CN110299470B

CN110299470B - Display panel and display device

Info

Publication number: CN110299470B
Application number: CN201910576033.3A
Authority: CN
Inventors: 刘梦琳; 高孝裕; 赵强; 李瑶; 王向前
Original assignee: Kunshan New Flat Panel Display Technology Center Co Ltd; Kunshan Govisionox Optoelectronics Co Ltd
Current assignee: Kunshan New Flat Panel Display Technology Center Co Ltd; Kunshan Govisionox Optoelectronics Co Ltd
Priority date: 2019-06-28
Filing date: 2019-06-28
Publication date: 2022-03-25
Anticipated expiration: 2039-06-28
Also published as: CN110299470A

Abstract

The application discloses display panel, display device and preparation method of display panel, display panel includes: a substrate defining a display region and a non-display region located at a periphery of the display region; an encapsulation layer comprising a first inorganic layer, an organic layer, and a second inorganic layer; wherein the first inorganic layer covers the display area and the non-display area of the substrate; the organic layer covers the first inorganic layer, and a part of the first inorganic layer positioned in the display area and at least a part of the first inorganic layer positioned in the non-display area are exposed out of the organic layer; the second inorganic layer is arranged on one side of the organic layer far away from the substrate and is in contact with the exposed part of the first inorganic layer from the organic layer. By means of the mode, the reliability of the package can be improved.

Description

Display panel and display device

Technical Field

The present application relates to the field of display technologies, and in particular, to a display panel and a display device.

Background

At present, display panels generally adopt an inorganic layer-organic layer-inorganic layer packaging structure, wherein the inorganic layer has a good water and oxygen barrier capability, and the organic layer has a capability of planarization, stress buffering, and particle covering.

In the long-term research process, the inventor of the application finds that the water and oxygen blocking capability of the organic layer is poor, and external water and oxygen can still enter the organic layer and corrode the display panel.

Disclosure of Invention

The technical problem that this application mainly solved provides a display panel and display device, can improve the reliability of encapsulation.

In order to solve the technical problem, the application adopts a technical scheme that: provided is a display panel including: a substrate defining a display region and a non-display region located at a periphery of the display region; an encapsulation layer comprising a first inorganic layer, an organic layer, and a second inorganic layer; wherein the first inorganic layer covers the display area and the non-display area of the substrate; the organic layer covers the first inorganic layer, and a part of the first inorganic layer positioned in the display area and at least a part of the first inorganic layer positioned in the non-display area are exposed out of the organic layer; the second inorganic layer is arranged on one side of the organic layer far away from the substrate and is in contact with the exposed part of the first inorganic layer from the organic layer.

Wherein a part of the first inorganic layer in the non-display area is exposed from the organic layer, and the organic layer in the non-display area has a slope on a side away from the display area, and the surface of the slope is rough; or, a part of the first inorganic layer located in the non-display area is exposed from the organic layer, the organic layer located in the non-display area has a slope on a side far away from the display area, the surface of the slope is provided with a plurality of grooves, and the second inorganic layer is further arranged on the surface of the groove; or, a portion of the first inorganic layer located in the non-display area is exposed from the organic layer, the slope surface is provided with a plurality of step portions, and the second inorganic layer is further provided on the step portion surface.

Wherein the display panel further comprises: the luminous layer is arranged between the substrate and the packaging layer, the area corresponding to the luminous layer is defined as the display area, and the area on the periphery of the luminous layer is defined as the non-display area; the light emitting layer includes a plurality of pixel defining blocks and light emitting cells between the pixel defining blocks; wherein the first inorganic layer positioned in the display region is disposed on the surfaces of the light emitting units between the pixel defining blocks and the pixel defining blocks; the organic layer located within the display area is disconnected at each of the pixel definition block locations such that a portion of the first inorganic layer corresponding to the pixel definition block location is exposed.

Wherein the organic layer positioned in the display region is disposed on a surface of the first inorganic layer between the adjacent pixel defining blocks, and the organic layer is flush with the first inorganic layer disposed at a top surface position of the pixel defining blocks.

The organic layer in the display area is arranged on one side of the first inorganic layer far away from the substrate, an opening is arranged at a part of the top surface of the organic layer corresponding to the pixel defining block, and the first inorganic layer is exposed from the opening.

