CN1494123A - Integrated circuit packing testing equipment - Google Patents
Integrated circuit packing testing equipment Download PDFInfo
- Publication number
- CN1494123A CN1494123A CNA031585353A CN03158535A CN1494123A CN 1494123 A CN1494123 A CN 1494123A CN A031585353 A CNA031585353 A CN A031585353A CN 03158535 A CN03158535 A CN 03158535A CN 1494123 A CN1494123 A CN 1494123A
- Authority
- CN
- China
- Prior art keywords
- integrated circuit
- test
- test board
- pcb
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
An IC package test apparatus is provided to increase a mounting rate of a PCB by monitoring an IC package without using an additional test point. An IC package test apparatus includes a test kit PCB(130), a test kit PCB connection pad(132), a test pad(134), a male connector pad, a PCB coupled male connector(120), and a PCB coupled female connector(110). The test kit PCB connection pad(132) is formed on an upper face of the test kit PCB(130). The test pad(134) is electrically connected to the test kit PCB connection pad. The test pad is formed on the test kit PCB. The male connector pad is electrically connected to the test kit PCB connection pad. The male connector pad is formed on a lower face of the test kit PCB. The PCB coupled male connector(120) is coupled to the male connector pad. The PCB coupled female connector(110) is coupled to the PCB coupled male connector.
Description
Technical field
The present invention relates to integrated circuit packaging and testing equipment, more particularly, the present invention relates to easily to test the integrated circuit packaging and testing equipment that whether has circuit (circuitous) fault between integrated circuit encapsulation that is installed on the printed circuit board (PCB) and another circuit that is connected to this integrated circuit encapsulation.
Background technology
Usually, by with high density integrated transistor, resistance and capacitor and with they encapsulation, obtain the integrated circuit encapsulation.
Fig. 1 illustrates the decomposition diagram that is installed in the state of the integrated circuit encapsulation on the printed circuit board (PCB) according to conventional art, Fig. 2 illustrates the assembling perspective view that is installed in the state of the integrated circuit encapsulation on the printed circuit board (PCB) according to conventional art, and Fig. 3 illustrates the rearview that is installed in the back side of the integrated circuit encapsulation on the printed circuit board (PCB) according to conventional art.
As shown in Figure 1 to Figure 3, a plurality of weld zones 11 are molded on the printed circuit board (PCB) 10, and corresponding to each weld zone 11, the ball pin 21 of a plurality of lead materials is molded on the lower surface of integrated circuit encapsulation.
Utilize the heating gun on the closing line of integrated circuit encapsulation 20, each ball pin 21 of fusing integrated circuit encapsulation 20, thus each ball pin 21 is connected to each weld zone 11 of printed circuit board (PCB) 10.In view of the above, integrated circuit encapsulation 20 is installed on the printed circuit board (PCB) 10.
In conventional art, with the back side of integrated circuit encapsulation 20 printed circuit board (PCB)s that link to each other 10 on several position test point is set, then, to be connected to this position such as the monitoring device (not shown) of logic analyzer, thus test integrated circuit encapsulation 20 be connected to this integrated circuit and encapsulate between another circuit (not shown) of 20 whether have circuit defect.
Yet, be installed in test under the situation of the integrated circuit encapsulation on the printed circuit board (PCB), particularly be installed under the situation about encapsulating such as the integrated circuit on the printed circuit board (PCB) in the midget plant of mobile phone in test, the user can not testing integrated circuits all ball pins of encapsulation, because this integrated circuit encapsulation is very little, and the assemblage gap between each circuit is very narrow.Therefore, the user only selects several ball pins, and test point is set to this position tests.Therefore, this integrated circuit testing imperfection, and also very difficult because the gap between the test point is narrow.
Summary of the invention
Therefore, the purpose of this invention is to provide a kind of by will be than integrated circuit encapsulation big and measuring head circuit that have a plurality of test pin be connected to the integrated circuit encapsulation, and by utilizing the test pin of measuring head, testing integrated circuits encapsulation easily be connected to the integrated circuit packaging and testing equipment that whether has fault between other circuit that this integrated circuit encapsulates.
