WO2019205883A1 - Encapsulation antenna and preparation method therefor, and mobile communication terminal - Google Patents

Abstract

Disclosed are an encapsulation antenna and a preparation method therefor, and a mobile communication terminal. The encapsulation antenna comprises a first substrate and a second substrate, wherein the first substrate and the second substrate abut against each other and are connected via a bonding material; a cavity wall of a cavity of the first substrate is provided with a glue overflow hole which penetrates the first substrate; a joint of a welding face of the second substrate and a cavity face is provided with a resistance welding structure; and the bonding material is arranged on the welding face, and the bonding material is connected to a second substrate face of the first substrate and extends into the glue overflow hole. Excessive bonding material is absorbed by means of the glue overflow hole so as to prevent the bonding material from affecting the abutting and the distance between the first substrate and the second substrate; and the resistance welding structure prevents the bonding material from flowing to the cavity so as to ensure the reliability of the antenna. By means of the glue overflow hole combined with the resistance welding structure, the technological problems of excessive bonding material contaminating an antenna area and of difficulty in controlling the thickness of the bonding material are effectively solved. The bonding material forms a rivet structure so that the first substrate and the second substrate are firmly and reliably connected.

Description

Package antenna, preparation method thereof, and mobile communication terminal

This application claims priority to Chinese Patent Application No. 2018103749458, entitled "Encapsulated Antenna and Its Preparation Method, and Mobile Communication Terminal", filed on April 24, 2018, the entire contents of which are incorporated by reference. In this application.

Technical field

The present invention relates to the field of antenna structures, and in particular, to a packaged antenna, a method for fabricating the same, and a mobile communication terminal.

Background technique

With the advent of high-speed communication eras such as 5G and VR, millimeter-wave communication has gradually become the mainstream, and the design and application requirements of millimeter-wave antennas are becoming more and more vigorous. Since the length of the transmission path of the millimeter wave band has a great influence on the signal amplitude loss, the architecture mode of the conventional IC+PCB+ antenna has been slowly unable to meet the high performance requirement, and the architecture of the IC+ package antenna has become mainstream. This is the AiP (Antenna in Package). Antenna integration) technology. Generally, high antenna gain is not obtained, and an antenna array is generally used. Due to the extremely short antenna feeder path in the AiP architecture, the EIRP (Equivalent Isotropic Radiated Power) value of the wireless system can be maximized, which facilitates a wider range of coverage. In addition, the wavelength of the millimeter wave band is extremely short, and the electrical property is very sensitive to the processing error. If the manufacturing precision is not good, the impedance mismatch causes signal reflection, and the conventional PCB processing technology cannot meet the millimeter wave processing precision requirement. Therefore, the packaging process with higher processing precision has played a greater value.

AiP antenna array technology will gradually become the mainstream antenna technology for 5G and millimeter wave high-speed communication systems, with broad application space and market space prospects. In the existing AIP technology, a dual-substrate package structure for realizing a millimeter-wave antenna and an antenna array in a 10G to 40 GHz band in a package mainly has an upper substrate and a lower substrate, and the height between the upper substrate and the lower substrate varies depending on the antenna frequency. Differently, the lower the antenna frequency, the greater the distance between the two antenna radiating sheets. Therefore, how to control the height between the upper substrate and the lower substrate is a technical key point. In the prior art, the upper substrate and the lower substrate are soldered using solder balls or other viscous materials. After soldering, solder balls or other viscous materials are located between the upper substrate and the lower substrate, and the solder balls are used for bonding, and thermal instability occurs. The distance between the upper and lower substrates is unstable; in addition, the viscous material easily enters into the cavity to form an overflow of the glue, so that the gas and the bonding material are simultaneously present inside the cavity, which changes the internal dielectric constant of the bonding material. In turn, the antenna performance is affected, and the thickness of the adhesive layer is difficult to control, and the process cost is high.

Summary of the invention

The technical problem to be solved by the embodiments of the present invention is to provide a package antenna, a preparation method thereof, and a mobile communication terminal, to ensure the reliability of the antenna, and to avoid the problem of glue contamination of the bonding material.

