CN110211938B - 一种基于信息技术控制的芯片封装装置 - Google Patents
一种基于信息技术控制的芯片封装装置 Download PDFInfo
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- CN110211938B CN110211938B CN201910548359.5A CN201910548359A CN110211938B CN 110211938 B CN110211938 B CN 110211938B CN 201910548359 A CN201910548359 A CN 201910548359A CN 110211938 B CN110211938 B CN 110211938B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Package Closures (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
Claims (9)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910548359.5A CN110211938B (zh) | 2019-06-24 | 2019-06-24 | 一种基于信息技术控制的芯片封装装置 |
JP2020040339A JP2021002643A (ja) | 2019-06-24 | 2020-03-09 | It制御に基づくチップ封止装置 |
GBGB2006329.3A GB202006329D0 (en) | 2019-06-24 | 2020-04-30 | A chip packaging device based on information technology control |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910548359.5A CN110211938B (zh) | 2019-06-24 | 2019-06-24 | 一种基于信息技术控制的芯片封装装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110211938A CN110211938A (zh) | 2019-09-06 |
CN110211938B true CN110211938B (zh) | 2020-07-24 |
Family
ID=67794097
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910548359.5A Active CN110211938B (zh) | 2019-06-24 | 2019-06-24 | 一种基于信息技术控制的芯片封装装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2021002643A (zh) |
CN (1) | CN110211938B (zh) |
GB (1) | GB202006329D0 (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110211938B (zh) * | 2019-06-24 | 2020-07-24 | 深圳市财富云端信息技术有限公司 | 一种基于信息技术控制的芯片封装装置 |
CN111564421B (zh) * | 2020-06-02 | 2020-12-01 | 杭州翔毅科技有限公司 | 一种多方式高效的芯片散热装置 |
CN111897402A (zh) * | 2020-09-10 | 2020-11-06 | 辽宁省交通高等专科学校 | 一种大数据信息汇总用服务系统 |
CN113745133B (zh) * | 2021-09-06 | 2023-10-13 | 江苏富联通讯技术股份有限公司 | 一种5g通信射频芯片sip封装用塑封设备及其使用方法 |
CN113857813B (zh) * | 2021-09-17 | 2023-03-17 | 重庆溯联塑胶股份有限公司 | 新能源汽车冷却系统管路接头装配抽芯机构 |
CN114313453B (zh) * | 2021-12-03 | 2024-02-06 | 中山市勤奋光电科技有限公司 | 一种电子元器件批量打包塑封装置 |
CN116759392B (zh) * | 2023-08-23 | 2023-11-14 | 成都宇熙电子技术有限公司 | 一种sip封装设备 |
CN117774400B (zh) * | 2023-12-29 | 2024-09-06 | 南通智凯瑞玻璃钢复合材料有限公司 | 一种玻璃钢复合板制备设备 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW580746B (en) * | 2003-03-26 | 2004-03-21 | Horng Terng Automation Co Ltd | Expandable semiconductor device packaging equipment |
JP2004095600A (ja) * | 2002-08-29 | 2004-03-25 | Daihen Corp | アライメント装置 |
CN108346602A (zh) * | 2018-03-31 | 2018-07-31 | 广州明森科技股份有限公司 | 一种高效的智能卡的芯片封装装置 |
CN108447803A (zh) * | 2018-03-26 | 2018-08-24 | 童龙范 | 一种新型片式半导体超薄封装装置 |
CN108706148A (zh) * | 2018-05-23 | 2018-10-26 | 浦江县安恒进出口有限公司 | 一种先进的封装材料设备 |
CN208868346U (zh) * | 2018-08-08 | 2019-05-17 | 天津瀚翔自动化设备有限公司 | 一种电器元件包装设备 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8648454B2 (en) * | 2012-02-14 | 2014-02-11 | International Business Machines Corporation | Wafer-scale package structures with integrated antennas |
CN106206393A (zh) * | 2016-09-25 | 2016-12-07 | 东莞市联洲知识产权运营管理有限公司 | 一种集成电路板封装的定位装置 |
CN110211938B (zh) * | 2019-06-24 | 2020-07-24 | 深圳市财富云端信息技术有限公司 | 一种基于信息技术控制的芯片封装装置 |
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2019
- 2019-06-24 CN CN201910548359.5A patent/CN110211938B/zh active Active
-
2020
- 2020-03-09 JP JP2020040339A patent/JP2021002643A/ja not_active Ceased
- 2020-04-30 GB GBGB2006329.3A patent/GB202006329D0/en not_active Ceased
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004095600A (ja) * | 2002-08-29 | 2004-03-25 | Daihen Corp | アライメント装置 |
TW580746B (en) * | 2003-03-26 | 2004-03-21 | Horng Terng Automation Co Ltd | Expandable semiconductor device packaging equipment |
CN108447803A (zh) * | 2018-03-26 | 2018-08-24 | 童龙范 | 一种新型片式半导体超薄封装装置 |
CN108346602A (zh) * | 2018-03-31 | 2018-07-31 | 广州明森科技股份有限公司 | 一种高效的智能卡的芯片封装装置 |
CN108706148A (zh) * | 2018-05-23 | 2018-10-26 | 浦江县安恒进出口有限公司 | 一种先进的封装材料设备 |
CN208868346U (zh) * | 2018-08-08 | 2019-05-17 | 天津瀚翔自动化设备有限公司 | 一种电器元件包装设备 |
Also Published As
Publication number | Publication date |
---|---|
CN110211938A (zh) | 2019-09-06 |
JP2021002643A (ja) | 2021-01-07 |
GB202006329D0 (en) | 2020-06-17 |
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Effective date of registration: 20200824 Address after: Chuangye Road, Nanshan, Guangdong Province Patentee after: Li Lin Address before: 518051 R3 B1-1, Yuehai Street High-tech Industrial Village, Nanshan District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN CAIFU YUNDUAN INFORMATION TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20201211 Address after: 241002 Room 308, building 3, Fortune Plaza, central city, Lugang street, Yijiang District, Wuhu City, Anhui Province Patentee after: Li Dengsai Address before: 518000 Chuangye road guanhaitai C2, Nanshan District, Shenzhen City, Guangdong Province Patentee before: Li Lin |
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Effective date of registration: 20210115 Address after: 310000 1st floor, 748 Renmin Avenue, Nanyuan street, Yuhang District, Hangzhou City, Zhejiang Province Patentee after: Hangzhou Baicheng Technology Co.,Ltd. Address before: 241002 Room 308, building 3, Fortune Plaza, central city, Lugang street, Yijiang District, Wuhu City, Anhui Province Patentee before: Li Dengsai |
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TR01 | Transfer of patent right |