In order to realize these and other advantage and according to purpose of the present invention, as this realization and broad sense explanation, a kind of integrated circuit packaging and testing equipment is provided, this integrated circuit packaging and testing equipment comprises: test board, it has a plurality of its centers that are molded over, has specific dimensions, be used to install the integrated circuit encapsulation and whether have the weld zone of fault between the integrated circuit encapsulation that is connected to printed circuit board (PCB) and another integrated circuit that is connected to the integrated circuit encapsulation, and have a plurality of through holes that are molded over the periphery of weld zone and are connected to the weld zone by graph line with test; The test board jockey, it is installed between test board and the printed circuit board (PCB), is used for test board is connected to printed circuit board (PCB); And measuring head, it is connected to test board, and have a plurality of corresponding to forming through holes in an one side, will insert lead-in wire and a plurality of test pin that is molded over its another side in the through hole.
This test board jockey comprises: female connector has and a plurality ofly is positioned at its lower surface, will be connected to the pin of a plurality of weld zones of moulding on printed circuit board (PCB), and has a plurality of through holes that are positioned at its upper surface; And plug-in type (male) connector, be detachably connected to female connector, and have a plurality of lead-in wires that are positioned at its lower surface, will be connected to through hole, and a plurality of pin that is positioned at its upper surface, will be connected to the weld zone of test board.
Female connector of being constructed and plug-in connector preferably form less than test board, and the test board of being constructed preferably forms greater than integrated circuit and encapsulates.
Measuring head further is provided with support plate, is used to support test pin.
According to another embodiment of the invention, a kind of integrated circuit packaging and testing equipment is provided, this integrated circuit packaging and testing equipment comprises: test board, it has and a plurality ofly is molded over its center, has specific dimensions, is used to install the integrated circuit encapsulation and whether has the weld zone of fault with test between the surface-mounted integrated circuit that is connected to printed circuit board (PCB) and other integrated circuits that are connected to integrated circuit encapsulation 20, and has a plurality of through holes that are molded over the periphery of weld zone and are connected to the weld zone by graph line; The test board jockey, it is installed between test board and the printed circuit board (PCB), is used for test board is connected to printed circuit board (PCB); Measuring head, it is connected to test board, and has and a plurality ofly be molded over an one side, will insert lead-in wire and a plurality of test pin that is molded over its another side in the through hole; And integrated circuit encapsulation jockey, it is installed between test board and the integrated circuit encapsulation, is used for the integrated circuit encapsulation is installed to the weld zone of test board, thereby makes them realize that mutually circuit connects.
Integrated circuit encapsulation jockey comprises: female connector, and it has a plurality of ball pins that are positioned at its lower surface, will be connected to the weld zone of test board, and has a plurality of through holes that are positioned at its upper surface; And plug-in connector, be detachably connected to female connector, and have a plurality of lead-in wires that are positioned at its lower surface, will be connected to through hole, and a plurality of weld zone that is positioned at its upper surface, will be connected to the pin of moulding on the lower surface of integrated circuit encapsulation.
By describing the present invention in detail below in conjunction with accompanying drawing, above-mentioned and other purposes, feature, aspect and advantage of the present invention will become more obvious.
Description of drawings
Included accompanying drawing helps further to understand the present invention, and accompanying drawing is introduced the part of this specification as this specification, and accompanying drawing illustrates embodiments of the invention, and is used from the explanation principle of the invention with explanation one.
