CN110316694A - A kind of processing method with micro-nano form mold - Google Patents
A kind of processing method with micro-nano form mold Download PDFInfo
- Publication number
- CN110316694A CN110316694A CN201910612997.9A CN201910612997A CN110316694A CN 110316694 A CN110316694 A CN 110316694A CN 201910612997 A CN201910612997 A CN 201910612997A CN 110316694 A CN110316694 A CN 110316694A
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- CN
- China
- Prior art keywords
- mother matrix
- mold
- micro
- silicon
- nano form
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00349—Creating layers of material on a substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00388—Etch mask forming
- B81C1/00396—Mask characterised by its composition, e.g. multilayer masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00841—Cleaning during or after manufacture
- B81C1/00849—Cleaning during or after manufacture during manufacture
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Silicon Compounds (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The present invention relates to mold machining technology fields, and disclose a kind of processing method with micro-nano form mold, step 1: the manufacture of silicon mother matrix, step 2: photoetching silicon mother matrix, step 3: surface coating and step 4: high molecular material transfer.The processing method with micro-nano form mold, not only makes the cycle time for processing the mold of micro-nano form, improves the production efficiency of the mold of micro-nano form, and improve the quality of production of the mold of micro-nano form.
Description
Technical field
The present invention relates to mold machining technology field, specially a kind of processing method with micro-nano form mold.
Background technique
Currently, the part of many electronic product, automobile etc. is produced by mold, mold adds as mechanical
The important element in work field has had become product, part processing due to its advantage in terms of producing and processing cost
First choice.
Mold is exactly briefly the tool for shaped article or part.According to the difference of shaped article, by mold
It is divided into metal die and nonmetal mould.And it is different according to the material that the mold uses is manufactured, the mold is divided into sand mold
Mold, metal die, paraffin mold, plastic mould etc..
For silicon mother matrix when being processed into the mold with micro-nano form, procedure of processing is especially cumbersome, and is processed at present
Micro-nano form die quality it is poor, it is impossible to meet the demands of modern industry.For this purpose, the invention proposes one kind with micro-
The processing method of nano shape mold.
Summary of the invention
(1) the technical issues of solving
In view of the deficiencies of the prior art, the present invention provides a kind of processing methods with micro-nano form mold to have not
Only make the cycle time for processing the mold of micro-nano form, improves the production efficiency of the mold of micro-nano form, Er Qieti
It the advantages of high quality of production of the mold of micro-nano form, solves silicon mother matrix in the market and is being processed into micro-nano form
Mold when, procedure of processing is especially cumbersome, and the die quality for the micro-nano form being processed into is poor, and it is impossible to meet modern works
The problem of demand of industry.
(2) technical solution
In order to achieve the above object, the invention provides the following technical scheme: a kind of processing with micro-nano form mold
Method, the specific steps are as follows:
Step 1: the manufacture of silicon mother matrix, A., which chooses, has the substrate that required size requires, by manually by the surface of substrate
Burr carries out polishing processing, then again cleans substrate by clear water, substrate is placed in drying box after cleaning
Portion carries out drying and processing, and it is stand-by to be put into natural cooling in air after substrate is taken out from the inside of drying box, after B. will be cooled down
Substrate be placed on the flush coater of silicon coating, on each surface of substrate coat one layer of silicon coating, then will spraying silicon apply
The substrate of material is placed in the bellows using fan and is cooled down, that is, silicon mother matrix is made；
Step 2: photoetching silicon mother matrix, according to the size requirements of mold, A. passes through tape measure on the surface of silicon mother matrix first
It the length of mold, width and depth and makes a mark, the silicon mother matrix after label is placed on litho machine out then, due to silicon mother
The fixture that the corner of version is easy to be photo-etched machine directly damages, therefore should add protective pad on the fixture of litho machine herein,
By the silicon mother matrix laser gun in face of standard and litho machine to be processed, litho machine work is opened, litho machine carves mould on silicon mother matrix
Tool, after B. is tentatively made by lithography due to the mold on silicon mother matrix, the roughness of inner wall is larger, it is therefore desirable to again will be on silicon mother matrix
It is carefully carved on litho machine；
Step 3: surface coating can have greatly during photoetching silicon mother matrix in step 2 in the remained on surface of silicon mother matrix
The clast and dust of amount, it is therefore desirable to the surface that step 2 processes to obtain silicon mother matrix mold be cleared up, made again after cleaning
Silicon mother matrix mold is rinsed with clear water, the inside that drying box is placed in after rinsing is dried, and taking out after drying will
It, which is placed on flush coater, sprays one layer of hexamethyldisilazane and alumina composite film, puts it into and is using again after spraying
It is cooled down in the bellows of fan；
Step 4: high molecular material, high score is added into silicon mother matrix mold obtained in step 3 in high molecular material transfer
Mold is made after sub- material solidification, high molecular material, can in order to accelerate the setting rate of high molecular material in condensation herein
A desk fan is set up in the side of silicon mother matrix mold, is processed into micro-nano form after waiting high molecular material to solidify completely
Mold.
