CN2520566Y - Contact pin type integrated circuit joining device - Google Patents
Contact pin type integrated circuit joining device Download PDFInfo
- Publication number
- CN2520566Y CN2520566Y CN02204714U CN02204714U CN2520566Y CN 2520566 Y CN2520566 Y CN 2520566Y CN 02204714 U CN02204714 U CN 02204714U CN 02204714 U CN02204714 U CN 02204714U CN 2520566 Y CN2520566 Y CN 2520566Y
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- Prior art keywords
- circuit
- integrated circuit
- contact pin
- pin type
- type integrated
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Abstract
A contact pin type integrated circuit association device comprises a circuit base plate, a sliding sheet, a guide frame, and an actuator. The circuit base plate comprises a plurality of jacks, conductive position elements, and a circuit means, wherein the contact pins of an integrated circuit assembly are inserted in the jacks, the conductive position elements are located in the jacks to grasp the contact pins, and the circuit comprises appropriate circuit arrangement. Conductive connection points are arranged on the bottom of the base plate and electrically linked with the conductive position elements through the circuit means. A plurality of extra electron components are arranged on the circuit base plate to provide extra additional functions. The sliding sheet is installed on the top face of the circuit base plate in a relative slippage way, and a plurality of trompils are disposed on the sliding sheet, and the positions of the trompils are respectively corresponding to each jack. The guide frame is used for limiting the sliding sheet to slip linearly. The actuator is interlocked with the sliding sheet, which can horizontally rotate to drive the sliding sheet to do certain linear slip.
Description
Technical field
The utility model relates to a kind of contact pin type integrated circuit coupling apparatus, especially a kind of setting of finger is fixed on the circuit board, and by array of receptacles being set for planting an integrated circuit package on the circuit substrate that can have circuit layout, and can provide a kind of contact pin type integrated circuit coupling apparatus of the electric connection of integrated circuit package and circuit board.
Background technology
For a long time, tradition is used for integrated circuit package assembling (Integrated Circuit Package; Being called for short IC Package) mode that is installed on circuit board (Circuit Board or claim Main Board) has two kinds, and a kind of is the dead and mode that can not plug of directly weldering, and another kind then is replaceable and pluggable mode.This kind contact pin type integrated circuit coupling apparatus is applicable to usually needs upgrading.Upgrade integrated circuit package, or on the integrated circuit (IC) apparatus of higher unit price, when circuit board or an integrated circuit package fault wherein maybe need be upgraded, then another assembly still can keep the continuation use, and for example central processing unit (CPU) (Central Processing Unit: be called for short CPU) is a typical example.
See also Fig. 1 and Fig. 2, typically can plug integrated circuit (IC) apparatus 10 for visible on the market at present.Traditionally, for double asking can plug and good electrically purpose of connecting, traditional practice is on integrated circuit package 11 (IC Package) contact pin 111 (Pins) to be set, and setting has the electric connector 13 (Socket) of a plurality of jacks 131 (Pin Holes) for this integrated circuit package 11 of planting on circuit board 12.Existing integrated circuits assembly 11 packaged types have lead frame (Lead Frame) and sphere grid array encapsulation (Ball Grid Array; Abbreviation BGA) two kind.In recent years, then often use crystal covering type sphere grid array encapsulation (Flip Chip BGA Packaging) for pursuing high-effect (that is high-cooling property) integrated circuit package with high pin number.Its basic composition assembly generally includes as shown in Figure 1: an integrated circuit (IC) chip 112 (IC Chip) is with on the side surface that covers crystal type and be installed on a substrate 113 (Substrate), substrate 113 opposite side surfaces then be provided with some tin balls 114 (Solders) its be by the circuit design of substrate 113 and electrical couplings in chip 112, the chip 112 non-start faces of side in addition then is pasted with a radiating subassembly 115 (Heat Sink).Because the non-rigid high object of contact pin 111#, damaged by distortion, and also be not easy and tin ball 114 firm engagement, therefore, present technology is soldered to it tin ball 114 after all needing earlier a plurality of contact pin 111 die castings (Mo1ding) to be fixed on the intermediate plate 116 (Interposer) again.