At accompanying drawing:
Fig. 1 illustrates the decomposition diagram that is installed in the state of the integrated circuit encapsulation on the printed circuit board (PCB) according to conventional art;
Fig. 2 illustrates the assembling perspective view that is installed in the state of the integrated circuit encapsulation on the printed circuit board (PCB) according to conventional art;
Fig. 3 illustrates the rearview that is installed in the back side of the integrated circuit encapsulation on the printed circuit board (PCB) according to conventional art;
Fig. 4 illustrates the decomposition diagram of integrated circuit packaging and testing equipment according to an embodiment of the invention;
Fig. 5 illustrates the assembling perspective view of integrated circuit packaging and testing equipment according to an embodiment of the invention;
Fig. 6 is the cutaway view of getting along line A-A shown in Figure 5;
Fig. 7 illustrates the plane graph of the test board of integrated circuit packaging and testing equipment according to an embodiment of the invention;
Fig. 8 illustrates the bottom view of the test board of integrated circuit packaging and testing equipment according to an embodiment of the invention;
Fig. 9 illustrates the decomposition diagram of integrated circuit packaging and testing equipment in accordance with another embodiment of the present invention;
Figure 10 illustrates the assembling perspective view of integrated circuit packaging and testing equipment in accordance with another embodiment of the present invention; And
Figure 11 is the cutaway view of getting along line B-B shown in Figure 10.
Embodiment
Now, will describe the preferred embodiments of the present invention in detail, accompanying drawing illustrates the example of the preferred embodiment.
Fig. 4 illustrates the decomposition diagram of integrated circuit packaging and testing equipment according to an embodiment of the invention, Fig. 5 illustrates the assembling perspective view of integrated circuit packaging and testing equipment according to an embodiment of the invention, Fig. 6 is the cutaway view of getting along line A-A shown in Figure 5, Fig. 7 illustrates the plane graph of the test board of integrated circuit packaging and testing equipment according to an embodiment of the invention, and Fig. 8 illustrates the bottom view of the test board of integrated circuit packaging and testing equipment according to an embodiment of the invention.
As shown in the figure, integrated circuit packaging and testing equipment comprises according to an embodiment of the invention: test board 110, be used to install integrated circuit encapsulation 20, with test the integrated circuit encapsulation 20 that is connected to printed circuit board (PCB) 10 be connected to integrated circuit and encapsulate the fault that whether has circuit between another integrated circuit of 20; Test board jockey 120, it is installed between test board 110 and the printed circuit board (PCB) 10, is used for test board 110 is connected to printed circuit board (PCB) 10; And measuring head 130, it is connected to test board 110, and has a plurality of test pin in an one side.
It is the littlest that the female connector 121 of being constructed and plug-in connector 122 cans be compared to test board 110 most, and the test board 110 of being constructed cans be compared to integrated circuit most and encapsulates 20 big.
More preferably, the test board 110 of being constructed encapsulates 20 big than integrated circuit, so that integrated circuit encapsulation 20 can be installed on the weld zone 111 of test board 110.In addition, the female connector 121 and the plug-in connector 122 of being constructed have certain height h, so that test board 110 can not contact the miscellaneous part (not shown) that is installed on the printed circuit board (PCB) 10, and the female connector 121 of being constructed and plug-in connector 122 to can be compared to test board 110 most the littlest, to reduce the installing space on the printed circuit board (PCB) 10.
The ball pin 21 of the lead-in wire 122a of the ball pin 121a of the weld zone 11 of printed circuit board (PCB) 10, the weld zone 111 of test board 10, female connector 121 and through hole 121b, plug-in connector 122 and ball pin 122b and integrated circuit encapsulation 20 is arranged in the relevant position mutually, and being inserted in proper order, thereby the connection of realization circuit.
Measuring head 130 is connected to the upper surface of test board 110, and, it is provided with a plurality of lead-in wires 131,, and it is provided with test pin 132 in its another side so that be inserted in the through hole 112 in an one side corresponding to through hole 112.
Also measuring head 130 is provided with support plate 133, is used for test pin 132 is supported in the intermediate portion.
Below with reference to Fig. 4 to 8 running of integrated circuit packaging and testing equipment according to an embodiment of the invention is described.
Utilizing the guide line (not shown) to make under the state of ball pin 121a corresponding to the weld zone 11 of printed circuit board (PCB) 10 of female connector 121, by utilizing heating gun to make the ball pin 121a fusing of female connector 121, thereby female connector 121 is connected to printed circuit board (PCB) 10.
Then, the lead-in wire 122a of plug-in connector 122 inserts in the through hole 121b of female connector 121 so that it is access in, and the ball pin 122b of plug-in connector 122 is installed on the weld zone 11 of test board 110.
Next, under weld zone 111 state in correspondence with each other of the ball pin 21 of integrated circuit encapsulation 20 and test board 110, utilize heating gun, integrated circuit encapsulation 20 is installed on the test board 110.
Then, measuring head 30 is connected to the upper surface of test board 110, thereby the lead-in wire 131 of measuring head 130 is inserted in the through hole 112 of test board 110.
In integrated circuit packaging and testing equipment according to the present invention, easy testing integrated circuits encapsulation 20 be connected under the situation of fault that this integrated circuit encapsulates the circuit between another integrated circuit (not shown) of 20, will be connected to the test pin 132 of measuring head 130 such as the monitoring device of logic analyzer (not shown).
Shown in Fig. 4 to 8, in integrated circuit packaging and testing equipment according to an embodiment of the invention, encapsulate 20 measuring heads 130 that are connected to integrated circuit encapsulation 20 and have a plurality of test pin 132 big, circuit by utilizing than integrated circuit, test point can be set to all ball pins 21 of integrated circuit encapsulation 20, and can test all positions.In addition, the interval between the test point is enough wide, therefore tests easily.
Fig. 9 illustrates the decomposition diagram of integrated circuit packaging and testing equipment in accordance with another embodiment of the present invention, Figure 10 illustrates the assembling perspective view of integrated circuit packaging and testing equipment in accordance with another embodiment of the present invention, and Figure 11 is the cutaway view of getting along line B-B shown in Figure 10.
As shown in the figure, integrated circuit packaging and testing equipment comprises in accordance with another embodiment of the present invention: test board 210, it has and a plurality ofly is molded over its center, has specific dimensions, is used to install integrated circuit encapsulation 20 and whether has the weld zone 211 of the fault of circuit with test between the integrated circuit encapsulation 20 that is connected to printed circuit board (PCB) 10 and another integrated circuit that is connected to integrated circuit encapsulation 20, and has a plurality of through holes 212 that are molded over the periphery of weld zone 211 and are connected to the weld zone by graph line 213; Test board jockey 220 is installed between test board 210 and the printed circuit board (PCB) 10, is used for test board 210 is connected to printed circuit board (PCB) 10; Measuring head 230, it is connected to test board 210, and has and a plurality ofly be molded over an one side, will insert lead-in wire 231 and a plurality of test pin 232 that is molded over its another side in the through hole 212; And integrated circuit encapsulation jockey 240, it is installed between test board 210 and the integrated circuit encapsulation 20, is used for integrated circuit encapsulation 20 is installed to the weld zone 211 of test board 210, thereby makes them realize the connection of circuit mutually.
Integrated circuit encapsulation jockey 240 comprises: female connector 241, and it has a plurality of ball pin 241a that are positioned at its lower surface, will be connected to the weld zone 211 of test board 210, and has a plurality of through hole 241b that are positioned at its upper surface; And plug-in connector 242, it is detachably connected to female connector 241, and have a plurality of lead-in wire 242a that are positioned at its lower surface, will be connected to through hole 241b, and a plurality of weld zone 242b that is positioned at its upper surface, will be connected to the ball pin 21 of integrated circuit encapsulation 20.
The running of integrated circuit packaging and testing equipment in accordance with another embodiment of the present invention below will be described.
Under the state of the ball pin 221a of female connector 221 corresponding to the weld zone 11 of printed circuit board (PCB) 10, female connector 221 is installed to printed circuit board (PCB) 10, then, the lead-in wire 222a of plug-in connector 222 is inserted the through hole 221b of female connector 221.
Then, the weld zone 111 of test board 10 is installed to the ball pin 222b of plug-in connector 222, and under the state of the ball pin 241a of female connector 241, plug-in connector 241 is installed to test board 110 corresponding to the weld zone 111 of test board 110.
The lead-in wire 242a of plug-in connector 242 is inserted the through hole 241b of female connector 241, and the ball pin 21 of integrated circuit encapsulation 20 is installed to the weld zone 242b of plug-in connector 242.
Then, measuring head 230 is connected to the upper surface of test board 110, thereby the lead-in wire 231 of measuring head 230 is inserted in the through hole 232 of test board 210.
In integrated circuit packaging and testing equipment according to the present invention, to be connected to the test pin 232 of measuring head 230 such as the monitoring device of logic analyzer (not shown), so as test between integrated circuit encapsulation and another integrated circuit that is connected to the integrated circuit encapsulation, whether exist circuit unusually.
In integrated circuit packaging and testing equipment in accordance with another embodiment of the present invention, integrated circuit encapsulation 20 is not to be directly connected to test board 210, but utilizes female connector 241 and plug-in connector 242 to be installed on it indirectly.Therefore, because hanging down of inferior quality reason, replacing under the situation of integrated circuit package 20 parts, by making female connector 241 and plug-in connector 242 disconnected from each other, integrated circuit encapsulation 20 is separated, with test board 210 so replace integrated circuit package 20 easily.
Because in not breaking away from spirit of the present invention or inner characteristic scope, can realize the present invention in several modes, so should also be appreciated that, the foregoing description is not limited to details described above, except as otherwise noted, and should in the essential scope of the present invention that claims are determined, extensively understand the foregoing description, therefore, claims should comprise and belonging in the claim scope, perhaps all changes and the modification in the claim equivalent scope.
Claims (11)
1. integrated circuit packaging and testing equipment, this equipment comprises:
Test board, it has and a plurality ofly is molded over its center, has specific dimensions, is used to install the integrated circuit encapsulation and whether has the weld zone of fault with test between the integrated circuit encapsulation that is connected to printed circuit board (PCB) and another integrated circuit that is connected to the integrated circuit encapsulation, and has a plurality of through holes that are molded over the periphery of weld zone and are connected to the weld zone by graph line;
The test board jockey, it is installed between test board and the printed circuit board (PCB), is used for test board is connected to printed circuit board (PCB); And
Measuring head, it is connected to test board, and have a plurality of corresponding to forming through holes in an one side, will insert lead-in wire and a plurality of test pin that is molded over its another side in the through hole.
2. equipment according to claim 1, wherein said test board jockey comprises:
Female connector, it has and a plurality ofly is positioned at its lower surface, will be connected to the pin of a plurality of weld zones of moulding on printed circuit board (PCB), and has a plurality of through holes that are positioned at its upper surface; And
Plug-in connector, it is detachably connected to female connector, and has a plurality of lead-in wires that are positioned at its lower surface, will be connected to through hole, and a plurality of pin that is positioned at its upper surface, will be connected to the weld zone of test board.
3. equipment according to claim 2, wherein the pin of the pin of female connector and plug-in connector is spherical.
4. equipment according to claim 2, wherein female connector of being constructed and plug-in connector are less than test board.
5. equipment according to claim 1, wherein the test board of being constructed encapsulates greater than integrated circuit.
6. equipment according to claim 1 is wherein corresponding to a plurality of pin arrangements weld zone on the lower surface that is molded over the integrated circuit encapsulation.
7. equipment according to claim 1 wherein further is provided with support plate to measuring head, is used for test pin is supported position therebetween.
8. integrated circuit packaging and testing equipment, this equipment comprises:
Test board, it has and a plurality ofly is molded over its center, has specific dimensions, is used to install the integrated circuit encapsulation and whether has the weld zone of fault with test between the surface-mounted integrated circuit that is connected to printed circuit board (PCB) and another circuit board that is connected to the integrated circuit encapsulation, and has a plurality of through holes that are molded over the periphery of weld zone and are connected to the weld zone by graph line;
The test board jockey, it is installed between test board and the printed circuit board (PCB), is used for test board is connected to printed circuit board (PCB);
Measuring head, it is connected to test board, and has and a plurality ofly be molded over an one side, will insert lead-in wire and a plurality of test pin that is molded over its another side in the through hole; And
Integrated circuit encapsulation jockey, it is installed between test board and the integrated circuit encapsulation, is used for the integrated circuit encapsulation is installed to the weld zone of test board, thereby makes them realize the connection of circuit mutually.
9. equipment according to claim 8, wherein said integrated circuit encapsulation jockey comprises:
Female connector, it has a plurality of ball pins that are positioned at its lower surface, will be connected to the weld zone of test board, and has a plurality of through holes that are positioned at its upper surface; And
Plug-in connector, it is detachably connected to female connector, and has a plurality of lead-in wires that are positioned at its lower surface, will be connected to through hole, and a plurality of weld zone that is positioned at its upper surface, will be connected to the pin of moulding on the lower surface of integrated circuit encapsulation.
10. equipment according to claim 9, wherein female connector of being constructed and plug-in connector are less than test board.
11. equipment according to claim 8, wherein the test board of being constructed encapsulates greater than integrated circuit.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2002-0057062A KR100486531B1 (en) | 2002-09-18 | 2002-09-18 | Apparatus for testing ic package |
| KR57062/2002 | 2002-09-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1494123A true CN1494123A (en) | 2004-05-05 |
Family
ID=34270508
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA031585353A Pending CN1494123A (en) | 2002-09-18 | 2003-09-18 | Integrated circuit packing testing equipment |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100486531B1 (en) |
| CN (1) | CN1494123A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101442898B (en) * | 2007-12-07 | 2011-04-27 | 北京航天光华电子技术有限公司 | Numerical control forming machine for integrated circuit pin |
| CN110225655A (en) * | 2019-06-28 | 2019-09-10 | 晶晨半导体(上海)股份有限公司 | A kind of assemble method of integrated circuit board |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102415601B1 (en) | 2020-07-23 | 2022-06-30 | 도레이첨단소재 주식회사 | Flame retardant polyester fibers with excellent dyeing properties and manufacturing method thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5086269A (en) * | 1991-03-08 | 1992-02-04 | Hewlett-Packard Company | Burn-in process and apparatus |
| US5420520A (en) * | 1993-06-11 | 1995-05-30 | International Business Machines Corporation | Method and apparatus for testing of integrated circuit chips |
| JP4187281B2 (en) * | 1996-04-05 | 2008-11-26 | スリーエム カンパニー | IC socket for testing |
| JP2000164772A (en) * | 1998-11-24 | 2000-06-16 | Nippon Avionics Co Ltd | Auxiliary printed wiring board for area array package ic, ic test method, and repairing method of printed wiring board |
| KR100564564B1 (en) * | 2000-03-08 | 2006-03-28 | 삼성전자주식회사 | Test socket for connecting a contact pad in both side of Chip On Board type package |
-
2002
- 2002-09-18 KR KR10-2002-0057062A patent/KR100486531B1/en not_active IP Right Cessation
-
2003
- 2003-09-18 CN CNA031585353A patent/CN1494123A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101442898B (en) * | 2007-12-07 | 2011-04-27 | 北京航天光华电子技术有限公司 | Numerical control forming machine for integrated circuit pin |
| CN110225655A (en) * | 2019-06-28 | 2019-09-10 | 晶晨半导体(上海)股份有限公司 | A kind of assemble method of integrated circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20040025210A (en) | 2004-03-24 |
| KR100486531B1 (en) | 2005-05-03 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |