CN113299849A - Display panel and preparation method thereof - Google Patents
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- CN113299849A CN113299849A CN202110500712.XA CN202110500712A CN113299849A CN 113299849 A CN113299849 A CN 113299849A CN 202110500712 A CN202110500712 A CN 202110500712A CN 113299849 A CN113299849 A CN 113299849A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The application provides a display panel and a preparation method thereof. The display panel includes a display area and a non-display area, including: a substrate; the planarization layer is arranged on one side of the substrate, and the thickness of the planarization layer is gradually increased along the direction from the display area to the direction far away from the display area in the non-display area. And the retaining wall is arranged in the non-display area, and the retaining wall is arranged on the planarization layer and is far away from one side of the substrate. And the display functional layer is arranged on one side, far away from the substrate, of the planarization layer. The film packaging layer is arranged on one side, far away from the planarization layer, of the display function layer so as to improve the edge thickness uniformity and the packaging effect of the display panel.
Description
Technical Field
The invention relates to the field of display, in particular to a display panel and a preparation method thereof.
Background
The thin film packaging technology has good water-blocking and oxygen-blocking effects, and has become the mainstream packaging technology for packaging flexible Organic light-emitting diode (OLED) display panels. At present, in the process of carrying out film encapsulation on the OLED display panel, the organic encapsulation layer is in a liquid state before being cured, has high flowability and is easy to flow out to the edge of the display panel, so that the edge thickness uniformity and the sealing effect of the OLED display panel are influenced.
Disclosure of Invention
The application provides a display panel and a preparation method thereof, which are used for improving the edge thickness uniformity and the packaging effect of the display panel.
The application provides a display panel, including display area and non-display area, include: a substrate;
the planarization layer is arranged on one side of the substrate, and the thickness of the planarization layer is gradually increased along the direction from the display area to the direction far away from the display area in the non-display area;
the retaining wall is arranged in the non-display area and is arranged on one side, far away from the substrate, of the planarization layer;
the display functional layer is arranged on one side, far away from the substrate, of the planarization layer;
and the film packaging layer is arranged on one side, far away from the planarization layer, of the display function layer.
In some embodiments of the present application, the retaining wall includes a first retaining wall and a second retaining wall, the first retaining wall surrounds the display area, and the second retaining wall surrounds the first retaining wall.
In some embodiments of the present application, the thin film encapsulation layer includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer, which are sequentially stacked; wherein,
the first inorganic packaging layer covers the display functional layer, the first retaining wall and the second retaining wall, the organic packaging layer is arranged in the first retaining wall, and the second inorganic packaging layer covers the organic packaging layer and the first inorganic packaging layer.
In some embodiments of the present application, the display panel further includes a driving circuit layer disposed between the substrate and the planarization layer.
In some embodiments of the present application, the display panel further comprises an encapsulation protection layer covering the second inorganic encapsulation layer.
In some embodiments of the present application, a cross-sectional shape of the first retaining wall and the second retaining wall perpendicular to the substrate is a quadrangle or a triangle.
In some embodiments of the present application, a distance between the first retaining wall and the second retaining wall is 40 micrometers to 90 micrometers, a distance between the first retaining wall and the edge of the display area is 500 micrometers to 900 micrometers, and a distance between the second retaining wall and the edge of the non-display area far away from the side of the display area is 200 micrometers to 500 micrometers.
In some embodiments of the present application, the retaining wall includes a first portion and a second portion, the display area is rectangular, the first portion is parallel to a long side of the display area, the second portion is parallel to a short side of the display area, a sum of thicknesses of the first portion and the planarization layer is less than or equal to 50 micrometers, and a sum of thicknesses of the second portion and the planarization layer is less than or equal to 40 micrometers.
Correspondingly, the application provides a preparation method of a display panel, which comprises the following steps:
providing a substrate;
forming a planarization layer on one side of the substrate; wherein, in the non-display area, the thickness of the planarization layer gradually increases along the direction from the display area to the far away from the display area;
forming a retaining wall on one side of the planarization layer, which is far away from the substrate, wherein the retaining wall is arranged in the non-display area;
forming a display function layer on one side of the planarization layer, which is far away from the substrate;
and forming a thin film packaging layer on one side of the display function layer far away from the planarization layer.
In some embodiments of the present application, the retaining wall includes a first retaining wall and a second retaining wall, the first retaining wall surrounds the display area, and the second retaining wall surrounds the first retaining wall.
