A (en) * | 2022-10-17 | 2023-03-28 | 江苏微导纳米科技股份有限公司 | Film coating equipment and film coating method |
| WO2024031958A1 (en) * | 2022-08-09 | 2024-02-15 | 通威太阳能（安徽）有限公司 | Solar cell, production device therefor, and copper seed layer coating process and apparatus |
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| CN115852335A (en) * | 2022-10-17 | 2023-03-28 | 江苏微导纳米科技股份有限公司 | Film coating equipment and film coating method |
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