CN111415970B

CN111415970B - OLED display panel

Info

Publication number: CN111415970B
Application number: CN202010342129.6A
Authority: CN
Inventors: 刘志乔; 陈永胜
Original assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Current assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date: 2020-04-27
Filing date: 2020-04-27
Publication date: 2022-11-08
Anticipated expiration: 2040-04-27
Also published as: CN111415970A

Abstract

The application provides an OLED display panel, which comprises an array substrate, a light-emitting functional layer and an encapsulation layer, wherein the array substrate, the light-emitting functional layer and the encapsulation layer are sequentially arranged; the OLED display panel also comprises a first retaining wall and a second retaining wall, wherein the first retaining wall is arranged in the non-display area and is used for preventing the organic layer from extending to the edge of the non-display area; the second retaining wall is arranged in the non-display area and located on one side, close to the display area, of the first retaining wall, and the outer peripheries of the cathode layer and the protective layer extend to the second retaining wall. The application improves the reliability of the narrow-frame display panel packaging structure.

Description

OLED display panel

Technical Field

The application relates to the technical field of display, in particular to an OLED display panel.

Background

With the continuous development of OLED (Organic Light-Emitting Diode) display technology, the design of narrow-bezel flexible display products gradually becomes a mainstream trend.

Along with the frame of the display panel is narrowed continuously, the packaging film layer at the edge of the panel is compressed continuously, so that the thickness of the packaging film layer at the position is thinner and thinner, and the packaging effect is poor. Because the light-emitting film layer in the OLED display panel is prepared by the whole-surface evaporation process, some film layers such as a cathode layer can overflow to the edge of the display panel in the evaporation process, so that the effective contact area between the packaging film layer and the array substrate in a non-display area is reduced, the reliability of the packaging structure is further influenced, and the product performance is reduced.

Disclosure of Invention

The application provides an OLED display panel to solve the technical problem that the reliability of a packaging structure is influenced due to the fact that a light-emitting film layer overflows.

The application provides an OLED display panel, it includes:

the array substrate comprises a display area and a non-display area;

the light-emitting functional layer is arranged on the array substrate and comprises a cathode layer and a protective layer which are sequentially arranged;

an encapsulation layer disposed on the light emitting functional layer, the encapsulation layer including an organic layer;

the first retaining wall is arranged in the non-display area and used for preventing the organic layer from extending to the edge of the non-display area; and

the second barricade, the second barricade sets up the non-display area, the second barricade is located one side that first barricade is close to the display area, the cathode layer with the periphery of protective layer extends to the second barricade.

In the OLED display panel provided by the application, the array substrate comprises a flat layer, an anode layer and a pixel definition layer which are sequentially arranged, wherein the pixel definition layer comprises a first pixel definition layer and a second pixel definition layer which are sequentially arranged;

the second barrier comprises a first layer and a second layer which are sequentially arranged, the first layer and the first pixel definition layer are arranged at the same layer, and the second layer and the second pixel definition layer are arranged at the same layer.

In the OLED display panel provided in the present application, a first opening and a second opening are opened on a portion of the flat layer located in the non-display area, the second opening is located on a side of the first opening close to the display area, and a portion of the anode layer located in the non-display area is disposed on the flat layer and covers the first opening and the second opening;

the first retaining wall is arranged on the anode layer and located in the first opening, and the second retaining wall is arranged on the anode layer and located between the first opening and the second opening.

In the OLED display panel that this application provided, OLED display panel includes the third barricade, the third barricade sets up the non-display area, the third barricade is located first barricade is kept away from one side in display area, the third barricade with pixel definition layer is with the layer setting.

In the OLED display panel provided herein, the encapsulation layer includes a first inorganic layer disposed on the light emitting function layer;

the array substrate comprises a non-display part which is positioned on one side, far away from the light-emitting functional layer, of the second retaining wall, and the first inorganic layer covers the non-display part.

In the OLED display panel provided herein, the encapsulation layer further includes a second inorganic layer, the organic layer is disposed on the first inorganic layer, and the second inorganic layer is disposed on the organic layer;

the OLED display panel comprises a fourth retaining wall, the fourth retaining wall and the flat layer are arranged on the same layer, and the periphery of the first inorganic layer and the periphery of the second inorganic layer extend to the fourth retaining wall.

In the OLED display panel provided in the present application, a plurality of third openings are opened on a portion of the flat layer located in the display area, and a portion of the anode layer located in the display area is disposed on the flat layer and covers the third openings;

a plurality of fourth openings are formed in the part, located in the display area, of the first pixel definition layer, and each fourth opening is communicated with the third opening in a one-to-one correspondence mode;

the light-emitting functional layer comprises an organic light-emitting layer, the organic light-emitting layer is arranged on the portion, located in the display area, of the anode layer, the organic light-emitting layer comprises a plurality of light-emitting bodies, and each light-emitting body correspondingly fills one third opening and one fourth opening.

In the OLED display panel provided in the present application, the cross-sectional shape of the second retaining wall is a regular trapezoid or an inverted trapezoid.

In the OLED display panel provided by the application, the height of the second retaining wall is less than or equal to that of the first retaining wall.

In the OLED display panel provided in the present application, the light emitting function layer further includes an electron transport layer and an optical path adjusting layer, and the electron transport layer and the optical path adjusting layer are disposed in the display region;

the electron transmission layer is arranged between the organic light emitting layer and the cathode layer, and the optical path adjusting layer is arranged on the protective layer.

Compare in OLED display panel among the prior art, the OLED display panel that this application provided is through setting up the second barricade at the non-display area, the second is kept off the wall and is located one side that first barricade is close to the display area, make the coating by vaporization in the luminous functional layer, the second is kept off the wall and can effectively be prevented cathode layer and protective layer and spill over to the display panel edge, the distance of luminous functional layer to panel edge has been increased from this, thereby the effective area of contact between encapsulation layer and the array substrate in the non-display area has been increased, packaging structure's reliability has been improved, product performance has been promoted.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic view of a first structure of an OLED display panel provided in an embodiment of the present application;

fig. 2 is a schematic diagram of a second structure of an OLED display panel provided in an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or may be connected through the use of two elements or the interaction of two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the recitation of a first feature "on" or "under" a second feature may include the recitation of the first and second features being in direct contact, and may also include the recitation of the first and second features not being in direct contact, but being in contact with another feature between them. Also, the first feature "on," "above" and "over" the second feature may include the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The following disclosure provides many different embodiments or examples for implementing different features of the application. To simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Further, the present application may repeat reference numerals and/or reference letters in the various examples for simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or arrangements discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize the application of other processes and/or the use of other materials.

Referring to fig. 1 and fig. 2, fig. 1 is a first structural schematic diagram of an OLED display panel provided in an embodiment of the present application, and fig. 2 is a second structural schematic diagram of the OLED display panel provided in the embodiment of the present application.

The OLED display panel 100 provided in the embodiment of the present application includes an array substrate 10, a light emitting functional layer 11, an encapsulation layer 12, a first retaining wall 13, and a second retaining wall 14. The array substrate 10 includes a display region 10A and a non-display region 10B. The light emitting function layer 11 is disposed on the array substrate 10. The light emitting function layer 11 includes a cathode layer 111 and a protective layer 112 which are sequentially provided. The encapsulating layer 12 is provided on the light-emitting functional layer 11. The encapsulation layer 12 includes an organic layer 121. The first retaining wall 13 is disposed in the non-display region 10B. The first blocking wall 13 serves to prevent the organic layer 121 from extending toward the edge of the non-display region 10B. The second blocking wall 14 is disposed in the non-display area 10B. The second retaining wall 14 is located on a side of the first retaining wall 13 close to the display region 10A. The outer peripheries of the cathode layer 111 and the protective layer 112 extend to the second retaining wall 14.

Therefore, in the OLED display panel 100 provided in the embodiment of the present application, the second retaining wall 14 is disposed in the non-display area 10B, and the second retaining wall 14 is located on one side of the first retaining wall 13 close to the display area 10A, so that in the evaporation process of the light-emitting functional layer 11, the second retaining wall 14 can effectively prevent the cathode layer 111 and the protective layer 112 from overflowing to the edge of the display panel, thereby increasing the distance from the light-emitting functional layer 11 to the edge of the panel, increasing the effective contact area between the encapsulation layer 12 and the array substrate 10 in the non-display area 10B, improving the reliability of the encapsulation structure, and improving the product performance.

Specifically, the array substrate 10 includes a planarization layer 101, an anode layer 102, and a pixel definition layer 103, which are sequentially disposed. Wherein a portion of the cathode layer 111 located in the display region 10A is disposed on the pixel defining layer 103. The portion of the cathode layer 111 in the non-display region 10B is disposed on the anode layer 102, and the outer periphery of the cathode layer 111 extends to the second retaining wall 14.

In the embodiment of the present application, the array substrate 10 further includes a substrate, a thin film transistor, a metal trace, and other peripheral circuits (not shown in the drawings), which are not described herein again.

Further, the pixel definition layer 103 includes a first pixel definition layer 1031 and a second pixel definition layer 1032 which are arranged in sequence.

Optionally, the first retaining wall 13 and the pixel defining layer 103 are disposed on the same layer. The first retaining wall 13 includes a third layer 131 and a fourth layer 132 disposed in this order. The third layer 131 is disposed in the same layer as the first pixel definition layer 1031. The fourth layer 132 is disposed in the same layer as the second pixel defining layer 1032.

Optionally, the second retaining wall 14 and the pixel defining layer 103 are disposed in the same layer. In addition, the film layer of the second retaining wall 14 can be selected according to actual situations, which is not limited in the present application.

In the embodiment of the present application, the second barrier 14 includes a first layer 141 and a second layer 142 sequentially disposed. The first layer 141 is disposed on the same layer as the first pixel definition layer 1031. The second layer 142 is disposed in the same layer as the second pixel defining layer 1032. Therefore, the method simplifies the process cost on the basis of not increasing the original process.

Alternatively, the cross-sectional shape of the second retaining wall 14 is trapezoidal, square or triangular. Specifically, the cross-sectional shape of the second retaining wall 14 is a regular trapezoid or an inverted trapezoid.

In the embodiment of the present application, the cross-sectional shape of the second retaining wall 14 is an inverted trapezoid, as shown in fig. 1. The arrangement enables the cathode layer 111 and the protective layer 112 to be separated from one side of the second blocking wall 14 close to the display area 10A in the evaporation process, thereby effectively preventing the cathode layer 111 and the protective layer 112 from overflowing to the edge of the non-display area 10B, and prolonging the distance from the light-emitting functional layer 11 to the edge of the panel.

In addition, the cross-sectional shape of the second retaining wall 14 may also be a regular trapezoid, as shown in fig. 2. This arrangement prevents the cathode layer 111 and the protective layer 112 from crossing the second retaining walls 14, thereby preventing the cathode layer 111 and the protective layer 112 from overflowing during the evaporation process.

In some embodiments, the second barrier wall 14 includes a face facing the light emission functional layer 11 and a face away from the light emission functional layer 11. One surface of the second retaining wall 14 facing the light-emitting functional layer 11 is a concave surface. The above arrangement can further partition the cathode layer 111 and the protective layer 112 on the side of the second barrier walls 14 close to the display area 10A, thereby further reducing the probability that the cathode layer 111 and the protective layer 112 extend to the edge of the non-display area 10B.

Further, the height of the second retaining wall 14 is less than or equal to the height of the first retaining wall 14.

Because the DOT (Direct on Touch) process is a process completed after the package layer 12, the thickness of the film layer where the metal wire is located in the DOT structure is relatively thin, and the height of the second retaining wall 14 is set to be less than or equal to the height of the first retaining wall 14, so that the phenomenon that the metal wire in the DOT structure is broken due to the fact that the second retaining wall 14 is too high can be avoided, the risk of breaking the metal wire is reduced, and the reliability of the DOT process is improved.

In the embodiment of the present application, the height of the second retaining wall 14 is equal to the height of the first retaining wall 13. Therefore, the film layer of the metal routing in the DOT structure, which is positioned at the non-display area 10B, can be uniformly transited, so that the wire breaking risk of the metal routing is further reduced, and the reliability of the DOT manufacturing process is improved.

Further, a portion of the planarization layer 101 located in the non-display area 10B is opened with a first opening 101a and a second opening 101B. Specifically, the second opening 101b is located on the side of the first opening 101a close to the display area 10A. A portion of the anode layer 102 located in the non-display region 10B is disposed on the planarization layer 101 and covers the first and second openings 101a and 101B.

Specifically, the first retaining wall 13 is disposed on the anode layer 102 and located in the first opening 101 a. The second retaining wall 14 is disposed on the anode layer 102 and between the first opening 101a and the second opening 101b.

Further, the OLED display panel 100 includes a third barrier wall 15. The third blocking wall 15 is disposed in the non-display area 10B. The third retaining wall 15 is located on a side of the first retaining wall 13 away from the display area 10A. The third barrier 15 is disposed on the same layer as the pixel definition layer 103.

Specifically, the third partition wall 15 includes a fifth layer 151 and a sixth layer 152, which are sequentially disposed. Wherein the fifth layer 151 is disposed on the same layer as the first pixel defining layer 1031. The sixth layer 152 is disposed in the same layer as the second pixel defining layer 1032.

