CN110379785A - 一种电子散热器 - Google Patents
一种电子散热器 Download PDFInfo
- Publication number
- CN110379785A CN110379785A CN201910674735.5A CN201910674735A CN110379785A CN 110379785 A CN110379785 A CN 110379785A CN 201910674735 A CN201910674735 A CN 201910674735A CN 110379785 A CN110379785 A CN 110379785A
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- CN
- China
- Prior art keywords
- radiator
- heat sink
- heat
- foot
- hot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910674735.5A CN110379785B (zh) | 2019-07-25 | 2019-07-25 | 一种电子散热器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910674735.5A CN110379785B (zh) | 2019-07-25 | 2019-07-25 | 一种电子散热器 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110379785A true CN110379785A (zh) | 2019-10-25 |
CN110379785B CN110379785B (zh) | 2020-12-01 |
Family
ID=68255825
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910674735.5A Active CN110379785B (zh) | 2019-07-25 | 2019-07-25 | 一种电子散热器 |
Country Status (1)
Country | Link |
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CN (1) | CN110379785B (zh) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101115367A (zh) * | 2006-07-28 | 2008-01-30 | 富准精密工业(深圳)有限公司 | 散热装置 |
US20100258271A1 (en) * | 2009-04-08 | 2010-10-14 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd | Heat dissipation device having a fan duct thereon |
CN202183368U (zh) * | 2011-08-25 | 2012-04-04 | 杭州三海电子有限公司 | 大功率晶体管风冷散热装置 |
CN103186206A (zh) * | 2011-12-28 | 2013-07-03 | 鸿富锦精密工业(深圳)有限公司 | 散热器组合 |
CN205726868U (zh) * | 2016-07-01 | 2016-11-23 | 全椒赛德利机械有限公司 | 一种分体焊接式合金风冷散热器 |
CN208338182U (zh) * | 2018-07-04 | 2019-01-04 | 苏州宏科金属制品有限公司 | 一种新型电子散热片 |
-
2019
- 2019-07-25 CN CN201910674735.5A patent/CN110379785B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101115367A (zh) * | 2006-07-28 | 2008-01-30 | 富准精密工业(深圳)有限公司 | 散热装置 |
US20100258271A1 (en) * | 2009-04-08 | 2010-10-14 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd | Heat dissipation device having a fan duct thereon |
CN202183368U (zh) * | 2011-08-25 | 2012-04-04 | 杭州三海电子有限公司 | 大功率晶体管风冷散热装置 |
CN103186206A (zh) * | 2011-12-28 | 2013-07-03 | 鸿富锦精密工业(深圳)有限公司 | 散热器组合 |
CN205726868U (zh) * | 2016-07-01 | 2016-11-23 | 全椒赛德利机械有限公司 | 一种分体焊接式合金风冷散热器 |
CN208338182U (zh) * | 2018-07-04 | 2019-01-04 | 苏州宏科金属制品有限公司 | 一种新型电子散热片 |
Non-Patent Citations (1)
Title |
---|
胡赢等: "笔记本风扇的散热专利技术 ", 《河南科技》 * |
Also Published As
Publication number | Publication date |
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CN110379785B (zh) | 2020-12-01 |
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Effective date of registration: 20230802 Address after: Building 101-T8, Building 4, No. 29-1 Wuyuan Road, Tangxiayong Community, Yanluo Street, Bao'an District, Shenzhen City, Guangdong Province, 518000 Patentee after: Shenzhen zhongxinyuan Hardware & Plastic Co.,Ltd. Address before: 509 Kangrui Times Square, Keyuan Business Building, 39 Huarong Road, Gaofeng Community, Dalang Street, Longhua District, Shenzhen, Guangdong Province, 518000 Patentee before: Shenzhen lizhuan Technology Transfer Center Co.,Ltd. Effective date of registration: 20230802 Address after: 509 Kangrui Times Square, Keyuan Business Building, 39 Huarong Road, Gaofeng Community, Dalang Street, Longhua District, Shenzhen, Guangdong Province, 518000 Patentee after: Shenzhen lizhuan Technology Transfer Center Co.,Ltd. Address before: No.552 Xinggang North Road, Qiaoxi District, Xingtai City, Hebei Province Patentee before: XINGTAI POLYTECHNIC College |