Wherein the display panel further comprises: a dam disposed on the non-display region of the substrate; wherein the first inorganic layer further covers at least a part of the surface of the dam and a non-display region on a side of the dam away from the display region; the organic layer extends from the display area to the non-display area and is cut off at one side of the dam adjacent to the display area; or, the organic layer extends from the display region to the non-display region onto the non-display region on a side of the bank facing away from the display region, and at least a part of the first inorganic layer covering the surface of the bank is exposed from the organic layer.

Wherein the first inorganic layer covers at least the top surface of the dam, and the surface of the first inorganic layer on the top surface of the dam has a relief structure or a through hole; or, the first inorganic layer covers part of the surface of the dam, and the surface of the dam exposed from the first inorganic layer has a concave-convex structure or a through hole; or, the number of the dams is one.

In order to solve the above technical problem, another technical solution adopted by the present application is: there is provided a display device comprising the display panel of any of the above embodiments.

The beneficial effect of this application is: in contrast to the prior art, the present application provides a display panel in which a portion of the first inorganic layer located in the display region and at least a portion of the first inorganic layer located in the non-display region may be exposed from the organic layer, and the second inorganic layer may cover the organic layer and the portion of the first inorganic layer exposed from the organic layer. That is, the periphery of the organic layer in the non-display area is wrapped by the first inorganic layer and the second inorganic layer, and the periphery of the organic layer in the display area is also wrapped by the first inorganic layer and the second inorganic layer, so that the path of water and oxygen invading from the organic layer can be effectively cut off, and the reliability of packaging is improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:

FIG. 1 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure;

FIG. 2 is an enlarged partial schematic view of one embodiment of the ramp of FIG. 1;

FIG. 3 is an enlarged, fragmentary view of another embodiment of the ramp of FIG. 1;

FIG. 4 is a schematic structural diagram of a non-display area of a display panel according to an embodiment of the present disclosure;

FIG. 5 is a schematic structural diagram of another embodiment of a non-display area of a display panel according to the present application;

FIG. 6 is a schematic structural diagram of another embodiment of a non-display area of a display panel according to the present application;

FIG. 7 is a schematic structural diagram of another embodiment of a non-display area of a display panel according to the present application;

FIG. 8 is a schematic structural diagram of another embodiment of a non-display area of a display panel according to the present application;

FIG. 9 is a schematic structural diagram of another embodiment of a display panel according to the present application;

FIG. 10 is a schematic structural diagram of an embodiment of a display device according to the present application;

fig. 11 is a schematic flow chart illustrating a manufacturing method of a display panel according to an embodiment of the present disclosure.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of a display panel of the present application, which may be an OLED display panel, a Micro-OLED display panel, or the like, and the display panel includes a substrate 10 and an encapsulation layer 12.

Specifically, the substrate 10 defines a display area AA and a non-display area CC located at the periphery of the display area AA, and the substrate 10 may be a flexible substrate made of polyimide, polyethylene terephthalate, polyethylene naphthalate, or the like; of course, in other embodiments, the substrate 10 may be a rigid substrate, and the material thereof may be silicon or the like.

The encapsulation layer 12 includes a first inorganic layer 120, an organic layer 122, and a second inorganic layer 124. The first inorganic layer 120 covers the display area AA and the non-display area CC of the substrate 10, the organic layer 122 covers the first inorganic layer 120, and a portion of the first inorganic layer 120 located in the display area AA and at least a portion of the first inorganic layer 120 located in the non-display area CC are exposed from the organic layer 122, and the second inorganic layer 124 is disposed on a side of the organic layer 122 away from the substrate 10 and contacts with an exposed portion of the first inorganic layer 120 from the organic layer 122. The first inorganic layer 120 and the second inorganic layer 124 may be formed by chemical vapor deposition, and the first inorganic layer 120 and the second inorganic layer 124 may be made of a non-metal oxide or a metal oxide, where the non-metal oxide includes at least one of silicon nitride, silicon oxide, and silicon oxynitride; the metal oxide includes at least one of alumina, zirconia, and titania. The organic layer 122 may be formed by inkjet printing, coating, or the like, and the material of the organic layer 122 may be acrylic (for example, polymethyl methacrylate, or the like), silicone (for example, polymethyl monophenyl vinyl siloxane, or the like), epoxy (for example, epoxy resin, or the like), or the like.

That is, as shown in fig. 1, in the present application, the periphery of the organic layer 122 located in the non-display area CC is wrapped by the first inorganic layer 120 and the second inorganic layer 124, and the periphery of the organic layer 122 located in the display area AA is also wrapped by the first inorganic layer 120 and the second inorganic layer 124, so that the path of water and oxygen invading from the organic layer 122 can be effectively cut off, and the reliability of the package can be improved.

The non-display area CC of the panel is displayed in detail as follows.

In one embodiment, with reference to fig. 1, a portion of the first inorganic layer 120 in the non-display region CC is exposed from the organic layer 122, the organic layer 122 in the non-display region CC has a slope 1220 on a side away from the display region AA, and the surface of the slope 1220 is rough, for example, the slope 1220 can be rough by plasma treatment. The design method can improve the bonding force between the subsequently formed second inorganic layer 124 and the organic layer 122 at the slope 1220, and reduce the probability of fracture of the second inorganic layer 124.

In yet another embodiment, as shown in FIG. 2, FIG. 2 is an enlarged partial view of an embodiment of the ramp of FIG. 1. The surface of the slope 1220a is provided with a plurality of grooves a, and the subsequently formed second inorganic layer 124 further covers the surfaces of the grooves a, and the grooves a may be formed by mask etching or the like. This design can make the second inorganic layer 124 formed subsequently gradually descend along the groove a on the outer surface of the slope 1220a of the organic layer 122, thereby reducing the risk of breaking the second inorganic layer 124.

In another embodiment, as shown in FIG. 3, FIG. 3 is an enlarged partial schematic view of another embodiment of the ramp of FIG. 1. The surface of the slope 1220B is provided with a plurality of step portions B, and the subsequently formed second inorganic layer 124 further covers the surface of the step portions B, and the step portions B may be formed by forming a step-shaped planarization layer on the surface of the slope 1220B. This design may enable the second inorganic layer 124 to be formed gradually and gradually along the step portion B on the outer surface of the slope 1220B of the organic layer 122, thereby reducing the risk of breaking the second inorganic layer 124.

In the above embodiment, the first inorganic layer 120 located at the non-display area CC is continuous; in other embodiments, as shown in fig. 4, fig. 4 is a schematic structural diagram of an embodiment of a non-display area of a display panel according to the present application. The first inorganic layer 120a located in the non-display region CC1 has an opening (not labeled); the organic layer 122a extends from the display region to the non-display region CC1 and ends at the opening. The second inorganic layer 124a is disposed on a side of the organic layer 122a away from the substrate 10a, and contacts the substrate 10a corresponding to the opening and the first inorganic layer 120a exposed from the organic layer 122 a. This design may enable a narrow bezel.

In the embodiments shown in fig. 1 and 4, the non-display areas CC and CC1 of the display panel are not provided with the dam, but in other embodiments, as shown in fig. 5, the display panel may further include: at least one bank 16b, for example, one, two, three, etc., the bank 16b being disposed on the non-display area CC2 of the substrate 10b, in the present embodiment, the distance between the bank 16b and the display area can be shortened to less than 150 um; wherein the first inorganic layer 120b also covers at least a part of the surface of the dam 16b and the non-display area CC2 on the side of the dam 16b away from the display area; the organic layer 122b extends from the display region to the non-display region CC2, and ends at the side of the bank 16b adjacent to the display region. The inclusion of the dam 16b in this design allows better definition of the location of the organic layer 122 b.

Of course, in other embodiments, as shown in fig. 6, the organic layer 122c may also extend from the display region to the non-display region CC3 to the non-display region CC3 on the side of the dam 16c facing away from the display region, and at least a portion of the first inorganic layer 120c covering the surface of the dam 16c is exposed from the organic layer 122 c. This mode can increase the bending resistance of the display panel on the side of the bank 16c facing away from the display area by the organic layer 122c, as compared with the mode in fig. 5.

In the above embodiments, the number of the

dikes

16b and 16c is one, and the design mode can reduce the number of the

dikes

16b and 16c, which is beneficial to realizing a narrow frame; in other embodiments, as shown in fig. 7, the number of the banks 16d may be at least two, and the organic layer 122d may also at least partially cover the area between adjacent banks 16 d. This design can reduce the probability of the encapsulant layer between adjacent dikes 16d breaking when bent.

