CN104129017A - Mould and mould film-coating method - Google Patents
Mould and mould film-coating method Download PDFInfo
- Publication number
- CN104129017A CN104129017A CN201310158119.7A CN201310158119A CN104129017A CN 104129017 A CN104129017 A CN 104129017A CN 201310158119 A CN201310158119 A CN 201310158119A CN 104129017 A CN104129017 A CN 104129017A
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- mould
- aluminum oxide
- film
- oxide film
- die cavity
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Abstract
A mould is provided with a mould cavity. A surface of the mould cavity is provided with a composite thin film containing hexamethyl-disilazane and aluminium oxide. By means of the composite thin film containing hexamethyl-disilazane and aluminium oxide, the mould has an anti-adhesion performance and an anti-scraping performance. The invention also relates to a mould film-coating method.
Description
Technical field
The present invention relates to a kind of mould and mould film plating process.
Background technology
The material of optical coupled connector is generally PEI resin, and adopts injection molding method manufacture, even if the extruder temperature of Jet forming machine has reached suitable temperature, PEI resin still has suitable viscous force, easily derivative defective material problem on mould.
In addition, due to the small volume of optical coupled connector, also make the die cavity small volume of mould, thereby resin flowing in die cavity is difficult for, make easily to leave on product flow liner phenomenon.
Summary of the invention
In view of this, be necessary to provide a kind of mould and mould film plating process with anti-scratch and anti-stick effect.
A kind of mould, has die cavity, and described die cavity surface has HMDS and alumina composite film.
A kind of mould film plating process, comprises the steps: mould to be placed in vacuum chamber, and described mould has die cavity; Heat described mould to predetermined temperature; In described vacuum chamber, alternately pass into trimethyl aluminium and oxygen, to form aluminum oxide film on described die cavity surface; Described mould is processed to increase to the hydroxy density on described aluminum oxide film surface; Heat described mould and described mould is placed in to the steam of HMDS, make at described die cavity Surface Creation HMDS and alumina composite nano thin-film with the modifying surface to described aluminum oxide film.
Compared to prior art, the mould of the present embodiment and the film plating process of mould arrange the aluminum oxide film through HMDS modification on mould die cavity surface, make aluminum oxide film possess the high rigidity of aluminium oxide and the hydrophobicity of silane, thereby mould have anti-scratch and anti-stick effect simultaneously.
Brief description of the drawings
Fig. 1 is the schematic diagram of embodiment of the present invention mould.
Fig. 2 is the enlarged drawing at II place in Fig. 1.
Fig. 3 is the schematic flow sheet of the film plating process of embodiment of the present invention mould.
Main element symbol description
Following detailed description of the invention further illustrates the present invention in connection with above-mentioned accompanying drawing.
Detailed description of the invention
As shown in Figures 1 and 2, the mould 10 of the embodiment of the present invention has die cavity 11, has the aluminum oxide film 12 through HMDS (Hexamethyldisilazane, HDMS) modification on the surface of die cavity 11.
HMDS has lower surface energy, and aluminium oxide has higher hardness, makes aluminum oxide film 12 have resistance to bond and resistance to scraping.
Above-mentioned mould 10 can method as shown in Figure 3 obtain, and concrete steps are as follows:
Step 1, is placed in the first cavity 20 by the mould 10 with die cavity 11, then by the first opening 30 or the second opening 40, the first cavity 20 is vacuumized so that the pressure in the first cavity 20 exists
-
between holder.
Step 2, the mould 10 that is arranged in the first cavity 20 is heated to 250 degree, then by the first opening 30 and the second opening 40 to 20 alternately passing into trimethyl aluminium (Trimethyl Aluminum in the first cavity, and oxygen TMA), first in the first cavity 20, (for example pass into a period of time by the first opening 30, 1 millisecond or 2 milliseconds) trimethyl aluminium, treat that trimethyl aluminium is dispersed in whole the first cavity 20, in the first cavity 20, (for example pass into a period of time by the second opening 40 again, 1 millisecond or 2 milliseconds) oxygen, thereby trimethyl aluminium and oxygen react generation alumina deposit in the first cavity 20 forms aluminum oxide films on the surface of die cavity 11 on die cavity 11 surfaces.
The ald mode that is formed as (the Atomic Layer Deposition of aluminum oxide film, ALD), the method can make the even thickness of aluminum oxide film and not affect the size of die cavity 11, and can obtain by controlling the reaction time aluminum oxide film of predetermined thickness, for example, 100 nanometers.
The main purpose that alternately passes into trimethyl aluminium and oxygen is to avoid just pyrolysis oxidization of surface that trimethyl aluminium molecules do not arrive mould 10, thereby affects the uniformity of aluminum oxide film.
Step 3, by generating the mould 10 of aluminum oxide film and be placed in the deionized water 50 of 100 degree, to increase hydroxyl (OH) density on aluminum oxide film surface.
Deionized water 50 can be pure water or ethanol, and mould 10 soaks about 1-5 minute in the deionized water 50 of 100 degree.
Step 4, mould 10 and HMDS 60 through perhydroxyl radical processing are together placed in the second cavity 70, heating mould 10 and HMDS 60 are to 100-110 degree, and the hydroxyl on five hours steam by HMDS 60 of continuous heating and aluminum oxide film surface carries out methyl-monosilane functional group's bond, make HMDS 60 to aluminum oxide film modifying surface with the surface coverage HMDS at aluminum oxide film, thereby form HMDS and alumina composite film, make the aluminum oxide film 12 after modification possess the high rigidity of aluminium oxide and the hydrophobicity of silane simultaneously.
In functional group's bond process, hexamethyldisilane 60 utilizes self assembly molecule layer technology to form nano level rete on the surface of aluminum oxide film.
In addition, can be according to repeatedly repeating step three and step 4 of the hydrophobic needs of reality, to increase hydrophobicity methyl-monosilane functional group's bond, so complete the aluminum oxide film 12 in conjunction with organic and inorganic, so that aluminum oxide film 12 possesses the high rigidity of aluminium oxide and the hydrophobicity of silane simultaneously.
Be understandable that, those skilled in the art also can do other variation etc. and be used in design of the present invention in spirit of the present invention, as long as it does not depart from technique effect of the present invention and all can.The variation that these do according to spirit of the present invention, within all should being included in the present invention's scope required for protection.
Claims (8)
1. a mould film plating process, comprises the steps:
Mould is placed in to vacuum chamber, and described mould has die cavity;
Heat described mould to predetermined temperature;
In described vacuum chamber, alternately pass into trimethyl aluminium and oxygen, to form aluminum oxide film on described die cavity surface;
Described mould is processed to increase to the hydroxy density on described aluminum oxide film surface;
Heat described mould and described mould is placed in to the steam of HMDS, make at described die cavity Surface Creation HMDS and alumina composite nano thin-film with the modifying surface to described aluminum oxide film.
2. mould film plating process as claimed in claim 1, is characterized in that, the pressure of described vacuum chamber is
-
holder.
3. mould film plating process as claimed in claim 1, is characterized in that, described predetermined temperature is 250 degree.
4. mould film plating process as claimed in claim 1, is characterized in that, described mould is placed in to deionized water aluminum oxide film is processed to increase hydroxy density.
5. mould film plating process as claimed in claim 4, is characterized in that, described deionized water is pure water or ethanol.
6. mould film plating process as claimed in claim 1, is characterized in that, the thickness of described aluminum oxide film is 100 nanometers.
7. a mould, has die cavity, it is characterized in that, described die cavity surface has HMDS and alumina composite film.
8. mould as claimed in claim 7, is characterized in that, the thickness of described aluminum oxide film is 100 nanometers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310158119.7A CN104129017A (en) | 2013-05-02 | 2013-05-02 | Mould and mould film-coating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310158119.7A CN104129017A (en) | 2013-05-02 | 2013-05-02 | Mould and mould film-coating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104129017A true CN104129017A (en) | 2014-11-05 |
Family
ID=51802003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310158119.7A Pending CN104129017A (en) | 2013-05-02 | 2013-05-02 | Mould and mould film-coating method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104129017A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110316694A (en) * | 2019-07-09 | 2019-10-11 | 嘉兴学院 | A kind of processing method with micro-nano form mold |
-
2013
- 2013-05-02 CN CN201310158119.7A patent/CN104129017A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110316694A (en) * | 2019-07-09 | 2019-10-11 | 嘉兴学院 | A kind of processing method with micro-nano form mold |
| CN110316694B (en) * | 2019-07-09 | 2022-03-15 | 嘉兴学院 | Processing method of mold with micro-nano form |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141105 |
|
| WD01 | Invention patent application deemed withdrawn after publication |