CN110401005A - Encapsulating antenna and preparation method thereof and mobile communication terminal - Google Patents
Encapsulating antenna and preparation method thereof and mobile communication terminal Download PDFInfo
- Publication number
- CN110401005A CN110401005A CN201810374945.8A CN201810374945A CN110401005A CN 110401005 A CN110401005 A CN 110401005A CN 201810374945 A CN201810374945 A CN 201810374945A CN 110401005 A CN110401005 A CN 110401005A
- Authority
- CN
- China
- Prior art keywords
- substrate
- cavity
- adhesives
- plate face
- excessive glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
Abstract
The embodiment of the invention discloses a kind of encapsulating antenna and preparation method thereof and mobile communication terminals.Encapsulating antenna includes first substrate and the second substrate, and first substrate abuts against with the second substrate and passes through adhesives and connect；Excessive glue hole is provided in the cavity wall of the cavity of first substrate, first substrate is run through in excessive glue hole；The welding surface of the second substrate and the junction of cavity face are provided with solder mask structure；Adhesives is set on welding surface, and adhesives is connected with the second plate face of first substrate and extends in excessive glue hole.Extra adhesives is absorbed using excessive glue hole, avoid adhesives between first substrate and the second substrate abutting and distance impact；Solder mask structure prevents adhesives to Cavity Flow, to guarantee the reliability of antenna.Solder mask structure is combined using excessive glue hole, efficiently solves the technological problems of extra adhesives pollution antenna field and adhesives thickness control difficulty, adhesives forms rivet arrangement, makes first substrate and the second substrate firm and reliable connection.
Description
Technical field
The present invention relates to antenna structure field more particularly to a kind of encapsulating antenna and preparation method thereof and mobile communication are whole
End.
Background technique
With the arriving in the high rate communications epoch such as 5G and VR, millimetre-wave attenuator gradually becomes mainstream, millimeter wave antenna
Design and application demand are also more and more vigorous.Since millimeter wave frequency band transmission path length influences very signal amplitude loss
Greatly, the architecture mode of traditional IC+PCB+ antenna is slowly unable to satisfy high performance demands, and the frame of IC+ encapsulating antenna is constituted
For mainstream, here it is AiP (Antenna in Package, encapsulating antenna are integrated) technologies.Usually high antenna gain is not obtained,
Generally by the way of aerial array.In AiP framework, feeder path is extremely short, so that the EIRP of wireless system
(Equivalent Isotropic Radiated Power, equivalent isotropically radiated power) value can maximize, be conducive to wider
The covering of range.Furthermore the wavelength of millimeter wave frequency band is extremely short, and electrical property is very high to the susceptibility of mismachining tolerance, if manufacture essence
Spend bad, just will appear impedance mismatching leads to signal reflex, and traditional PCB processing technology can no longer meet millimeter wave processing essence
Degree requires, therefore the encapsulation process technique with more high manufacturing accuracy has just played bigger value.
AiP antenna array technology will gradually become the mainstream antenna technology of 5G and millimeter wave high-speed communication system, have wide
Application space and market space prospect.In existing AIP technology, 10G~40GHz frequency band millimeter wave day is realized in packaging body
Double substrate encapsulation structures of line and aerial array mainly have upper substrate and lower substrate to constitute, the distance between upper substrate and lower substrate
Height is different and different with antenna frequencies, and antenna frequencies are lower, and the distance between two aerial radiation pieces will be bigger, therefore how
Height between upper substrate and lower substrate is controlled, is key problem in technology point.In the prior art, upper substrate and lower substrate using tin ball or its
He welds cohesive material, and tin ball or other cohesive materials are between upper substrate and lower substrate after welding, using tin ball
Carrying out bonding, there are thermal instabilitys, cause the distance between upper and lower base plate unstable；In addition, cohesive material is easily accessible cavity
Inside forms excessive glue pollution, so that cavity inside exists simultaneously gas and adhesives, can change cavity inside by bonding material
Expect the influence of dielectric constant, and then influence antenna performance, and adhesive-layer thickness control is difficult, process costs are high.
Summary of the invention
The technical problem to be solved by the embodiment of the invention is that providing a kind of encapsulating antenna and preparation method thereof and moving
Mobile communication terminal, guarantees the reliability of antenna, and is avoided that the excessive glue pollution problem of adhesives.
In a first aspect, the embodiment of the invention provides a kind of encapsulating antenna, including first substrate and the second substrate, described
One substrate is stacked with the second substrate, and the two is abutted against and connected by adhesives；
The first substrate has the first plate face and the second plate face that are disposed opposite to each other, and second plate face is towards described second
Substrate setting, is provided with cavity on the first substrate, and the opening of the cavity is located at second plate face and towards described the
Two substrates, excessive glue hole is provided in the cavity wall of the cavity, and first plate face and the second plate face are run through in the excessive glue hole；
The second substrate has the third plate face towards the first substrate, and the third plate face includes cavity face and weldering
Junction, the cavity face are oppositely arranged with the cavity, and the cavity wall of the welding surface and the cavity is oppositely arranged, the welding
Face and the junction of the cavity face are provided with solder mask structure；
The adhesives is set on the welding surface, and the adhesives is oppositely arranged with the excessive glue hole, described
Adhesives is connected with second plate face and extends in the excessive glue hole.
In a first possible implementation of that first aspect, position corresponding with the excessive glue hole on the welding surface
Place is provided with pad, and the adhesives is arranged on the pad；By the way that pad is arranged on welding surface, bonding can be enhanced
The bonding strength of material and the second substrate；
The solder mask structure and the pad interval are arranged, so that there is gap, therebetween to increase adhesives
Flow range, the connection area for increasing adhesives and pad improves bonding strength, while reducing adhesives to first substrate
The influence of spacing between the second substrate；
Alternatively, the solder mask structure covers the edge of the pad；It is more to prevent adhesives from flowing to outside solder mask structure
Remaining adhesives all flows in excessive glue hole.
