CN110216598A - 一种半导体用划片刀及其加工工艺 - Google Patents
一种半导体用划片刀及其加工工艺 Download PDFInfo
- Publication number
- CN110216598A CN110216598A CN201910546531.3A CN201910546531A CN110216598A CN 110216598 A CN110216598 A CN 110216598A CN 201910546531 A CN201910546531 A CN 201910546531A CN 110216598 A CN110216598 A CN 110216598A
- Authority
- CN
- China
- Prior art keywords
- wheel hub
- saw blade
- notch
- semiconductor
- blade
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 20
- 238000005516 engineering process Methods 0.000 title claims abstract description 10
- 238000007747 plating Methods 0.000 claims abstract description 18
- 238000009713 electroplating Methods 0.000 claims abstract description 15
- 230000007704 transition Effects 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 12
- 239000004576 sand Substances 0.000 claims description 12
- 239000002131 composite material Substances 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 10
- 239000000126 substance Substances 0.000 claims description 7
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 6
- 238000003801 milling Methods 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 239000011780 sodium chloride Substances 0.000 claims description 3
- 230000001360 synchronised effect Effects 0.000 claims 1
- 238000005520 cutting process Methods 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 26
- 229910052759 nickel Inorganic materials 0.000 description 13
- 230000000694 effects Effects 0.000 description 7
- 239000000047 product Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- TVEXGJYMHHTVKP-UHFFFAOYSA-N 6-oxabicyclo[3.2.1]oct-3-en-7-one Chemical compound C1C2C(=O)OC1C=CC2 TVEXGJYMHHTVKP-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000007771 core particle Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/04—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of metal, e.g. skate blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0018—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by electrolytic deposition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/12—Cut-off wheels
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Electroplating Methods And Accessories (AREA)
- Dicing (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910546531.3A CN110216598B (zh) | 2019-06-24 | 2019-06-24 | 一种半导体用划片刀及其加工工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910546531.3A CN110216598B (zh) | 2019-06-24 | 2019-06-24 | 一种半导体用划片刀及其加工工艺 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110216598A true CN110216598A (zh) | 2019-09-10 |
CN110216598B CN110216598B (zh) | 2021-06-15 |
Family
ID=67814368
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910546531.3A Active CN110216598B (zh) | 2019-06-24 | 2019-06-24 | 一种半导体用划片刀及其加工工艺 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN110216598B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114672860A (zh) * | 2022-03-03 | 2022-06-28 | 郑州磨料磨具磨削研究所有限公司 | 一种表面无凸起的电镀超薄切割砂轮的制作方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010017820A (ja) * | 2008-07-11 | 2010-01-28 | Asahi Diamond Industrial Co Ltd | ハブ付きブレード |
CN204604125U (zh) * | 2015-04-17 | 2015-09-02 | 郑州宏拓超硬材料制品有限公司 | 电镀轮毂型划片刀 |
CN204927264U (zh) * | 2015-07-22 | 2015-12-30 | 刘国家 | 一种新型超薄晶圆划片刀 |
CN106637359A (zh) * | 2016-10-11 | 2017-05-10 | 郑州磨料磨具磨削研究所有限公司 | 轮毂型电镀超薄金刚石切割砂轮的制造方法 |
CN108546939A (zh) * | 2018-06-29 | 2018-09-18 | 郑州晶研科技有限公司 | 一种超薄轮毂型金刚石划片刀的电化学加工工艺及工装 |
-
2019
- 2019-06-24 CN CN201910546531.3A patent/CN110216598B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010017820A (ja) * | 2008-07-11 | 2010-01-28 | Asahi Diamond Industrial Co Ltd | ハブ付きブレード |
CN204604125U (zh) * | 2015-04-17 | 2015-09-02 | 郑州宏拓超硬材料制品有限公司 | 电镀轮毂型划片刀 |
CN204927264U (zh) * | 2015-07-22 | 2015-12-30 | 刘国家 | 一种新型超薄晶圆划片刀 |
CN106637359A (zh) * | 2016-10-11 | 2017-05-10 | 郑州磨料磨具磨削研究所有限公司 | 轮毂型电镀超薄金刚石切割砂轮的制造方法 |
CN108546939A (zh) * | 2018-06-29 | 2018-09-18 | 郑州晶研科技有限公司 | 一种超薄轮毂型金刚石划片刀的电化学加工工艺及工装 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114672860A (zh) * | 2022-03-03 | 2022-06-28 | 郑州磨料磨具磨削研究所有限公司 | 一种表面无凸起的电镀超薄切割砂轮的制作方法 |
CN114672860B (zh) * | 2022-03-03 | 2024-04-12 | 郑州磨料磨具磨削研究所有限公司 | 一种表面无凸起的电镀超薄切割砂轮的制作方法 |
Also Published As
Publication number | Publication date |
---|---|
CN110216598B (zh) | 2021-06-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A dicing knife for semiconductor and its processing technology Effective date of registration: 20220316 Granted publication date: 20210615 Pledgee: Agricultural Bank of China Limited Zhongshan triangle sub branch Pledgor: ZHONGSHAN THINK ELECTRONIC TECHNOLOGY CO.,LTD. Registration number: Y2022980002703 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20210615 Pledgee: Agricultural Bank of China Limited Zhongshan triangle sub branch Pledgor: ZHONGSHAN THINK ELECTRONIC TECHNOLOGY CO.,LTD. Registration number: Y2022980002703 |