It is understood that the organic layer 121 can be effectively blocked from extending to the edge of the non-display region 10B by the cooperation of the first retaining wall 13 and the third retaining wall 15.

It should be noted that, in some embodiments, the overflow of the organic layer 121 may be prevented only by disposing the first retaining wall 13 to meet the design requirement of the narrow-bezel display product, and the embodiment is not to be construed as limiting the application.

Further, the encapsulation layer 12 includes a first inorganic layer 122 and a second inorganic layer 123. The first inorganic layer 122 is disposed on the light emitting functional layer 11. The organic layer 121 is disposed on the first inorganic layer 122. The second inorganic layer 123 is disposed on the organic layer 121.

In the embodiment of the present application, the array substrate 10 includes the non-display portion 10C on the side of the second retaining wall 14 away from the light emitting functional layer 11. The first inorganic layer 122 covers the non-display portion 10C. Specifically, the first inorganic layer 122 covers the first wall 13, the third wall 15, the exposed portion of the anode layer 102, and the exposed portion of the flat layer 101.

In the embodiment of the present application, the OLED display panel 100 includes the fourth retaining wall 16. The fourth retaining wall 16 is disposed on the same layer as the flat layer 101. The outer peripheries of the first inorganic layer 122 and the second inorganic layer 123 extend to the fourth retaining wall 16.

The second retaining walls 14 are arranged to shorten the overflow distance between the cathode layer 111 and the protective layer 112, so that the effective contact area between the package layer 12 and the array substrate 10 in the non-display region 10B is increased, and the reliability of the package structure is improved. Meanwhile, in the design of a narrow-frame display product, the distance from the luminous functional layer 11 to the edge of the display panel is increased, so that the thickness of a packaging film layer at the edge of the panel is increased, the probability of edge cracks of the packaging structure during panel cutting can be reduced, the reliability of the packaging structure is further improved, the packaging effect is improved, and the product performance is further improved.

Furthermore, the path of external water vapor invading to the light-emitting functional layer 11 from the edge of the panel can be prolonged, so that the peeling risk among all films in the light-emitting functional layer 11 is reduced, the adhesion reliability between the light-emitting functional layer 11 and the array substrate 10 is improved, the film peeling risk possibly generated in the subsequent DOT process can be reduced, and the product yield is improved.

In addition, in order to protect the peripheral circuits of the display panel from being damaged, the cathode layer 111 usually adopts a half-etching process in the evaporation process. This application is through the distance of extension cathode layer 111 to the panel edge, when improving packaging structure reliability, can also satisfy the demand that the half etching process of cathode layer 111 designed.

Further, in the embodiment of the present application, a plurality of third openings 101c are formed on a portion of the planarization layer 101 located in the display area 10A. A portion of the anode layer 102 located at the display region 10A is disposed on the planarization layer 101 and covers the third opening 101c.

A plurality of fourth openings 101d are opened on a portion of the first pixel definition layer 1031 located in the display region 10A. Each fourth opening 101d is communicated with the third opening 101c in a one-to-one correspondence manner.

The light-emitting functional layer 11 includes an organic light-emitting layer 113. The organic light emitting layer 113 is disposed on a portion of the anode layer 102 located in the display region 10A. The organic light emitting layer 113 includes a plurality of light emitters 113A. Each light emitting body 113A correspondingly fills a third opening 101c and a fourth opening 101d.

Specifically, the light-emitting body 113A may be a sub-pixel of different colors. For example, the light emitting body 113A may be one of a red sub-pixel, a green sub-pixel, or a blue sub-pixel.

It is to be understood that the light-emitting functional layer 11 further includes an electron transport layer 114 and an optical path adjusting layer 115. An electron transit layer 114 and an optical path length adjusting layer 115 are provided in the display region 10A. The electron transport layer 114 is disposed between the organic light emitting layer 113 and the cathode layer 111. An optical path adjusting layer 115 is provided on the protective layer 112. The optical path adjusting layer 115 has a light extraction function.

In the embodiment of the present application, the light-emitting functional layer 11 further includes a hole transport layer (not shown in the figure). The hole transport layer is disposed between the anode layer 102 and the organic light emitting layer 113. In addition, in some embodiments, the light emitting function layer 11 may further include an electron injection layer and a hole injection layer, which are not described herein again.

The OLED display panel 100 provided in the embodiment of the application is provided with the second retaining wall 14 in the non-display area 10B, the second retaining wall 14 is located on one side of the first retaining wall 13 close to the display area 10A, so that in the evaporation process of the light-emitting functional layer 11, the second retaining wall 14 can effectively prevent the cathode layer 111 and the protective layer 112 from overflowing to the edge of the display panel, thereby increasing the distance from the light-emitting functional layer 11 to the edge of the panel, thereby increasing the effective contact area between the encapsulation layer 12 and the array substrate 10 in the non-display area 10B, improving the reliability of the encapsulation structure, and improving the product performance.

The preparation method of the OLED display panel 100 provided in the embodiment of the present application includes:

s1: an array substrate 10 is provided. The array substrate 10 includes a display region 10A and a non-display region 10B. The array substrate 10 includes a flat layer 101, an anode layer 102, and a pixel defining layer 103 formed in sequence;

s2: the portions of the pixel defining layer 103 in the non-display region 10B are etched by an etching process to form the first retaining wall 13 and the second retaining wall 14, respectively. The second retaining wall 14 is located on one side of the first retaining wall 13 close to the display area 10A;

s3: a light emitting function layer 11 is formed on the array substrate 10. The light-emitting functional layer 11 includes a cathode layer 111 and a protective layer 112 formed in this order, and the outer peripheries of the cathode layer 111 and the protective layer 112 extend to the second retaining wall 14;

s4: an encapsulating layer 12 is formed on the light-emitting functional layer 11. The encapsulation layer 12 includes an organic layer 121, and the second blocking wall 14 is used to block the organic layer 121 from extending to the edge of the non-display region 10B.

The method for manufacturing the OLED display panel 100 of the present application is completed.

Compare in OLED display panel among the prior art, the OLED display panel that this application provided is through setting up the second barricade at the non-display area, the second barricade is located one side that first barricade is close to the display area, make at the coating by vaporization in-process of luminous functional layer, the second barricade can effectively prevent cathode layer and protective layer to spill over to the display panel edge, the distance of luminous functional layer to panel edge has been increased from this, thereby the effective area of contact between encapsulation layer and the array substrate in the non-display area has been increased, packaging structure's reliability has been improved, product performance has been promoted.

The foregoing provides a detailed description of embodiments of the present application, and the principles and embodiments of the present application have been described herein using specific examples, which are presented solely to aid in the understanding of the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. An OLED display panel, comprising:

the array substrate comprises a display area and a non-display area;

the second retaining wall is arranged in the non-display area and is positioned on one side, close to the display area, of the first retaining wall, and the outer peripheries of the cathode layer and the protective layer extend to the second retaining wall;

the array substrate comprises a flat layer, an anode layer and a pixel definition layer which are sequentially arranged, wherein a first opening and a second opening are formed in the part, located in the non-display area, of the flat layer, the second opening is located on one side, close to the display area, of the first opening, and the part, located in the non-display area, of the anode layer is arranged on the flat layer and covers the first opening and the second opening;

the first retaining wall is arranged on the anode layer and located in the first opening, the second retaining wall is arranged on the anode layer and located between the first opening and the second opening, the cathode layer and the protective layer extend and cover the second opening from the display area and extend to the outer wall of the second retaining wall.

2. The OLED display panel according to claim 1, wherein the pixel defining layer includes a first pixel defining layer and a second pixel defining layer which are sequentially disposed;

the second retaining wall comprises a first layer and a second layer which are sequentially arranged, the first layer and the first pixel definition layer are arranged at the same layer, and the second layer and the second pixel definition layer are arranged at the same layer.

3. The OLED display panel according to claim 2, wherein the OLED display panel comprises a third retaining wall, the third retaining wall is disposed in the non-display region, the third retaining wall is disposed on a side of the first retaining wall away from the display region, and the third retaining wall and the pixel definition layer are disposed on the same layer.

4. The OLED display panel of claim 1, wherein the encapsulation layer includes a first inorganic layer disposed on the light-emitting functional layer;

5. The OLED display panel of claim 4, wherein the encapsulation layer further comprises a second inorganic layer, the organic layer disposed on the first inorganic layer, the second inorganic layer disposed on the organic layer;

6. The OLED display panel of claim 2, wherein a plurality of third openings are opened on a portion of the flat layer located in the display area, and a portion of the anode layer located in the display area is disposed on the flat layer and covers the third openings;

7. The OLED display panel of claim 1, wherein the cross-sectional shape of the second retaining wall is a regular trapezoid or an inverted trapezoid.

8. The OLED display panel of claim 1, wherein the height of the second retaining wall is less than or equal to the height of the first retaining wall.

9. The OLED display panel according to claim 6, wherein the light emission function layer further includes an electron transport layer and an optical path length adjusting layer, the electron transport layer and the optical path length adjusting layer being provided in the display region;