The application provides a display panel and a preparation method thereof. The display panel includes a display area and a non-display area, including: a substrate; the planarization layer is arranged on one side of the substrate, and the thickness of the planarization layer is gradually increased along the direction from the display area to the direction far away from the display area in the non-display area. And the retaining wall is arranged in the non-display area, and the retaining wall is arranged on the planarization layer and is far away from one side of the substrate. And the display functional layer is arranged on one side, far away from the substrate, of the planarization layer. The film packaging layer is arranged on one side, far away from the planarization layer, of the display function layer so as to improve the edge thickness uniformity and the packaging effect of the display panel.
Drawings
In order to more clearly illustrate the technical solutions in the present application, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic plan view of a display panel according to a first embodiment of the present disclosure.
FIG. 2 is a cross-sectional view of a first embodiment of a display panel taken along line A-A'.
Fig. 3 is a schematic plan view illustrating a display panel according to a second embodiment of the present disclosure.
FIG. 4 is a cross-sectional view of a second embodiment of a display panel of the present application along line B-B'.
Fig. 5 is a schematic plan view illustrating a third embodiment of a display panel provided in the present application.
FIG. 6 is a cross-sectional view of a third embodiment of a display panel of the present application along line C-C'.
Fig. 7 is a schematic plan view illustrating a fourth embodiment of a display panel provided in the present application.
FIG. 8 is a cross-sectional view of a fourth embodiment of a display panel of the present application taken along line D-D'.
Fig. 9 is a flowchart of a method for manufacturing a display panel provided in the present application.
Fig. 10 is a schematic plan view of a display device provided in the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that the use of ordinal numbers such as first and second herein does not denote any order, quantity, or importance, but rather the terms first, second, etc. are used to distinguish one element from another. In the drawings, elements having similar structures are denoted by the same reference numerals.
At present, in the process of carrying out film encapsulation on an OLED display panel, the organic encapsulation layer is in a liquid state before being cured, has high flowability and is easy to flow out to the edge of the display panel, so that the edge thickness uniformity and the sealing effect of the OLED display panel are influenced. In addition, the organic packaging layer has small edge slope angle, poor edge thickness uniformity and large climbing distance, and is difficult to realize the narrow frame of the display panel. Therefore, the present application provides a display panel, and the present application will be described in detail with reference to specific embodiments.
Referring to fig. 1-2, fig. 1 is a schematic plan view illustrating a display panel according to a first embodiment of the present disclosure. FIG. 2 is a cross-sectional view of a first embodiment of a display panel taken along line A-A'.
The display panel 100 provided in the embodiment of the present application includes a display area 10 and a non-display area 20. The non-display area 20 is disposed around the display area 10. The shape of the display area 10 may be rectangular, circular or other irregular shapes. The display panel 100 includes a substrate 101, a planarization layer 102, a dam 30, a display function layer 40, and a thin film encapsulation layer 50. The substrate 101 may be a glass substrate or a flexible substrate. Among them, the flexible substrate may be formed of Polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), Polyarylate (PAR), Polycarbonate (PC), Polyetherimide (PEI), or Polyethersulfone (PES). The planarization layer 102 is disposed on one side of the substrate 101. In the non-display region 20, the thickness of the planarization layer 102 gradually increases in a direction from the display region 10 toward away from the display region 10. The planarization layer 102 may be formed of an organic photoresist material. The retaining wall 30 is disposed in the non-display region 20, and the retaining wall 30 is disposed on a side of the planarization layer 102 away from the substrate 101. The retaining wall 30 may be fabricated in the same process as the planarization layer 102 or the pixel definition layer. The dam 30 is disposed around the display area 10. The display function layer 40 is disposed on a side of the planarization layer 102 away from the substrate 101. The display function layer 40 includes a pixel defining layer, an anode layer, a hole transport layer, an organic light emitting layer, an electron transport layer, and a cathode layer, which are sequentially stacked on the planarization layer 102. The thin film encapsulation layer 50 is disposed on a side of the display function layer 40 away from the planarization layer 102.
Wherein, the organic luminous layer can be prepared by evaporation or ink-jet printing. When the organic light emitting layer is prepared by attaching the mask to the display panel, poor attachment occurs between the mask and the display panel at the boundary between the display region 10 and the non-display region 20 due to poor uniformity of thickness at the edge of the display panel. The thickness of the planarization layer 102 in the non-display area 20 is gradually increased along the direction from the display area 10 to the display area 10, so that the uniformity of the edge of the non-display area 20 is improved, the reliability of the attachment between the shade and the display panel is improved, the precision of the preparation of the organic light emitting layer is improved, and the performance of the display panel 100 is improved. Further, the thickness of the planarization layer 102 in the non-display area 20 gradually increases from the display area 10 to a direction away from the display area 10, so that the edge slope angle of the thin film encapsulation layer 50 is increased, the edge thickness uniformity of the display panel 100 is improved, and the problem of color cast due to different viewing angles is solved. The film encapsulation layer 50 can be effectively prevented from extending to the non-display area 20 of the display panel 100 by the retaining wall 30, so that the width of the non-display area 20 is reduced, and the preparation of the display panel 100 with a narrow frame is facilitated. This application can the separation water oxygen through setting up film packaging layer 50, prolongs display panel 100's life.
In some embodiments of the present application, the retaining wall 30 includes a first portion 310 and a second portion 320. When the display area 10 has a rectangular shape, the first portion 310 is parallel to a long side of the display area 10, and the second portion 320 is parallel to a short side of the display area 10. The sum of the thicknesses of the first portion 310 and the planarizing layer 102 is less than or equal to 50 microns. The sum of the thicknesses of the second portion 320 and the planarizing layer 102 is less than or equal to 40 microns.
Since the non-display regions 20 located at the long and short sides of the display region 10 have different thickness differences, the present application can improve the thickness uniformity of the non-display regions 20 located at the long side of the display region 10 by setting the sum of the thicknesses of the first portion 310 of the retaining wall 30 and the planarization layer 102 to be less than or equal to 50 micrometers; by setting the sum of the thicknesses of the second portion 320 of the retaining wall 30 and the planarization layer 102 to be less than or equal to 40 micrometers, the thickness uniformity of the non-display region 20 located at the short side of the display region 10 can be improved. Therefore, when the organic light emitting layer is prepared by attaching the mask to the display panel, the reliability of attaching the mask to the display panel can be improved, the accuracy of preparing the organic light emitting layer is improved, and the performance of the display panel 100 is improved. Further, the thickness of the planarization layer 102 in the non-display area 20 gradually increases from the display area 10 to a direction away from the display area 10, so that the edge slope angle of the thin film encapsulation layer 50 is increased, the edge thickness uniformity of the display panel 100 is improved, and the problem of color cast due to different viewing angles is solved.
Referring to fig. 3-4, fig. 3 is a schematic plan view illustrating a display panel according to a second embodiment of the present disclosure. FIG. 4 is a cross-sectional view of a second embodiment of a display panel of the present application along line B-B'.
In some embodiments of the present application, the retaining wall 30 includes a first retaining wall 301 and a second retaining wall 302. The first retaining wall 301 is disposed around the display region 10, and the second retaining wall 302 is disposed around the first retaining wall 301.
The first retaining wall 301 is arranged to effectively prevent the thin film encapsulation layer 50 from extending to the non-display area 20 of the display panel 100, so that the width of the non-display area 20 is reduced, and the preparation of the display panel 100 with a narrow frame is facilitated. The effective contact area between the non-display area 20 and the thin film encapsulation layer 50 can be increased by the second retaining wall 302, so that the reliability of the package structure is improved. Meanwhile, in the design of the narrow-frame display panel, the distance from the display function layer 40 to the edge of the display panel 100 is reduced, so that the thickness of a packaging film layer of the display panel is increased, the probability of cracks generated at the edge of the packaging structure during panel cutting and the risk of peeling can be reduced by arranging the second retaining wall 302, the reliability of the packaging structure is further improved, and the packaging effect of the display panel is improved. Further, according to the present application, by providing the second retaining wall 302, a path through which external water vapor invades from the edge of the display panel 100 to the display functional layer 40 can be further extended, so that the service life of the display functional layer 40 is prolonged, and thus the service life of the display panel 100 is prolonged.
In some embodiments of the present application, the thin film encapsulation layer 50 includes a first inorganic encapsulation layer 501, an organic encapsulation layer 502, and a second inorganic encapsulation layer 503, which are sequentially stacked and disposed on the planarization layer 102. The first inorganic encapsulating layer 501 covers the display functional layer 40, the first retaining wall 301, and the second retaining wall 302. The organic encapsulation layer 502 is disposed in the first retaining wall 301. The second inorganic encapsulation layer 503 covers the organic encapsulation layer 502 and the first inorganic encapsulation layer 501. The thin film encapsulation layer 50 may also include a stack structure formed of more inorganic layers and organic layers.
The thin film encapsulation layer 50 can block water and oxygen, and prolong the service life of the display panel 100. The first inorganic encapsulation layer 501 and the second inorganic encapsulation layer 503 can be prepared by vapor deposition. The first inorganic encapsulation layer 501 and the second inorganic encapsulation layer 503 may be formed of silicon nitride, silicon oxide, silicon oxynitride, silicon carbide, titanium oxide, zirconium oxide, zinc oxide, aluminum oxide, or the like. The organic encapsulation layer 502 can be prepared by ink-jet printing or evaporation. The organic encapsulation layer 502 may be formed of epoxy, Polyimide (PI), polyethylene terephthalate (PET), Polycarbonate (PC), Polyethylene (PE), polyacrylate, or the like. The organic encapsulation layer 502 is liquid before curing, has fluidity, is difficult to accurately control its diffusion in the preparation process, is easy to overflow to the non-display area 20, and is not beneficial to preparing the display panel 100 with narrow frame. By arranging the first retaining wall 301, the organic encapsulation layer 502 can be prevented from extending to the edge of the non-display area 20 during preparation, so that the width of the non-display area 20 is reduced, and the preparation of the display panel 100 with a narrow frame is facilitated. In the present application, the first inorganic encapsulation layer 501 covers the second retaining wall 302, and the second inorganic encapsulation layer 503 covers the first inorganic encapsulation layer 501, so that the effective contact area between the non-display region 20 and the thin film encapsulation layer 50 can be increased, and the reliability of the encapsulation structure can be improved. Meanwhile, in the design of the display panel with the narrow frame, the distance from the display function layer 40 to the edge of the display panel is reduced, so that the thickness of the packaging film layer of the display panel is increased, the first inorganic packaging layer 501 covers the second retaining wall 302 and the second inorganic packaging layer 503 covers the first inorganic packaging layer 501, the thickness of the packaging film layer is reduced, the probability of cracks at the edge of the packaging structure and the risk of peeling can be reduced when the panel is cut, the reliability of the packaging structure is further improved, and the packaging effect of the display panel is improved. Further, according to the present disclosure, the first inorganic encapsulation layer 501 covers the second retaining wall 302, and the second inorganic encapsulation layer 503 covers the first inorganic encapsulation layer 501, so that a path of external water vapor from the edge of the display panel 100 to the display functional layer 40 can be further extended, the service life of the display functional layer 40 is prolonged, and the service life of the display panel 100 is prolonged.
In some embodiments of the present application, the display panel 100 further includes a driving circuit layer 60. The driving circuit layer 60 is disposed between the substrate 101 and the planarization layer 102.
The driving circuit layer 60 includes a plurality of thin film transistors. The thin film transistor includes an active layer, a gate electrode, a source electrode, and a drain electrode. The active layer is arranged corresponding to the grid electrode. The source electrode and the drain electrode are positioned on two sides of the active layer and are electrically connected with the active layer. The driving circuit layer 60 is electrically connected to the display function layer 40, and is configured to drive the display function layer 40 to emit light, so as to realize normal light emission of the display panel 100.
Referring to fig. 5-6, fig. 5 is a schematic plan view illustrating a display panel according to a third embodiment of the present disclosure. FIG. 6 is a cross-sectional view of a third embodiment of a display panel of the present application along line C-C'.
The display panel 100 provided in the embodiment of the present application further includes an encapsulation protection layer 70. The encapsulation protective layer 70 covers the second inorganic encapsulation layer 503.
The encapsulation protective layer 70 may be prepared by inkjet printing or evaporation. The package protection layer 70 may be formed of acryl, epoxy, polyimide, or the like. When the display panel is cut, the internal stress of the second inorganic encapsulation layer 503 is too large, and at this time, the second inorganic encapsulation layer 503 is easily broken and peeled off, resulting in package failure. The thin film encapsulation layer 50 can be further protected by forming the encapsulation protection layer 70 covering the second inorganic encapsulation layer 503, so that the encapsulation reliability of the display panel 100 is improved, and the stability of the display panel 100 is improved.
Referring to fig. 6-8, fig. 7 is a schematic plan view illustrating a display panel according to a fourth embodiment of the present disclosure. FIG. 8 is a cross-sectional view of a fourth embodiment of a display panel of the present application taken along line D-D'.
In some embodiments of the present application, the cross-sectional shapes of the first retaining wall 301 and the second retaining wall 302 perpendicular to the substrate 101 are quadrangle or triangle. The present application takes as an example that the cross-sectional shapes of the first retaining wall 301 and the second retaining wall 302 are a regular trapezoid and an inverted trapezoid.
When the cross-sectional shape of the first retaining wall 301 is a regular trapezoid, the organic encapsulation layer 502 cannot cross the first retaining wall 301, so as to prevent the organic encapsulation layer 502 from overflowing to the non-display region 20 during the printing or evaporation process, which is beneficial to the preparation of the narrow-bezel display panel 100. When the cross-sectional shape of the first wall 301 is an inverted trapezoid, the organic encapsulation layer 502 cannot pass through the first wall 301, thereby preventing the organic encapsulation layer 502 from overflowing to the non-display area 20 during the printing process. Further, the distance from the display function layer 40 to the edge of the display panel 100 may be extended, which is beneficial to manufacturing the display panel 100 with a narrow bezel.
In some embodiments of the present application, the distance L1 between the first wall 301 and the second wall 302 is 40 microns to 90 microns. The distance L2 between the first retaining wall 301 and the edge of the display area 10 is 500 micrometers to 900 micrometers. The distance L3 between the second retaining wall 302 and the edge of the non-display area 20 is 200 micrometers to 500 micrometers.
Specifically, the distance L1 between the first retaining wall 301 and the second retaining wall 302 may be 40 micrometers, 50 micrometers, 60 micrometers, 70 micrometers, 80 micrometers, or 90 micrometers. The distance L2 between the first retaining wall 301 and the display region 10 may be 500 micrometers, 600 micrometers, 700 micrometers, 800 micrometers, or 900 micrometers. The distance L3 between the second retaining wall 302 and the edge of the non-display area 20 may be 200 micrometers, 300 micrometers, 400 micrometers, or 500 micrometers.
By controlling the distance L1 between the first retaining wall 301 and the second retaining wall 302 to be 40-90 micrometers, the distance L2 between the first retaining wall 301 and the display area 10 to be 500-900 micrometers, and the distance L3 between the second retaining wall 302 and the edge of the non-display area 20 to be 200-500 micrometers, the width of the non-display area 20 can be effectively controlled, and the preparation of the display panel 100 with a narrow frame is facilitated.
Referring to fig. 9, fig. 9 is a flowchart of a method for manufacturing a display panel according to the present application.
B10: a substrate is provided.
In particular, the substrate may be a glass substrate or a flexible substrate. Among them, the flexible substrate may be formed of Polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), Polyarylate (PAR), Polycarbonate (PC), Polyetherimide (PEI), or Polyethersulfone (PES).
B20: a planarization layer is formed on one side of the substrate, and the thickness of the planarization layer gradually increases in a direction from the display region toward a direction away from the display region in the non-display region.
In some embodiments of the present application, before forming the planarization layer on the substrate side, the following steps may be further included:
b21: a driving circuit layer is formed on one side of the substrate.
The driving circuit layer comprises a plurality of thin film transistors. The driving circuit layer is electrically connected with the display functional layer and used for driving the display functional layer to emit light, so that normal light emission of the display panel is realized.
B30: and forming a retaining wall on one side of the planarization layer, which is far away from the substrate, wherein the retaining wall is arranged in the non-display area.
In some embodiments of the present application, the retaining wall comprises a first retaining wall and a second retaining wall; wherein, first barricade sets up around the display area, and the second barricade sets up around first barricade.
B40: and forming a display function layer on the side of the planarization layer away from the substrate.
Specifically, a pixel defining layer, an anode layer, a hole transport layer, an organic light emitting layer, an electron transport layer, and a cathode layer may be formed in this order on the side of the planarization layer away from the substrate. The planarization layer may be formed of an organic photoresist material.
B50: and forming a thin film packaging layer on the side of the display function layer far away from the planarization layer.
Specifically, a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer may be formed in this order on the side of the display function layer away from the planarization layer. The film packaging layer can block water and oxygen, and the service life of the display panel is prolonged. Wherein the first inorganic encapsulation layer and the second inorganic encapsulation layer can be prepared by a vapor deposition method. The first inorganic encapsulation layer and the second inorganic encapsulation layer may be formed of silicon nitride, silicon oxide, silicon oxynitride, silicon carbide, titanium oxide, zirconium oxide, zinc oxide, aluminum oxide, or the like. The organic encapsulation layer can be prepared by ink-jet printing or evaporation. The organic encapsulation layer may be formed of epoxy, Polyimide (PI), polyethylene terephthalate (PET), Polycarbonate (PC), Polyethylene (PE), polyacrylate, or the like.
This application is gradually increased progressively along the direction of keeping away from the display area orientation through the thickness that sets up the planarization layer in the non-display area, has improved the edge thickness homogeneity of non-display area to improve the reliability of laminating between shade and the display panel, improved the precision of preparation organic light emitting layer, promoted display panel's performance, furtherly, can also improve the problem that causes the colour cast because of the observation visual angle difference. This application can effectively prevent the film encapsulation layer to extend to display panel's non-display area through setting up the barricade to reduce the width in non-display area, be favorable to preparing the display panel of narrow frame. This application can separation water oxygen through setting up the film packaging layer, prolongs display panel's life.
Referring to fig. 10, fig. 10 is a schematic plan view illustrating a display device according to an embodiment of the present disclosure.
The display device 1000 provided by the embodiment of the present application includes the display panel 100 provided by any one of the embodiments described above. The display device 1000 includes, but is not limited to, the following types of electronic devices: a rollable or foldable mobile phone, a watch, a bracelet, a television or other wearable display or touch control electronic device, and a flexible smart phone, a tablet computer, a notebook computer, a desktop display, a television, smart glasses, a smart watch, an ATM machine, a digital camera, a vehicle-mounted display, a medical display, an industrial display, an electronic paper book, an electrophoretic display device, a game machine, a transparent display, a double-sided display, a naked-eye 3D display, a mirror display device, a semi-reflective and semi-transparent display device, or a flexible touch screen, etc.
In summary, although the embodiments of the present application are described in detail above, the above-mentioned embodiments are not intended to limit the present application, and it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present application.
Claims (10)
1. A display panel including a display region and a non-display region, comprising:
a substrate;
the planarization layer is arranged on one side of the substrate, and the thickness of the planarization layer is gradually increased along the direction from the display area to the direction far away from the display area in the non-display area;
the retaining wall is arranged in the non-display area and is arranged on one side, far away from the substrate, of the planarization layer;
the display functional layer is arranged on one side, far away from the substrate, of the planarization layer;
and the film packaging layer is arranged on one side, far away from the planarization layer, of the display function layer.
2. The display panel according to claim 1, wherein the retaining wall comprises a first retaining wall and a second retaining wall, the first retaining wall is disposed around the display area, and the second retaining wall is disposed around the first retaining wall.
3. The display panel according to claim 2, wherein the thin film encapsulation layer comprises a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer, which are sequentially stacked; wherein,
the first inorganic packaging layer covers the display functional layer, the first retaining wall and the second retaining wall, the organic packaging layer is arranged in the first retaining wall, and the second inorganic packaging layer covers the organic packaging layer and the first inorganic packaging layer.
4. The display panel according to claim 3, further comprising a driving circuit layer disposed between the substrate and the planarization layer.
5. The display panel according to claim 3, wherein the display panel further comprises an encapsulation protection layer covering the second inorganic encapsulation layer.
6. The display panel according to claim 2, wherein the cross-sectional shapes of the first and second walls perpendicular to the substrate are quadrangle or triangle.
7. The display panel according to any one of claims 2 to 6, wherein the distance between the first retaining wall and the second retaining wall is 40 micrometers to 90 micrometers, the distance between the first retaining wall and the edge of the display region is 500 micrometers to 900 micrometers, and the distance between the second retaining wall and the edge of the non-display region on the side away from the display region is 200 micrometers to 500 micrometers.
8. The display panel according to claim 1, wherein the dam comprises a first portion and a second portion, the display region has a rectangular shape, the first portion is parallel to a long side of the display region, the second portion is parallel to a short side of the display region, a sum of thicknesses of the first portion and the planarization layer is less than or equal to 50 micrometers, and a sum of thicknesses of the second portion and the planarization layer is less than or equal to 40 micrometers.
9. A method for manufacturing a display panel, comprising:
providing a substrate;
forming a planarization layer on one side of the substrate; wherein, in the non-display area, the thickness of the planarization layer gradually increases along the direction from the display area to the far away from the display area;
forming a retaining wall on one side of the planarization layer, which is far away from the substrate, wherein the retaining wall is arranged in the non-display area;
forming a display function layer on one side of the planarization layer, which is far away from the substrate;
and forming a thin film packaging layer on one side of the display function layer far away from the planarization layer.
10. The method according to claim 9, wherein the retaining wall comprises a first retaining wall and a second retaining wall, the first retaining wall is disposed around the display area, and the second retaining wall is disposed around the first retaining wall.
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