CN110228785A - 用于通孔结构的系统、方法及设备 - Google Patents

用于通孔结构的系统、方法及设备 Download PDF

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Publication number
CN110228785A
CN110228785A CN201910414865.5A CN201910414865A CN110228785A CN 110228785 A CN110228785 A CN 110228785A CN 201910414865 A CN201910414865 A CN 201910414865A CN 110228785 A CN110228785 A CN 110228785A
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CN
China
Prior art keywords
metal layer
layer
hole structure
equipment according
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910414865.5A
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English (en)
Chinese (zh)
Inventor
潘耀玲
赵李霞
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Nujira Ltd
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Nujira Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nujira Ltd filed Critical Nujira Ltd
Publication of CN110228785A publication Critical patent/CN110228785A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0006—Interconnects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/00246—Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Micromachines (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CN201910414865.5A 2011-10-20 2012-10-17 用于通孔结构的系统、方法及设备 Pending CN110228785A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/278,080 2011-10-20
US13/278,080 US10131534B2 (en) 2011-10-20 2011-10-20 Stacked vias for vertical integration
CN201280059040.2A CN103974896A (zh) 2011-10-20 2012-10-17 用于垂直集成的堆叠式通孔

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201280059040.2A Division CN103974896A (zh) 2011-10-20 2012-10-17 用于垂直集成的堆叠式通孔

Publications (1)

Publication Number Publication Date
CN110228785A true CN110228785A (zh) 2019-09-13

Family

ID=47138180

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201910414865.5A Pending CN110228785A (zh) 2011-10-20 2012-10-17 用于通孔结构的系统、方法及设备
CN201280059040.2A Pending CN103974896A (zh) 2011-10-20 2012-10-17 用于垂直集成的堆叠式通孔

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201280059040.2A Pending CN103974896A (zh) 2011-10-20 2012-10-17 用于垂直集成的堆叠式通孔

Country Status (7)

Country Link
US (1) US10131534B2 (https=)
EP (1) EP2768767A1 (https=)
JP (1) JP2014534470A (https=)
KR (1) KR20140083042A (https=)
CN (2) CN110228785A (https=)
IN (1) IN2014CN02998A (https=)
WO (1) WO2013059345A1 (https=)

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Publication number Priority date Publication date Assignee Title
US20180123245A1 (en) * 2016-10-28 2018-05-03 Broadcom Corporation Broadband antenna array for wireless communications
CN108231747A (zh) * 2016-12-21 2018-06-29 中芯国际集成电路制造(上海)有限公司 半导体器件及其制作方法、电子装置
US20190169020A1 (en) * 2017-12-05 2019-06-06 Intel Corporation Package substrate integrated devices
EP3598235A1 (en) 2018-07-18 2020-01-22 ASML Netherlands B.V. Metrology apparatus and method for determining a characteristic relating to one or more structures on a substrate

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US6320244B1 (en) * 1999-01-12 2001-11-20 Agere Systems Guardian Corp. Integrated circuit device having dual damascene capacitor
CN1603883A (zh) * 2003-09-29 2005-04-06 松下电器产业株式会社 微型电力机械系统及其制造方法
EP1695937A2 (en) * 2005-02-25 2006-08-30 Hitachi, Ltd. Integrated micro electro-mechanical system and manufacturing method thereof
US20100062600A1 (en) * 2008-09-08 2010-03-11 Oki Semiconductor Co., Ltd. Method of manufacturing a semiconductor device
US20100117124A1 (en) * 2007-11-13 2010-05-13 Rohm Co., Ltd. Semiconductor device
CN101728355A (zh) * 2008-11-03 2010-06-09 巨擘科技股份有限公司 多层基板的导孔结构及其制造方法
CN101772467A (zh) * 2007-08-07 2010-07-07 高通Mems科技公司 微机电系统装置及其互连

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US5798283A (en) 1995-09-06 1998-08-25 Sandia Corporation Method for integrating microelectromechanical devices with electronic circuitry
US6562656B1 (en) 2001-06-25 2003-05-13 Thin Film Module, Inc. Cavity down flip chip BGA
US20030234415A1 (en) * 2002-06-24 2003-12-25 Hwey-Ching Chien Scalable three-dimensional fringe capacitor with stacked via
JP4289005B2 (ja) 2003-04-30 2009-07-01 日本ビクター株式会社 多層プリント配線板
US20050041405A1 (en) 2003-08-22 2005-02-24 Intel Corporation Stacked via structure that includes a skip via
JP4776197B2 (ja) 2004-09-21 2011-09-21 日本特殊陶業株式会社 配線基板の検査装置
JP4608294B2 (ja) 2004-11-30 2011-01-12 日亜化学工業株式会社 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
KR100881303B1 (ko) * 2005-11-02 2009-02-03 이비덴 가부시키가이샤 반도체 장치용 다층 프린트 배선판 및 그 제조 방법
TWI298608B (en) 2006-05-19 2008-07-01 Foxconn Advanced Tech Inc Method for manufacturing stack via of hdi printed circuit board
US7777715B2 (en) * 2006-06-29 2010-08-17 Qualcomm Mems Technologies, Inc. Passive circuits for de-multiplexing display inputs
US20080029898A1 (en) 2006-08-01 2008-02-07 Farooq Mukta G Via stack structures
US7733552B2 (en) 2007-03-21 2010-06-08 Qualcomm Mems Technologies, Inc MEMS cavity-coating layers and methods
US8022896B2 (en) * 2007-08-08 2011-09-20 Qualcomm Mems Technologies, Inc. ESD protection for MEMS display panels
JP5125531B2 (ja) 2008-01-16 2013-01-23 富士通セミコンダクター株式会社 配線基板及び半導体装置
US8242593B2 (en) 2008-01-27 2012-08-14 International Business Machines Corporation Clustered stacked vias for reliable electronic substrates
US20090194861A1 (en) 2008-02-04 2009-08-06 Mathias Bonse Hermetically-packaged devices, and methods for hermetically packaging at least one device at the wafer level
CN102379037B (zh) * 2009-03-30 2015-08-19 高通股份有限公司 使用顶部后钝化技术和底部结构技术的集成电路芯片
JP2010283189A (ja) 2009-06-05 2010-12-16 Shinko Electric Ind Co Ltd 配線基板及びその製造方法
TW201102340A (en) * 2009-07-10 2011-01-16 Nat Univ Tsing Hua A method for fabricating a multilayer microstructure with balancing residual stress capability
CN102001613B (zh) 2009-09-02 2014-10-22 原相科技股份有限公司 微电子装置及制造方法、微机电封装结构及封装方法
JP5134027B2 (ja) * 2010-02-18 2013-01-30 北陸電気工業株式会社 圧電型三軸加速度センサ

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1195115A (zh) * 1997-03-28 1998-10-07 大宇电子株式会社 光学投影系统中的薄膜驱动式反射镜阵列及其制造方法
US6320244B1 (en) * 1999-01-12 2001-11-20 Agere Systems Guardian Corp. Integrated circuit device having dual damascene capacitor
CN1603883A (zh) * 2003-09-29 2005-04-06 松下电器产业株式会社 微型电力机械系统及其制造方法
EP1695937A2 (en) * 2005-02-25 2006-08-30 Hitachi, Ltd. Integrated micro electro-mechanical system and manufacturing method thereof
US20060205106A1 (en) * 2005-02-25 2006-09-14 Hiroshi Fukuda Integrated micro electro-mechanical system and manufacturing method thereof
CN101772467A (zh) * 2007-08-07 2010-07-07 高通Mems科技公司 微机电系统装置及其互连
US20100117124A1 (en) * 2007-11-13 2010-05-13 Rohm Co., Ltd. Semiconductor device
US20100062600A1 (en) * 2008-09-08 2010-03-11 Oki Semiconductor Co., Ltd. Method of manufacturing a semiconductor device
CN101728355A (zh) * 2008-11-03 2010-06-09 巨擘科技股份有限公司 多层基板的导孔结构及其制造方法

Also Published As

Publication number Publication date
JP2014534470A (ja) 2014-12-18
EP2768767A1 (en) 2014-08-27
WO2013059345A1 (en) 2013-04-25
US10131534B2 (en) 2018-11-20
CN103974896A (zh) 2014-08-06
US20130100143A1 (en) 2013-04-25
KR20140083042A (ko) 2014-07-03
IN2014CN02998A (https=) 2015-07-03

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