In a second possible implementation of that first aspect, the adhesives is connected directly with the welding surface；It can
To be directly realized by being fixedly connected between first substrate and the second substrate using adhesives, simplify processing technology, reduces processing
Cost.
In first aspect in the third possible implementation, the solder mask structure is ring-type, the solder mask structure and institute
It states excessive glue hole to be oppositely arranged, and the internal diameter of the solder mask structure is greater than the internal diameter in the excessive glue hole；Utilize cricoid solder mask structure
It can reduce the flow range of solder mask structure, so that adhesives is surrounded in a certain range by solder mask structure, effectively avoid gluing
Material is connect to pollute cavity；
Alternatively, the solder mask structure is the strip being arranged along the cavity wall of the cavity, adhesives can prolonging along cavity wall
It is mobile to stretch direction, the excessive glue range of adhesives can be increased, to reduce to distance between first substrate and the second substrate
It influences.
In the 4th kind of possible implementation of first aspect, the adhesives and the solder mask structure interval are arranged,
The dosage that adhesives can be reduced, avoid adhesives excessively multipair so that adhesives crosses solder mask structure and to antenna performance
It impacts.
In the 5th kind of possible implementation of first aspect, the solder mask structure is made of solder resist material；Utilize welding resistance
Material can further prevent adhesives to enter in cavity.
It is described to overflow in the 6th kind of possible implementation of first aspect in conjunction with aforementioned any possible implementation
Glue hole is stepped hole, and the excessive glue hole includes the first hole and the second hole, and the internal diameter of first hole is less than described second
The internal diameter of hole, for relatively described second hole of first hole close to the second substrate, the adhesives is filled in institute
It states the first hole and extends in the second hole；It can be rivet arrangement, the company of further increasing at both ends using adhesives
Intensity, and the second hole by being relatively large in diameter are connect, more adhesives can be accommodated.
In the 7th kind of possible implementation of first aspect, second plate face is connected to the solder mask structure；So that
It obtains first substrate mutually to abut with the second substrate, so that the height spacing of the two is kept fixed.
In the 8th kind of possible implementation of first aspect,
The second substrate has the 4th plate face, and the 4th plate face is disposed opposite to each other with the third plate face；
The encapsulating antenna further includes chip, and the chip is connected to the 4th plate face.Pass through antenna pattern and chip
Cooperation, encapsulating antenna can be made to reach default frequency range.
Second aspect, the present invention provides a kind of mobile communication terminal, the mobile communication terminal has aforementioned encapsulation day
Line.
The third aspect, the present invention provides a kind of preparation methods of encapsulating antenna, are used to prepare encapsulating antenna above-mentioned, institute
The preparation method for stating encapsulating antenna includes:
One first substrate is provided, the first substrate has the first plate face and the second plate face being disposed opposite to each other, and described first
Cavity is provided on substrate, the opening of the cavity is located at second plate face, is provided with excessive glue hole in the cavity wall of the cavity,
First plate face and the second plate face are run through in the excessive glue hole；
A second substrate is provided, the second substrate has third plate face, and the third plate face includes cavity face and welding
The junction of face, the welding surface and the cavity face is provided with solder mask structure；
Adhesives is set on the welding surface；
By the opening of the cavity towards the second substrate, the excessive glue hole of the first substrate is directed at the bonding material
Material, then in the second substrate and the two is abutted against the first substrate patch, the adhesives and described second
Plate face is connected and extends in the excessive glue hole.
In the third aspect in the first possible implementation, one first substrate of the offer the step of in, further include
Following sub-step:
A copper-clad plate is provided, the copper-clad plate has the first surface and second surface being oppositely arranged；
Antenna pattern is set on the first surface；
The silk-screen resin layer on the second surface, and toast, cavity wall is formed, cavity wall crowds around to form cavity；
Excessive glue hole is bored at the position of the cavity wall, copper-clad plate and resin layer are run through in excessive glue hole.It, can by silk-screen resin layer
With the problem that solve first substrate production efficiency low, at high cost.
In second of the third aspect possible implementation, on the second surface silk-screen resin layer and toast
Step, which is repeated as many times, to be executed, to reach preset thickness, to reach antenna applications frequency and performance.
In the third aspect in the third possible implementation, in the step of adhesives is arranged on the recessed welding surface
In, the adhesives is set to by the welding surface by dispensing, the diameter of the adhesives is greater than the excessive glue hole
Diameter；So that adhesives can carry out be bonded, the bonding strength of raising first substrate and the second substrate with the second plate face.
In the 4th kind of possible implementation of the third aspect, in the step of adhesives is arranged on the recessed welding surface
In, gap is provided between the adhesives and the solder mask structure；Excessively make to avoid adhesives in patch process
Middle adhesives is crossed solder mask structure and is polluted.
By implementing the embodiment of the present invention, by the way that first substrate and the second substrate are abutted against setting, it is ensured that the two
The distance between be fixed value, guarantee the reliability of antenna；It is connected by adhesives with the second plate face and welding surface, can be incited somebody to action
First substrate is fixed together with the second substrate, and extra adhesives can be absorbed using excessive glue hole, avoids bonding material
Expect to impact directly abutting between first substrate and the second substrate；Solder mask structure can prevent adhesives to cavity zone
Domain flowing, avoids adhesives from entering cavity, so that the dielectric constant in cavity not will receive the influence of adhesives, and
So that adhesives will not be attached to the second radiation fin, so that the reliability of antenna be effectively ensured；Welding resistance is combined using excessive glue hole
Structure efficiently solves the technological problems of extra adhesives pollution antenna field and adhesives thickness control difficulty, is bonded material
Material is connected with the second plate face and enters in excessive glue hole, allows adhesives to form rivet arrangement, plays preferable welding
The effect of first substrate and the second substrate.
