CN110316694B - Processing method of mold with micro-nano form - Google Patents
Processing method of mold with micro-nano form Download PDFInfo
- Publication number
- CN110316694B CN110316694B CN201910612997.9A CN201910612997A CN110316694B CN 110316694 B CN110316694 B CN 110316694B CN 201910612997 A CN201910612997 A CN 201910612997A CN 110316694 B CN110316694 B CN 110316694B
- Authority
- CN
- China
- Prior art keywords
- mold
- silicon
- micro
- mother plate
- nano
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00349—Creating layers of material on a substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00388—Etch mask forming
- B81C1/00396—Mask characterised by its composition, e.g. multilayer masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00841—Cleaning during or after manufacture
- B81C1/00849—Cleaning during or after manufacture during manufacture
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Silicon Compounds (AREA)
Abstract
The invention relates to the technical field of die processing, and discloses a processing method of a die with a micro-nano form, which comprises the following steps: manufacturing a silicon master mask, and step two: photoetching the silicon master plate, and step three: surface coating and step four: and (4) transferring the high polymer material. According to the processing method of the micro-nano mold, the period for processing the micro-nano mold is shortened, the production efficiency of the micro-nano mold is improved, and the production quality of the micro-nano mold is improved.
Description
Technical Field
The invention relates to the technical field of mold processing, in particular to a processing method of a mold with a micro-nano shape.
Background
At present, many parts of electronic products, automobiles and the like are produced by molds, and the molds are important elements in the field of machining, and have become the first choice for processing and producing products and parts increasingly due to the advantages of the molds in the aspect of production and processing cost.
A mold, simply referred to as a tool, is used to form a product or part. The mold is divided into a metal mold and a non-metal mold according to the difference of the molded product. The molds are classified into sand molds, metal molds, paraffin molds, plastic molds, and the like according to the materials used for manufacturing the molds.
At present, when a silicon master plate is processed into a mold with a micro-nano form, the processing steps are very complicated, and the processed micro-nano form mold is poor in quality and cannot meet the requirements of modern industry. Therefore, the invention provides a processing method of a mold with a micro-nano form.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides the processing method of the mold with the micro-nano form, which has the advantages of shortening the cycle of processing the mold with the micro-nano form, improving the production efficiency of the mold with the micro-nano form, improving the production quality of the mold with the micro-nano form, and solving the problems that the processing steps are very complicated when a silicon master plate is processed into the mold with the micro-nano form in the market, the quality of the processed mold with the micro-nano form is poor, and the requirement of the modern industry cannot be met.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme: a processing method of a mold with a micro-nano form comprises the following specific steps:
the method comprises the following steps: b, placing the cooled substrate on a silicon coating sprayer, coating a layer of silicon coating on each surface of the substrate, and then placing the substrate sprayed with the silicon coating into a bellows adopting a fan for cooling, thus obtaining the silicon master plate;
step two: firstly, measuring the length, the width and the depth of a mold on the surface of the silicon mother plate through a ruler and marking the mold, then placing the marked silicon mother plate on a photoetching machine, wherein the corner of the silicon mother plate is easily damaged directly by a clamp of the photoetching machine, so that a protective pad is added on the clamp of the photoetching machine, aligning the surface to be processed of the silicon mother plate with a laser gun of the photoetching machine, opening the photoetching machine to work, and etching the mold on the silicon mother plate by the photoetching machine;
step three: coating a film on the surface, namely, in the process of photoetching the silicon mother plate in the second step, a large amount of scraps and dust are remained on the surface of the silicon mother plate, so that the surface of the silicon mother plate mold obtained by processing in the second step needs to be cleaned, the silicon mother plate mold is washed by using clear water after the cleaning, the washed silicon mother plate mold is placed in a drying box for drying, the dried silicon mother plate mold is taken out and placed in a spraying machine for spraying a layer of hexamethyldisilazane and alumina composite film, and the sprayed silicon mother plate mold is placed in a bellows adopting a fan for cooling;
step four: and (3) transferring the high polymer material, namely adding the high polymer material into the silicon master mold obtained in the third step, and after the high polymer material is solidified, manufacturing the mold.