In a first aspect, an embodiment of the present invention provides a package antenna, including a first substrate and a second substrate, wherein the first substrate and the second substrate are stacked, and the two are abutted and connected by an adhesive material;

The first substrate has a first plate surface and a second plate surface disposed opposite to each other, the second plate surface is disposed toward the second substrate, and the first substrate is provided with a cavity, the cavity The opening is located on the second plate surface and faces the second substrate, and the cavity wall of the cavity is provided with an overflow hole, and the overflow hole penetrates the first plate surface and the second plate surface;

The second substrate has a third plate surface facing the first substrate, and the third plate surface includes a cavity surface and a welding surface, the cavity surface is opposite to the cavity, and the welding surface is The cavity walls of the cavity are oppositely disposed, and a joint of the welding surface and the cavity surface is provided with a solder resist structure;

The bonding material is disposed on the soldering surface, and the bonding material is disposed opposite to the overflow hole, and the bonding material is connected to the second board surface and extends into the overflow hole.

In a first possible implementation manner of the first aspect, the soldering surface is provided with a pad at a position corresponding to the overflow hole, and the bonding material is disposed on the pad; The pad is disposed on the surface to enhance the connection strength between the bonding material and the second substrate;

The solder resist structure is spaced apart from the pad so that there is a gap between the two to increase the flow range of the bonding material, increase the connection area of the bonding material and the pad, improve the connection strength, and reduce the bonding material pair. The influence of the spacing between the first substrate and the second substrate;

Alternatively, the solder resist structure covers the edge of the pad; to prevent the bonding material from flowing outside the solder resist structure, the excess bonding material flows into the overflow hole.

In a second possible implementation manner of the first aspect, the bonding material is directly connected to the soldering surface; the fixing connection between the first substrate and the second substrate can be directly realized by using the bonding material, and the processing technology is simplified. Reduce processing costs.

In a third possible implementation manner of the first aspect, the solder resist structure is annular, the solder resist structure is opposite to the overflow hole, and an inner diameter of the solder resist structure is larger than the overflow hole The inner diameter of the ring-shaped solder resist structure can reduce the flow range of the solder resist structure, so that the bonding material is surrounded by the solder resist structure within a certain range, thereby effectively preventing the bonding material from polluting the cavity;

Alternatively, the solder resist structure is strip-shaped along the cavity wall of the cavity, and the bonding material can move along the extending direction of the cavity wall, which can increase the overflow range of the bonding material, thereby reducing the first substrate and The effect of the distance between the second substrates.

In a fourth possible implementation manner of the first aspect, the bonding material is spaced apart from the solder resist structure, which can reduce the amount of the bonding material, and avoid excessive bonding material, so that the bonding material passes over the solder resist structure. It affects the performance of the antenna.

In a fifth possible implementation manner of the first aspect, the solder resist structure is made of a solder resist material; the solder resist material can further prevent the bonding material from entering the cavity.

In combination with any of the foregoing possible implementations, in a sixth possible implementation manner of the first aspect, the overflow hole is a stepped hole, the overflow hole includes a first segment hole and a second segment hole, The inner diameter of the first hole is smaller than the inner diameter of the second hole, the first hole is close to the second substrate with the second hole, and the bonding material is filled in the first hole and It extends into the second section of the hole; the bonding material can be used as a rivet structure at both ends to further improve the joint strength, and the second section of the larger diameter hole can accommodate more bonding materials.

In a seventh possible implementation manner of the first aspect, the second board surface abuts the solder resist structure; such that the first substrate and the second substrate abut each other such that the height spacing of the two remains fixed.

In an eighth possible implementation of the first aspect,

The second substrate has a fourth plate surface, and the fourth plate surface is disposed opposite to the third plate surface;

The package antenna further includes a chip, and the chip is connected to the fourth board surface. By matching the antenna pattern with the chip, the package antenna can be brought to a preset frequency band.

In a second aspect, the present invention provides a mobile communication terminal having the aforementioned package antenna.

In a third aspect, the present invention provides a method for fabricating a packaged antenna, which is used to prepare the packaged antenna. The method for preparing the packaged antenna includes:

Providing a first substrate, the first substrate has a first plate surface and a second plate surface disposed opposite to each other, the first substrate is provided with a cavity, and the opening of the cavity is located at the second plate surface The cavity wall of the cavity is provided with an overflow hole, and the overflow hole penetrates the first plate surface and the second plate surface;

Providing a second substrate, the second substrate has a third plate surface, the third plate surface includes a cavity surface and a welding surface, and a joint of the welding surface and the cavity surface is provided with a solder resist structure;

Providing a bonding material on the soldering surface;

Orienting the opening of the cavity toward the second substrate, aligning the overflow hole of the first substrate with the bonding material, and then attaching the first substrate to the second substrate and making two Abutting, the bonding material is connected to the second plate surface and extends into the overflow hole.