Detailed description of the invention
Technical solution in order to illustrate the embodiments of the present invention more clearly or in background technique below will be implemented the present invention
Attached drawing needed in example or background technique is illustrated.
Fig. 1 is the structural schematic diagram for the encapsulating antenna that the preferred embodiment of the present invention provides；
Fig. 2 is structure enlargement diagram at A in Fig. 1；
Fig. 3 is structure enlargement diagram at B in Fig. 1；
Fig. 4 is structure enlargement diagram at C in Fig. 1；
Fig. 5 is the structural schematic diagram of another embodiment in the excessive glue hole of encapsulating antenna in the present invention；
Fig. 6 to Fig. 9 is the process schematic of the first preparation method of the first substrate of encapsulating antenna in the present invention；
Figure 10 to Figure 13 is the process schematic of second of preparation method of first substrate of encapsulating antenna in the present invention；
Figure 14 to Figure 18 is the process schematic of the third preparation method of the first substrate of encapsulating antenna in the present invention；
Figure 19 is the structural schematic diagram of the second substrate of encapsulating antenna in the present invention；
Figure 20 is that the structural schematic diagram after adhesives is arranged in the second substrate；
Figure 21 be in the present invention first substrate and the second substrate bonding after structural schematic diagram；
Figure 22 is that the structural schematic diagram after chip is arranged in the second substrate in Figure 21；
Figure 23 is to plant the structural schematic diagram after BGA ball in the second substrate in Figure 22.
Specific embodiment
The embodiment of the present invention is described with reference to the attached drawing in the embodiment of the present invention.
Referring to Figure 1, Fig. 1 is a kind of encapsulating antenna provided in an embodiment of the present invention, including first substrate 100 and the second base
Plate 200, first substrate 100 are stacked with the second substrate 200, and the two abuts against and passes through adhesives 300 and connects, pass through by
First substrate 100 and the second substrate 200 abut against setting, it is ensured that distance between the two is fixed value, even across more
Secondary high warm fantasy, can still be maintained preferable stability, guarantees the reliability of antenna.
First substrate 100 has the first plate face 100a and the second plate face 100b being disposed opposite to each other.First plate face 100a deviates from
The second substrate 200 is arranged, and antenna pattern can be set in the first plate face 100a, and antenna pattern includes the first radiation fin 109.Second plate
Face 100b is arranged towards the second substrate 200, and cavity 10 is provided on first substrate 100, and cavity 10 is to be arranged in the second plate face
Groove structure at 100b, the opening of cavity 10 are located at the second plate face 100b and towards the second substrate 200, the cavity walls of cavity 10
Excessive glue hole 102 is provided on 101, the first plate face 100a and the second plate face 100b is run through in excessive glue hole 102.The second substrate 200 has
It include cavity face 210a and welding surface 220a, cavity face towards the third plate face 200a of first substrate 100, third plate face 200a
The second radiation fin 209 is provided on 210a, cavity face 210a is oppositely arranged with cavity 10, and cavity 10 is located at the first radiation fin 109
And second between radiation fin 209.The lower air of dielectric constant can be filled in cavity 10, utilize the first radiation fin 109 and
The interaction of two radiation fins 209 and cavity 10, may be implemented signal radiation.It is corresponding at the position of cavity 10 in the present embodiment
It is provided with first radiation fin 109 and second radiation fin 209, certainly in other embodiments, the position of cavity 10
The quantity of corresponding first radiation fin 109 in place and the second radiation fin 209 can according to need specific determination.
Welding surface 220a and the cavity wall 101 of cavity 10 are oppositely arranged, and welding surface 220a and the junction of cavity face 210a are set
It is equipped with solder mask structure 201, solder mask structure 201 protrudes from third plate face.Adhesives 300 is set on welding surface 220a, bonding
Material 300 is oppositely arranged with excessive glue hole 102, and adhesives 300 is connected with the second plate face 100b and extends in excessive glue hole 102.
It is connected by adhesives 300 with the second plate face 100b and welding surface 220a, it can be by first substrate 100 and second
Substrate 200 is fixed together, and extra adhesives 300 can be absorbed using excessive glue hole 102, avoid adhesives 300
Directly abutting between first substrate 100 and the second substrate 200 is impacted.
Solder mask structure 201 can prevent adhesives 300 from flowing to 10 region of cavity, and adhesives 300 is avoided to enter
Cavity 10 so that the dielectric constant in cavity 10 not will receive the influence of adhesives 300, and makes adhesives 300 not
It can be attached to the second radiation fin 209, so that the reliability of antenna be effectively ensured.
Solder mask structure 201 is combined using excessive glue hole 102, extra adhesives 300 is efficiently solved and pollutes antenna field and glue
The technological problems of material 300 thickness control difficulty are connect, adhesives 300 is connected with the second plate face 100b and enters excessive glue hole
In 102, adhesives 300 is allowed to form rivet arrangement, plays preferable welding first substrate 100 and the second substrate 200
Effect.
In the present embodiment, the cavity 10 on first substrate 100 is multiple, the interval of a plurality of cavities 10 setting, two neighboring sky
Chamber 10 is separated by cavity wall 101, and a plurality of cavities 10 can arrange in matrix, and there are four empty for display in sectional view as shown in Figure 1
Chamber 10.Herein, the quantity of cavity 10 is also not limited to shown in Fig. 1, and the quantity of cavity 10 can be determined according to antenna performance.
It is formed at least three cavity walls 101 between four cavitys 10, is provided with excessive glue hole 102 in three cavity walls 101.More
Specifically, the structure of the corresponding position of three corresponding the second substrates 200 in excessive glue hole 102 has differences, and forms three differences
Embodiment.In addition, in other embodiments, the corresponding position of three corresponding the second substrates 200 in excessive glue hole 102
Structure can be identical, to facilitate processing to prepare, reduces production cost.
As shown in Fig. 2, at the position in first excessive glue hole 102 at i.e. A, it is opposite with excessive glue hole 102 on welding surface 220a
Pad 202 is provided at the position answered, adhesives 300 is arranged on pad 202, and solder mask structure 201 is set with the interval of pad 202
It sets.By the way that pad 202 is arranged on welding surface 220a, the bonding strength of adhesives 300 Yu the second substrate 200 can be enhanced.
Setting is spaced between solder mask structure 201 and pad 202, so that there are gaps 203 therebetween, to increase adhesives 300
Flow range, the connection area for increasing adhesives 300 and pad improve bonding strength, while reducing adhesives 300 to the
The influence of spacing between one substrate 100 and the second substrate 200.
As shown in figure 3, at the position in second excessive glue hole 102 at i.e. B, it is opposite with excessive glue hole 102 on welding surface 220a
Pad 202 is provided at the position answered, adhesives 300 is arranged on pad 202, and solder mask structure 201 covers the side of pad 202
Edge, to prevent adhesives 300 from flowing to outside solder mask structure 201, extra adhesives 300 all flows to excessive glue hole 102
In.
As shown in figure 4, adhesives 300 and welding surface 220a are direct at the position in third excessive glue hole 102 at i.e. C
It is connected, can use adhesives 300 and be directly realized by being fixedly connected between first substrate 100 and the second substrate 200, simplify and add
Work technique reduces processing cost.
In the embodiment at 201 position of above three solder mask structure, the shape of solder mask structure 201 can be ring-type,
Solder mask structure 201 is oppositely arranged with excessive glue hole 102, and the internal diameter of solder mask structure 201 is greater than the internal diameter in excessive glue hole 102；With convenient
Adhesives 300 can be attached with the second plate face 100b, can reduce solder mask structure using cricoid solder mask structure 201
201 flow range effectively avoids adhesives so that adhesives 300 is surrounded in a certain range by solder mask structure 201
300 pairs of cavitys 10 pollute.Herein, in other embodiments, solder mask structure 201 can also be for along the cavity wall of cavity 10
The strip of 101 settings, adhesives 300 can be moved along the extending direction of cavity wall 10, can increase the excessive glue model of adhesives
It encloses, to reduce the influence to distance between first substrate and the second substrate；Adhesives can be prevented using solder mask structure 201
300 flow to 10 position of cavity.
In the present embodiment, solder mask structure 201 is made of solder resist material, and solder resist material can be the green oil etc. for circuit board
Solder mask or solder resist can directly coat solder resist material on third plate face 200a and form solder mask structure；Alternatively, welding resistance
Structure 201 is that the protrusion of third plate face 200a is arranged in, and coats solder resist material on the surface of protrusion.It can be into using solder resist material
One step prevents adhesives 300 from entering in cavity 10.
Adhesives 300 and the interval of solder mask structure 201 are arranged, it is possible to reduce the dosage of adhesives 300 avoids bonding material
Material 300 is excessively multipair so that adhesives 300 is crossed solder mask structure 201 and impacted to antenna performance.
In the present embodiment, as shown in Figures 2 to 4, the second plate face 100b is connected to solder mask structure 201, so that first
Substrate 100 is mutually abutted with the second substrate 200, so that the height spacing of the two is kept fixed.Herein, in other embodiments
In, protrusion can be set on the second plate face 100b, and protrusion is connected to the third plate face 200a of the second substrate 200, or the
On three plate face 200a be arranged protrusion, protrusion abut with first substrate 100 on second surface, can guarantee first substrate 100 with
The second substrate 200 mutually abuts；It is also provided with solder mask structure alternatively, being located at cavity edge position in the second plate face, the
Solder mask structure in two plate faces is abutted against with the solder mask structure in third plate face, so that first substrate is mutual with the second substrate
It abuts, further adhesives can be prevented to be flowed into cavity using the solder mask structure in the second plate face.
The second substrate 200 has the 4th plate face 200b, and the 4th plate face is disposed opposite to each other with third plate face 200a；Encapsulating antenna is also
Including chip 400, chip 400 is connected to the 4th plate face 200b.Pass through the first radiation fin 109, cavity 10, the second radiation fin 209
With the cooperation of chip 400, encapsulating antenna can be made to reach default frequency range, play performance.
In the above-described embodiment, excessive glue hole 102 is clear opening, in addition, in other embodiments, as shown in figure 5, overflowing
Glue hole 102 can also be stepped hole, and excessive glue hole 102 includes the first hole 102a and the second hole 102b, the first hole 102a's
Internal diameter of the internal diameter less than the second hole 102b, the first hole 102a, close to the second substrate 200, are bonded material with respect to the second hole 102b
Material 300 is filled in the first hole 102a and extends in the second hole 102b, can be riveting at both ends using adhesives 300
Pin structure further increases bonding strength, and the second hole 102b by being relatively large in diameter, can accommodate more adhesives
300.Herein, can also excessive glue hole 102 towards the second substrate 200 edge be arranged chamfering, in favor of adhesives 300 into
Enter into excessive glue hole 102.
The present invention provides a kind of mobile communication terminal, mobile communication terminal has encapsulating antenna above-mentioned.
The present invention also provides the preparation method of aforementioned encapsulation antenna, which includes:
Step 10, a first substrate is provided, first substrate has the first plate face and the second plate face being disposed opposite to each other, and described the
Antenna pattern is provided on one substrate, the antenna pattern includes the first radiation fin；Cavity is provided on first substrate, cavity
Opening is located at the second plate face, and the cavity is the groove structure being arranged at second plate face, and the cavity and described the
The position of one radiation fin is corresponding, and excessive glue hole is provided in the cavity wall of cavity, and the first plate face and the second plate face are run through in excessive glue hole.This
Place, it is possible to understand that ground, cavity is corresponding with the position of the first radiation fin to be referred to, the thickness of cavity and the first radiation fin along first substrate
Spend direction arrangement setting.
It further include following sub-step as shown in Figures 6 to 9 in the first specific implementation of this step 10.
Step 111, as shown in fig. 6, providing a copper-clad plate 11, copper-clad plate 11 have the first surface 11a that is oppositely arranged and
Second surface 11b.
Step 112, as shown in fig. 6, antenna pattern is arranged on the first surface 11a of copper-clad plate 11, and the first spoke is formed
Penetrate piece 109.It, can be by plant substrate or printed wiring board factory existing equipment and condition the first of copper-clad plate 11 in the step
Antenna pattern is arranged in 11a on surface.
Step 113, as shown in fig. 7, on the second surface 11b of copper-clad plate 11 silk-screen resin layer 12, and toast, form chamber
Wall 101, cavity wall 101 crowd around to form cavity 10.It the position of cavity wall 101 and cavity 10 can be according to the position of the first radiation fin 109
It is determined.In the step, resin layer can be formed by screen process press or steel mesh printing machine technique silk-screen.Such as Fig. 8 institute
Show, single printing can be unable to reach preset thickness, can repeat the step, repeatedly print and toast, until reaching
Preset thickness.The preset thickness can be determined according to antenna applications frequency and performance.
Step 114, excessive glue hole 102 is bored at the position of cavity wall 101, copper-clad plate 11 and resin layer 12 are run through in excessive glue hole 102.
It by above step, can process to form first substrate 100, by silk-screen resin layer, can solve first substrate
100 production efficiencys are low, problem at high cost.
It can also include following sub-step as shown in Figure 10 to Figure 13 in second of specific implementation of this step 10
Suddenly.
Step 121, as shown in Figure 10, a copper-clad plate 11 is provided, copper-clad plate 11 have the first surface 11a being oppositely arranged and
Second surface 11b.
Step 122, as shown in Figure 10, antenna pattern is set on first surface 11a.In the step, substrate can be passed through
Antenna pattern is arranged on the first surface 11a of copper-clad plate 11 in factory or printed wiring board factory existing equipment and condition, and is formed
First radiation fin 109.
Step 123, as shown in figure 11, prepare photosensitive dielectric material, pasted photosensitive dielectric material using vacuum laminator
In the second surface 11b of copper-clad plate 11, photosensitive dielectric material layer 13 is formed, 13 thickness of photosensitive dielectric material layer is answered depending on antenna
With frequency and performance.
Step 124, as shown in figure 12, using exposure, developing apparatus, by the corresponding area of the first radiation fin 109 of antenna pattern
The photosensitive dielectric material layer 13 in domain removes, and forms cavity 10 and its cavity wall 101.
Step 125, as shown in figure 13, excessive glue hole 102 is bored at the position of cavity wall 101, photoimageable dielectric is run through in excessive glue hole 102
Material layer 13 and copper-clad plate 11.
It can also include following sub-step as shown in Figure 14 to Figure 18 in the third specific implementation of this step 10
Suddenly.
Step 131, as shown in figure 14, the copper-clad plate of two kinds of thickness, the first copper-clad plate CCL1 and second copper-clad plate are provided
CCL2 and low-flow paste prepreg PPG, and the thickness of three depends on the antenna performance to be made.
Step 132, half is pasted admittedly to three kinds of material the first copper-clad plate CCL1 and second copper-clad plate CCL2 and low-flow
Change piece PPG, carries out following old process processing.
As shown in figure 15, antenna pattern is made in the first surface CCL1a of the first copper-clad plate CCL1.
As shown in figure 16, second copper-clad plate CCL2 is corresponded to by the first copper-clad plate CCL1 by machine drilling and milling edge equipment
Antenna area hollows out removal, forms cavity 10 and its cavity wall 101.
Step 133, as shown in figure 17, the first copper-clad plate CCL1 and second copper-clad plate CCL2 are led to using prepreg PPG
Cross laminated bonding together, second copper-clad plate CCL2 is bonded at the second surface CCL1b of the first copper-clad plate CCL1.
Step 134, as shown in figure 18, excessive glue hole 102 is bored at the position of cavity wall 101, copper is covered through first in excessive glue hole 102
Plate CCL1, prepreg PPG and second copper-clad plate CCL2.
In the above-described embodiment, it first can prepare to form antenna pattern, to form the first radiation fin, further according to first
The position of radiation fin prepares to form cavity and its cavity wall；Certainly, in other embodiments, can also first prepare to be formed cavity and
Its cavity wall prepares to form the first radiation fin further according to the position of cavity.
Step 20, as shown in figure 19, a second substrate 200 is provided, the second substrate 200 has third plate face 200a, third
Plate face 200a includes cavity face 210a and welding surface 220a, is provided with the second radiation fin on cavity face 210a, welding surface 220a with
The junction of cavity face 210a is provided with solder mask structure 201, and solder mask structure 201 protrudes from third plate face 200a.Cavity face 210a
And the position of welding surface 220a, design, and root can be determined in conjunction with the position of the position of antenna pattern, cavity and its cavity wall
The position in excessive glue hole and the position of solder mask structure are determined according to the position that needs weld.
The main part of the second substrate 200 can be made of conventional flowsheet, in the present embodiment, the second substrate 200
It can be actually adjusted according to wiring and performance needs, layer for multilayered structure specifically, can be six layer structure substrate
Number is not limited to six layer structure, can reduce the number of plies or increases the number of plies.After the completion of the main part preparation of the second substrate 200, then
According to the position in excessive glue hole, solder mask structure is set in the third plate face of the second substrate 200.Solder mask structure can be hindered by coating
Wlding material prepares to be formed.
The sequence of above step 10 and step 20 can be in no particular order.
Step 30, as shown in figure 20, adhesives 300 is set on welding surface 220a.Material can will be bonded by dispensing
Material 300 is set to welding surface 220a.Herein, in other embodiments, steel mesh printing technology gluing, sticky material can also be used
Material can be with are as follows: copper cream, tin cream, elargol, low-flow tackifying resin glue etc..
