CN110246947A - LED encapsulation method and products thereof - Google Patents
LED encapsulation method and products thereof Download PDFInfo
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- CN110246947A CN110246947A CN201810193311.2A CN201810193311A CN110246947A CN 110246947 A CN110246947 A CN 110246947A CN 201810193311 A CN201810193311 A CN 201810193311A CN 110246947 A CN110246947 A CN 110246947A
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- Prior art keywords
- led
- fluorophor
- adhesive layer
- light
- white
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
Abstract
The present invention provides a kind of LED encapsulation method and products thereof, which includes: step 100: obtaining strip fluorophor, the fluorophor tool is there are two axial end face and connects the outer peripheral surfaces of described two axial end faces；Step 200: coating white adhesive layer on the outer peripheral surface of the fluorophor；Step 300: the fluorophor for being coated with white adhesive layer edge is cut into multiple flourescent sheets perpendicular to the axially direction；Step 400: at least one of flourescent sheet is encapsulated on LED light-emitting surface.Using product packaged by LED encapsulation method provided by the present invention, global shape is regular, good product consistency.
Description
Technical field
The present invention relates to a kind of LED encapsulation methods and products thereof, belong to LED manufacture technology field.
Background technique
Currently, light source LED energy saving and environment friendly as one kind generally instead of conventional light source, is widely used in each
A indoor and outdoors place, such as: house room lighting, Department Store Decoration illumination, light of stage illumination, outdoor street lamp, plaza lighting
Lamp, advertising display board, decorating outer wall of building light and traffic lights etc..In LED white-light illuminating field, people are constantly chased after
High photosynthetic efficiency, high brightness are asked, to reach the promotion of the energy conversion and benefit of peak efficiency.
In numerous technologies for promoting white light LEDs luminous efficiency, there is a kind of white glue that high reflection is used on LED chip periphery
The technology for carrying out box dam encapsulation, enables to light efficiency to have further promotion.The technology quilt in the packaging technology of white light LEDs
It is widely applied.But existing this technology of realization is using gluing process technical solution, this technology difficult point is, to dispensing
Required precision is higher, and the viscosity of glue must control preferably, otherwise easily causes dam body part to collapse, so that white size
Water spreads to light-emitting surface, reduces light extraction efficiency instead.
Summary of the invention
Technical problem to be solved by the present invention lies in view of the deficiencies of the prior art, provide a kind of LED encapsulation method and
Its product, using product packaged by LED encapsulation method provided by the present invention, global shape is regular, good product consistency.
The technical problem to be solved by the present invention is to what is be achieved through the following technical solutions:
A kind of LED encapsulation method, includes the following steps:
Step 100: obtaining strip fluorophor, the fluorophor tool is there are two axial end face and connects described two axial ends
The outer peripheral surface in face；
Step 200: coating white adhesive layer on the outer peripheral surface of the fluorophor；
Step 300: the fluorophor for being coated with white adhesive layer is multiple glimmering along being cut into perpendicular to the axially direction
Mating plate；
Step 400: at least one of flourescent sheet is encapsulated on LED light-emitting surface.
As needed, the preparation shape of the strip fluorophor in the step 100 includes: cylindrical or prismatic.
Further, the material of the strip fluorophor include: the mixture of fluorescent powder and resin, fluorescent glass ceramics,
One of complex phase ceramic made of fluorescent-pure phase ceramics, fluorescent powder and aluminium oxide.
Further, the white adhesive layer includes:
It is starched by one of alumina powder, titanium oxide powder, magnesia powder or a variety of white adhesive layers being mixed with glass powder
Material, the white diffusing reflection layer formed through sintering；
Alternatively, the white adhesive layer slurry made of aluminium oxide, the diffusing reflection ceramic layer formed through sintering；
Alternatively, being mixed into white adhesive layer slurry made of high refractive index powder granule in aluminium oxide, formed through sintering unrestrained anti-
Penetrate ceramic layer；
The step 200 includes: that fluorophor that will be coated with any of the above-described kind of white adhesive layer slurry is integral sintered, thus in institute
It states and forms white adhesive layer on the outer peripheral surface of fluorophor.
Further, the high refractive index powder granule includes: calcium oxide, zirconium oxide, magnesia, yttrium oxide or barium sulfate
One of them.
Further, the LED light-emitting surface is COB light-emitting surface, the geomery of the flourescent sheet in the step 400 with
The geomery of COB light-emitting surface matches；Alternatively, the LED light-emitting surface is single LED chip light emitting face, in the step 400
The cross sectional shape size of flourescent sheet is matched with single LED chip light emitting face size.
Further, the step 100 includes:
Fluorophor ingot is prepared, one or more slot is opened along longitudinal direction and/or laterally in the end face of the fluorophor ingot, thus shape
At phosphor array, into strips, there are two axial end faces for each fluorophor tool for each fluorophor of the phosphor array
With the outer peripheral surface for connecting described two axial end faces, the end surface shape of the phosphor array and a LED chip array light-emitting surface
Shape matching；
The LED light-emitting surface is LED chip array light-emitting surface.
Further, the step 200 includes: to infiltrate the fluorophor in white adhesive layer slurry or starched with white adhesive layer
Material carries out spraying to the fluorophor or by then solidifying in the phosphor surface brushing white adhesive layer slurry, thus
White adhesive layer is coated on the outer peripheral surface of the fluorophor.
The invention further relates to a kind of LED encapsulating products, including flourescent sheet and LED light-emitting surface, the flourescent sheet to be encapsulated in institute
It states on LED light-emitting surface, the flourescent sheet includes the phosphor plates for being located at middle part and the white glue for being coated on the phosphor plates surrounding
Layer, the white adhesive layer are non-overlapping in the projection on the LED light-emitting surface with the phosphor plates.
Further, the upper surface of the white adhesive layer is plane, and with the upper surface of the phosphor plates same flat
On face.
Further, the side surface of the inner surface of the white adhesive layer and the phosphor plates is in close contact.
Further, on the thickness direction of the flourescent sheet, the white adhesive layer is equal with the phosphor plates thickness.
Further, the white adhesive layer and phosphor plates with a thickness of 30~200 μm.
Further, the LED light-emitting surface includes: COB light-emitting surface, single LED chip light emitting face or flip LED chips battle array
Column group light-emitting surface.
In conclusion the present invention provides a kind of LED encapsulation method and products thereof, due to being sliced stratification again using first gluing
The mode of the first layered dispensing box dam again of non-existing technology, so that interface is clear between white adhesive layer and phosphor plates, and the two
Surfacing, thus using the product of present invention process method encapsulation, global shape is regular, good product consistency.
In the following with reference to the drawings and specific embodiments, technical solution of the present invention is described in detail.
Detailed description of the invention
Fig. 1 is the process flow diagram of the embodiment of the present invention one；
Fig. 2 is the flow diagram of the embodiment of the present invention one；
Fig. 3 is the process flow diagram of the embodiment of the present invention two；
Fig. 4 is the flow diagram of the embodiment of the present invention two；
Fig. 5 is the process flow diagram of the embodiment of the present invention three；
Fig. 6 is the flow diagram of the embodiment of the present invention three；
Fig. 7 is existing silica gel glue dispensing and packaging product schematic diagram；
Fig. 8 is encapsulating products schematic diagram of the present invention.
Specific embodiment
Embodiment one
Fig. 1 is the process flow diagram of the LED encapsulation method of the embodiment of the present invention one；Fig. 2 is the embodiment of the present invention one
Flow diagram.Such as Fig. 1 and as shown in connection with fig. 2, by taking COB is encapsulated as an example, technical solution of the present invention is described in detail.
In the present embodiment, include the following steps:
Step 01: strip fluorophor 101 is processed into the strip of cylinder, long square column or its alloytype, the shape in section
Size and the size of COB light-emitting surface to be packaged exactly match；Wherein strip fluorophor can be the mixing of fluorescent powder and resin
Complex phase ceramic made of body, fluorescent glass ceramics, fluorescent-pure phase ceramics or fluorescent powder such as YGA:Ce3+ and aluminium oxide.
Step 02: the periphery of the strip fluorophor after processing being coated into certain thickness white adhesive layer 102, which can be
The white glue of the model WR-3012 or WR-3001 of supplier Dow Corning production are also possible to tool made of other materials
There is the colloid of high reflectance (such as reflectivity is greater than 92%)；
The method wherein coated may include following several:
(1) dip-coating method: block is immersed in white glue slurry, sufficiently after infiltration, then is at the uniform velocity lifted, then toasted
Solidification, finishing touch shape；
(2) viscosity of white glue slurry: being deployed into sprayable viscosity requirement, is repeatedly sprayed by spray coating method, reaches conjunction
Suitable thickness, then solidification is dried；
(3) knife coating: multiple (such as squares, cuboid) with irregular figure are side-by-side, form one
Plane scratches one layer of diffusing reflection white glue, after solidification, then successively coats other faces.
No matter which kind of above-mentioned method is used, wherein the thickness control range of white adhesive layer is 30~200 μm.
Step 03: the fluorophor of white adhesive layer will be coated with, carry out slice processing according to certain thickness, enclosed per a piece of outside
There is white glue；Wherein slice thickness need to be required according to product colour temperature to determine, in the white light encapsulation of LED, blue chip surface is covered
Lid yellow fluorescence layer, fluorescent layer thickness determine to carry out the colour temperature of white light, and universal law is, glimmering when fluorescent material composition is constant
Photosphere is thicker, and colour temperature is lower, the inclined warm white of the white light of outgoing；Photosphere is thinner, and colour temperature is higher, and the white light of outgoing is colder white.
Step 04: the flourescent sheet that outside is with white adhesive layer being encapsulated on the COB light-emitting surface of COB plate 103, that is, is completed white
The encapsulation of light COB product；As shown in Figure 1, further including circuit anode 104, circuit cathode 105 and LED core on packaged substrate
Piece group 106.
In the present embodiment, the encapsulation process to white light LEDs can be completed by above-mentioned each step.
Embodiment two
Fig. 3 is the process flow diagram of the LED encapsulation method of the embodiment of the present invention two；Fig. 4 is the embodiment of the present invention two
Flow diagram.Such as Fig. 3 and as shown in connection with fig. 4, by taking single White-light LED chip encapsulates as an example, to technical solution of the present invention into
Row explains in detail.
In the present embodiment, include the following steps:
Step 1: strip fluorophor 201 is processed into long square column, the geomery in section and single LED core to be packaged
The size of piece light-emitting surface exactly matches；Wherein strip fluorophor include the mixture of fluorescent powder and resin, fluorescent glass ceramics, it is glimmering
The complex phase ceramic etc. of light pure phase ceramics and YGA:Ce3+ and aluminium oxide production.
Step 2: by periphery one layer of diffusing reflection white adhesive layer 202 of cladding of the strip fluorophor after processing at certain thickness white
Glue-line；
Diffusing reflection white adhesive layer 202 can be following any: by one of alumina powder, titanium oxide powder, magnesia powder
Or a variety of white adhesive layer slurries being mixed with glass powder, the white diffusing reflection layer formed through sintering；Or it is made of aluminium oxide
White adhesive layer slurry, through sintering formed diffusing reflection ceramic layer；It is made alternatively, being mixed into high refractive index powder granule in aluminium oxide
The slurry of white adhesive layer, the diffusing reflection ceramic layer formed through sintering；
Wherein the thickness control range of white adhesive layer is 30~200 μm.
Step 3: by the fluorophor for being coated with any of the above-described kind of white adhesive layer slurry it is integral sintered after, be cut into multiple fluorescence
Piece.Wherein slice thickness need to be required according to product colour temperature to determine, in the white light encapsulation of LED, the covering of blue chip surface is yellow
Color fluorescence coating, fluorescent layer thickness determine to carry out the colour temperature of white light, and universal law is, when fluorescent material composition is constant, fluorescence coating
Thicker, colour temperature is lower, the inclined warm white of the white light of outgoing；Photosphere is thinner, and colour temperature is higher, and the white light of outgoing is colder white.
Its cutting processing mode can be processed using wire cutting machine cutting, can also be processed using scribing cut-off machine of many.
Step 4: the flourescent sheet that outside is with white glue being encapsulated on single blue-light LED chip surface 203, that is, completes list
The encapsulation of white light LEDs product；As shown in Fig. 2, further including two gold threads 204 being connected on chip on packaged substrate.
Embodiment three
Fig. 5 is the process flow diagram of the LED encapsulation method of the embodiment of the present invention three；Fig. 6 is the embodiment of the present invention three
Flow diagram.Such as Fig. 5 and as shown in connection with fig. 6, by taking the encapsulation of array blue-light LED chip as an example, to technical side of the invention
Case is described in detail.In the present embodiment, include the following steps:
Step 10: preparing fluorophor ingot, open one or more along longitudinal direction and/or laterally in the end face of the fluorophor ingot
Slot, to form phosphor array, into strips, there are two each fluorophor tools for each fluorophor of the phosphor array
Axial end face and the outer peripheral surface for connecting described two axial end faces, the end surface shape of the phosphor array and a LED chip battle array
The matching of column light-emitting surface shape；Wherein strip fluorophor includes the mixture of fluorescent powder and resin, fluorescent glass ceramics, fluorescence pure phase
The complex phase ceramic etc. of ceramics and YGA:Ce3+ and aluminium oxide production.
As shown in figure 5, slot downwards along one of fluorophor ingot, longitudinal three bar grooves, a lateral bar groove, the width of slot
It is equal with the gap of flip LED chips array group；After fluting, the material of the part conduit 301-2 is by the chipping wear of wire cutting machine
Fall, the strip fluorophor 301-1 left, section and the chip surface shape size of single LED need to exactly match；It is not cut
Part 301-3, play the role of a base station, the strip fluorophor of firm support above is arranged according to regular array；It is above-mentioned to open
Slot scheme can be used the completion of wire cutting machine equipment, need to match line footpath and groove width parameter.
Step 20: the phosphor array material after fluting being placed in white glue slurry, after solidification to be dried, then is cut extra white
The block materials structure of step 30 in Fig. 3 can be obtained in glue-line.
Step 30: by block materials along the method Xiang Fangxiang of fluting, carrying out the cutting of certain thickness thin slice to get all to array
While sealing the flourescent sheet 303 of white adhesive layer.
Wherein slice thickness need to be required according to product colour temperature to determine, in the white light encapsulation of LED, blue chip surface
Yellow fluorescence layer is covered, fluorescent layer thickness determines to carry out the colour temperature of white light, and universal law is, when fluorescent material composition is constant,
Fluorescence coating is thicker, and colour temperature is lower, the inclined warm white of the white light of outgoing；Fluorescence coating is thinner, and colour temperature is higher, and the white light of outgoing is colder white.
Its cutting processing mode is that wire cutting machine cutting is processed or scribing cut-off machine of many is processed.
Step 40: the contraposition of flourescent sheet 303 obtained in upper step being encapsulated on the LED chip array of COB substrate 304, i.e.,
Complete the array package of white light COB.
By above three embodiments, a summary can be done to packaging technology provided by the present invention, that is to say, that a kind of
LED encapsulation method includes the following steps:
Step 100: preparing strip fluorophor, the fluorophor tool is there are two axial end face and connects described two axial ends
The outer peripheral surface in face；
Step 200: coating white adhesive layer on the outer peripheral surface of the fluorophor；
Step 300: the fluorophor for being coated with white adhesive layer is multiple glimmering along being cut into perpendicular to the axially direction
Mating plate；
Step 400: at least one of flourescent sheet is encapsulated on LED light-emitting surface.
As needed, the preparation shape of the strip fluorophor in the step 100 includes: cylindrical or rectangular shaped post, also
It can be other shapes.
Specifically, the material of the strip fluorophor include: the mixture of fluorescent powder and resin, fluorescent glass ceramics,
One of the complex phase ceramic of fluorescent-pure phase ceramics or YGA:Ce3+ and aluminium oxide production, are also possible to fluorescent powder and other materials
Manufactured block, as long as containing fluorescent powder, can overlay on LED light-emitting surface.
Further, the white adhesive layer includes:
By one of glass powder, alumina powder, titanium oxide powder, magnesia powder or a variety of slurries being mixed, through burning
Tie the white diffusing reflection layer formed；
Alternatively, the slurry made of aluminium oxide, the diffusing reflection ceramic layer formed through sintering；
Alternatively, slurry made of high refractive index powder granule is mixed into aluminium oxide, the diffusing reflection ceramics formed through sintering
Layer；Aforementioned high refractive index powder granule includes: one of calcium oxide, zirconium oxide, magnesia, yttrium oxide or barium sulfate；
Alternatively, white adhesive layer can be using the encapsulation common white glue of LED, such as the silicon containing white scattering particles on the market at present
Glue, details are not described herein or does any restrictions for specific ingredient.
In above-described embodiment one, the LED light-emitting surface is COB light-emitting surface, the section of the flourescent sheet in the step 400
Geomery and COB light-emitting surface size exactly match.
In above-described embodiment two, the LED light-emitting surface is single LED chip light emitting face, the fluorescence in the step 400
The cross sectional shape size of piece is identical with single LED chip light emitting face size.
In above-described embodiment three, the LED light-emitting surface is LED chip array light-emitting surface.
Under normal conditions, step 200 can be realized using various ways, such as: dip-coating method, spray coating method or blade coating
Method.
The present invention also provides a kind of LED encapsulating products, which includes flourescent sheet and LED light-emitting surface, and flourescent sheet is encapsulated in
On LED light-emitting surface, LED light-emitting surface can be the light-emitting surface of any of the above-described LED product used in the examples.The flourescent sheet packet
The fluorophor positioned at middle part and the white adhesive layer for being coated on the phosphor plates surrounding are included, the white adhesive layer and the phosphor plates exist
Projection on the LED light-emitting surface is non-overlapping namely the interface of the two is clearly clearly demarcated.
In addition the upper surface of white adhesive layer is plane, and in the same plane with the upper surface of phosphor plates.Also, white glue
The inner surface of layer and the side surface of phosphor plates are in close contact.Due to using identical cutting technique one-pass molding, white adhesive layer
Surface and phosphor plates surface co-planar.In the actual processing process, flourescent sheet and the flatness area requirement of white adhesive layer are: fluorescence
Piece < 0.010mm；White adhesive layer < 0.050mm.On the thickness direction of flourescent sheet, white adhesive layer is equal with phosphor plates thickness.It is logical
In normal situation, the white adhesive layer and phosphor plates with a thickness of 30~200 μm.
These structure features are determined by above-mentioned LED encapsulation method, are encapsulated using the dispensing mode of the prior art
The surface of LED encapsulating products, white glue layer surface and phosphor plates be it is independently molding, be difficult to be precisely controlled and be formed in one
In a plane；Simultaneously because using a point gum forming, the upper surface of white adhesive layer is at the convex of natural packing, rather than one flat
Face；When position for dispensing glue is located next to phosphor plates, white glue will necessarily be to the upper surface at phosphor plates edge when solidifying
Trickling, has overlapping so as to cause the projection of white adhesive layer and phosphor plates on LED light-emitting surface, and the interface both caused is fuzzy；
If in order to enable the not unrestrained upper phosphor plates of white adhesive layer, need for be moved out position for dispensing glue, at this time its accumulation being formed by curing
Shape protrusion causes to separate between the inner surface of white adhesive layer and the side surface of phosphor plates, and can not be in close contact.It is white
Glue-line is separated with phosphor plates side surface, and will directly affect light extraction efficiency leads to the reduction of light efficiency.
Illustrate that the prior art and product of the invention are distinguished below by comparison diagram.Fig. 7 is existing silica gel glue dispensing and packaging
Product schematic diagram；Fig. 8 is encapsulating products schematic diagram of the present invention.Product shown by Fig. 7 and Fig. 8 is the list in above-mentioned implementation two
White-light LED chip encapsulating products.As shown in fig. 7, being from left to right respectively that existing silica gel glue dispensing and packaging product is clapped using mobile phone
The picture and contour picture shown under the photo taken the photograph, microscope.Similarly, Fig. 8 is respectively encapsulating products of the present invention from left to right
Use the picture and contour picture shown under the photo of mobile phone shooting, microscope.Comparative diagram 7 and Fig. 8 must can clearly be seen
It out, is phosphor plates in the middle part of existing silica gel glue dispensing and packaging product, periphery is coated with white adhesive layer, but between phosphor plates and encapsulated layer
It interpenetrates, diffuses out each other, it is very fuzzy to make boundary line, and surface is uneven.Shown in comparative diagram 8, encapsulation of the invention
The clear-cut between fluorophor and peripheral white adhesive layer in the middle part of product is clear, and product upper surface either uses mobile phone shooting also
It is bust shot under microscope, surface is all very smooth and flat.It follows that the present invention is no matter from appearance or performance
All there is the difference of highly significant between the prior art.
And why encapsulating products provided by the present invention can reach said effect and packaging technology step is direct phase
It closes.Specifically, the present invention first prepares strip fluorophor, after the surrounding coating white adhesive layer of strip fluorophor, curable adhesive layer,
Thin slice cutting is carried out further along cross section, the flourescent sheet of well cutting is finally carried out to the encapsulation of white light LEDs.It first applies and cuts afterwards in this way,
Can guarantee positioned at core fluorophor and be coated on fluorophor periphery white adhesive layer between distinct, do not permeate each other
With diffuse out.And flourescent sheet is obtained from the fluorophor for coated white adhesive layer by way of cutting, to guarantee flourescent sheet
Surface either white adhesive layer or fluorophor all surfaces are smooth.In the encapsulation process of final step, constitute flourescent sheet
Light-emitting surface and white light LEDs light-emitting surface between matching to just, it is ensured that the good integrity of encapsulating products, yields are high.
In conclusion the present invention provides a kind of LED encapsulation method and products thereof, it is existing from technological angle effective solution
Gluing process is higher to the required precision of glue dispensing, higher to the viscosity control of glue, otherwise easily causes dam body part
It collapses, so that white glue spreads to light-emitting surface, reduces the technological difficulties of light extraction efficiency instead, global shape is regular, product one
Cause property is controlled.
Claims (14)
1. a kind of LED encapsulation method, which comprises the steps of:
Step 100: obtaining strip fluorophor, the fluorophor tool is there are two axial end face and connects described two axial end faces
Outer peripheral surface；
Step 200: coating white adhesive layer on the outer peripheral surface of the fluorophor；
Step 300: the fluorophor for being coated with white adhesive layer edge is cut into multiple flourescent sheets perpendicular to the axially direction；
Step 400: at least one of flourescent sheet is encapsulated on LED light-emitting surface.
2. LED encapsulation method as described in claim 1, which is characterized in that the preparation of the strip fluorophor in the step 100
Shape includes: cylindrical or prismatic.
3. LED encapsulation method as described in claim 1, which is characterized in that the material of the strip fluorophor includes: fluorescent powder
With complex phase ceramic made of the mixture of resin, fluorescent glass ceramics, fluorescent-pure phase ceramics, fluorescent powder and aluminium oxide wherein it
One.
4. LED encapsulation method as described in claim 1, which is characterized in that the white adhesive layer includes:
By one of alumina powder, titanium oxide powder, magnesia powder or a variety of white adhesive layer slurries being mixed with glass powder, warp
It is sintered the white diffusing reflection layer formed；
Alternatively, the white adhesive layer slurry made of aluminium oxide, the diffusing reflection ceramic layer formed through sintering；
Alternatively, being mixed into white adhesive layer slurry made of high refractive index powder granule in aluminium oxide, the diffusing reflection formed through sintering is made pottery
Enamel coating；
The step 200 includes: that fluorophor that will be coated with any of the above-described kind of white adhesive layer slurry is integral sintered, thus described glimmering
White adhesive layer is formed on the outer peripheral surface of body of light.
5. LED encapsulation method as claimed in claim 4, which is characterized in that the high refractive index powder granule includes: oxidation
One of calcium, zirconium oxide, magnesia, yttrium oxide or barium sulfate.
6. LED encapsulation method as described in claim 1, which is characterized in that the LED light-emitting surface is COB light-emitting surface, the step
The geomery of flourescent sheet in rapid 400 is matched with the geomery of COB light-emitting surface；Alternatively, the LED light-emitting surface is single
LED chip light-emitting surface, the cross sectional shape size of the flourescent sheet in the step 400 are matched with single LED chip light emitting face size.
7. LED encapsulation method as described in claim 1, which is characterized in that the step 100 includes:
Fluorophor ingot is prepared, one or more slot is opened along longitudinal direction and/or laterally in the end face of the fluorophor ingot, to be formed glimmering
Each fluorophor of body of light array, the phosphor array is in a strip shape, and there are two axial end face and companies for each fluorophor tool
Connect the outer peripheral surface of described two axial end faces, the end surface shape of the phosphor array and a LED chip array light-emitting surface shape
Matching；
The LED light-emitting surface is LED chip array light-emitting surface.
8. LED encapsulation method as described in claim 1, which is characterized in that the step 200 includes: that the fluorophor exists
It is infiltrated in white glue slurry or the fluorophor spray or by the phosphor surface brushing with white glue slurry
White glue slurry, then solidifies, to coat white adhesive layer on the outer peripheral surface of the fluorophor.
9. a kind of LED encapsulating products, including flourescent sheet and LED light-emitting surface, the flourescent sheet are encapsulated on the LED light-emitting surface,
It is characterized in that, the flourescent sheet include positioned at middle part phosphor plates and be coated on the white adhesive layer of the phosphor plates surrounding,
The white adhesive layer is non-overlapping in the projection on the LED light-emitting surface with the phosphor plates.
10. LED encapsulating products as claimed in claim 9, which is characterized in that the upper surface of the white adhesive layer is plane, and with
The upper surface of the phosphor plates is in the same plane.
11. LED encapsulating products as claimed in claim 9, which is characterized in that the inner surface of the white adhesive layer and the fluorescence
The side surface of body piece is in close contact.
12. LED encapsulating products as claimed in claim 9, which is characterized in that described on the thickness direction of the flourescent sheet
White adhesive layer is equal with the phosphor plates thickness.
13. LED encapsulating products as claimed in claim 12, which is characterized in that the white adhesive layer and phosphor plates with a thickness of
30~200 μm.
14. LED encapsulating products as claimed in claim 9, which is characterized in that the LED light-emitting surface includes: COB light-emitting surface, list
LED chip light emitting face or LED chip array group light-emitting surface.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810193311.2A CN110246947A (en) | 2018-03-09 | 2018-03-09 | LED encapsulation method and products thereof |
| PCT/CN2018/110329 WO2019169867A1 (en) | 2018-03-09 | 2018-10-16 | Encapsulation method for led and product thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810193311.2A CN110246947A (en) | 2018-03-09 | 2018-03-09 | LED encapsulation method and products thereof |
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| Publication Number | Publication Date |
|---|---|
| CN110246947A true CN110246947A (en) | 2019-09-17 |
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ID=67845516
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810193311.2A Pending CN110246947A (en) | 2018-03-09 | 2018-03-09 | LED encapsulation method and products thereof |
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| CN101536197A (en) * | 2006-11-06 | 2009-09-16 | 皇家飞利浦电子股份有限公司 | Wavelength converting elements with reflective edges |
| CN102176335A (en) * | 2011-01-29 | 2011-09-07 | 江苏中惠医疗科技股份有限公司 | Method for manufacturing crystal array of gamma-ray detector |
| CN106159068A (en) * | 2015-05-15 | 2016-11-23 | 日亚化学工业株式会社 | The manufacture method of luminous intensity distribution component, the manufacture method of light-emitting device, luminous intensity distribution component and light-emitting device |
| CN106449951A (en) * | 2016-11-16 | 2017-02-22 | 厦门市三安光电科技有限公司 | Manufacturing method of light emitting diode packaging structure |
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| JP5287935B2 (en) * | 2011-06-16 | 2013-09-11 | 東レ株式会社 | Phosphor-containing sheet, LED light-emitting device using the same, and manufacturing method thereof |
| CN103346244A (en) * | 2013-06-13 | 2013-10-09 | 苏州金科信汇光电科技有限公司 | LED with fluorescent film |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101536197A (en) * | 2006-11-06 | 2009-09-16 | 皇家飞利浦电子股份有限公司 | Wavelength converting elements with reflective edges |
| CN102176335A (en) * | 2011-01-29 | 2011-09-07 | 江苏中惠医疗科技股份有限公司 | Method for manufacturing crystal array of gamma-ray detector |
| CN106159068A (en) * | 2015-05-15 | 2016-11-23 | 日亚化学工业株式会社 | The manufacture method of luminous intensity distribution component, the manufacture method of light-emitting device, luminous intensity distribution component and light-emitting device |
| CN106449951A (en) * | 2016-11-16 | 2017-02-22 | 厦门市三安光电科技有限公司 | Manufacturing method of light emitting diode packaging structure |
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