As for, plant in order to supply the contact pin 111 of aforementioned existing integrated circuit package 11, and must take into account the function of choosing again, all existing electric connectors 13 include following member now: a socket 132 with a plurality of jacks 131 is welded on the circuit board 12.One sliding panel 133 covers on socket 132 end faces with mode device that can linear slippage and one pulls stock 134 devices and carry out micro-slippage at socket 132 sides for driving this sliding panel 133.Be equipped with the conductive metal sheet (not shown) in each jack 131 of socket 132 and have in jack 131 bottoms tin ball 135 for welding and and circuit board 12 electrically connect, position corresponding to jack 131 on the sliding panel 133 also is provided with big slightly perforate (not shown), by will press down this pull stock 134 make its with bar axle 136 serve as axle be rotated up to 132 one-tenth levels of socket, can make sliding panel 133 carry out micro-slippage and the contact pin 111 of integrated circuit package 11 is clamped in the jack 131.When desiring the integrated circuit package 11 of choosing, then needing to pull stock 134 changes and is pulled to and 132 one-tenths vertical 90 degree angles of socket, and contact pin 111 like this will be released and desirable from integrated circuit package 11.
Yet the existing contact pin type integrated circuit of this kind coupling apparatus still has following shortcoming:
(1) socket of existing electric connector is to be to penetrate the pure working of plastics that (Injecting) is shaped with die casting (Molding) or plastics, and it only only has the effect of holding with the contact pin of located integrated circuit assembly, and other extra additional function can't be provided fully.
(2) existing electric connector to pull the long rod device area occupied bigger, need have an exceptional space to hold and pull stock and bar axial region part thereof, the area that causes taking circuit board is bigger.And, pull stock and need carry out large-scale pivotal action, make in the spatial dimension of pulling the stock pivot and all other assembly must not be set, cause the restriction in the space utilization.
(3) the complex structure assembly of existing electric connector is more, and production cost is higher relatively.
Summary of the invention
First purpose of the present utility model is to be to provide a kind of contact pin type integrated circuit coupling apparatus, by a plurality of jacks are set at circuit substrate to replace the socket of existing pure working of plastics, and circuit layout and extra electron assembly can be set so that additional function to be provided on circuit substrate, and also improve the coplanarity of circuit substrate and circuit board contact-making surface simultaneously.
Second purpose of the present utility model is to be to provide a kind of contact pin type integrated circuit coupling apparatus, can drive slide by the actuating mechanism that horizontally rotates actuating by one and carry out an amount of linear displacement at the circuit substrate end face, pull long rod device not only complex structure and all bigger shortcoming of area occupied and operating space with what overcome prior art, and production cost is relatively low.
The invention provides a kind of contact pin type integrated circuit coupling apparatus, the integrated circuit package and that power supply property connection one has a plurality of contact pins has the circuit board of circuit layout and some electronic building bricks, includes:
One circuit substrate, this circuit substrate more includes:
A plurality of jacks are arranged on the end face of circuit substrate, and the position of these a plurality of jacks just corresponds respectively to this a plurality of contact pins;
A plurality of conduction keepers are arranged at respectively in each jack, can supply and the contact pin electrical couplings;
Circuit arrangement is used for the bottom surface of a plurality of conduction keeper electrical couplings to circuit substrate; And,
A plurality of conductive junction points are arranged at the bottom surface of substrate, can be for welding with circuit board electrical couplings in the circuit layout of circuit board, these a plurality of conductive junction points and suitably electrical couplings in this circuit arrangement.
Described contact pin type integrated circuit coupling apparatus also can include:
One slide, but place the circuit substrate top surface side in the mode of slide relative, be provided with its position of a plurality of perforates in slide and just correspond respectively to each jack, and bore size is to be slightly larger than jack;
One guiding frame is arranged on the respective side of two-phase at least of circuit substrate, and this guiding frame is to be used to limit make slide only can carry out linear sliding motion along the direction that the guiding frame extends; And
One actuating mechanism, interlock can drive slide by actuating mechanism and carry out this an amount of linearity sliding motion in slide.
Described slide can be integrated solid memder with the guiding frame.
Described slide and guiding frame can be the member of two independent separate.
Described actuating mechanism also can include:
One opening runs through an appropriate position that is arranged at slide, this length that is opened on the predetermined direction of carrying out described linear sliding motion be greater than with the perpendicular width of this linearity sliding motion direction;
One pivot hole is arranged on the circuit substrate position corresponding to opening; And,
One rotating part, this rotating part has and comprises that a pivot and is positioned at pivot one end and has the shifting block that protrudes out to horizontal direction at least, this pivot is can the pivot mode to be hubbed in the pivot hole and to make shifting block just be arranged in opening simultaneously, to make shifting block can promote the opening inside edge for axle is rotated and and then impel slide to carry out this linearity sliding motion according to pivot by stirring this rotating part.
Described circuit arrangement can by with each jack and the conduction keeper all extends through to the bottom surface of circuit substrate and electrical couplings in corresponding conductive junction point.
Described circuit arrangement can be by be equipped with circuit layout on the end face of circuit substrate and bottom surface, and be provided with the circuit layout of some conductive plugs in addition in the position that circuit substrate is not provided with jack with electrical couplings circuit substrate end face and bottom surface, and the circuit layout of circuit substrate end face and bottom surface be respectively electrical couplings in conduction keeper and conductive junction point.
It is that electrical couplings is in this circuit arrangement also can be provided with at least one extra electron assembly on circuit substrate.
Described extra electron assembly can be in order to adjust operating voltage.
Described extra electron assembly can be in order to adjust operating frequency.
The bottom of described a plurality of conduction keepers is extensible and run through circuit board.
In sum, contact pin type integrated circuit coupling apparatus of the present utility model has following advantage at least with respect to prior art:
(1) can provide extra additional function.The proper circuit layout designs of the circuit arrangement of the utility model on the circuit substrate can make circuit substrate can provide extra additional function or increase that extra electron assembly person is set.
(2) board area that takies and operating space are all less.The utility model adopts the actuating mechanism horizontally rotate actuating to drive the slide displacement, and not only area occupied reduces, and the restriction on can not having living space fully during operation.
(3) cost is relatively low.The structure of assemblies such as slide of the present utility model, guiding frame and actuating mechanism is more simple with respect to existing electric connector, and production cost is relatively low.
(4) the leveling degree of circuit substrate bottom surface is preferable.Its bottom copper packing (LAND) of circuit substrate of the present utility model auxiliary make and go up flatness of solder balls the evenness of the existing electric connector socket of tradition is better, therefore all relative better in conjunction with adaptation, evenness and electrical characteristic between circuit substrate of the present utility model and the circuit board.
Description of drawings
Fig. 1 is the side-looking perspective diagram for existing contact pin type integrated circuit coupling apparatus;
Fig. 2 is for looking schematic diagram on the existing contact pin type integrated circuit coupling apparatus shown in Figure 1;
Fig. 3 is the first preferred embodiment schematic side view for contact pin type integrated circuit coupling apparatus of the present utility model;
Fig. 4 is the schematic top view for preferred embodiment shown in Figure 3;
Fig. 5 is the second preferred embodiment schematic side view for contact pin type integrated circuit coupling apparatus of the present utility model;
Fig. 6 is the 3rd a preferred embodiment schematic side view for contact pin type integrated circuit coupling apparatus of the present utility model;
Fig. 7 is the 4th a preferred embodiment schematic side view for contact pin type integrated circuit coupling apparatus of the present utility model;
Fig. 8 is the 5th a preferred embodiment schematic side view for contact pin type integrated circuit coupling apparatus of the present utility model;
Fig. 9 is the 6th a preferred embodiment schematic side view for contact pin type integrated circuit coupling apparatus of the present utility model.
Embodiment
See also Fig. 3 and Fig. 4, be respectively the side-looking and the schematic top view of first preferred embodiment of contact pin type integrated circuit coupling apparatus 20 of the present utility model.This contact pin type integrated circuit coupling apparatus mainly is to be used to electrically connect an integrated circuit package 30 (IC Package) and a circuit board 40 (Circuit Board or title Main Board) that can be separated from each other.
This integrated circuit package 30 is to be laid with substrate 32 (Substrate) institute of circuit layout (Circuit Layout) in conjunction with constituting by an integrated circuit (IC) chip 31 (IC Chin) and, bottom side in substrate 32 is provided with plurality of conductors ball 33 (Solder Balls), and this plurality of conductors ball 33 electrically connects by the start side (Active Side) of this circuit layout and integrated circuit (IC) chip 31.The opposite side of integrated circuit (IC) chip 31 then is pasted with a fin 34 (Heat Sink) to promote radiating effect.In this preferred embodiment, this integrated circuit package 31 is that so it can also be the sphere grid array package assembling of other kind for existing crystal covering type sphere grid array encapsulation (Flip ChinBGA) assembly, the sphere grid array package assembling person of other kind of routing type (WireBond) or film auto-stitching (Tape Automated Bonding abbreviates TAB as) or the like for example.In this preferred embodiment, this integrated circuit package 31 is same as the prior art, and also the bottom side of substrate 32 is provided with intermediate plate 35 (Interposer) and a plurality of contact pins 36 (Pins), and contact pin 36 is to be electrically connected at corresponding conducting sphere 33.
On the upper surface of circuit board 40, be formed with some contact mats 41 (ContactPad) with conductive material, the preferably, the material of this contact mat 41 can be nickel, gold, chromium, copper, iron, aluminium, titanium, lead, tin or its alloy.These some contact mats 41 are to be exposed to the external world for carrying out solder bond with contact pin type integrated circuit coupling apparatus 20 of the present utility model.Certainly, on circuit board 40, also can electronic building bricks such as other existing capacitance resistance or other integrated circuit package (not shown) etc. be arranged device, since this kind on circuit board 40, be provided with electricity in assembly partly be to belong to prior art and non-ly be technical characterictic of the present utility model, so below repeat no more.
In first preferred embodiment as shown in Figure 3 and Figure 4, this contact pin type integrated circuit coupling apparatus 20 of the present utility model includes: a circuit substrate 21, some extra electron assemblies 22, a slide 23, a guiding frame 24 and an actuating mechanism 25.
This circuit substrate 21 more includes: a plurality of jacks 211, a plurality of conduction keeper 212, circuit arrangement 213 and a plurality of conductive junction point 214.A plurality of jacks 211 are to be arranged on the end face of circuit substrate 21, the position of these a plurality of jacks 211 just corresponds respectively to this a plurality of contact pins 36, therefore, can be one by one corresponding insert in the jack 211 of the contact pin 36 of integrated circuit package 30 and with integrated circuit package 30 plant in conjunction with and be positioned on circuit substrate 21 end faces.These a plurality of conduction keepers 212 are to be arranged at respectively in each jack 211, can for clamping contact pin 36 and with contact pin 36 electrical couplings.These a plurality of conductive junction points 214 are the bottom surfaces that are arranged at circuit substrate 21, can by scolder 26 be soldered on the contact mat 41 of circuit board 40 and electrical couplings in the circuit layout (not shown) of circuit board 40.
In this preferred embodiment, this jack 211 and conduction keeper 212 all are not through to the bottom side of circuit substrate 21.This circuit arrangement 213 is by the end face at circuit substrate 21, being provided with circuit layout on intermediate course and the bottom surface constitutes, and be one to have the circuit substrate 21 of multilayer circuit layout, and be provided with some conductive plugs 215 in the position that circuit substrate 21 is not provided with jack 211 in addition and be positioned at the circuit layout of circuit substrate 21 end faces and bottom surface with electrical couplings, and the circuit layout of circuit substrate 21 end faces and bottom surface then be respectively electrical couplings in conduction keeper 212 and conductive junction point 214.Because circuit substrate 21 of the present utility model is provided with this circuit arrangement 213, therefore can be by the design of the circuit layout of circuit arrangement 213 or by these some extra electron assembly 22 electrical couplings being set on circuit substrate 21 in this circuit layout, and extra additional function can be provided.For example, can adjust the operating voltage or the operating frequency of this integrated circuit package 30, or extend some test contacts (not shown) and electrically detect for it for connecting an extraneous checkout equipment (not shown), or additional specific passive component is to improve the electrical characteristic of integrated circuit package 30, or other additional function, and be not that socket as the pure working of plastics manufacturing of Fig. 1 and prior art shown in Figure 2 can only provide function of socket.
And, circuit substrate 21 its bottom surface copper packings (LAND) of the present utility model auxiliary make and go up flatness of solder balls the evenness of existing electric connector 13 sockets 132 made with pure working of plastics of tradition is better, therefore the coplanarity between circuit substrate 21 of the present utility model and the circuit board 40, all relative better in conjunction with mechanical property such as adaptation, evenness and electrical characteristic.
In another preferred embodiment shown in Figure 9, also jack 211 can be designed to through circuit substrate 21, this moment, this circuit substrate 21 just can have the lamina of individual layer circuit layout or the circuit substrate of the doubling plate of odt circuit layout designs to reduce manufacturing cost.
But this slide 23 is the modes with slide relative is positioned over circuit substrate 21 top surface side, be provided with a plurality of perforates 231 its positions in slide 23 and just correspond respectively to each jack 211, and perforate 231 sizes is to be slightly larger than jack 211.This guiding frame 24 is to be arranged on the respective side of two-phase at least of circuit substrate 21, and be to extend along circuit substrate 21 side directions, this guiding frame 24 is to be used for that slide 23 is remained on circuit substrate 21 end faces to avoid it to come off, and also limit slippage sheet 23 only can carry out linear sliding motion along the direction that guiding frame 24 extends simultaneously.
This actuating mechanism 25 be interlock in slide 23, can drive slide 23 by actuating mechanism 25 and carry out this an amount of linearity sliding motion.In this preferred embodiment, this slide 23 and guiding frame 24 are the members for two independent separate, and this actuating mechanism 25 more includes: an opening 251, one pivot holes 252 and a rotating part 253.
This opening 251 is to run through an appropriate position that is arranged at slide 23, in the present embodiment, opening 251 is to be a similar oval groove shape structure, that is opening 251 intervention carry out surely length on the direction of described linear sliding motion be greater than with the perpendicular width of this linearity sliding motion direction.This pivot hole 252 is the positions that are arranged on the circuit substrate 21 corresponding to opening 251.This rotating part 253 has and comprises that a pivot 2531 and is positioned at pivot 2531 upper ends and has the shifting block 2532 that protrudes out to horizontal direction at least.Shifting block 2532 in the present embodiment is for being non-concentrically ringed cam structure with pivot hole 2531, in the top side of shifting block 2532 and be provided with and be available for users to the projection reversed with finger or instrument or the torsional part 2533 of recessed structure.This pivot 2531 is can the pivot mode to be hubbed in the pivot hole 252 and to make shifting block 2532 just be arranged in opening 251 simultaneously, to make shifting block 2532 can promote opening 251 inside edges for axle is rotated and and then impel slide 23 to carry out this linearity sliding motion according to pivot 2531 by rotating this rotating part 253.
Because actuating mechanism of the present utility model is by opening 251.The collocation utilization of pivot hole 252 and rotating part 253, only need take less relatively circuit board 40 areas, and rotating part 253 maintains all the time on the same horizontal plane and rotates when operation, can not cause taking and limiting on the space fully, the utility model is with respect to as Fig. 1 and existing pulling for the long rod device shown in Figure 2 as can be known, and the utility model is really in the saving in area and space and utilize and have obvious improvement.
Certainly, in another preferred embodiment not shown in the figures, also can select 251 changes of this opening are arranged on the guiding frame 24, and rotating part 253 changes are designed to one can be along the impeller (not shown) of the long and narrow direction horizontal linearity passing that is positioned at the opening of guiding frame, the below of this impeller is to be fixed in slide 23, so, can drive slide 23 by the promotion impeller and carry out the linear slippage of (that is length distance of opening) in right amount.
In other preferred embodiment of the utility model of the following stated, because of the assembly of major part is the same as or similar to previous embodiment, therefore identical assembly will directly give identical title and numbering, and for similar assembly then give same names but after former numbering, increase in addition an English alphabet as a means of the difference and will not give unnecessary details, close chat earlier bright.
See also Fig. 5 and be the second preferred embodiment schematic side view for contact pin type integrated circuit coupling apparatus 20a of the present utility model.This preferred embodiment is approximately identical to embodiment shown in Figure 3, and this contact pin type integrated circuit coupling apparatus 20a also has a circuit substrate 21, a slide 23a and a guiding frame 24a and an actuating mechanism 25 equally.As for 22 of some extra electron assemblies can be according to actual needs selection whether increasing setting as the aforementioned.This circuit substrate 21 has equally and includes: a plurality of jack 211a.A plurality of conduction keeper 212a, the circuit arrangement that is constituted by the proper circuit layout.And a plurality of conductive junction points.
In second preferred embodiment shown in Figure 5, be with difference embodiment illustrated in fig. 3, slide 23a shown in Figure 5 and guiding frame 24a are that the solid memder that is formed in one but not the assembly (but can also select to use the designer who is illustrated in figure 3 as two stand-alone assemblies) of two independent separate so can further reduce production costs.And, this jack 211a is for directly running through the conductive junction point of through its bottom side of circuit substrate, conduction keeper 212a then is inserted in jack 211a near the part of bottom and be to stretch out suitably distance and be closely linked with scolder 26 of circuit substrate 21 bottom surfaces one, conducting electricity the upper end of keeper 212a simultaneously is slightly open configuration for the contact pin 36 that holds clamping integrated circuit package 30, make conduction keeper 212a (or contact pin 36) directly electrical couplings in the conductive junction point of correspondence.By this kind configuration, combining between conduction keeper 212a and conductive junction point can more firm difficult drop-off.In addition, integrated circuit package 30 does not as shown in Figure 5 have intermediate plate, but follow technology (Surface Mount Technology) by the surface contact pin 36 directly is combined on the conducting sphere 33.
See also Fig. 6 and be the 3rd preferred embodiment for contact pin type integrated circuit coupling apparatus 20b of the present utility model.In this preferred embodiment, this contact pin type integrated circuit coupling apparatus 20b only has circuit substrate 21, its by scolder 26 be fixedly welded on the circuit board 40 and with its electrical couplings.On circuit substrate 21, have equally and include: a plurality of jack 211b that run through, a plurality of conduction keeper 212b.The circuit arrangement and a plurality of conductive junction point that are constituted by the proper circuit layout.A plurality of conduction keeper 212b are that the whole bottom of running through jack 211b and conduction keeper 212b is to stretch out circuit substrate 21 bottom surfaces and combine closely by scolder 26 and conductive junction point.As the embodiment of Fig. 3, the circuit arrangement of this preferred embodiment shown in Figure 6 can provide by suitable circuit layout equally and for example extend some test contacts and some extra electron assemblies are set so that additional function to be provided for connecting extraneous checkout equipment or selecting.
See also Fig. 7 and be the 4th preferred embodiment for contact pin type integrated circuit coupling apparatus 20c of the present utility model.The present embodiment major part is analogous to embodiment shown in Figure 5 so repeat no more, its unique difference is that the bottom of a plurality of conduction keeper 212c as shown in Figure 7 is to extend and run through circuit board 40, so that the more firm effect that combines between contact pin type integrated circuit coupling apparatus 20c of the present utility model and the circuit board 40 to be provided.
See also Fig. 8 and be the 5th preferred embodiment for contact pin type integrated circuit coupling apparatus 20d of the present utility model.The present embodiment major part is analogous to embodiment shown in Figure 6 so repeat no more, its unique difference is that the bottom of a plurality of conduction keeper 212d as shown in Figure 8 is to extend and run through circuit board 40, so that the more firm effect that combines between contact pin type integrated circuit coupling apparatus 20d of the present utility model and the circuit board 40 to be provided.
The above is to utilize preferred embodiment to describe the utility model in detail, and unrestricted scope of the present utility model, for example, though circuit substrate of the present utility model is with lamina (only having the individual layer circuit layout) or doubling plate and describe, so it can also be to use the circuit substrate with more multi-layered circuit layout.
Claims (9)
1. contact pin type integrated circuit coupling apparatus is characterized in that including:
One circuit substrate, this circuit substrate includes:
A plurality of jacks are arranged on the end face of circuit substrate, and the position of these a plurality of jacks just corresponds respectively to this a plurality of contact pins;
A plurality of conduction keepers are arranged at respectively in each jack;
With the circuit arrangement of a plurality of conduction keeper electrical couplings to a bottom surface of circuit substrate; And,
A plurality of conductive junction points are arranged at the bottom surface of substrate, these a plurality of conductive junction points and suitably electrical couplings in this circuit arrangement.
2. contact pin type integrated circuit coupling apparatus as claimed in claim 1 is characterized in that described contact pin type integrated circuit coupling apparatus more includes:
One slide, but place the circuit substrate top surface side in the mode of slide relative, be provided with its position of a plurality of perforates in slide and just correspond respectively to each jack, and bore size is to be slightly larger than jack;
One guiding frame is arranged on the respective side of two-phase at least of circuit substrate; And
One actuating mechanism, interlock is in slide.
3. contact pin type integrated circuit coupling apparatus as claimed in claim 2 is characterized in that described slide and guiding frame are the solid memders that is formed in one.
4. contact pin type integrated circuit coupling apparatus as claimed in claim 2 is characterized in that described slide and guiding frame are the members for two independent separate.
5. contact pin type integrated circuit coupling apparatus as claimed in claim 2 is characterized in that described actuating mechanism more includes:
One opening runs through an appropriate position that is arranged at slide, this length that is opened on the predetermined direction of carrying out described linear sliding motion be greater than with the perpendicular width of this linearity sliding motion direction;
One pivot hole is arranged on the circuit substrate position corresponding to opening; And,
One rotating part, this rotating part have and comprise that a pivot and is positioned at pivot one end and has the shifting block that protrudes out to horizontal direction at least, and this pivot is can the pivot mode to be hubbed in the pivot hole and to make shifting block just be arranged in opening simultaneously.
6. contact pin type integrated circuit coupling apparatus as claimed in claim 1, it is characterized in that described circuit arrangement be by with each jack and the conduction keeper all extends through to the bottom surface of circuit substrate and electrical couplings in corresponding conductive junction point.
7. contact pin type integrated circuit coupling apparatus as claimed in claim 1, it is characterized in that described circuit arrangement is by be equipped with circuit layout on the end face of circuit substrate and bottom surface, and be provided with the circuit layout of some conductive plugs in addition in the position that circuit substrate is not provided with jack with electrical couplings circuit substrate end face and bottom surface, and the circuit layout of circuit substrate end face and bottom surface be respectively electrical couplings in conduction keeper and conductive junction point.
8. contact pin type integrated circuit coupling apparatus as claimed in claim 1 is characterized in that, more is provided with at least one extra electron assembly on circuit substrate, and it is that electrical couplings is in this circuit arrangement.
9. contact pin type integrated circuit coupling apparatus as claimed in claim 1, the bottom that it is characterized in that described a plurality of conduction keepers are extensions and run through circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN02204714U CN2520566Y (en) | 2002-01-21 | 2002-01-21 | Contact pin type integrated circuit joining device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN02204714U CN2520566Y (en) | 2002-01-21 | 2002-01-21 | Contact pin type integrated circuit joining device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2520566Y true CN2520566Y (en) | 2002-11-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN02204714U Expired - Lifetime CN2520566Y (en) | 2002-01-21 | 2002-01-21 | Contact pin type integrated circuit joining device |
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|---|---|
| CN (1) | CN2520566Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1697285B (en) * | 2004-05-12 | 2012-06-13 | 精工电子有限公司 | Power generation circuit using electromagnetic wave |
| CN102833959A (en) * | 2012-08-30 | 2012-12-19 | 北京兴科迪科技有限公司 | Tooling device for welding circuit board and keyboard plate |
| CN103800018A (en) * | 2012-11-13 | 2014-05-21 | 财团法人工业技术研究院 | pressure measuring mechanism |
| CN107172827A (en) * | 2017-07-19 | 2017-09-15 | 郑州云海信息技术有限公司 | A kind of solution is because of the long processing procedure ameliorative way of material Pin pin |
-
2002
- 2002-01-21 CN CN02204714U patent/CN2520566Y/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1697285B (en) * | 2004-05-12 | 2012-06-13 | 精工电子有限公司 | Power generation circuit using electromagnetic wave |
| CN102833959A (en) * | 2012-08-30 | 2012-12-19 | 北京兴科迪科技有限公司 | Tooling device for welding circuit board and keyboard plate |
| CN102833959B (en) * | 2012-08-30 | 2015-01-21 | 北京兴科迪科技有限公司 | Tooling device for welding circuit board and keyboard plate |
| CN103800018A (en) * | 2012-11-13 | 2014-05-21 | 财团法人工业技术研究院 | pressure measuring mechanism |
| CN107172827A (en) * | 2017-07-19 | 2017-09-15 | 郑州云海信息技术有限公司 | A kind of solution is because of the long processing procedure ameliorative way of material Pin pin |
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