Preferably, the drying box in the first step is a rotary drying box or a suspension type drying box, and the rotary drying box or the suspension type drying box is heated by resistance wires.
Preferably, the lithography machine in the second step adopts a clamping plate type clamp, and a protective pad is fixedly arranged on the surface of the clamping plate type clamp.
Preferably, a dust suction device and a smoking device are fixedly arranged on the photoetching machine in the second step.
Preferably, a handheld electric grinding machine is adopted for grinding the pair of substrates in the step.
Preferably, the micro-nano form mold in the fourth step is taken out by a specially-made sharp-nose mold taking clamp.
Preferably, the environment where the polymer material is transferred in the fourth step is a vacuum environment.
(III) advantageous effects
Compared with the prior art, the invention provides a processing method of a mold with a micro-nano form, which has the following beneficial effects:
1. the processing method of the mold with the micro-nano form comprises the following steps: manufacturing a silicon master mask, and step two: photoetching the silicon master plate, and step three: surface coating and step four: the high polymer material transfer printing not only shortens the period of processing the micro-nano mold, improves the production efficiency of the micro-nano mold, but also improves the production quality of the micro-nano mold.
Drawings
Fig. 1 is a flow chart of a processing method of a mold with a micro-nano form according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, a method for processing a mold having a micro-nano shape includes the following steps:
the method comprises the following steps: b, placing the cooled substrate on a silicon coating sprayer, coating a layer of silicon coating on each surface of the substrate, and then placing the substrate sprayed with the silicon coating into a bellows adopting a fan for cooling, thus obtaining the silicon master plate;
step two: firstly, measuring the length, the width and the depth of a mold on the surface of the silicon mother plate through a ruler and marking the mold, then placing the marked silicon mother plate on a photoetching machine, wherein the corner of the silicon mother plate is easily damaged directly by a clamp of the photoetching machine, so that a protective pad is added on the clamp of the photoetching machine, aligning the surface to be processed of the silicon mother plate with a laser gun of the photoetching machine, opening the photoetching machine to work, and etching the mold on the silicon mother plate by the photoetching machine;
step three: coating a film on the surface, namely, in the process of photoetching the silicon mother plate in the second step, a large amount of scraps and dust are remained on the surface of the silicon mother plate, so that the surface of the silicon mother plate mold obtained by processing in the second step needs to be cleaned, the silicon mother plate mold is washed by using clear water after the cleaning, the washed silicon mother plate mold is placed in a drying box for drying, the dried silicon mother plate mold is taken out and placed in a spraying machine for spraying a layer of hexamethyldisilazane and alumina composite film, and the sprayed silicon mother plate mold is placed in a bellows adopting a fan for cooling;
step four: and (3) transferring the high polymer material, namely adding the high polymer material into the silicon master mold obtained in the third step, and after the high polymer material is solidified, manufacturing the mold.
The drying box in the step one is a rotary drying box or a suspension type drying box, and the rotary drying box or the suspension type drying box is heated by resistance wires.
And the photoetching machine in the second step adopts a clamping plate type clamp, and a protective pad is fixedly arranged on the surface of the clamping plate type clamp.
And the photoetching machine in the second step is fixedly provided with a dust suction device and a smoke suction device.
And step two, adopting a handheld electric grinding machine when the pair of substrates are ground.
In the fourth step, a special sharp-nose mold taking clamp is adopted for taking out the micro-nano morphological mold.
The environment of the polymer material transfer printing in the fourth step is a vacuum environment.
In summary, when the processing method of the mold with the micro-nano form is used, the first step is that: manufacturing a silicon master mask, and step two: photoetching the silicon master plate, and step three: surface coating and step four: the high polymer material transfer printing not only shortens the period of processing the micro-nano mold, improves the production efficiency of the micro-nano mold, but also improves the production quality of the micro-nano mold.