In addition, the first

inorganic layers

120b, 120c, 120d in the above embodiments cover at least the top surfaces of the

dam banks

16b, 16c, 16d, and the surfaces of the first

inorganic layers

120b, 120c, 120d positioned on the top surfaces of the

dam banks

16b, 16c, 16d have a concave-convex structure or a through hole, so that the bonding force between the second

inorganic layers

124b, 124c, 124d and the first

inorganic layers

120b, 120c, 120d is better.

In yet another embodiment, referring to fig. 8, at least a portion of the surface of the bank 16e is not provided with the first inorganic layer 120e, for example, as shown in fig. 8, the top surface of the bank 16e is not provided with the first inorganic layer 120 e. The surface of the dam 16e exposed from the first inorganic layer 120e has a concavo-convex structure or a through hole so that the bonding force between the second inorganic layer 124e and the surface of the dam 16e is good.

In a specific application scenario, when the size of the display panel is smaller than 8inch, the width of a frame (i.e., a non-display area) of the display panel provided by the application may be smaller than 1mm, and at this time, the display panel may be applied to a mobile phone, a watch, a tablet, and the like; when the size of the display panel is between 8inch and 32inch, the width of the frame of the display panel provided by the application can be smaller than 2mm, and the display panel can be applied to flat panels, vehicle-mounted display and the like; when the size of the display panel exceeds 32inch, the width of the frame of the display panel provided by the application can be smaller than 4mm, and the display panel can be applied to televisions or other large display screens.

The display area AA of the display panel is described in detail below.

Referring to fig. 1 again, the display panel provided in the present application further includes a light emitting layer 14 disposed between the substrate 10 and the encapsulation layer 12, wherein an area corresponding to the light emitting layer 14 is defined as a display area AA, and an area around the light emitting layer 14 is defined as a non-display area CC. In one embodiment, the light emitting layer 14 includes a plurality of pixel defining blocks 140 and light emitting units 142 positioned between the pixel defining blocks 140, and an area between the outermost pixel defining block 140 and the edge of the substrate 10 may be defined as a non-display area CC and the other area as a display area AA. The pixel defining block 140 may be made of a photoresist, and the photoresist may include at least one of polyimide, polymethyl methacrylate, and organic silane. The cross section of the pixel defining block 140 in the direction perpendicular to the substrate 10 may be a trapezoid in fig. 1, or may have another shape. The light emitting units 142 may include a red light emitting unit R, a blue light emitting unit B, and a green light emitting unit G, which may be sequentially formed in an area defined by the pixel defining block 140 by a metal or non-metal mask, and the heights of the formed red light emitting unit R, blue light emitting unit B, and green light emitting unit G do not exceed the height of the pixel defining block 140. In addition, in the present embodiment, the light emitting areas of the red light emitting unit R, the blue light emitting unit B, and the green light emitting unit G may be different, for example, the light emitting area of the blue light emitting unit B is larger than the light emitting areas of the red light emitting unit R and the green light emitting unit G in consideration of the light emitting life. In addition, in this embodiment, the display panel may further include a thin-film transistor layer, which may be located between the substrate 10 and the light-emitting layer 14, and is used to control the light-emitting unit 142 in the light-emitting layer 14 to emit light.

Referring to fig. 1, in the present embodiment, the first inorganic layer 120 located in the display area AA is disposed on the surfaces of the pixel defining blocks 140 and the light emitting units 142 between the pixel defining blocks 140; the organic layer 122 positioned within the display area AA is disconnected at the position of each pixel defining block 140 so that a portion of the first inorganic layer 120 corresponding to the position of the pixel defining block 140 is exposed. The design mode has a simple structure, and the process is easy to realize.

In one application scenario, as shown in fig. 1, the organic layer 122 located within the display area AA is disposed on the surface of the first inorganic layer 120 between the adjacent pixel defining blocks 140, and the organic layer 122 is flush with the first inorganic layer 120 disposed at the top surface C position of the pixel defining block 140, such that the organic layer 122 is disconnected at the top surface C position of the pixel defining block 140. The organic layer 122 is simple and easy to implement.

In another application scenario, as shown in fig. 9, fig. 9 is a schematic structural diagram of another embodiment of a display panel according to the present application. The organic layer 122f located in the display area AA6 is disposed on a side of the first inorganic layer 120f away from the substrate 10f, and the organic layer 122f is provided with an opening corresponding to a portion of the top surface C1 of the pixel defining block 140f, through which the first inorganic layer 120f is exposed. Compared with the design shown in fig. 1, the design method can reduce the contact area between the first inorganic layer 120f and the second inorganic layer 124f, and can reduce the probability of the package layer breaking when the display panel is bent.