In a first possible implementation manner of the third aspect, in the step of providing a first substrate, the following sub-steps are further included:

Providing a copper clad plate having opposite first and second surfaces;

Providing an antenna pattern on the first surface;

Screening a resin layer on the second surface and baking to form a cavity wall, the cavity wall surrounding forming a cavity;

A glue hole is drilled at a position of the cavity wall, and the glue hole penetrates through the copper clad plate and the resin layer. Through the silk screen resin layer, the problem that the first substrate has low production efficiency and high cost can be solved.

In a second possible implementation of the third aspect, the step of silk-screening the resin layer on the second surface and baking is repeated a plurality of times to achieve a predetermined thickness to achieve antenna application frequency and performance.

In a third possible implementation manner of the third aspect, in the step of providing an adhesive material on the concave soldering surface, the bonding material is disposed on the soldering surface by dispensing, the bonding material The diameter is larger than the diameter of the overflow hole; so that the bonding material can be bonded to the second plate surface to improve the connection strength between the first substrate and the second substrate.

In a fourth possible implementation manner of the third aspect, in the step of disposing the bonding material on the concave soldering surface, a gap is disposed between the bonding material and the solder resist structure; Too much causes contamination of the bonding material over the solder mask during the placement process.

By implementing the embodiment of the present invention, by abutting the first substrate and the second substrate, the distance between the two substrates can be ensured to be a fixed value to ensure the reliability of the antenna; and the bonding material and the second board surface and the welding surface are Connected, the first substrate and the second substrate can be fixedly connected together, and the excess adhesive material can be absorbed by the overflow plastic hole to prevent the bonding material from affecting the direct contact between the first substrate and the second substrate; The welded structure can prevent the bonding material from flowing into the cavity region, preventing the bonding material from entering the cavity, so that the dielectric constant in the cavity is not affected by the bonding material, and the bonding material does not adhere to the second The radiation piece can effectively ensure the reliability of the antenna; the use of the overflow glue hole combined with the solder resist structure effectively solves the problem that the excess bonding material contaminates the antenna area and the thickness of the bonding material is difficult to control, and the bonding material is connected to the second board surface. And entering into the overflow hole, so that the bonding material can form a rivet structure, which plays a better role in soldering the first substrate and the second substrate.

DRAWINGS

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the background art, the drawings to be used in the embodiments of the present invention or the background art will be described below.

1 is a schematic structural diagram of a package antenna according to a preferred embodiment of the present invention;

Figure 2 is an enlarged schematic view showing the structure of A in Figure 1;

Figure 3 is an enlarged schematic view showing the structure of B in Figure 1;

Figure 4 is an enlarged schematic view showing the structure of C in Figure 1;

5 is a schematic structural view of another embodiment of an overflow hole of a package antenna according to the present invention;

6 to FIG. 9 are schematic diagrams showing processes of a first preparation method of a first substrate for packaging an antenna according to the present invention;

10 to FIG. 13 are schematic diagrams showing processes of a second method for preparing a first substrate for packaging an antenna according to the present invention;

14 to FIG. 18 are schematic diagrams showing processes of a third method for preparing a first substrate for packaging an antenna according to the present invention;

19 is a schematic structural view of a second substrate encapsulating an antenna in the present invention;

20 is a schematic structural view showing an adhesive material disposed on a second substrate;

21 is a schematic structural view of the first substrate and the second substrate after bonding in the present invention;

FIG. 22 is a schematic structural view of the second substrate after the chip is disposed on FIG. 21; FIG.

Figure 23 is a schematic view showing the structure after the BGA ball is implanted on the second substrate of Figure 22.

detailed description

The embodiments of the present invention are described below in conjunction with the accompanying drawings in the embodiments of the present invention.

Referring to FIG. 1, FIG. 1 is a package antenna according to an embodiment of the present invention, which includes a first substrate 100 and a second substrate 200. The first substrate 100 and the second substrate 200 are stacked, and the two are abutted and bonded. The material 300 is connected. By abutting the first substrate 100 and the second substrate 200, the distance between the two substrates can be ensured to be a fixed value. Even after a plurality of high-temperature heats, the antenna can maintain good stability and ensure the antenna. Reliability.

The first substrate 100 has a first plate surface 100a and a second plate surface 100b disposed opposite each other. The first board surface 100a is disposed away from the second substrate 200. The first board surface 100a may be provided with an antenna pattern, and the antenna pattern includes a first radiating piece 109. The second plate surface 100b is disposed toward the second substrate 200. The first substrate 100 is provided with a cavity 10, and the cavity 10 is a groove structure disposed at the second plate surface 100b, and the opening of the cavity 10 is located at the second plate surface. 100b and facing the second substrate 200, the cavity wall 101 of the cavity 10 is provided with an overflow hole 102, and the overflow hole 102 penetrates the first plate surface 100a and the second plate surface 100b. The second substrate 200 has a third plate surface 200a facing the first substrate 100. The third plate surface 200a includes a cavity surface 210a and a soldering surface 220a. The cavity surface 210a is provided with a second radiating plate 209, and the cavity surface 210a is The cavities 10 are oppositely disposed, and the cavity 10 is located between the first radiating sheet 109 and the second radiating sheet 209. The cavity 10 can be filled with air having a low dielectric constant, and signal radiation can be achieved by the interaction of the first radiation piece 109 and the second radiation piece 209 with the cavity 10. In this embodiment, a first radiating piece 109 and a second radiating piece 209 are correspondingly disposed at the position of the cavity 10. Of course, in other embodiments, the first radiating piece 109 corresponding to the position of the cavity 10 and the first The number of the two radiation sheets 209 can be specifically determined as needed.

The welding surface 220a is disposed opposite to the cavity wall 101 of the cavity 10. The junction of the welding surface 220a and the cavity surface 210a is provided with a solder resist structure 201, and the solder resist structure 201 protrudes from the third plate surface. The bonding material 300 is disposed on the bonding surface 220a. The bonding material 300 is disposed opposite to the overflow hole 102. The bonding material 300 is connected to the second plate surface 100b and extends into the overflow hole 102.

The first substrate 100 and the second substrate 200 can be fixedly connected together by the bonding material 300 being connected to the second board surface 100b and the soldering surface 220a. The excess adhesive material 300 can be absorbed by the overflow hole 102 to avoid bonding. The material 300 affects the direct abutment between the first substrate 100 and the second substrate 200.

The solder resist structure 201 can prevent the bonding material 300 from flowing toward the cavity 10 region, preventing the bonding material 300 from entering the cavity 10, so that the dielectric constant in the cavity 10 is not affected by the bonding material 300, and the bonding is made The bonding material 300 does not adhere to the second radiation sheet 209, thereby effectively ensuring the reliability of the antenna.

The use of the glue hole 102 in combination with the solder resist structure 201 effectively solves the problem that the excess bonding material 300 contaminates the antenna area and the thickness of the bonding material 300 is difficult to control. The bonding material 300 is connected to the second board surface 100b and enters the overflow glue. In the hole 102, the bonding material 300 can be formed into a rivet structure, which serves to better solder the first substrate 100 and the second substrate 200.

In this embodiment, the plurality of cavities 10 on the first substrate 100 are plural, the plurality of cavities 10 are spaced apart, the adjacent two cavities 10 are separated by the cavity wall 101, and the plurality of cavities 10 may be arranged in a matrix. Four cavities 10 are shown in the cross-sectional view shown in FIG. Here, the number of the cavities 10 is also not limited to that shown in Fig. 1, and the number of the cavities 10 can be determined in accordance with the antenna performance.

At least three cavity walls 101 are formed between the four cavities 10, and the three cavity walls 101 are provided with overflow holes 102. More specifically, there are differences in the structure of the corresponding positions of the second substrate 200 corresponding to the three overflow holes 102, forming three different embodiments. In addition, in other embodiments, the structures of the corresponding positions of the second substrate 200 corresponding to the three overflow holes 102 may be the same to facilitate processing and preparation, and reduce production cost.

As shown in FIG. 2, at the position of the first overflow hole 102, that is, A, a pad 202 is disposed on the soldering surface 220a at a position corresponding to the overflow hole 102, and the bonding material 300 is disposed on the pad 202. The solder resist structure 201 is spaced apart from the pad 202. By providing the pad 202 on the bonding surface 220a, the bonding strength of the bonding material 300 and the second substrate 200 can be enhanced. The solder resist structure 201 is spaced apart from the pad 202 such that there is a gap 203 therebetween to increase the flow range of the bonding material 300, increase the connection area of the bonding material 300 and the pad, and improve the connection strength while reducing the adhesion. The influence of the bonding material 300 on the spacing between the first substrate 100 and the second substrate 200.

As shown in FIG. 3, at the position of the second overflow hole 102, that is, B, a pad 202 is disposed on the soldering surface 220a at a position corresponding to the overflow hole 102, and the bonding material 300 is disposed on the pad 202. The solder resist structure 201 covers the edge of the pad 202 to prevent the bonding material 300 from flowing outside the solder resist structure 201, and the excess bonding material 300 flows into the overflow hole 102.

As shown in FIG. 4, at the position of the third overflow hole 102, that is, C, the bonding material 300 is directly connected to the bonding surface 220a, and the first substrate 100 and the second substrate 200 can be directly realized by the bonding material 300. The fixed connection between the two simplifies the machining process and reduces the processing cost.

In the embodiment of the three solder resist structures 201, the shape of the solder resist structure 201 may be annular, the solder resist structure 201 is disposed opposite to the overflow hole 102, and the inner diameter of the solder resist structure 201 is larger than the overflow hole 102. The inner diameter of the adhesive material 300 can be connected to the second plate surface 100b. The annular solder resist structure 201 can reduce the flow range of the solder resist structure 201, so that the bonding material 300 is surrounded by the solder resist structure 201. Within a certain range, the bonding material 300 is effectively prevented from contaminating the cavity 10. Herein, in other embodiments, the solder resist structure 201 may also be a strip shape disposed along the cavity wall 101 of the cavity 10, and the bonding material 300 may move along the extending direction of the cavity wall 10, which may increase the overflow of the bonding material. The glue range reduces the influence on the distance between the first substrate and the second substrate; the solder resist structure 201 can prevent the bonding material 300 from flowing toward the cavity 10.

In this embodiment, the solder resist structure 201 is made of a solder resist material, and the solder resist material may be a solder resist ink or a solder resist for green oil used in the circuit board, and the solder resist material may be directly coated on the third board surface 200a. A solder resist structure is formed; or, the solder resist structure 201 is a bump provided on the third board surface 200a, and a solder resist material is coated on the surface of the bump. The bonding material 300 can be further prevented from entering the cavity 10 by the solder resist material.

The adhesive material 300 is spaced apart from the solder resist structure 201, which can reduce the amount of the bonding material 300, and avoid excessive influence of the bonding material 300 on the antenna performance by causing the bonding material 300 to pass over the solder resist structure 201.

In this embodiment, as shown in FIG. 2 to FIG. 4, the second board surface 100b abuts against the solder resist structure 201, so that the first substrate 100 and the second substrate 200 abut each other, so that the height spacing of the two is maintained. fixed. Here, in other embodiments, a protrusion may be provided on the second board surface 100b, the protrusion abuts against the third board surface 200a of the second substrate 200, or a protrusion is provided on the third board surface 200a, and the protrusion is convex. Abutting against the second surface on the first substrate 100 can ensure that the first substrate 100 and the second substrate 200 abut each other; or the second plate surface is also provided with a solder resist structure at a position of the edge of the cavity The solder resist structure on the second board abuts the solder resist structure on the third board surface, so that the first substrate and the second substrate abut each other, and the solder resist structure on the second board surface can further prevent the sticking The material flows into the cavity.

The second substrate 200 has a fourth board surface 200b, and the fourth board surface is disposed opposite to the third board surface 200a. The package antenna further includes a chip 400, and the chip 400 is connected to the fourth board surface 200b. Through the cooperation of the first radiation piece 109, the cavity 10, and the second radiation piece 209 and the chip 400, the package antenna can be brought to a preset frequency band to exert performance.

In the above embodiment, the overflow hole 102 is a through hole. In addition, in other embodiments, as shown in FIG. 5, the overflow hole 102 may also be a stepped hole, and the overflow hole 102 includes a first hole 102a and a first hole. The second-stage hole 102b has an inner diameter smaller than the inner diameter of the second-stage hole 102b. The first-stage hole 102a is adjacent to the second substrate 200 with respect to the second-stage hole 102b, and the bonding material 300 is filled in the first-stage hole 102a. Extending into the second-stage hole 102b, the bonding material 300 can be used as a rivet structure at both ends to further improve the connection strength, and the second-stage hole 102b having a larger diameter can accommodate more bonding material 300. Here, it is also possible to provide chamfering at the edge of the overflow substrate 102 toward the second substrate 200 to facilitate the entry of the bonding material 300 into the overflow hole 102.

The present invention provides a mobile communication terminal having the aforementioned package antenna.

The invention also provides a method for preparing the foregoing packaged antenna, the preparation method comprising:

Step 10, providing a first substrate, the first substrate has a first plate surface and a second plate surface disposed opposite to each other, the first substrate is provided with an antenna pattern, and the antenna pattern includes a first radiation piece; a cavity is disposed on the substrate, the opening of the cavity is located on the second plate surface, the cavity is a groove structure disposed at the second plate surface, and the cavity and the position of the first radiation piece Correspondingly, the cavity wall of the cavity is provided with an overflow glue hole, and the overflow glue hole penetrates the first plate surface and the second plate surface. Here, it can be understood that the cavity corresponds to the position of the first radiation piece, and the cavity and the first radiation piece are arranged along the thickness direction of the first substrate.

In the first specific implementation of the step 10, as shown in FIG. 6 to FIG. 9, the following sub-steps are further included.

Step 111, as shown in FIG. 6, provides a copper clad laminate 11 having a first surface 11a and a second surface 11b disposed opposite each other.

Step 112, as shown in FIG. 6, an antenna pattern is provided on the first surface 11a of the copper clad laminate 11, and a first radiating sheet 109 is formed. In this step, the antenna pattern can be placed on the first surface 11a of the copper clad laminate 11 by the existing equipment and conditions of the substrate factory or the printed circuit board factory.

Step 113, as shown in FIG. 7, the resin layer 12 is screen printed on the second surface 11b of the copper clad laminate 11 and baked to form a cavity wall 101, and the cavity wall 101 surrounds the cavity 10. The position of the cavity wall 101 and the cavity 10 can be determined according to the position of the first radiation piece 109. In this step, the resin layer can be formed by screen printing by a screen printer or a stencil printer. As shown in FIG. 8, a single printing may fail to reach a preset thickness, and the step may be repeated, printed and baked a plurality of times until a predetermined thickness is reached. The preset thickness can be determined according to the antenna application frequency and performance.

In step 114, the glue hole 102 is drilled at the position of the cavity wall 101, and the glue hole 102 penetrates the copper clad plate 11 and the resin layer 12.

Through the above steps, the first substrate 100 can be processed and formed, and the silk-screen resin layer can solve the problem that the first substrate 100 has low production efficiency and high cost.

In the second specific implementation manner of this step 10, as shown in FIG. 10 to FIG. 13, the following sub-steps may also be included.

Step 121, as shown in FIG. 10, provides a copper clad laminate 11 having a first surface 11a and a second surface 11b disposed opposite each other.

Step 122, as shown in FIG. 10, an antenna pattern is disposed on the first surface 11a. In this step, the antenna pattern can be disposed on the first surface 11a of the copper clad laminate 11 by the existing equipment and conditions of the substrate factory or the printed circuit board factory, and the first radiating sheet 109 can be formed.

Step 123, as shown in FIG. 11, preparing a photosensitive dielectric material, and applying a photosensitive dielectric material to the second surface 11b of the copper clad laminate 11 by a vacuum laminator to form a photosensitive dielectric material layer 13, and a photosensitive dielectric material layer 13 The thickness depends on the frequency and performance of the antenna application.

Step 124, as shown in FIG. 12, removes the photosensitive dielectric material layer 13 of the corresponding region of the first radiation piece 109 of the antenna pattern by using an exposure and developing device to form the cavity 10 and its cavity wall 101.

In step 125, as shown in FIG. 13, the glue hole 102 is drilled at the position of the cavity wall 101, and the overflow hole 102 penetrates through the photosensitive dielectric material layer 13 and the copper clad plate 11.

In the third specific implementation manner of this step 10, as shown in FIG. 14 to FIG. 18, the following sub-steps may also be included.

Step 131, as shown in FIG. 14, provides two thicknesses of copper clad laminates, a first copper clad laminate CCL1 and a second copper clad laminate CCL2, and a low flow adhesive pasting prepreg PPG, the thickness of which depends on the performance of the antenna to be fabricated.

In step 132, the first copper clad laminate CCL1 and the second copper clad laminate CCL2, and the low-flow adhesive prepreg PPG are processed in the following manner.

As shown in FIG. 15, an antenna pattern is formed on the first surface CCL1a of the first copper clad laminate CCL1.

As shown in FIG. 16, the second copper clad CCL2 is hollowed out corresponding to the antenna area of the first copper clad CCL1 by mechanical drilling and edge milling equipment to form the cavity 10 and its cavity wall 101.

Step 133, as shown in FIG. 17, the first copper clad laminate CCL1 and the second copper clad laminate CCL2 are bonded together by lamination using a prepreg PPG, and the second clad copper clad CCL2 is bonded to the second surface CCL1b of the first clad copper clad CCL1. At the office.

In step 134, as shown in FIG. 18, the glue hole 102 is drilled at the position of the cavity wall 101, and the overflow hole 102 penetrates the first copper clad plate CCL1, the prepreg PPG and the second copper clad plate CCL2.

In the above embodiments, the antenna pattern may be first formed to form a first radiation sheet, and then the cavity and the cavity wall thereof are prepared according to the position of the first radiation sheet; of course, in other embodiments, the first radiation sheet may be prepared first. The cavity and its cavity wall are formed, and then the first radiation piece is prepared according to the position of the cavity.

Step 20, as shown in FIG. 19, a second substrate 200 is provided. The second substrate 200 has a third plate surface 200a. The third plate surface 200a includes a cavity surface 210a and a soldering surface 220a. The cavity surface 210a is provided with a first surface. The two radiation sheets, the joint of the welding surface 220a and the cavity surface 210a are provided with a solder resist structure 201, and the solder resist structure 201 protrudes from the third board surface 200a. The position of the cavity surface 210a and the welding surface 220a can be determined in combination with the position of the antenna pattern, the position of the cavity and the cavity wall thereof, and the position of the overflow hole and the position of the solder resist structure are determined according to the position where the welding is required.

The main body portion of the second substrate 200 can be fabricated by a conventional process. In this embodiment, the second substrate 200 has a multi-layer structure. Specifically, it can be a six-layer structure substrate, which can be adjusted according to wiring and performance requirements. The number is not limited to the six-layer structure, and the number of layers can be reduced or the number of layers can be increased. After the main body portion of the second substrate 200 is prepared, a solder resist structure is disposed on the third surface of the second substrate 200 according to the position of the overflow hole. The solder resist structure can be formed by applying a solder resist material.

The order of steps 10 and 20 above may be in no particular order.

In step 30, as shown in Fig. 20, an adhesive material 300 is provided on the soldering surface 220a. The bonding material 300 can be placed on the bonding surface 220a by dispensing. Here, in other embodiments, the stencil printing process may also be used, and the viscous material may be: copper paste, solder paste, silver paste, low flow adhesive resin glue, and the like.

Preferably, the diameter of the bonding material 300 is larger than the diameter of the overflow hole 102, so that the bonding material 300 can be bonded to the second plate surface 100b, thereby improving the connection strength between the first substrate and the second substrate.

In this step, a gap may be provided between the bonding material 300 and the solder resist structure 201 to prevent the bonding material 300 from being excessively caused to cause contamination of the bonding material 300 over the solder resist structure 201 during the mounting process.

Step 40, as shown in FIG. 21, the opening of the cavity 10 is directed toward the second substrate 200, the overflow hole 102 of the first substrate 100 is aligned with the bonding material 300, and the first substrate 100 is pasted on the second substrate. 200 and abutting the two, the bonding material 300 is connected to the second plate surface and extends into the overflow hole 102. Here, the first substrate 100 may be aligned on the second substrate 200 by using a top sheet device.

Step 50, as shown in FIG. 22, the chip 400 is attached to the fourth surface 200b of the second substrate 200 by a conventional flip chip process.

Step 60, as shown in FIG. 23, a BGA (Ball Grid Array) ball 500 is implanted on the fourth surface 200b of the second substrate 200 by a conventional process to facilitate connecting the entire package antenna to components such as a circuit board.

The package antenna provided by the present invention and the method for fabricating the same, the first substrate 100 and the second substrate 200 are bonded by using a viscous material, and the bonding pads are designed at the overflow hole 102 of the cavity wall 101, and are pressed by the first substrate 100. When the second substrate 200 is pressed, the bonding material 300 is extruded into the overflow hole 102 to form a rivet-like structure, which is good for bonding the first substrate 100 and the second substrate 200. The chip and the BGA ball are packaged and mounted according to a conventional process. The cavity 10 between the first substrate 100 and the second substrate 200 is highly stable, and can maintain good stability even after a plurality of high temperature thermal cycles. The overflow hole 102 of the first substrate 100 effectively absorbs the excess bonding material 300, thereby effectively solving the process problem that the overflow of the antenna area and the thickness of the viscous material are difficult to control. At the same time, the overflow glue forms a rivet structure together with the glue of the second plate surface 100b, and functions as a good welding of the first substrate 100 and the second substrate 200.

The above is only the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of changes or substitutions within the technical scope of the present invention. It is within the scope of the invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims (15)

1. A package antenna, comprising: a first substrate and a second substrate, wherein the first substrate and the second substrate are stacked, and the two are abutted and connected by an adhesive material;

   The first substrate has a first plate surface and a second plate surface disposed opposite to each other, and the first substrate is provided with an antenna pattern, the antenna pattern includes a first radiation piece; the second plate surface faces the a second substrate is disposed, the first substrate is provided with a cavity, and the cavity is a groove structure disposed at the second plate surface, the opening of the cavity is located on the second plate surface and facing The second substrate, the cavity wall of the cavity is provided with an overflow hole, and the overflow hole penetrates the first plate surface and the second plate surface;

   The second substrate has a third plate surface facing the first substrate, the third plate surface includes a cavity surface and a welding surface, and the cavity surface is provided with a second radiation sheet; the cavity surface Opposite the cavity, the cavity is located between the first radiation piece and the second radiation piece; the welding surface is opposite to the cavity wall of the cavity, and the welding surface is a joint of the cavity surface is provided with a solder resist structure, the solder resist structure protruding from the third plate surface;

   The bonding material is disposed on the soldering surface, and the bonding material is disposed opposite to the overflow hole, and the bonding material is connected to the second board surface and extends into the overflow hole.
2. The package antenna according to claim 1, wherein a pad is disposed at a position corresponding to the overflow hole on the soldering surface, and the bonding material is disposed on the pad;

   The solder resist structure is spaced apart from the pad, or the solder resist structure covers an edge of the pad.
3. The packaged antenna of claim 1 wherein said bonding material is directly coupled to said soldering surface.
4. The package antenna according to claim 1, wherein the solder resist structure is annular, the solder resist structure is disposed opposite to the overflow hole, and an inner diameter of the solder resist structure is larger than the overflow The inner diameter of the hole; or,

   The solder resist structure is a strip shape disposed along a cavity wall of the cavity.
5. The packaged antenna of claim 1 wherein said bonding material is spaced from said solder resist structure.
6. The packaged antenna according to any one of claims 1 to 5, wherein the solder resist structure is made of a solder resist material.
7. The package antenna according to claim 1, wherein the overflow hole is a stepped hole, and the overflow hole comprises a first segment hole and a second segment hole, wherein the inner diameter of the first segment hole is smaller than the An inner diameter of the second length of the hole, the first length of the hole is adjacent to the second substrate relative to the second length of the hole, and the bonding material is filled in the first length of the hole and extends into the second length of the hole.
8. The package antenna according to claim 1, wherein the second plate surface abuts against the solder resist structure.
9. The packaged antenna according to any one of claims 1 to 3, wherein the second substrate has a fourth plate surface, and the fourth plate surface is disposed opposite to the third plate surface;

   The package antenna further includes a chip, and the chip is connected to the fourth board surface.
10. A mobile communication terminal, characterized in that the mobile communication terminal has the packaged antenna according to any one of claims 1-8.
11. A method for fabricating a packaged antenna, which is used for preparing the packaged antenna according to any one of claims 1 to 9, the method for preparing the packaged antenna, comprising:

    Providing a first substrate, the first substrate has a first plate surface and a second plate surface disposed opposite to each other, the first substrate is provided with an antenna pattern, and the antenna pattern includes a first radiation piece; a cavity is disposed on a substrate, the cavity is a groove structure disposed at the second plate surface, and the cavity corresponds to a position of the first radiation piece, and an opening of the cavity Located on the second plate surface, the cavity wall of the cavity is provided with an overflow hole, and the overflow hole penetrates the first plate surface and the second plate surface;

    Providing a second substrate, the second substrate has a third plate surface, the third plate surface includes a cavity surface and a welding surface, and the cavity surface is provided with a second radiation sheet; a joint of the cavity surface is provided with a solder resist structure; the solder resist structure protrudes from the third plate surface;

    Providing a bonding material on the soldering surface;

    Orienting the opening of the cavity toward the second substrate, aligning the overflow hole of the first substrate with the bonding material, and then attaching the first substrate to the second substrate and making two Abutting, the bonding material is connected to the second plate surface and extends into the overflow hole.
12. The method for fabricating a packaged antenna according to claim 11, wherein in the step of providing a first substrate, the following substeps are further included:

    Providing a copper clad plate having opposite first and second surfaces;

    Providing an antenna pattern on the first surface;

    Screening a resin layer on the second surface and baking to form a cavity wall, the cavity wall surrounding forming a cavity;

    A glue hole is drilled at a position of the cavity wall, and the glue hole penetrates through the copper clad plate and the resin layer.
13. The method of manufacturing a packaged antenna according to claim 12, wherein the step of silk-screening the resin layer on the first surface and baking is repeated a plurality of times to achieve a predetermined thickness.
14. The method of manufacturing a packaged antenna according to claim 11, wherein in the step of providing an adhesive material on the soldering surface, the bonding material is disposed on the soldering surface by dispensing, the sticking The diameter of the material is larger than the diameter of the overflow hole.
15. The method of manufacturing a packaged antenna according to claim 11, wherein in the step of providing an adhesive material on the soldering surface, a gap is provided between the adhesive material and the solder resist structure.

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