Preferably, the drying box in the step 1 specifically uses rotary drying case or suspension type drying box, and revolves
Rotatable drying box or suspension type drying box are all made of Resistant heating.
Preferably, the litho machine in the step 2 uses clamping plate type fixture, and the surface of clamping plate type fixture is fixed with anti-
Protection pad.
Preferably, dust exhaust apparatus and smoking apparatus are fixed on the litho machine in the step 2.
Preferably, hand electric sander is used when the step 1 polishes to substrate.
Preferably, the removal method of micro-nano form mold is clamped using special sharp mouth modulus in the step 4.
Preferably, environment locating for the high molecular material transfer in the step 4 is vacuum environment.
(3) beneficial effect
Compared with prior art, the present invention provides a kind of processing method with micro-nano form mold, have following
The utility model has the advantages that
1, the processing method with micro-nano form mold, passes through step 1: the manufacture of silicon mother matrix, step 2: photoetching silicon
Mother matrix, step 3: surface coating and step 4: high molecular material transfer not only makes the mold for processing micro-nano form
Cycle time, improves the production efficiency of the mold of micro-nano form, and improves the production matter of the mold of micro-nano form
Amount.
Detailed description of the invention
Fig. 1 is a kind of flow chart of the processing method with micro-nano form mold proposed by the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Referring to Fig. 1, a kind of processing method with micro-nano form mold, the specific steps are as follows:
Step 1: the manufacture of silicon mother matrix, A., which chooses, has the substrate that required size requires, by manually by the surface of substrate
Burr carries out polishing processing, then again cleans substrate by clear water, substrate is placed in drying box after cleaning
Portion carries out drying and processing, and it is stand-by to be put into natural cooling in air after substrate is taken out from the inside of drying box, after B. will be cooled down
Substrate be placed on the flush coater of silicon coating, on each surface of substrate coat one layer of silicon coating, then will spraying silicon apply
The substrate of material is placed in the bellows using fan and is cooled down, that is, silicon mother matrix is made；
Step 2: photoetching silicon mother matrix, according to the size requirements of mold, A. passes through tape measure on the surface of silicon mother matrix first
It the length of mold, width and depth and makes a mark, the silicon mother matrix after label is placed on litho machine out then, due to silicon mother
The fixture that the corner of version is easy to be photo-etched machine directly damages, therefore should add protective pad on the fixture of litho machine herein,
By the silicon mother matrix laser gun in face of standard and litho machine to be processed, litho machine work is opened, litho machine carves mould on silicon mother matrix
Tool, after B. is tentatively made by lithography due to the mold on silicon mother matrix, the roughness of inner wall is larger, it is therefore desirable to again will be on silicon mother matrix
It is carefully carved on litho machine；
Step 3: surface coating can have greatly during photoetching silicon mother matrix in step 2 in the remained on surface of silicon mother matrix
The clast and dust of amount, it is therefore desirable to the surface that step 2 processes to obtain silicon mother matrix mold be cleared up, made again after cleaning
Silicon mother matrix mold is rinsed with clear water, the inside that drying box is placed in after rinsing is dried, and taking out after drying will
It, which is placed on flush coater, sprays one layer of hexamethyldisilazane and alumina composite film, puts it into and is using again after spraying
It is cooled down in the bellows of fan；
Step 4: high molecular material, high score is added into silicon mother matrix mold obtained in step 3 in high molecular material transfer
Mold is made after sub- material solidification, high molecular material, can in order to accelerate the setting rate of high molecular material in condensation herein
A desk fan is set up in the side of silicon mother matrix mold, is processed into micro-nano form after waiting high molecular material to solidify completely
Mold.
Drying box in step 1 specifically uses rotary drying case or suspension type drying box, and rotary drying case or
Person's suspension type drying box is all made of Resistant heating.
Litho machine in step 2 uses clamping plate type fixture, and the surface of clamping plate type fixture is fixed with protective pad.
Dust exhaust apparatus and smoking apparatus are fixed on litho machine in step 2.
Hand electric sander is used when step 1 polishes to substrate.
The removal method of micro-nano form mold is clamped using special sharp mouth modulus in step 4.
Environment locating for high molecular material transfer in step 4 is vacuum environment.
In conclusion there is the processing method of micro-nano form mold to pass through step 1 when in use for this: silicon mother matrix system
Make, step 2: photoetching silicon mother matrix, step 3: surface coating and step 4: high molecular material transfer not only to process micro-
The cycle time of the mold of nano shape, improves the production efficiency of the mold of micro-nano form, and improves micro-nano shape
The quality of production of the mold of state.
It should be noted that the terms "include", "comprise" or its any other variant are intended to the packet of nonexcludability
Contain, so that the process, method, article or equipment for including a series of elements not only includes those elements, but also including
Other elements that are not explicitly listed, or further include for elements inherent to such a process, method, article, or device.