Referring to fig. 10, fig. 10 is a schematic structural diagram of an embodiment of a display device according to the present application. The display device includes the display panel 30 in any of the above embodiments. Of course, in other embodiments, the display device may further include other structures, such as a housing 32, and the housing 32 may be disposed at the periphery of the display panel 30 for protecting the display panel 30.

Referring to fig. 1 and fig. 11 together, fig. 11 is a schematic flow chart illustrating a manufacturing method of a display panel according to an embodiment of the present application, the manufacturing method including:

s101: the first inorganic layer 120 is formed on one side of the substrate 10, and the first inorganic layer 120 continuously covers the display area AA of the substrate 10 and the non-display area CC located at the periphery of the display area AA.

Specifically, the first inorganic layer 120 may be formed on the surface of the substrate 10 by chemical vapor deposition or the like.

In an embodiment, before the step S101, the preparation method provided by the present application further includes: the light emitting layer 14 is formed on one side of the substrate 10, an area corresponding to the light emitting layer 14 is defined as a display area AA, an area around the light emitting layer 14 is defined as a non-display area CC, and the light emitting layer 14 includes a plurality of pixel defining blocks 140 and light emitting cells 142 between the plurality of pixel defining blocks 140. Specifically, the method of forming the light-emitting layer 14 may be: forming a plurality of pixel defining blocks 140 on one side of the substrate 10; then, the light emitting unit 142 is formed between the plurality of pixel defining blocks 140 by evaporation or the like. In this case, the step S101 specifically includes: a continuous first inorganic layer 120 is formed on the surfaces of the non-display region CC, the pixel defining block 140, and the light emitting unit 142.

S102: a discontinuous organic layer 122 is formed on the first inorganic layer 120 on a side away from the substrate 10, and a portion of the first inorganic layer 120 located in the display area AA and a portion of the first inorganic layer 120 located in the non-display area CC are exposed from the organic layer 122.

Specifically, referring to fig. 1 again, the step S102 specifically includes:

a. the organic layer 122 is formed in the display area AA in the area between the adjacent pixel defining blocks 140 by ink-jet printing or the like, and the organic layer 122 is flush with the first inorganic layer 120 at the position covering the top surfaces C of the pixel defining blocks 140.

b. Forming an organic layer 122 on the first inorganic layer 120 of the non-display region CC; the organic layer 122 positioned at the non-display region CC at this time may extend from the sidewall of the outermost pixel defining block 140. The order of step b and step a may be reversed or synchronized.

c. Removing part of the organic layer 122 located in the non-display area CC, for example, removing part of the organic layer 122 near the edge of the display panel by using a mask, that is, precisely controlling the boundary of the organic layer 122 located in the non-display area CC by using the mask, so that the thickness of the organic layer 122 of the removed non-display area CC is close to the thickness of the organic layer 122 in the display area AA, and the probability of uneven mura in the display area is reduced; and this way, a dam for limiting the position of the organic layer 122 in the prior art can be eliminated, thereby facilitating the realization of a narrow bezel.

In another embodiment, referring to fig. 4 again, the step S102 may be:

a. forming an organic layer 122a on the surface of the first inorganic layer 120a of the display area AA1 and the non-display area CC 1; when the material forming the organic layer 122a is liquid, the organic layer 122a may fill the recess regions between the adjacent pixel defining blocks 140 a.

b. Removing a portion of the organic layer 122a at the position of the top surface C1 of the pixel defining block 140 a; for example, the removal may be by etching; a portion of the first inorganic layer 120a located at the position of the top surface C1 of the pixel defining block 140a at this time is exposed from the organic layer 122 a.

c. Removing part of the organic layer 122a in the non-display area CC1, for example, removing part of the organic layer 122a near the edge of the display panel by using a mask, that is, precisely controlling the boundary of the organic layer 122a in the non-display area CC1 by using the mask, so that the thickness of the organic layer 122a in the removed non-display area CC1 is close to the thickness of the organic layer 122a in the display area AA1, thereby reducing the occurrence probability of uneven mura in the display area; in addition, the dam for limiting the position of the organic layer 122a in the prior art can be eliminated, so that the narrow frame is realized, and the packaging reliability is improved. In addition, in other embodiments, the steps c and b may be performed synchronously.

Of course, in other embodiments, the method of forming the structure of fig. 4 may be other, for example, after the first inorganic layer 120a is formed, a barrier may be formed on the first inorganic layer 120a at the position of the top surface C1 of the pixel defining block 140 a; then, the organic layer 122a is formed by means of inkjet printing or the like, and the organic layer 122a may be aligned with the height of the barrier; when the material of the blocking member is different from that of the first inorganic layer 120a or the second inorganic layer 124a formed later, the blocking member may be removed; when the material of the barrier is the same as the first inorganic layer 120a or the second inorganic layer 124a formed subsequently, the barrier may remain.

In addition, in other embodiments, after removing the portion of the organic layer 122/122a located in the non-display area CC/CC1, the organic layer 122/122a remaining in the non-display area CC/CC1 has a slope 1220/1220c on a side away from the display area AA/AA1, and the preparation method provided by the present application further includes: a plurality of steps are formed on the surface of the slope 1220/1220c, or a plurality of grooves are formed on the surface of the slope 1220/1220c, or the surface of the slope 1220/1220c is roughened, so that the bonding force between the subsequently formed second inorganic layer 124/124a and the organic layer 122/122a at the position of the slope 1220/1220c is better, and the probability of fracture of the second inorganic layer 124/124a at the position of the slope 1220/1220c is reduced.

S103: forming a second inorganic layer 124 on the organic layer 122 at a side away from the substrate 10, wherein the second inorganic layer 124 covers the organic layer 122 and the exposed part of the first inorganic layer 120 from the organic layer 122; to this end, the encapsulation layer 12 of the display panel is formed. In the encapsulation layer 12, the periphery of the organic layer 122 located in the non-display area CC is wrapped by the first inorganic layer 120 and the second inorganic layer 124, and the periphery of the organic layer 122 located in the display area AA is also wrapped by the first inorganic layer 120 and the second inorganic layer 124, so that the path of water and oxygen invading from the organic layer 122 can be effectively cut off, and the encapsulation reliability is improved.

This application can get rid of unnecessary organic layer that is located non-display area before forming the second inorganic layer, compare with prior art, when the distance between dykes and dams and the display area shortens, the organic layer that spreads to dykes and dams and keep away from display area one side can get rid of before forming the second inorganic layer, and then can realize reducing the purpose of the distance between dykes and dams and the display area, and can reduce the quantity of dykes and dams, no dykes and dams even, and then be favorable to realizing the narrow frame.

In the above embodiments, the non-display area of the display panel is not provided with the dam, but of course, in other embodiments, as shown in fig. 5, at least one dam 16b is provided on the non-display area CC2 of the display panel, the number of the dams 16b may be one, two, three, etc., and the position of the organic layer 122b can be better defined by the arrangement of the dams 16 b. The removing of the portion of the organic layer 122b located in the non-display area CC 2in step S102 includes: the organic layer 122b extending over the bank 16b or extending to the side of the bank 16b away from the display area is entirely removed; in this embodiment, the removal may be performed by an integral thinning method or a first mask removing method. At this time, the organic layer 122b may extend from the display region to the non-display region CC2, end at a side of the bank 16b adjacent to the display region, and not cover the top surface of the bank 16 b.

Of course, in other embodiments, as shown in fig. 6, the removing of the portion of the organic layer 122c located in the non-display area CC3 in step S102 may also include: the organic layer 122c that extends over the bank 16c or to the side of the bank 16c remote from the display area is partially removed; in this embodiment, the removal may be performed by an integral thinning method or a first mask removing method. At this time, the organic layer 122c may extend from the display region to the non-display region CC3 to a side of the bank 16c facing away from the display region, and other regions may be covered except for the top surface of the bank 16 c. Of course, in other embodiments, the organic layer may also cover the top surface of the dam; alternatively, the organic layer may comprise at least two spaced apart regions on the side of the dam facing away from the display area. When the number of the banks 16d is at least two, as shown in fig. 7, the organic layer 122d may at least partially cover the region between the adjacent banks 16 d.

In another embodiment, after the above-mentioned removing all the organic layer on the surface of the dam, the encapsulation method provided by the present application further comprises: the bank and the first inorganic layer covering the surface of the bank are all removed, and the structure formed at this time is as shown in fig. 4. In this embodiment, the surface of the dam includes the top surface and the side surface thereof, and the first inorganic layer and the dam can be removed by dry etching or the like, which is favorable for realizing a narrow bezel.

In another embodiment, referring to fig. 5 again, after the organic layer 122b on the surface of the dam 16b is completely removed, the encapsulation method provided by the present application further includes: the first inorganic layer 120b covering the surface of the bank 16b is treated so that the surface of the first inorganic layer 120b forms a concave-convex structure or a through-hole. For example, a via hole may be formed on the first inorganic layer 120b by dry etching or the like; for example, the concave-convex structure may be formed on the surface of the first inorganic layer 120b by plasma or the like. This design may make the subsequently formed second inorganic layer 124b more adhesive with the first inorganic layer 120b on the surface of the bank 16 b.

In another embodiment, referring to fig. 8 again, after the organic layer 122e on the surface of the dam 16e is completely removed, the encapsulation method provided by the present application further includes: at least a part of the first inorganic layer 120e covering the surface of the bank 16e is removed, and the exposed surface of the bank 16e is treated so that a concave-convex structure or a through hole is formed on the surface of the bank 16 e. This design can make the bonding force between the subsequently formed second inorganic layer 124e and the surface of the bank 16e high while extending the path of the water oxygen barrier from the side or the path of crack extension at the time of laser cutting.

In still another embodiment, before the first inorganic layer is formed, the surface of the bank may be treated so that the surface of the bank forms a concave-convex structure or a through hole, and the design may make the bonding force between the first inorganic layer formed later and the surface of the bank high.

The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims

1. A display panel, comprising:

a substrate defining a display region and a non-display region located at a periphery of the display region;

an encapsulation layer comprising a first inorganic layer, an organic layer, and a second inorganic layer; wherein the first inorganic layer covers the display area and the non-display area of the substrate; the organic layer covers the first inorganic layer, and a part of the first inorganic layer positioned in the display area and at least a part of the first inorganic layer positioned in the non-display area are exposed out of the organic layer; the second inorganic layer is arranged on one side of the organic layer far away from the substrate and is in contact with the part of the first inorganic layer exposed from the organic layer; the part of the first inorganic layer positioned in the non-display area is exposed from the organic layer, the organic layer positioned in the non-display area is provided with a slope on the side far away from the display area, the surface of the slope is provided with a plurality of grooves or a plurality of step parts, and the second inorganic layer is further arranged on the surfaces of the grooves or the step parts;

a dam disposed on the non-display region of the substrate; the first inorganic layer also covers at least part of the surface of the dam and a non-display area on one side of the dam away from the display area; the organic layer extends from the display region to the non-display region onto the non-display region on a side of the bank facing away from the display region, and at least a part of the first inorganic layer covering a surface of the bank is exposed from the organic layer.

2. The display panel according to claim 1,

the part of the first inorganic layer in the non-display area is exposed from the organic layer, and the organic layer in the non-display area has a slope on the side far away from the display area, and the surface of the slope is rough.

3. The display panel according to claim 1, characterized in that the display panel further comprises:

the luminous layer is arranged between the substrate and the packaging layer, the area corresponding to the luminous layer is defined as the display area, and the area on the periphery of the luminous layer is defined as the non-display area; the light emitting layer includes a plurality of pixel defining blocks and light emitting cells between the pixel defining blocks;

wherein the first inorganic layer positioned in the display region is disposed on the surfaces of the light emitting units between the pixel defining blocks and the pixel defining blocks; the organic layer located within the display area is disconnected at each of the pixel definition block locations such that a portion of the first inorganic layer corresponding to the pixel definition block location is exposed.

4. The display panel according to claim 3,

the organic layer positioned in the display region is disposed on a surface of the first inorganic layer between the adjacent pixel defining blocks, and the organic layer is flush with the first inorganic layer disposed at a top surface position of the pixel defining blocks.

5. The display panel according to claim 3,

the organic layer in the display area is arranged on one side, far away from the substrate, of the first inorganic layer, an opening is arranged at a position, corresponding to the top surface of the pixel defining block, of the organic layer, and the first inorganic layer is exposed out of the opening.

6. The display panel according to claim 1,

the first inorganic layer at least covers the top surface of the dam, and the surface of the first inorganic layer on the top surface of the dam has a concave-convex structure or a through hole; or, the first inorganic layer covers part of the surface of the dam, and the surface of the dam exposed from the first inorganic layer has a concave-convex structure or a through hole; or, the number of the dams is one.

7. A display device characterized by comprising the display panel according to any one of claims 1 to 6.