Preferably, the diameter of adhesives 300 is greater than the diameter in excessive glue hole 102, so that adhesives 300 can be with
Second plate face 100b is bonded, and the bonding strength of first substrate and the second substrate is improved.
In this step, gap can be set between adhesives 300 and solder mask structure 201, to avoid adhesives 300
Excessively adhesives 300 during patch to cross solder mask structure 201 to pollute.
Step 40, as shown in figure 21, by the opening of cavity 10 towards the second substrate 200, by the excessive glue hole of first substrate 100
102 alignment adhesives 300, then in the second substrate 200 and the two is abutted against 100 patch of first substrate, adhesives
300 are connected with the second plate face and extend in excessive glue hole 102.Herein, first substrate 100 can be aligned using upper piece equipment and is pasted
Piece is in the second substrate 200.
Step 50, as shown in figure 22, using conventional flip technique patch chip 400 in the 4th surface of the second substrate 200
200b。
Step 60, as shown in figure 23, the 4th surface 200b using common process in the second substrate 200 plants BGA (Ball
Grid Array, ball grid array) ball 500, entire encapsulating antenna is connected on the components such as circuit board with facilitating.
Encapsulating antenna provided by the invention and preparation method thereof, using cohesive material by first substrate 100 and the second substrate
200 are bonded, and bonding solder joint design crimps the second substrate 200 using first substrate 100 at the excessive glue hole 102 of cavity wall 101
When pressure, adhesives 300 is squeezed into excessive glue hole 102, and then form similar rivet arrangement, plays good first base
Plate 100 and 200 cementation of the second substrate.Routinely technique is packaged attachment for chip and BGA ball.First substrate 100 and
Cavity 10 between two substrates 200 is highly stable, and even across multiple high temp thermal cycle, preferable stabilization can still be maintained
Property.The excessive glue hole 102 of first substrate 100 effectively absorbs extra adhesives 300, efficiently solves excessive glue pollution antenna field and glues
Property the difficult technological problems of substance thickness control.The glue of excessive glue and the second plate face 100b are formed together rivet arrangement simultaneously, play
The effect of welding first substrate 100 and the second substrate 200 well.
Above embodiment does not constitute the restriction to the technical solution protection scope.It is any in above embodiment
Spirit and principle within made modifications, equivalent substitutions and improvements etc., should be included in the technical solution protection scope it
It is interior.
Claims (15)
1. a kind of encapsulating antenna, which is characterized in that including first substrate and the second substrate, the first substrate and second base
Board stacking setting, the two are abutted against and are connected by adhesives；
The first substrate has the first plate face and the second plate face being disposed opposite to each other, and is provided with antenna diagram on the first substrate
Shape, the antenna pattern include the first radiation fin；Second plate face is arranged towards the second substrate, on the first substrate
It is provided with cavity, the cavity is the groove structure being arranged at second plate face, and the opening of the cavity is located at described the
Two plate faces and towards the second substrate, are provided with excessive glue hole, the excessive glue hole runs through described first in the cavity wall of the cavity
Plate face and the second plate face；
The second substrate has the third plate face towards the first substrate, and the third plate face includes cavity face and welding
Face is provided with the second radiation fin in the cavity face；The cavity face is oppositely arranged with the cavity, and the cavity is located at described
Between first radiation fin and second radiation fin；The cavity wall of the welding surface and the cavity is oppositely arranged, the welding surface
The junction of the cavity face is provided with solder mask structure, the solder mask structure protrudes from the third plate face；
The adhesives is set on the welding surface, and the adhesives is oppositely arranged with the excessive glue hole, the bonding
Material is connected with second plate face and extends in the excessive glue hole.
2. encapsulating antenna according to claim 1, which is characterized in that corresponding with the excessive glue hole on the welding surface
Pad is provided at position, the adhesives is arranged on the pad；
The solder mask structure and the pad interval are arranged, alternatively, the solder mask structure covers the edge of the pad.
3. encapsulating antenna according to claim 1, which is characterized in that the adhesives and the direct phase of the welding surface
Even.
4. encapsulating antenna according to claim 1, which is characterized in that the solder mask structure is ring-type, the solder mask structure
It is oppositely arranged with the excessive glue hole, and the internal diameter of the solder mask structure is greater than the internal diameter in the excessive glue hole；Alternatively,
The solder mask structure is the strip being arranged along the cavity wall of the cavity.
5. encapsulating antenna according to claim 1, which is characterized in that the adhesives is set with the solder mask structure interval
It sets.
6. encapsulating antenna according to claim 1-5, which is characterized in that the solder mask structure is solder resist material system
At.
7. encapsulating antenna according to claim 1, which is characterized in that the excessive glue hole is stepped hole, the excessive glue hole packet
The first hole and the second hole are included, the internal diameter of first hole is less than the internal diameter of second hole, the first hole phase
To second hole close to the second substrate, the adhesives is filled in first hole and extends to the second hole
In.
8. encapsulating antenna according to claim 1, which is characterized in that second plate face is connected to the solder mask structure.
9. described in any item encapsulating antennas according to claim 1, which is characterized in that the second substrate has the 4th plate face,
4th plate face is disposed opposite to each other with the third plate face；
The encapsulating antenna further includes chip, and the chip is connected to the 4th plate face.
10. a kind of mobile communication terminal, which is characterized in that the mobile communication terminal has described in any one of claim 1-8
Encapsulating antenna.
11. a kind of preparation method of encapsulating antenna, which is characterized in that be used to prepare the described in any item encapsulation of claim 1-9
The preparation method of antenna, the encapsulating antenna includes:
A first substrate is provided, the first substrate has the first plate face and the second plate face being disposed opposite to each other, the first substrate
On be provided with antenna pattern, the antenna pattern includes the first radiation fin；Cavity, the cavity are provided on the first substrate
For the groove structure at second plate face is arranged in, and the cavity is corresponding with the position of first radiation fin, described
The opening of cavity is located at second plate face, is provided with excessive glue hole in the cavity wall of the cavity, and the excessive glue hole is through described the
One plate face and the second plate face；
A second substrate is provided, the second substrate has third plate face, and the third plate face includes cavity face and welding surface, institute
It states and is provided with the second radiation fin in cavity face；The junction of the welding surface and the cavity face is provided with solder mask structure；It is described
Solder mask structure protrudes from the third plate face；
Adhesives is set on the welding surface；
By the opening of the cavity towards the second substrate, the excessive glue hole of the first substrate is directed at the adhesives,
In the second substrate and the two is abutted against the first substrate patch again, the adhesives and second plate face
It is connected and extends in the excessive glue hole.
12. the preparation method of encapsulating antenna according to claim 11, which is characterized in that in one first substrate of the offer
The step of in, further include following sub-step:
A copper-clad plate is provided, the copper-clad plate has the first surface and second surface being oppositely arranged；
Antenna pattern is set on the first surface；
The silk-screen resin layer on the second surface, and toast, cavity wall is formed, cavity wall crowds around to form cavity；
Excessive glue hole is bored at the position of the cavity wall, copper-clad plate and resin layer are run through in excessive glue hole.
13. the preparation method of encapsulating antenna according to claim 12, which is characterized in that the silk-screen in first plate face
Resin layer and being repeated as many times the step of toast executes, to reach preset thickness.
14. the preparation method of encapsulating antenna according to claim 11, which is characterized in that be arranged on the welding surface viscous
In the step of connecing material, the adhesives is set to by the welding surface by dispensing, the diameter of the adhesives is greater than
The diameter in the excessive glue hole.
15. the preparation method of encapsulating antenna according to claim 11, which is characterized in that be arranged on the welding surface viscous
In the step of connecing material, gap is provided between the adhesives and the solder mask structure.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810374945.8A CN110401005B (en) | 2018-04-24 | 2018-04-24 | Packaged antenna, preparation method thereof and mobile communication terminal |
| PCT/CN2019/080187 WO2019205883A1 (en) | 2018-04-24 | 2019-03-28 | Encapsulation antenna and preparation method therefor, and mobile communication terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810374945.8A CN110401005B (en) | 2018-04-24 | 2018-04-24 | Packaged antenna, preparation method thereof and mobile communication terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110401005A true CN110401005A (en) | 2019-11-01 |
| CN110401005B CN110401005B (en) | 2021-01-29 |
Family
ID=68293781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810374945.8A Active CN110401005B (en) | 2018-04-24 | 2018-04-24 | Packaged antenna, preparation method thereof and mobile communication terminal |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110401005B (en) |
| WO (1) | WO2019205883A1 (en) |
Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101118890A (en) * | 2006-08-03 | 2008-02-06 | 国际商业机器公司 | Si-based packaging with integrated passive components |
| US20090207080A1 (en) * | 2008-02-20 | 2009-08-20 | International Business Machines Corporation | Radio Frequency (RF) Integrated Circuit (IC) Packages with Integrated Aperture-Coupled Patch Antenna(s) |
| US20100311369A1 (en) * | 2009-06-09 | 2010-12-09 | Ahmadreza Rofougaran | Method and system for communicating via leaky wave antennas within a flip-chip bonded structure |
| CN102007519A (en) * | 2008-04-14 | 2011-04-06 | 国际商业机器公司 | Radio frequency (rf) integrated circuit (ic) packages with integrated aperture-coupled patch antenna(s) in ring and/or offset cavities |
| CN102197475A (en) * | 2009-03-12 | 2011-09-21 | 爱信艾达株式会社 | Semiconductor module |
| CN102365006A (en) * | 2011-10-20 | 2012-02-29 | 深圳市五株电路板有限公司 | Processing method of multi-layer circuit board |
| CN102365005A (en) * | 2011-10-20 | 2012-02-29 | 深圳市五株电路板有限公司 | Printed circuit board (PCB) processing method |
| CN103329349A (en) * | 2011-01-21 | 2013-09-25 | 国际商业机器公司 | Laminated antenna structures for package applications |
| CN103400829A (en) * | 2012-08-01 | 2013-11-20 | 日月光半导体制造股份有限公司 | Semiconductor package and manufacture method thereof |
| CN103779319A (en) * | 2012-10-19 | 2014-05-07 | 英飞凌科技股份有限公司 | Semiconductor package having integrated antenna and method for forming the same |
| US9196951B2 (en) * | 2012-11-26 | 2015-11-24 | International Business Machines Corporation | Millimeter-wave radio frequency integrated circuit packages with integrated antennas |
| CN105789847A (en) * | 2014-12-15 | 2016-07-20 | 财团法人工业技术研究院 | Antenna integrated package structure and fabrication method thereof |
| US9553371B2 (en) * | 2010-11-12 | 2017-01-24 | Nxp Usa, Inc. | Radar module |
| CN106374208A (en) * | 2016-10-09 | 2017-02-01 | 华进半导体封装先导技术研发中心有限公司 | High-bandwidth organic substrate antenna structure and manufacturing method |
| US9620464B2 (en) * | 2014-08-13 | 2017-04-11 | International Business Machines Corporation | Wireless communications package with integrated antennas and air cavity |
| CN106876872A (en) * | 2016-12-20 | 2017-06-20 | 西安科锐盛创新科技有限公司 | The preparation method of the Ge base restructural dipole antennas based on AlAs/Ge/AlAs structures |
| CN107437654A (en) * | 2016-05-27 | 2017-12-05 | 台湾积体电路制造股份有限公司 | Antenna assembly |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8648454B2 (en) * | 2012-02-14 | 2014-02-11 | International Business Machines Corporation | Wafer-scale package structures with integrated antennas |
| US9806422B2 (en) * | 2013-09-11 | 2017-10-31 | International Business Machines Corporation | Antenna-in-package structures with broadside and end-fire radiations |
| CN105609944B (en) * | 2015-12-28 | 2018-06-05 | 西安电子科技大学昆山创新研究院 | Double-deck fractal microstrip radio frequency package antenna based on cavity structure |
-
2018
- 2018-04-24 CN CN201810374945.8A patent/CN110401005B/en active Active
-
2019
- 2019-03-28 WO PCT/CN2019/080187 patent/WO2019205883A1/en active Application Filing
Patent Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101118890A (en) * | 2006-08-03 | 2008-02-06 | 国际商业机器公司 | Si-based packaging with integrated passive components |
| US20090207080A1 (en) * | 2008-02-20 | 2009-08-20 | International Business Machines Corporation | Radio Frequency (RF) Integrated Circuit (IC) Packages with Integrated Aperture-Coupled Patch Antenna(s) |
| CN102007519A (en) * | 2008-04-14 | 2011-04-06 | 国际商业机器公司 | Radio frequency (rf) integrated circuit (ic) packages with integrated aperture-coupled patch antenna(s) in ring and/or offset cavities |
| CN102197475A (en) * | 2009-03-12 | 2011-09-21 | 爱信艾达株式会社 | Semiconductor module |
| US20100311369A1 (en) * | 2009-06-09 | 2010-12-09 | Ahmadreza Rofougaran | Method and system for communicating via leaky wave antennas within a flip-chip bonded structure |
| US9553371B2 (en) * | 2010-11-12 | 2017-01-24 | Nxp Usa, Inc. | Radar module |
| CN103329349A (en) * | 2011-01-21 | 2013-09-25 | 国际商业机器公司 | Laminated antenna structures for package applications |
| CN102365005A (en) * | 2011-10-20 | 2012-02-29 | 深圳市五株电路板有限公司 | Printed circuit board (PCB) processing method |
| CN102365006A (en) * | 2011-10-20 | 2012-02-29 | 深圳市五株电路板有限公司 | Processing method of multi-layer circuit board |
| CN103400829A (en) * | 2012-08-01 | 2013-11-20 | 日月光半导体制造股份有限公司 | Semiconductor package and manufacture method thereof |
| CN103779319A (en) * | 2012-10-19 | 2014-05-07 | 英飞凌科技股份有限公司 | Semiconductor package having integrated antenna and method for forming the same |
| US9196951B2 (en) * | 2012-11-26 | 2015-11-24 | International Business Machines Corporation | Millimeter-wave radio frequency integrated circuit packages with integrated antennas |
| US9620464B2 (en) * | 2014-08-13 | 2017-04-11 | International Business Machines Corporation | Wireless communications package with integrated antennas and air cavity |
| CN105789847A (en) * | 2014-12-15 | 2016-07-20 | 财团法人工业技术研究院 | Antenna integrated package structure and fabrication method thereof |
| CN107437654A (en) * | 2016-05-27 | 2017-12-05 | 台湾积体电路制造股份有限公司 | Antenna assembly |
| CN106374208A (en) * | 2016-10-09 | 2017-02-01 | 华进半导体封装先导技术研发中心有限公司 | High-bandwidth organic substrate antenna structure and manufacturing method |
| CN106876872A (en) * | 2016-12-20 | 2017-06-20 | 西安科锐盛创新科技有限公司 | The preparation method of the Ge base restructural dipole antennas based on AlAs/Ge/AlAs structures |
Non-Patent Citations (1)
| Title |
|---|
| 季强: "基于LTCC的集成化封装天线设计与研究", 《中国优秀硕士学位论文全文数据库 信息科技辑》 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110401005B (en) | 2021-01-29 |
| WO2019205883A1 (en) | 2019-10-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8912634B2 (en) | High frequency transition matching in an electronic package for millimeter wave semiconductor dies | |
| US9219041B2 (en) | Electronic package for millimeter wave semiconductor dies | |
| JP4463102B2 (en) | Multi-layer stripline assembly interconnection and interconnection method | |
| US6717253B2 (en) | Assembly package with stacked dies and signal transmission plate | |
| CN103247581B (en) | chip package and device | |
| EP2253045B1 (en) | Radio frequency (rf) integrated circuit (ic) packages with integrated aperture-coupled patch antenna(s) | |
| CN107978593A (en) | A kind of encapsulating structure and method for packing of integrated tunable antenna array and radio-frequency module | |
| US9018741B2 (en) | Semiconductor package and manufacturing method thereof | |
| TWI600092B (en) | Semiconductor package with antenna and method of manufacturing the same | |
| TW201407745A (en) | Semiconductor package and manufacturing method thereof | |
| CN105789847B (en) | Aerial integration formula encapsulating structure and its manufacturing method | |
| FI122217B (en) | Multi-chip package and manufacturing method | |
| CN108649019A (en) | Fan-out package structure | |
| JP4504204B2 (en) | High frequency chip package with connecting elements | |
| EP3859877B1 (en) | Antenna packaging structure and manufacturing method thereof | |
| CN103367349A (en) | Stacked module | |
| TW201622503A (en) | Integrated antenna package and manufacturing method thereof | |
| CN110364496A (en) | A kind of chip-packaging structure and its packaging method | |
| CN107069354A (en) | A kind of Miniature radio-frequency connector and preparation method thereof | |
| CN111971852B (en) | Antenna packaging structure | |
| CN207909873U (en) | A kind of encapsulating structure of integrated tunable antenna array and radio-frequency module | |
| CN103426844A (en) | Broadband full-sealed package of microwave devices | |
| CN110401005A (en) | Encapsulating antenna and preparation method thereof and mobile communication terminal | |
| CN100389494C (en) | IC package and its preparing process | |
| CN112436242A (en) | High integrated microwave assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |