CN110346609A - Chip gripping mechanism and wafer testing apparatus including it - Google Patents
Chip gripping mechanism and wafer testing apparatus including it Download PDFInfo
- Publication number
- CN110346609A CN110346609A CN201910248428.0A CN201910248428A CN110346609A CN 110346609 A CN110346609 A CN 110346609A CN 201910248428 A CN201910248428 A CN 201910248428A CN 110346609 A CN110346609 A CN 110346609A
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- Prior art keywords
- chuck
- vacuum
- containment member
- chip
- gripping mechanism
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
This application discloses a kind of chip gripping mechanism and including its wafer testing apparatus.Chip gripping mechanism may include chuck, vacuum clamping device and containment member.Chuck may include the multiple first annular vacuum tanks being formed on the upper surface of chuck.Vacuum clamping device may be coupled to the side surface of chuck, to provide vacuum to the lower surface of chip.Containment member can be arranged on the upper surface of chuck, to surround the outmost first annular vacuum tank among multiple first annular vacuum tanks.
Description
Cross reference to related applications
This application claims the applying date submitted to Korean Intellectual Property Office be on April 3rd, 2018 application No. is 10-
2018-0038815 and the applying date be on October 16th, 2018 application No. is the South Korea patent applications of 10-2018-0123255
Priority, the disclosure of which is by quoting whole is incorporated herein.
Technical field
Various embodiments can be related to a kind of semiconductor manufacturing apparatus in general, more particularly, to a kind of chip card
Tight device and the wafer testing apparatus including it.
Background technique
In general, the semiconductor element of such as integrated circuit can be by repeating a series of semiconductor fabrication process on chip
To be formed.For example, having electricity special to be formed by being recycled and reused on chip cambial depositing operation, for etching the layer
Property the etching technics of pattern, the ion implantation technology for adulterating the pattern using impurity or diffusion technique, for from tool
The cleaning of figuratum chip removal particle and developing technique etc., can form integrated circuit on chip.
After being formed by the above-mentioned technique semiconductor element, the electrical characteristics for testing semiconductor element can be executed
Test technology.Wafer testing apparatus can be used to execute test process, the wafer testing apparatus includes having probe pins
Probe card and be connected to probe card with to wafer testing apparatus provide test signal tester.
Probe card may be mounted at the top of test cabinet.The chuck for being used to support chip can be arranged in below probe card.
Revolving actuator for rotary chuck can be arranged in below chuck.For moving chuck in the horizontal direction and the vertical direction
Vertical/horizontal actuator can be arranged in below revolving actuator.
Before executing test process, the alignment procedures for being directed at chip with probe card can be executed, so that probe
The probe pins of card are contacted with semiconductor element.
However, the heat as used in semiconductor fabrication process, can generate thermal deformation in the wafer.It is partly led that is, having
The chip of volume elements part can be bent upward or downward, that is, can generate warpage in the wafer.Chuck possibly can not accurately clamp curved
Bent chip, so that probe may not be contacted equably with semiconductor element.Therefore, testing reliability can be reduced.In addition,
The Temperature Distribution of chip can become uneven in test process.In addition, position of the chip on chuck can change.In addition, chip
It may be unclamped from chuck.
The above problem in order to prevent, can continue research and utilization vacuum come equably clamped wafer chip gripping mechanism and
Method.
Summary of the invention
In the example embodiment of the disclosure, a kind of chip gripping mechanism may include chuck, vacuum clamping device and sealing
Component.Chuck may include the multiple first annular vacuum tanks being formed on the upper surface of chuck.Vacuum clamping device can connect
To the side surface of chuck, to provide vacuum to the lower surface of chip.Containment member can be arranged on the upper surface of chuck, with packet
Enclose the outmost first annular vacuum tank among multiple first annular vacuum tanks.
In the example embodiment of the disclosure, a kind of wafer testing apparatus may include chuck, probe card and containment member.
Chuck can support chip.Chuck may include the multiple first annular vacuum tanks being formed on the upper surface of chuck.Probe card
The electrical characteristics that chip is tested on chuck can be arranged in.Containment member can be arranged on the upper surface of chuck, to surround
Outmost first annular vacuum tank among multiple first annular vacuum tanks.
Accoding to exemplary embodiment, the containment member can prevent the vacuum between the chip and chuck with warpage
Leakage, to enhance the clamping force of chip gripping mechanism.Therefore, chip gripping mechanism can equably clamp the crystalline substance with warpage
Piece.
Detailed description of the invention
Through the following detailed description taken in conjunction with the accompanying drawings, will be more clearly understood disclosure theme above and other aspects,
Feature and advantage, in which:
Fig. 1 is the block diagram for showing wafer testing apparatus accoding to exemplary embodiment.
Fig. 2A is the plan view for showing chuck accoding to exemplary embodiment；
Fig. 2 B is the sectional view of the line A1-A1' interception in Fig. 2A；
Fig. 2 C is the sectional view of the line A2-A2' interception in Fig. 2A；
Fig. 3 A is the plan view for showing chuck accoding to exemplary embodiment；
Fig. 3 B is the sectional view of the line B1-B1' interception in Fig. 3 A；
Fig. 3 C is the sectional view of the line B2-B2' interception in Fig. 3 A；
Fig. 4 A is the plan view for showing chuck accoding to exemplary embodiment；
Fig. 4 B is the sectional view of the line C1-C1' interception in Fig. 4 A；
Fig. 4 C is the sectional view of the line C2-C2' interception in Fig. 4 A；
Fig. 4 D is the sectional view of the line C3-C3' interception in Fig. 4 A；
Fig. 5 A is the plan view for showing chuck accoding to exemplary embodiment；
Fig. 5 B is the sectional view of the line D-D' interception in Fig. 5 A；
Fig. 6 A and Fig. 6 B are the sectional views of the containment member in insertion groove accoding to exemplary embodiment；
Fig. 7 A is the sectional view of the chip on the containment member shown in Fig. 6 A；
Fig. 7 B is to show to utilize the sectional view of the chip of vacuum clamping in Fig. 6 A；
Fig. 8 A is the sectional view of the chip on the containment member shown in Fig. 6 B；
Fig. 8 B is to show to utilize the sectional view of the chip of vacuum clamping in Fig. 6 B；
Fig. 9 A is the sectional view of the containment member in insertion groove accoding to exemplary embodiment；
Fig. 9 B is the sectional view of the chip on the containment member shown in Fig. 9 A；
Fig. 9 C is to show to utilize the sectional view of the chip of vacuum clamping in Fig. 9 A；
Figure 10 A is the sectional view of the containment member in insertion groove accoding to exemplary embodiment；
Figure 10 B is the sectional view of the chip on the containment member shown in Figure 10 A；
Figure 10 C is to show to utilize the sectional view of the chip of vacuum clamping in Figure 10 A；
Figure 11 A is the sectional view of the containment member in insertion groove accoding to exemplary embodiment；
Figure 11 B is the sectional view of the chip on the containment member shown in Figure 11 A；And
Figure 11 C is to show to utilize the sectional view of the chip of vacuum clamping in Figure 11 A.
Specific embodiment
Various embodiments of the present invention will be described in greater detail with reference to the attached drawings.Attached drawing is various embodiments (and intermediate structure)
Schematic diagram.It therefore, it is expected to the configuration of the diagram as caused by such as manufacturing technology and/or tolerance and the variation of shape.
Therefore, described embodiment should not be construed as limited to specific configuration and shape shown in this paper, but may include
The configuration of the spirit and scope of the present invention as defined in appended claims and the deviation of shape are not departed from.
The present invention is described with reference to the cross section of idealized embodiments of the invention and/or plan view herein.However, this
The embodiment of invention is not necessarily to be construed as limitation present inventive concept.Although some embodiments of the present invention will be shown and be described,
It is it will be appreciated by the skilled addressee that without departing from the principles and spirit of the present invention, can implement at these
It is changed in example.
Fig. 1 is the block diagram for showing wafer testing apparatus accoding to exemplary embodiment.
With reference to Fig. 1, the wafer testing apparatus 10 of the exemplary embodiment may include probe card 100 and chip gripping mechanism
200。
Probe card 100 may include substrate 110 and multiple probe pins 120.Substrate 110 may include single PCB or more
Layer PCB.Substrate 110 may include the conducting wire connecting with probe pins 120.Substrate 110 may be used as main structure.Substrate 110
It can have corresponding with the shape of wafer W disk-shaped, be not limited to specific shape.Substrate 110 can have search coverage and
It is configured as surrounding the peripheral region of search coverage.
Probe pins 120 can be arranged on the lower surface of substrate 110.Probe pins 120 can be set in substrate 110
In search coverage.Probe pins 120 can be extended downwardly from the lower surface of substrate 110.Probe pins 120 can have lower end,
The lower end is configured to contact with wafer W to apply test signal to wafer W.Probe pins 120 may include for that will test
Signal is transferred to the conductive material of wafer W.
Probe card 100 can be electrically connected to test the electrical characteristics of wafer W with tester.Tester can pass through substrate 110
The semiconductor element in wafer W is applied test signals to probe pins 120.Tester can be based on from semiconductor element
Output signal and test the electrical characteristics of wafer W.Probe pins 120 can be electrically connected with the p-wire in substrate 110.Therefore,
Probe pins 120 can apply test signals to the semiconductor element in wafer W.Probe pins 120 can also will come from half
The output signal of conductor element is transferred to tester.
Chip gripping mechanism 200 can be arranged in below probe card 100.Chip gripping mechanism 200 may include chuck 210
With vacuum clamping device 250.Wafer W can be loaded on chuck 210.Vacuum clamping device 250 can use vacuum clamping in chuck
Wafer W on 210.Chip gripping mechanism 200 can also include vacuum transducer 270 and alarm device 280.Vacuum transducer 270
The vacuum between chuck 210 and wafer W can be sensed.Alarm device 280 can be defeated according to the sensing result of vacuum transducer 270
Alarm signal out.Chip gripping mechanism 200 can also include the controller for controlling the operation of chip gripping mechanism 200.
For example, chuck 210 can have cylindrical shape, it is not limited to specific shape.Chuck 210 can have and chip
The corresponding rounded upper surface in the upper surface of W.The upper surface of chuck 210 can have the diameter longer than the upper surface of wafer W.
Chuck 210 can be configured as support wafer W.Chuck 210 can rotate wafer W.Chuck 210 can be in level side
It is moved up to Vertical Square.Revolving actuator for rotary chuck 210 can be arranged in 210 lower section of chuck.For in water
The horizontal/vertical actuator that flat/Vertical Square moves up chuck 210 can be arranged in 210 lower section of chuck.Horizontal/vertical actuating
Device can control the horizontal position and upright position of chuck 210, so that the wafer W on chuck 210 is aligned with probe card 100.Control
Device processed can control revolving actuator and horizontal/vertical actuator.
Upper visual apparatus and lower visual apparatus can be arranged in the side of probe card 100 and the side of chuck 210.On
Visual apparatus can obtain the image of the pattern in wafer W.Lower visual apparatus can obtain the probe pins in probe card 100
120 image.It can be used for for probe card 100 being aligned with wafer W by the image that upper visual apparatus and lower visual apparatus obtain.Example
Such as, the controller of chip gripping mechanism 200 can control water based on the image obtained by upper visual apparatus and lower visual apparatus
Flat/vertical actuator, so that probe card 100 is aligned with wafer W.
Vacuum clamping device 250 may be coupled to the side surface of chuck 210.Optionally, vacuum clamping device 250 may be coupled to
The other positions of chuck 210.Vacuum clamping device 250 may include pump line 251 and vacuum pump 253.Pump line 251 can be with
The vacuum line being connected in chuck 210.Vacuum pump 253 may be coupled to pump line 251.Vacuum pump 253 can pass through control
The signal of device processed drives.
Vacuum transducer 270 may be coupled to pump line 251.Vacuum transducer 270 can be based in pump line 251
Pressure sense the vacuum between the upper surface of chuck 210 and the lower surface of wafer W.For example, vacuum transducer 270 can be with
The pressure in pump line 251 is provided to controller.Controller can be by the pressure provided from vacuum transducer 270 and with reference to pressure
Power is compared, to judge whether produce vacuum leak between the upper surface of chuck 210 and the lower surface of wafer W.When
Vacuum leak between the upper surface of chuck 210 and the lower surface of wafer W there may be when, controller can control alarm device
280 output alarm signals.Alarm signal may include warning, lamp etc..
Vacuum leak when alarm signal can be exported, between the upper surface of chuck 210 and the lower surface of wafer W
It can be identified to execute movement.For example, worker can stop the operation of chip gripping mechanism 200.Sealing structure on chuck 210
Part 213 (A referring to fig. 2) can be replaced with new containment member 213, the new containment member 213 have for under wafer W
The thickness of surface contact.
Fig. 2A is the plan view for showing chuck accoding to exemplary embodiment, and Fig. 2 B is the line A1-A1' interception in Fig. 2A
Sectional view and Fig. 2 C be in Fig. 2A line A2-A2' interception sectional view.
With reference to Fig. 2A, chuck 210A may include the multiple first annular vacuum tanks being formed on the upper surface of chuck 210A
211.Multiple first annular vacuum tanks 211 can have different diameters.Multiple first annular vacuum tanks 211 can be by uniform
Gap and be separated from each other.
Chuck 210A can also include multiple first vacuum hole 215a and multiple second vacuum hole 215b.Multiple first vacuum
Hole 215a and multiple second vacuum hole 215b can be formed in the bottom surface of each of multiple first annular vacuum tanks 211
On.Multiple first vacuum hole 215a can be arranged in the first straight line extended in a first direction, be not limited to specific direction.It is more
A second vacuum hole 215b can be arranged in the second straight line extended in a second direction, be not limited to specific direction, and described
Two directions are tilted relative to first direction with predetermined angular.The quantity of multiple first vacuum hole 215a can be true more than multiple second
The quantity of emptying aperture 215b is not limited to specific quantity.
Containment member 213 can be arranged on chuck 210A.Containment member 213, which can be configured as, surrounds multiple first rings
Outmost first annular vacuum tank 211 among shape vacuum tank 211.Containment member 213 can with it is outmost first annular
Vacuum tank 211 is spaced apart.Containment member 213 is inserted into the insertion groove being formed on the upper surface of chuck 210A.
With reference to Fig. 2 B and Fig. 2 C, the containment member 213 in the insertion groove of chuck 210A be can have higher than chuck 210A
Upper surface the top.Therefore, containment member 213 can be partly prominent from the upper surface of chuck 210A.Containment member 213
It can be used for being sealed the space that multiple first annular vacuum tanks 211 can be set.Containment member 213 may include elasticity
Material.Therefore, containment member 213 can have deformable shape because of the pressure of the wafer W on chuck 210A.
With reference to Fig. 2 B, first annular vacuum tank 211 can extend to the following table of chuck 210A from the upper surface of chuck 210A
Face.First vacuum hole 215a can extend to the lower surface of chuck 210A from the bottom surface of corresponding first annular vacuum tank 211.
First vacuum line 217a can be formed in chuck 210A.First vacuum line 217a can be parallel to the upper table of chuck 210A
Face and lower surface and extend.First vacuum hole 215a may be coupled to the first vacuum line 217a.
With reference to Fig. 2 C, the second vacuum hole 215b can be from corresponding first ring among multiple first annular vacuum tanks 211
The bottom surface of shape vacuum tank 211 extends to the lower surface of chuck 210A.For example, the second vacuum hole 215b can be from multiple first rings
The bottom surface of at least one first annular vacuum tank 211 in 211 outside of shape vacuum tank extends to the lower surface of chuck 210A.Second
Vacuum line 217b can be formed in chuck 210A.Second vacuum line 217b can be parallel to chuck 210A upper surface and
Lower surface and extend.Second vacuum line 217b may be coupled to the second vacuum hole 215b.First vacuum line 217a and second
Vacuum line 217b can be separated from each other.
Fig. 3 A is the plan view for showing chuck accoding to exemplary embodiment, and Fig. 3 B is the line B1-B1' interception in Fig. 3 A
Sectional view, and Fig. 3 C be in Fig. 3 A line B2-B2' interception sectional view.For brevity, can be omitted here about
With appointing for substantially identical, chuck 210B accoding to exemplary embodiment the element of the element of the chuck 210A in Fig. 2A to Fig. 2 C
What is further illustrated.
With reference to Fig. 3 A, chuck 210B may include multiple first annular vacuum tanks 211 and the second ring vaccum slot 219.It is more
A first annular vacuum tank 211 can be formed on the upper surface of the chuck 210B inside containment member 213.Second ring vaccum
Slot 219 can be formed on the upper surface of the chuck 210B outside containment member 213.Second ring vaccum slot 219 can be along
The marginal portion of containment member 213 extends.Second ring vaccum slot 219 can be spaced apart with containment member 213.
With reference to Fig. 3 B and Fig. 3 C, the second ring vaccum slot 219 can extend to chuck 210B from the upper surface of chuck 210B
Lower surface.Third vacuum hole 218a and the 4th vacuum hole 218b can be formed on the bottom surface of the second ring vaccum slot 219.
Third vacuum hole 218a and the 4th vacuum hole 218b can extend to chuck 210B's from the bottom surface of the second ring vaccum slot 219
Lower surface.Third vacuum hole 218a and the 4th vacuum hole 218b can be connected respectively to the first vacuum line 217a and the second vacuum
Route 217b.
Fig. 4 A is the plan view for showing chuck accoding to exemplary embodiment, and Fig. 4 B is the line C1-C1' interception in Fig. 4 A
Sectional view, Fig. 4 C is the sectional view of the line C2-C2' interception in Fig. 4 A, and Fig. 4 D is that line C3-C3' in Fig. 4 A is cut
The sectional view taken.For brevity, it can be omitted here about essentially identical with the element of the chuck 210A in Fig. 2A to Fig. 2 C
, any further explanation of the element of chuck 210C accoding to exemplary embodiment.
With reference to Fig. 4 A, chuck 210C may include the multiple third ring vaccum slots being formed on the upper surface of chuck 210C
400.Multiple third ring vaccum slots 400 can be set in 213 inside of containment member.Multiple third ring vaccum slots 400 can be with
It is separated from each other.Gap between multiple third ring vaccum slots 400 can be different from each other, is not limited to above-mentioned condition.
Chuck 210C may include multiple 5th vacuum holes being formed on the upper surface of chuck 210C and be formed in third
Multiple 6th vacuum holes on the bottom surface of ring vaccum slot 400.
Multiple 5th vacuum holes may include: multiple 5th (1) vacuum hole 401a, are arranged in and extend in a first direction
In the second straight line extended in first straight line and in a second direction, the second direction is substantially perpendicular to first direction；And
Multiple 5th (2) vacuum hole 401b, for being arranged in along the third straight line that third direction extends and extending along fourth direction
On four straight lines, the third direction is in a first direction between second direction, and the fourth direction is substantially perpendicular to third party
To.
Multiple 6th vacuum holes may include: multiple 6th (1) vacuum hole 403a, be arranged in first straight line and second
On straight line；And multiple 6th (2) vacuum hole 403b, it is arranged on the 5th straight line, the 5th straight line is along in a first direction
The 5th direction between third direction extends.Multiple 6th (1) vacuum hole 403a can be formed in multiple 5th (1) vacuum holes
On the bottom surface of multiple third ring vaccum slots 400 between 401a.Multiple 6th (2) vacuum hole 403b can be formed therein
It can not formed on the bottom surface of multiple third ring vaccum slots 400 of multiple 6th (1) vacuum hole 403a.
In Figure 4 A, multiple 6th (1) vacuum hole 403a can be formed in the bottom of outmost third ring vaccum slot 400
On surface, and multiple 6th (2) vacuum hole 403b can be formed in the bottom surface of innermost third ring vaccum slot 400
On.Optionally, multiple 6th (1) vacuum hole 403a can be formed on the bottom surface of innermost third ring vaccum slot 400,
And multiple 6th (2) vacuum hole 403b can be formed on the bottom surface of outmost third ring vaccum slot 400.
With reference to Fig. 4 B, multiple third ring vaccum slots 400 can extend to chuck 210C's from the upper surface of chuck 210C
Lower surface.Multiple 5th (1) vacuum hole 401a can extend to the lower surface of chuck 210C from the upper surface of chuck 210C.It is multiple
6th (1) vacuum hole 403a can extend to the lower surface of chuck 210C from the bottom surface of corresponding third ring vaccum slot 400.
Multiple 5th (1) vacuum hole 401a and multiple 6th (1) vacuum hole 403a can be relative in the upper surfaces in chuck 210C
Arrange to heart point symmetry.
First vacuum line 411 and the second vacuum line 413 can be formed in chuck 210C.First vacuum line 411
The upper and lower surfaces of chuck 210C can be parallel to and extended.Second vacuum line 413 can be with the first vacuum line 411
Symmetrically separate.Multiple 5th (1) vacuum hole 401a in the right part of the upper surface of chuck 210c and multiple are set
Six (1) vacuum hole 403a may be coupled to the first vacuum line 411.It is arranged in the left part of the upper surface of chuck 210c
Multiple 5th (1) vacuum hole 401a and multiple 6th (1) vacuum hole 403a may be coupled to the second vacuum line 413.
With reference to Fig. 4 C, multiple 5th (2) vacuum hole 401b can extend to chuck 210C's from the upper surface of chuck 210C
Lower surface.Multiple 5th (2) vacuum hole 401b can be arranged symmetrically relative to the central point of the upper surface in chuck 210C.
Third vacuum line 415 and the 4th vacuum line 417 can be formed in chuck 210C.Third vacuum line 415
The upper and lower surfaces of chuck 210C can be parallel to and extended.4th vacuum line 417 can be with third vacuum line 415
Symmetrically separate.Multiple 5th (2) vacuum hole 401b being arranged in the right part of the upper surface of chuck 210C can connect
To third vacuum line 415.Multiple 5th (2) vacuum hole 401b being arranged in the left part of the upper surface of chuck 210C can
To be connected to the 4th vacuum line 417.
With reference to Fig. 4 D, multiple 6th (2) vacuum hole 403b can prolong from the bottom surface of corresponding third ring vaccum slot 400
Reach the lower surface of chuck 210C.Multiple 6th (2) vacuum hole 403b can be provided only on a side of the upper surface of chuck 210
Point.
5th vacuum line 419 can be formed in chuck 210C.5th vacuum line 419 can be parallel to chuck 210C
Upper and lower surfaces and extend.Multiple 6th (2) vacuum hole 403b may be coupled to the 5th vacuum line 419.
Fig. 5 A is the plan view for showing chuck accoding to exemplary embodiment, and Fig. 5 B is line D-D' sections in Fig. 5 A
The sectional view taken.For brevity, it can be omitted here about substantially identical with the element of the chuck 210C in Fig. 4 A to Fig. 4 D
, any further explanation of the element of chuck 210D accoding to exemplary embodiment.
With reference to Fig. 5 A, chuck 210D may include the multiple third ring vaccum slots being formed on the upper surface of chuck 210D
400.Multiple third ring vaccum slots 400 can be set in 213 inside of containment member.Multiple third ring vaccum slots 400 can be with
It is separated from each other.
Chuck 210D may include multiple 5th vacuum holes being formed on the upper surface of chuck 210C and be formed in multiple
Multiple 6th vacuum holes on the bottom surface of third ring vaccum slot 400.Chuck 210D can also include from multiple third annulars
Multiple separators 405 that the bottom surface of vacuum tank 400 extends.Multiple separators 405 can have the upper surface with chuck 210D
Substantially coplanar upper end.
Multiple 5th vacuum holes may include: multiple 5th (1) vacuum hole 401a, are arranged in and extend in a first direction
In the second straight line extended in first straight line and in a second direction, the second direction is substantially perpendicular to first direction；And
Multiple 5th (2) vacuum hole 401b, for being arranged in along the third straight line that third direction extends and extending along fourth direction
On four straight lines, the third direction is in a first direction between second direction, and the fourth direction is substantially perpendicular to third party
To.
Multiple 6th vacuum holes may include: multiple 6th (1) vacuum hole 403a, be arranged in first straight line and second
On straight line；And multiple 6th (2) vacuum hole 403b, be arranged on the 5th straight line the 5th straight line along in a first direction with
The 5th direction between third direction extends.Multiple 6th (1) vacuum hole 403a can be formed in multiple 5th (1) vacuum holes
It is on the bottom surface of multiple third ring vaccum slots 400 between 401a and more between multiple 5th (2) vacuum hole 401b
On the bottom surface of a third ring vaccum slot 400.Multiple 6th (2) vacuum hole 403b can not be formed with formed therein
On the bottom surface of multiple third ring vaccum slots 400 of multiple 6th (1) vacuum hole 403a.
Separator 405 can be arranged in the 5th straight line to the 8th straight line from first straight line to the 4th line shifting
On.Separator 405 can be arranged in the third ring vaccum slot 400 Chong Die with the 5th straight line to the 8th straight line.In fig. 5,
Separator 405 can be arranged in outmost third ring vaccum slot 400.Optionally, separator 405 can be formed in multiple
In the third ring vaccum slot 400 with multiple 6th (1) vacuum hole 403a among third ring vaccum slot 400.In addition, more
A separator 405 can be spaced apart with multiple 6th (1) vacuum hole 403a.
The upper surface of chuck 210D can be divided into the multiple regions with fan shape by separator 405.For example, as schemed
Shown in 5A, the upper surface of chuck 210D can be divided into eight regions with fan shape.On the same line multiple
5th vacuum hole and multiple 6th vacuum holes can be arranged in each area.
In addition, vacuum line can be formed in each region formed by separator 405 although not showing in fig. 5
In.Vacuum line may be coupled to pump line.As shown in Figure 5 B, a part of the chuck 210D with separator 405 can be with
It is capped.On the contrary, not having the ring vaccum slot 400 of separator 405 can be opened.
Fig. 6 A and Fig. 6 B are the sectional views of the containment member in insertion groove accoding to exemplary embodiment.
With reference to Fig. 6 A, the containment member 213a of the exemplary embodiment can have solid construction.Containment member 213a can
To include elastic material.Insertion groove G1 for accommodating containment member 213a can be formed in the upper surface of chuck 210D.It inserts
Entering slot G1 can have the diameter being gradually increased from entrance to bottom surface in insertion groove G1.Insertion groove G1 can have curved
Inner surface is not limited to specific shape.
The diameter D1 of entrance in insertion groove G1 can be different from the diameter D2 of the bottom surface in insertion groove G1.For example, inserting
The diameter D1 for entering the entrance in slot G1 can be shorter than the diameter D2 of the bottom surface in insertion groove G1.
Containment member 213a can be partially inserted into insertion groove G1.The rest part of containment member 213a can from insert
It is prominent to enter slot G1.For example, the center portion of containment member 213a and lower part can be set in insertion groove G1.Containment member 213a
Top can be prominent from the entrance of insertion groove G1.
Step part S can be formed on the upper surface of chuck 210.Step part S can be configured as encirclement insertion groove
The entrance of G1.It can be from the bottom surface and card of step part S from the upper end of the entrance of insertion groove G1 containment member 213a outstanding
The upper surface of disk 210 is prominent, is not limited to above structure.
With reference to Fig. 6 B, the containment member 213b of the exemplary embodiment may include hollow tubular body part and and main body
The portion of part connection.Containment member 213b may include elastic material.For accommodating the insertion groove G2 of containment member 213b
It can be formed on the upper surface of chuck 210.Insertion groove G2 may include first step part S1 and second step part S2.The
One step part S1 can have the bottom surface lower than the bottom surface of second step part S2.The bottom surface of first step part S1
It can be set in the plane lower than the upper surface of chuck 210 with the bottom surface of second step part S2.
Containment member 213b can be arranged at the first step part S1 of chuck 210.For example, the tail of containment member 213b
Part can be contacted with the bottom surface of first step part S1.The main part of containment member 213b can in first step portion
The side surface of S1 is divided to be in contact with the coupling part between the bottom surface of second step part S2.The portion of containment member 213b
It can be fixed on by fixing component 214 on the bottom surface of first step part S1.
Fig. 7 A is the sectional view of the chip on the containment member shown in Fig. 6 A, and Fig. 7 B is to show to use vacuum in Fig. 6 A
The sectional view of the chip of clamping.Fig. 7 A and Fig. 7 B show the wafer W with downsagging.
With reference to Fig. 7 A and Fig. 7 B, the marginal portion of the wafer W on chuck 210 can partly be connect with containment member 213a
Touching, seals the space with multiple first annular vacuum tanks 211 inside containment member 213a.Therefore, exist
Vacuum in space with multiple first annular vacuum tanks 211 can be not leak between wafer W and chuck 210, to increase
Clamping force of the chuck 210 relative to the lower surface of wafer W.Due to being applied to the clamping force of wafer W, wafer W can be to sealing structure
Part 213a pressurization.Therefore, as shown in Figure 7 B, containment member 213a can be deformed because of the pressure of wafer W, so that containment member
213a can have shape corresponding with the shape of the shape of insertion groove G1 and step part S.As a result, wafer W can be equal
It is fixed to chuck 210 evenly.
Fig. 8 A is the sectional view of the chip on the containment member shown in Fig. 6 B, and Fig. 8 B is shown in Fig. 6 B using true
The sectional view for the chip that sky clamps.
With reference to Fig. 8 A and Fig. 8 B, the marginal portion of the wafer W on chuck 210 can partly be connect with containment member 213b
Touching, seals the space with multiple first annular vacuum tanks 211 inside containment member 213b.Therefore, from
The vacuum in the space with multiple first annular vacuum tanks 211 that vacuum clamping device 250 provides can be not leak into wafer W
Between chuck 210, to increase clamping force of the chuck 210 relative to the lower surface of wafer W.Due to being applied to the clamping of wafer W
Power, wafer W can pressurize to the main part of containment member 213b.Therefore, the main part of containment member 213b can be because of crystalline substance
The pressure of piece W and fold so that fold containment member 213b be inserted into the second step part S2 of insertion groove G2.
Fig. 9 A is the sectional view of the containment member in insertion groove accoding to exemplary embodiment, and Fig. 9 B is shown in Fig. 9 A
The sectional view of chip on containment member, and Fig. 9 C is shown in Fig. 9 A using the sectional view of the chip of vacuum clamping.
With reference to Fig. 9 A, the insertion groove G3 for accommodating containment member 213c can be formed in the upper surface of chuck 210.It inserts
Entering slot G3 can have bottom surface and from the vertically extending inner surface of bottom surface.The inner surface of insertion groove G3 can have
The curved shape that diameter is gradually increased from top to bottom in insertion groove G3, is not limited to specific shape.Therefore, insertion groove G3
In the diameter D1 of bottom surface can be than the diameter D2 long of the entrance in insertion groove G3.
Containment member 213c is inserted into insertion groove G3.Containment member 213c can have solid construction, the structure
With closed both ends.Containment member 213c may include elastic material.Containment member 213c can be partially inserted into insertion
In slot G3.The rest part of containment member 213c can be prominent from insertion groove G3.For example, the lower end of containment member 213c can be with
The bottom surface of insertion groove G3 contacts.The upper end of containment member 213c can be higher than the upper surface of chuck 210.
With reference to Fig. 9 B, the marginal portion of the wafer W on chuck 210 can be contacted with containment member 213c, so that sealing
The space with multiple first annular vacuum tanks 211 inside component 213c can be sealed.Therefore, chuck 210 is applied to crystalline substance
The clamping force of the lower surface of piece W can increase.Therefore, as shown in Figure 9 C, containment member 213c can become because of the pressure of wafer W
Shape is the shape corresponding to insertion groove G3.As a result, wafer W can be equably fixed to chuck 210.
Figure 10 A is the sectional view of the containment member in insertion groove accoding to exemplary embodiment, and Figure 10 B is to show Figure 10 A
In containment member on chip sectional view, and Figure 10 C be show in Figure 10 A using vacuum clamping chip section
Figure.For brevity, it can be omitted here about the element in Figure 10 A to Figure 10 C substantially identical with the element in Fig. 9 A
Any further explanation.
With reference to Figure 10 A, the containment member 213d of the exemplary embodiment can have the shape of hollow tubular.Containment member
213d may include elastic material.Containment member 213d can be partially inserted into insertion groove G3.Containment member 213d its
Remaining part point can be prominent from insertion groove G3.For example, the lower end of containment member 213d can be contacted with the bottom surface of insertion groove G3.It is close
The upper end for sealing component 213d can be higher than the upper surface of chuck 210.
With reference to Figure 10 B, the marginal portion of the wafer W on chuck 210 can be contacted with containment member 213d, so that sealing structure
The space with multiple first annular vacuum tanks 211 inside part 213d can be sealed.Therefore, chuck 210 is applied to wafer W
The clamping force of lower surface can increase.Therefore, as illustrated in figure 10 c, containment member 213d can be deformed because of the pressure of wafer W
For the shape corresponding to insertion groove G3, then it is inserted into insertion groove G3.As a result, wafer W can be equably fixed to
Chuck 210.
Figure 11 A is the sectional view of the containment member in insertion groove accoding to exemplary embodiment, and Figure 11 B is to show Figure 11 A
In containment member on chip sectional view, and Figure 11 C be show in Figure 11 A using vacuum clamping chip section
Figure.For brevity, it can be omitted here about in Figure 11 A to Figure 11 C substantially identical with the element in Fig. 9 A and Figure 10 A
Any further explanation of element.
With reference to Figure 11 A, the containment member 213e of the exemplary embodiment can have the belt shape of even width.Seal structure
Part 213e may include elastic material.Containment member 213e can partly with a side contacts of the inner surface of insertion groove G3.
The rest part of containment member 213e can be prominent from insertion groove G3.It can direction from insertion groove G3 containment member 213e outstanding
The other side opposite with the side with the inner surface of insertion groove G3 extends.That is, because the inner surface of insertion groove G3 can
To have the diameter being gradually reduced from lower end to upper end, so the containment member 213e being inserted into the side of insertion groove G3
Part may be located remotely from the upper surface of chuck 210.On the contrary, the containment member 213e being inserted into the side of insertion groove G3
Part can be adjacent with the other side of insertion groove G3.
With reference to Figure 11 B, the marginal portion of the wafer W on chuck 210 can be contacted with containment member 213e, so that sealing structure
The space with multiple first annular vacuum tanks 211 inside part 213e can be sealed.Therefore, chuck 210 is applied to wafer W
The clamping force of lower surface can increase.Therefore, as shown in Figure 11 C, the protrusion of containment member 213e can be because of wafer W
Pressure and towards insertion groove G3 fold.As a result, wafer W can be equably fixed to chuck 210.
The above embodiment of the present invention is intended to the illustrative and not limiting present invention.Various substitutions and equivalent are possible.This
Invention is not limited by embodiment described herein.Present invention is also not necessarily limited to any certain types of semiconductor devices.Mirror
In present disclosure, other additions, reduction or modification are it will be apparent that and being intended to fall within scope of the appended claims
It is interior.
Claims (25)
1. a kind of chip gripping mechanism, comprising:
It is used to support the chuck of chip, the chuck includes the multiple first annular vacuum being formed on the upper surface of the chuck
Slot；
Vacuum clamping device is connected to the side surface of the chuck, to provide clamping force to the lower surface of the chip；And
Containment member is arranged on the upper surface of the chuck and is configured as surrounding the multiple first annular true
Outmost first annular vacuum tank among empty slot.
2. chip gripping mechanism as described in claim 1, wherein the containment member and described outmost first annular true
Empty slot is spaced apart.
3. chip gripping mechanism as described in claim 1, wherein be formed on the upper surface of the chuck for portion
The insertion groove for dividing ground to accommodate the containment member.
4. chip gripping mechanism as claimed in claim 3, wherein the insertion groove have in the insertion groove from upper end to
The diameter that lower end is gradually increased.
5. chip gripping mechanism as claimed in claim 3, wherein be formed with stage portion on the upper surface of the chuck
Point, the step part is configured as surrounding the entrance of the insertion groove.
6. chip gripping mechanism as described in claim 1, wherein the containment member has solid construction, the solid knot
Structure has closed both ends, and the containment member includes elastic material.
7. chip gripping mechanism as described in claim 1, wherein the containment member has the shape of hollow tubular, and
The containment member includes elastic material.
8. chip gripping mechanism as described in claim 1, wherein the containment member has the belt shape in clean width.
9. chip gripping mechanism as described in claim 1, wherein the containment member include tubular body portion and with it is described
The portion of main part connection.
10. chip gripping mechanism as claimed in claim 9, wherein be formed with first on the upper surface of the chuck
Step part, the portion of the containment member are arranged at the first step part, and in the institute of the chuck
It states and is formed with the second step part adjacent with the first step part on upper surface.
11. chip gripping mechanism as claimed in claim 10, further includes fixing component, the fixing component is arranged in described close
The portion is fixed to the bottom surface of the first step part by the portion for sealing component.
12. chip gripping mechanism as described in claim 1, wherein the chuck further includes be formed in the chuck described
The second ring vaccum slot on upper surface, the second ring vaccum slot are spaced apart with the containment member and in the sealings
The outside of component extends.
13. chip gripping mechanism as described in claim 1, wherein the chuck further include:
Multiple vacuum holes are formed on the bottom surface of each ring vaccum slot in the multiple first annular vacuum tank；With
And
At least one vacuum line is formed in the chuck and is parallel to the upper surface of the chuck and extends,
The vacuum line is connected to the multiple vacuum hole.
14. chip gripping mechanism as claimed in claim 13, wherein the multiple vacuum hole includes:
Multiple first vacuum holes, are arranged in the first straight line extended in a first direction；And
Multiple second vacuum holes, are arranged in the second straight line extended in a second direction, and the second direction is relative to described
First direction is tilted with predetermined angular.
15. chip gripping mechanism as claimed in claim 14, wherein at least one described vacuum line includes:
First vacuum line is connected to the multiple first vacuum hole；And
Second vacuum line is connected to the multiple second vacuum hole.
16. chip gripping mechanism as claimed in claim 14, wherein it is true that the quantity of first vacuum hole is greater than described second
The quantity of emptying aperture.
17. chip gripping mechanism as described in claim 1, further includes:
Vacuum transducer, for being sensed to the vacuum in the space for being disposed with the multiple first annular vacuum tank；And
Alarm device, for being generated according to the sensing result of the vacuum transducer and exporting alarm signal.
18. chip gripping mechanism as described in claim 1, wherein the chuck further include:
Multiple vacuum holes are formed on the upper surface of the chuck and the bottom surface of the multiple first annular vacuum tank
On；And
At least one vacuum line is formed in the chuck and is parallel to the upper surface of the chuck and extends,
The vacuum line is connected to the multiple vacuum hole.
19. chip gripping mechanism as claimed in claim 18, wherein the multiple vacuum hole includes:
Multiple first vacuum holes, are formed on the upper surface of the chuck, and the multiple first vacuum hole is arranged in edge
In the first straight line that first direction extends and in the second straight line that extends in a second direction, the second direction substantially perpendicular to
The first direction；
Multiple second vacuum holes, are formed on the upper surface of the chuck, and the multiple second vacuum hole is arranged in edge
On the third straight line that third direction extends and along the 4th straight line that fourth direction extends, the third direction is in the first party
To between the second direction, the fourth direction is substantially perpendicular to the third direction；And
Multiple third vacuum holes are formed in the bottom of the multiple first annular vacuum tank between the multiple first vacuum hole
On surface, the multiple third vacuum hole be arranged in the first straight line and the second straight line on.
20. chip gripping mechanism as claimed in claim 19, wherein the vacuum line includes:
First vacuum line is connected to the multiple first vacuum hole and the multiple third vacuum hole；And
Second vacuum line is connected to the multiple second vacuum hole.
21. chip gripping mechanism as claimed in claim 19, wherein the multiple vacuum hole further includes multiple 4th vacuum
Hole, the multiple 4th vacuum hole is formed therein not to form the multiple first annular true of the multiple third vacuum hole
On the bottom surface of empty slot, the multiple 4th vacuum hole is arranged in along the 5th straight line that the 5th direction extends, the 5th side
To between the third direction and the fourth direction.
22. a kind of wafer testing apparatus, comprising:
It is used to support the chuck of chip, the chuck includes the multiple first annular vacuum being formed on the upper surface of the chuck
Slot；
Probe card is arranged in the electrical characteristics that the chip is tested on the chuck；And
Containment member is arranged on the upper surface of the chuck and is configured as surrounding the multiple first annular true
Outmost first annular vacuum tank among empty slot.
23. wafer testing apparatus as claimed in claim 22, wherein the chuck further includes be formed in the chuck described
The second ring vaccum slot on upper surface, and the second ring vaccum slot is spaced apart with the containment member, is arranged in institute
It states the outside of containment member and extends along the marginal portion of the containment member.
24. wafer testing apparatus as claimed in claim 22, wherein the chuck further includes insertion groove and step part, institute
It states insertion groove to be formed on the upper surface of the chuck partly to accommodate the containment member, the step part is matched
It is set to the entrance for surrounding the insertion groove.
25. wafer testing apparatus as claimed in claim 22, wherein the chuck further include:
First step part is formed on the upper surface of the chuck, with a part of the fixation containment member；With
And
Second step part, it is adjacent with the first step part, with accommodate the containment member by the chip
The rest part of pressure.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2018-0038815 | 2018-04-03 | ||
| KR20180038815 | 2018-04-03 | ||
| KR10-2018-0123255 | 2018-10-16 | ||
| KR1020180123255A KR20190116037A (en) | 2018-04-03 | 2018-10-16 | Wafer chunking apparatus and wafer test equipment having the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110346609A true CN110346609A (en) | 2019-10-18 |
Family
ID=68171502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910248428.0A Pending CN110346609A (en) | 2018-04-03 | 2019-03-29 | Chip gripping mechanism and wafer testing apparatus including it |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20190116037A (en) |
| CN (1) | CN110346609A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110567986A (en) * | 2019-10-22 | 2019-12-13 | 苏州精濑光电有限公司 | Silicon-based OLED panel lighting inspection equipment |
| CN115064479A (en) * | 2022-07-12 | 2022-09-16 | 法特迪精密科技（苏州）有限公司 | Wafer adsorption method for probe station |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113130365A (en) * | 2019-12-30 | 2021-07-16 | 上海微电子装备（集团）股份有限公司 | Suction cup |
| CN115083988B (en) * | 2022-07-12 | 2023-01-31 | 法特迪精密科技（苏州）有限公司 | Wafer adsorption platform facing probe platform and reducing ring groove and rotating ring groove thereof |
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| JPH04122045A (en) * | 1990-09-12 | 1992-04-22 | Fujitsu Ltd | Clamp device of wafer and lamp method |
| CN101137911A (en) * | 2005-01-10 | 2008-03-05 | 埃里希·赖廷格 | Method and device for testing semiconductor wafers using a chuck device whose temperature can be regulated |
| CN202758864U (en) * | 2012-07-18 | 2013-02-27 | 胡孔佑 | Vacuum chuck |
| US20140191478A1 (en) * | 2011-07-01 | 2014-07-10 | Mechatronic Systemtechnik Gmbh | Device for holding a planar substrate |
| CN104690641A (en) * | 2013-12-04 | 2015-06-10 | 台湾积体电路制造股份有限公司 | Transfer Module for Bowed Wafers |
| WO2017086333A1 (en) * | 2015-11-19 | 2017-05-26 | 日本特殊陶業株式会社 | Vacuum chuck |
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2018
- 2018-10-16 KR KR1020180123255A patent/KR20190116037A/en not_active Application Discontinuation
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|---|---|---|---|---|
| JPH04122045A (en) * | 1990-09-12 | 1992-04-22 | Fujitsu Ltd | Clamp device of wafer and lamp method |
| CN101137911A (en) * | 2005-01-10 | 2008-03-05 | 埃里希·赖廷格 | Method and device for testing semiconductor wafers using a chuck device whose temperature can be regulated |
| US20140191478A1 (en) * | 2011-07-01 | 2014-07-10 | Mechatronic Systemtechnik Gmbh | Device for holding a planar substrate |
| CN202758864U (en) * | 2012-07-18 | 2013-02-27 | 胡孔佑 | Vacuum chuck |
| CN104690641A (en) * | 2013-12-04 | 2015-06-10 | 台湾积体电路制造股份有限公司 | Transfer Module for Bowed Wafers |
| WO2017086333A1 (en) * | 2015-11-19 | 2017-05-26 | 日本特殊陶業株式会社 | Vacuum chuck |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110567986A (en) * | 2019-10-22 | 2019-12-13 | 苏州精濑光电有限公司 | Silicon-based OLED panel lighting inspection equipment |
| CN115064479A (en) * | 2022-07-12 | 2022-09-16 | 法特迪精密科技（苏州）有限公司 | Wafer adsorption method for probe station |
| CN115064479B (en) * | 2022-07-12 | 2023-02-24 | 法特迪精密科技（苏州）有限公司 | Wafer adsorption method for probe station |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190116037A (en) | 2019-10-14 |
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