It is to be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A processing method of a mold with a micro-nano shape is characterized by comprising the following steps: the method comprises the following specific steps:
the method comprises the following steps: b, placing the cooled substrate on a silicon coating sprayer, coating a layer of silicon coating on each surface of the substrate, and then placing the substrate sprayed with the silicon coating into a bellows adopting a fan for cooling, thus obtaining the silicon master plate;
step two: firstly, measuring the length, the width and the depth of a mold on the surface of the silicon mother plate through a ruler and marking the mold, then placing the marked silicon mother plate on a photoetching machine, wherein the corner of the silicon mother plate is easily damaged directly by a clamp of the photoetching machine, so that a protective pad is added on the clamp of the photoetching machine, the surface to be processed of the silicon mother plate is aligned to a laser gun of the photoetching machine, the photoetching machine is opened to work, the photoetching machine carves the mold on the silicon mother plate, and B, after the mold on the silicon mother plate is primarily photoetched, the roughness of the inner wall of the mold is larger, so that the silicon mother plate needs to be finely carved on the photoetching machine;
step three: coating a film on the surface, wherein in the process of photoetching the silicon mother plate in the second step, a large amount of scraps and dust are remained on the surface of the silicon mother plate, so that the surface of the silicon mother plate mold obtained by processing in the second step needs to be cleaned, the silicon mother plate mold is washed by using clear water after being cleaned, the washed silicon mother plate mold is placed in a drying box for drying, the dried silicon mother plate mold is taken out and placed in a spraying machine for spraying a layer of hexamethyldisilazane and aluminum oxide composite film, and the sprayed silicon mother plate mold is placed in a bellows adopting a fan for cooling;
step four: transferring the polymer material, namely adding the polymer material into the silicon master mold obtained in the third step, and preparing the mold after the polymer material is solidified, wherein when the polymer material is condensed, in order to accelerate the solidification speed of the polymer material, a fan can be arranged on one side of the silicon master mold, and the mold with the micro-nano form is prepared after the polymer material is completely solidified;
the drying box in the first step is a rotary drying box or a suspension type drying box, and the rotary drying box or the suspension type drying box is heated by resistance wires;
and the photoetching machine in the second step adopts a clamping plate type clamp, and a protective pad is fixedly arranged on the surface of the clamping plate type clamp.
2. The processing method of the mold with the micro-nano form according to claim 1, characterized in that: and a dust suction device and a smoke suction device are fixedly arranged on the photoetching machine in the second step.
3. The processing method of the mold with the micro-nano form according to claim 1, characterized in that: and in the step, a handheld electric grinding machine is adopted when the pair of substrates are ground.
4. The processing method of the mold with the micro-nano form according to claim 1, characterized in that: and in the fourth step, a special sharp-nose mold taking clamp is adopted for taking out the micro-nano mold.
5. The processing method of the mold with the micro-nano form according to claim 1, characterized in that: and the environment where the high polymer material is transferred in the fourth step is a vacuum environment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910612997.9A CN110316694B (en) | 2019-07-09 | 2019-07-09 | Processing method of mold with micro-nano form |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910612997.9A CN110316694B (en) | 2019-07-09 | 2019-07-09 | Processing method of mold with micro-nano form |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110316694A CN110316694A (en) | 2019-10-11 |
| CN110316694B true CN110316694B (en) | 2022-03-15 |
Family
ID=68121633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910612997.9A Active CN110316694B (en) | 2019-07-09 | 2019-07-09 | Processing method of mold with micro-nano form |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110316694B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102458800A (en) * | 2009-06-08 | 2012-05-16 | 新田股份有限公司 | Mold for imprinting, and method for manufacturing same |
| CN103124929A (en) * | 2010-09-27 | 2013-05-29 | 富士胶片株式会社 | Pattern forming method, substrate manufacturing method, and mold manufacturing method |
| CN104129017A (en) * | 2013-05-02 | 2014-11-05 | 鸿富锦精密工业（深圳）有限公司 | Mould and mould film-coating method |
| CN105365168A (en) * | 2015-12-07 | 2016-03-02 | 重庆林洲机械制造有限公司 | Die and die coating method |
| CN105652590A (en) * | 2014-12-04 | 2016-06-08 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Manufacturing method of coining template |
| WO2019048633A1 (en) * | 2017-09-07 | 2019-03-14 | Luxembourg Institute Of Science And Technology (List) | Mould for nanoimprint lithography |
| CN208737221U (en) * | 2018-10-17 | 2019-04-12 | 福建汉晶光电科技有限公司 | A kind of litho machine for patterned sapphire substrate |
| CN208937911U (en) * | 2018-09-20 | 2019-06-04 | 天津英浩电子有限公司 | A kind of lithographic equipment of production of electronic components |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180217494A1 (en) * | 2015-06-23 | 2018-08-02 | The University Of North Carolina At Chapel Hill | Method for making an epoxy resin mold from a lithography patterned microstructure master |
-
2019
- 2019-07-09 CN CN201910612997.9A patent/CN110316694B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102458800A (en) * | 2009-06-08 | 2012-05-16 | 新田股份有限公司 | Mold for imprinting, and method for manufacturing same |
| CN103124929A (en) * | 2010-09-27 | 2013-05-29 | 富士胶片株式会社 | Pattern forming method, substrate manufacturing method, and mold manufacturing method |
| CN104129017A (en) * | 2013-05-02 | 2014-11-05 | 鸿富锦精密工业（深圳）有限公司 | Mould and mould film-coating method |
| CN105652590A (en) * | 2014-12-04 | 2016-06-08 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Manufacturing method of coining template |
| CN105365168A (en) * | 2015-12-07 | 2016-03-02 | 重庆林洲机械制造有限公司 | Die and die coating method |
| WO2019048633A1 (en) * | 2017-09-07 | 2019-03-14 | Luxembourg Institute Of Science And Technology (List) | Mould for nanoimprint lithography |
| CN208937911U (en) * | 2018-09-20 | 2019-06-04 | 天津英浩电子有限公司 | A kind of lithographic equipment of production of electronic components |
| CN208737221U (en) * | 2018-10-17 | 2019-04-12 | 福建汉晶光电科技有限公司 | A kind of litho machine for patterned sapphire substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110316694A (en) | 2019-10-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW201109190A (en) | Production method of three dimensional pattern | |
| CN109648782A (en) | A kind of in-mode inserts Shooting Technique of display panel | |
| CN110316694B (en) | Processing method of mold with micro-nano form | |
| CN107775849B (en) | 3D printing casting resin mold technology | |
| CN212472507U (en) | Mould suitable for fiber reinforced composite material with complex special-shaped hollow closed structure | |
| KR101439858B1 (en) | Method for manufacturing cast core | |
| CN113022188A (en) | Decoration transfer process for surface texture of 3D structure product and transfer mold thereof | |
| CN102069619A (en) | Method for preparing hot bonding membrane with inner grains | |
| CN111014587A (en) | Technological method for processing complex sand core by using foam loose piece | |
| CN110978835A (en) | Three-dimensional transfer printing method for paper pulp molding | |
| CN110576301A (en) | method for combining laser engraving and chemical engraving with engraving mold | |
| CN103313861B (en) | For decorating cosmetic sheet, its manufacture method of three dimensional mold material surface and using described cosmetic sheet to decorate the method on described moulding material surface | |
| CN108481684A (en) | Cost-effective injection mold | |
| CN1385265A (en) | Technology for precision casting metal die and parts | |
| CN105887086A (en) | Anchor type three-dimensional etching method | |
| CN107685439A (en) | Mould quick molding method | |
| CN111231534A (en) | Water transfer printing manufacturing process of concave-convex touch ornament | |
| CN103692533A (en) | 3D (three dimensional) piano baking varnish manufacturing process for furniture | |
| CN217957379U (en) | Casting plate release table static electricity removing device | |
| TWI272134B (en) | Method for manufacturing masking member of resin | |
| CN107041130A (en) | System and method for molded metal part | |
| CN115319020A (en) | Wax pattern production process based on metal sculpture | |
| KR100730039B1 (en) | A manufacturing method of pellicle frame | |
| CN109317609A (en) | A kind of sand casting uses the moulding method of mold | |
| CN112410848A (en) | Method for preventing magnesium piece from being polluted during encapsulation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |