CN110225655A - A kind of assemble method of integrated circuit board - Google Patents
A kind of assemble method of integrated circuit board Download PDFInfo
- Publication number
- CN110225655A CN110225655A CN201910580151.1A CN201910580151A CN110225655A CN 110225655 A CN110225655 A CN 110225655A CN 201910580151 A CN201910580151 A CN 201910580151A CN 110225655 A CN110225655 A CN 110225655A
- Authority
- CN
- China
- Prior art keywords
- circuit plate
- circuit board
- integrated circuit
- assemble method
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention relates to technical field of integrated circuits more particularly to a kind of assemble method of integrated circuit board, including entire integrated circuit board step S1, is divided into core circuit plate and peripheral circuit plate；Step S2, it is defined according to pin and core circuit plate and the interface of peripheral circuit plate is handled respectively, core circuit plate is embedded in the opening of peripheral circuit plate；Step S3, core circuit plate and peripheral circuit plate are assembled respectively, to weld completion integrated circuit board.Technical solution of the present invention beneficial effect is: the assemble method flexible design, can allow different core circuit plate and peripheral circuit plate by setting interface, saves time and cost, and then accelerate the development progress of product, be suitble to volume production.
Description
Technical field
The present invention relates to technical field of integrated circuits more particularly to a kind of assemble methods of integrated circuit board.
Background technique
Integrated circuit (integrated circuit) is a kind of microelectronic device or component.Using certain technique,
Together the elements such as transistor, resistance, capacitor and inductance needed for a circuit and wiring interconnection, it is produced on a fritter or several
It on fritter semiconductor wafer or dielectric substrate, is then encapsulated in a shell, becomes the miniature knot with required circuit function
Structure；Wherein all elements have formed a whole in structure, make electronic component towards microminaturization, low-power consumption, intelligence and
Major step has been strided forward in terms of high reliability.
In the prior art, integrated circuit board project is developed together, and required time is long, and Replacing Scheme needs completely to set again
Meter, design iterations, and then waste time and therefore cost is not promoted.
Summary of the invention
For the above-mentioned problems in the prior art, a kind of assemble method of integrated circuit board is now provided.
Specific technical solution is as follows:
A kind of assemble method of integrated circuit board, including:
Step S1, the entire integrated circuit board is divided into core circuit plate 1 and peripheral circuit plate 2；
Step S2, according to pin define respectively to the core circuit plate at the interface of the peripheral circuit plate
The core circuit plate, is embedded in the opening of the peripheral circuit plate by reason；
Step S3, the core circuit plate and the peripheral circuit plate are assembled respectively, the collection is completed with welding
At circuit board.
Preferably, in Yu Suoshu step S1, the core circuit plate include system level chip, volatile memory, it is non-easily
The property lost memory, reset circuit and transistor circuit.
Preferably, in Yu Suoshu step S1, the peripheral circuit plate includes power panel, USB interface, high-definition multimedia
Interface, AV interface, power amplifier and flash memory cards.
Preferably, in Yu Suoshu step S2, the weldering of surface mount ellipse is set by the pedestal pad of the peripheral circuit plate
Disk.
Preferably, the surface mount ellipse pad is sized to 1.05mm*2mm.
Preferably, in Yu Suoshu step S2, the opening of Yu Suoshu core circuit plate is set as stamp tooth.
Preferably, the diameter of the stamp tooth sets at least to 1.05mm.
Preferably, the protrusion part of the stamp tooth is formed by the pedestal pad of the peripheral circuit plate.
Preferably, in Yu Suoshu step S3, when assembling to the core circuit plate, each module pin and function are drawn
Line is attached in order, and connects the power supply line and ground wire of the core circuit plate.
Preferably, in Yu Suoshu step S3, when assembling to the peripheral circuit plate, each module pin and function are drawn
Line is attached in order, and connects the power supply line and ground wire of the peripheral circuit plate.
Technical solution of the present invention beneficial effect is: providing a kind of assemble method of integrated circuit board, the assemble method
Flexible design can allow different core circuit plate and peripheral circuit plate by setting interface, save time and cost, Jin Erjia
The development progress of fast product, is suitble to volume production.
Detailed description of the invention
With reference to appended attached drawing, more fully to describe the embodiment of the present invention.However, appended attached drawing be merely to illustrate and
It illustrates, and is not meant to limit the scope of the invention.
Fig. 1 is the step flow chart of the assemble method of the integrated circuit board of the embodiment of the present invention；
Fig. 2 is the structure chart of the integrated circuit board of the assemble method of the integrated circuit board of the embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art without creative labor it is obtained it is all its
His embodiment, shall fall within the protection scope of the present invention.
It should be noted that in the absence of conflict, the feature in embodiment and embodiment in the present invention can phase
Mutually combination.
The present invention will be further explained below with reference to the attached drawings and specific examples, but not as the limitation of the invention.
The present invention includes a kind of assemble method of integrated circuit board, including:
Step S1, entire integrated circuit board is divided into core circuit plate 1 and peripheral circuit plate 2；
Step S2, it is defined according to pin and core circuit plate 1 and the interface of peripheral circuit plate 2 is handled respectively, it will
Core circuit plate 1 is embedded in the opening of peripheral circuit plate 2；
Step S3, core circuit plate 1 and peripheral circuit plate 2 are assembled respectively, to weld completion integrated circuit board.
Pass through the technical solution of the assemble method of said integrated circuit plate, in conjunction with shown in Fig. 1,2, the group of this integrated circuit board
Dress method, which is used, independently separates design with peripheral circuit plate 2 for core circuit plate 1, is respectively welded on again by stamp tooth after the completion
The assembling of entire integrated circuit board is completed together.The assemble method flexible design can allow different cores by setting interface
Circuit board 1 and peripheral circuit plate 2, save time and cost, and then accelerate the development progress of product, are suitble to volume production.
In above-mentioned technical proposal, core circuit plate 1 include system level chip, volatile memory, nonvolatile memory,
Reset circuit and transistor circuit.
In above-mentioned technical proposal, peripheral circuit plate 2 connects including power panel, USB interface, high-definition multimedia interface, AV
Mouth, power amplifier and flash memory cards.Wherein, two-panel design also can be used in peripheral circuit plate 2, which can
Reduce cost.
In a kind of preferably embodiment, surface mount ellipse pad is set by the pedestal pad of peripheral circuit plate 2.It will
Pedestal pad is set as surface mount ellipse pad, is conducive to increase contact area, increases weld strength, it is preferred that surface patch
It fills oval pad and is sized to 1.05mm*2mm.The assemble method flexible design can allow different by setting interface
Core circuit plate 1 and peripheral circuit plate 2, save time and cost, and then accelerate the development progress of product, are suitble to volume production.
In a kind of preferably embodiment, stamp tooth is set as (due to stamp teeth size in the opening of core circuit plate 1
Very little is not shown in Figure 2).It is that it is possible to the advantage that the opening of core circuit plate 1 is set as stamp tooth to stablize weldering
Connect it is not easily to fall off, and situations such as still be able to stable operation under long-time use, be not in broken string, and according to integrated electricity
The function and pin of road plate define the stamp tooth for being made into special assembling, and core circuit plate 1 is embedded in opening for peripheral circuit plate 2
At mouthful, the definition of concrete principle figure interface according to each module pin and functional pin, fits together, middle section in order
It is inserted into power supply and ground network, the assembling of integrated circuit board can be completed.
In above-mentioned technical proposal, it is preferred that the diameter of stamp tooth sets at least to 1.05mm.Wherein, the protrusion of stamp tooth
Part formed by the pedestal pad of peripheral circuit plate 2, be by by the interface of core circuit plate 1 on integrated circuit board pressing board
While cutting away the remaining semicircle interface of half to get to stamp tooth, be conducive to weld in this way, scolding tin is welded up and down by via hole
It connects.
In a kind of preferably embodiment, when assembling to core circuit plate 1, each module pin and functional pin are pressed
Sequence is attached, and connects the power supply line and ground wire of core circuit plate 1.It is done according to the function of integrated circuit board and pin definition
It is embedded in peripheral circuit plate 2 at the stamp tooth of special assembling, and core circuit plate 1, the definition of concrete principle figure interface, according to
Each module pin and functional pin, fit together in order, and power supply and ground network are inserted into middle section, can be completed integrated
The assembling of circuit board.
In a kind of preferably embodiment, in step S3, when being assembled to peripheral circuit board 2, each module pin
It is attached in order with functional pin, and connects the power supply line and ground wire of peripheral circuit plate 2.According to the function of integrated circuit board
And pin defines the stamp tooth for being made into special assembling, and core circuit plate 1 is embedded in peripheral circuit plate 2, concrete principle figure
Interface definition, according to each module pin and functional pin, fits together in order, and power supply and earth mat are inserted into middle section
The assembling of integrated circuit board can be completed in network.
The foregoing is merely preferred embodiments of the present invention, are not intended to limit embodiments of the present invention and protection model
It encloses, to those skilled in the art, should can appreciate that all with made by description of the invention and diagramatic content
Equivalent replacement and obviously change obtained scheme, should all be included within the scope of the present invention.
Claims (10)
1. a kind of assemble method of integrated circuit board characterized by comprising
Step S1, the entire integrated circuit board is divided into core circuit plate and peripheral circuit plate；
Step S2, it is defined according to pin and the interface of the core circuit plate and the peripheral circuit plate is handled respectively, with
The core circuit plate is embedded in the opening of the peripheral circuit plate；
Step S3, the core circuit plate and the peripheral circuit plate are assembled respectively, the integrated electricity is completed with welding
Road plate.
2. the assemble method of integrated circuit board according to claim 1, which is characterized in that described in Yu Suoshu step S1
Core circuit plate includes system level chip, volatile memory, nonvolatile memory, reset circuit and transistor circuit.
3. the assemble method of integrated circuit board according to claim 1, which is characterized in that described in Yu Suoshu step S1
Peripheral circuit plate includes power panel, USB interface, high-definition multimedia interface, AV interface, power amplifier and flash memory
Card.
4. the assemble method of integrated circuit board according to claim 1, which is characterized in that in Yu Suoshu step S2, by institute
The pedestal pad for stating peripheral circuit plate is set as surface mount ellipse pad.
5. the assemble method of integrated circuit board according to claim 4, which is characterized in that the surface mount ellipse pad
It is sized to 1.05mm*2mm.
6. the assemble method of integrated circuit board according to claim 1, which is characterized in that in Yu Suoshu step S2, in institute
The opening for stating core circuit plate is set as stamp tooth.
7. the assemble method of integrated circuit board according to claim 6, which is characterized in that the diameter of the stamp tooth is at least
It is set as 1.05mm.
8. the assemble method of integrated circuit board according to claim 6, which is characterized in that the protrusion part of the stamp tooth
It is formed by the pedestal pad of the peripheral circuit plate.
9. the assemble method of integrated circuit board according to claim 1, which is characterized in that in Yu Suoshu step S3, to institute
When stating core circuit plate and being assembled, each module pin and functional pin are attached in order, and connect the core electricity
The power supply line and ground wire of road plate.
10. the assemble method of integrated circuit board according to claim 1, which is characterized in that in Yu Suoshu step S3, to institute
When stating peripheral circuit plate and being assembled, each module pin and functional pin are attached in order, and connect the periphery electricity
The power supply line and ground wire of road plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910580151.1A CN110225655A (en) | 2019-06-28 | 2019-06-28 | A kind of assemble method of integrated circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910580151.1A CN110225655A (en) | 2019-06-28 | 2019-06-28 | A kind of assemble method of integrated circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110225655A true CN110225655A (en) | 2019-09-10 |
Family
ID=67815352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910580151.1A Pending CN110225655A (en) | 2019-06-28 | 2019-06-28 | A kind of assemble method of integrated circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110225655A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10303527A (en) * | 1997-04-28 | 1998-11-13 | Nippon Seiki Co Ltd | Connecting structure of electrical-equipment component to printed-wiring board |
| CN1494123A (en) * | 2002-09-18 | 2004-05-05 | Lg电子株式会社 | Integrated circuit packing testing equipment |
| CN106061213A (en) * | 2016-08-05 | 2016-10-26 | 深圳市众易畅科技有限公司 | Integrated heat radiation system and method of display screen mounted in automobile and used for man-machine interaction |
-
2019
- 2019-06-28 CN CN201910580151.1A patent/CN110225655A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10303527A (en) * | 1997-04-28 | 1998-11-13 | Nippon Seiki Co Ltd | Connecting structure of electrical-equipment component to printed-wiring board |
| CN1494123A (en) * | 2002-09-18 | 2004-05-05 | Lg电子株式会社 | Integrated circuit packing testing equipment |
| CN106061213A (en) * | 2016-08-05 | 2016-10-26 | 深圳市众易畅科技有限公司 | Integrated heat radiation system and method of display screen mounted in automobile and used for man-machine interaction |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190910 |