In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that including the element
Process, method, article or equipment in there is also other identical elements.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (7)
1. a kind of processing method with micro-nano form mold, it is characterised in that: specific step is as follows:
Step 1: the manufacture of silicon mother matrix, A., which chooses, has the substrate that required size requires, by manually by the burr on the surface of substrate
Carry out polishing processing, then again clean substrate by clear water, substrate is placed in after cleaning the inside of drying box into
It is stand-by to be put into natural cooling in air after taking out substrate from the inside of drying box for row drying and processing, and B. is by base after cooling
Plate is placed on the flush coater of silicon coating, and one layer of silicon coating is coated on each surface of substrate, then will spray silicon coating
Substrate is placed in the bellows using fan and is cooled down, that is, silicon mother matrix is made；
Step 2: photoetching silicon mother matrix, according to the size requirements of mold, A. passes through tape measure depanning on the surface of silicon mother matrix first
Length, width and the depth of tool simultaneously make a mark, and then the silicon mother matrix after label are placed on litho machine, due to silicon mother matrix
The fixture that corner is easy to be photo-etched machine directly damages, therefore should add protective pad on the fixture of litho machine herein, by silicon
The mother matrix laser gun in face of standard and litho machine to be processed, opens litho machine work, and litho machine carves mold, B. on silicon mother matrix
After tentatively being made by lithography due to the mold on silicon mother matrix, the roughness of inner wall is larger, it is therefore desirable to again by silicon mother matrix in light
It is carefully carved on quarter machine；
Step 3: surface coating can have largely during photoetching silicon mother matrix in step 2 in the remained on surface of silicon mother matrix
Clast and dust, it is therefore desirable to the surface that step 2 processes to obtain silicon mother matrix mold be cleared up, reused after cleaning clear
Water is rinsed silicon mother matrix mold, and the inside that drying box is placed in after rinsing is dried, and takes out and is put after drying
Enter and spray one layer of hexamethyldisilazane and alumina composite film on flush coater, is put it into again after spraying using fan
Bellows in cooled down；
Step 4: high molecular material, macromolecule material are added into silicon mother matrix mold obtained in step 3 for high molecular material transfer
Mold is made after material solidification, high molecular material, can be in silicon in order to accelerate the setting rate of high molecular material in condensation herein
A desk fan is set up in the side of mother matrix mold, is processed into micro-nano form mould after waiting high molecular material to solidify completely
Tool.
2. a kind of processing method with micro-nano form mold according to claim 1, it is characterised in that: the step
Drying box in one specifically uses rotary drying case perhaps suspension type drying box and rotary drying case or suspension type drying
Case is all made of Resistant heating.
3. a kind of processing method with micro-nano form mold according to claim 1, it is characterised in that: the step
Litho machine in two uses clamping plate type fixture, and the surface of clamping plate type fixture is fixed with protective pad.
4. a kind of processing method with micro-nano form mold according to claim 1, it is characterised in that: the step
Dust exhaust apparatus and smoking apparatus are fixed on litho machine in two.
5. a kind of processing method with micro-nano form mold according to claim 1, it is characterised in that: the step
Hand electric sander is used when a pair of of substrate is polished.
6. a kind of processing method with micro-nano form mold according to claim 1, it is characterised in that: the step
The removal method of micro-nano form mold is clamped using special sharp mouth modulus in four.
7. a kind of processing method with micro-nano form mold according to claim 1, it is characterised in that: the step
Environment locating for high molecular material transfer in four is vacuum environment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910612997.9A CN110316694B (en) | 2019-07-09 | 2019-07-09 | Processing method of mold with micro-nano form |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910612997.9A CN110316694B (en) | 2019-07-09 | 2019-07-09 | Processing method of mold with micro-nano form |
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| CN110316694A true CN110316694A (en) | 2019-10-11 |
| CN110316694B CN110316694B (en) | 2022-03-15 |
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| US20180217494A1 (en) * | 2015-06-23 | 2018-08-02 | The University Of North Carolina At Chapel Hill | Method for making an epoxy resin mold from a lithography patterned microstructure master |
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| CN208737221U (en) * | 2018-10-17 | 2019-04-12 | 福建汉晶光电科技有限公司 | A kind of litho machine for patterned sapphire substrate |
| CN208937911U (en) * | 2018-09-20 | 2019-06-04 | 天津英浩电子有限公司 | A kind of lithographic equipment of production of electronic components |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102458800A (en) * | 2009-06-08 | 2012-05-16 | 新田股份有限公司 | Mold for imprinting, and method for manufacturing same |
| CN103124929A (en) * | 2010-09-27 | 2013-05-29 | 富士胶片株式会社 | Pattern forming method, substrate manufacturing method, and mold manufacturing method |
| CN104129017A (en) * | 2013-05-02 | 2014-11-05 | 鸿富锦精密工业（深圳）有限公司 | Mould and mould film-coating method |
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| CN110316694B (en) | 2022-03-15 |
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