580746 玖、發明說明 【發明所屬之技術領域】 本發明係關於一種可擴充式半導體元件構裝設備，尤 指-種應用力帛導體元件縣製料進行具有賴性動作 如黏晶、黏接散熱片、點膠、...等步驟所使用的構裝 設備，且可有效降低該設備之工作端待料時間，以增進^ 能者。 9 【先前技術】 現今半導體元件之構裝製程，依選用的晶片載體不同 ，或構裝的型態不同，其構裝製程在實施上有所差異，但 -般而言，該半導體元件之構裝製程概包括有：晶圓切割 成複數小晶片、將晶片黏著於載體上、晶片與載體上預； 的引腳電性連接、模塑封膠等主要步驟，此外，為增進該 半導體7G件之散熱效果，另於模塑封膠前，會增加於載體 上植設金屬散熱片之步驟。 月*J述半導體元件為完成前 凡成則項各製程步驟，均係使用特 疋的構裝设備來完成，以栢机 风彳植叹政熱片之步驟為例，其係將 黏者有晶片的半成品放置於承載匣，經搬運至 片二著設備之輸入區，復由該設備輸入端處的推送裝 置母- 人自承載匣中推出一件口 件+成〇〇於該設備的輸送帶上， ，經輸送帶將該半成品移 點膠頭於該半成品上於各& n免備的 ，由輸送帶移往下一個計置處逐一點注黏谬，之後 放f置自，献y 個預疋位置處定位，再由該設備的取 政熱片放置區吸取-散熱片，移植於該半成品之 5 預疋位置處，如此反復進 订’直至半成品上各元件單元上 均點著有散熱片後，再由鈐、篆嫌々 田輪送帶移往該設備另側的輸出區 並由δ玄輸出區的接收努番 又装置移至元件承載匣集中儲放等。 由前述構裝設備之眚隊0仏 貫際钿作過程中可以得知··該構裝 設備係採取一進一出之榀备 ^ 呆作方式進行，亦即每一元件半成 品完成某項步驟後移離兮 ^ 雕該工作區，再輸入另一元件半成品 後，才繼續對該元件丰忐σ 、 千成進仃该項製程步驟，在此二元 牛成口口 A it的輸出時間中，該設備的工作端完全呈現 閒置的狀態，以致該設備有單位時間產能偏低之問題。 【發明内容】 本發月之主要目的在於提供一種可擴充式半導體元件 構U，用以解決現今半導體元作構裝製程㈣產能偏 低之問題。 為達成前揭目的，本發明所提出之技術方案在於提供 7種可擴充式半導體元件構裝設備，該構裝設備包括二組 乂上工作模組、⑨於該工作模組輸人端、輸出端的輸入裝 置、輸出裝置以及用以控制工作模組、輸入裝置、輸出裝 置作用的控制裝置，其中·· 該工作模組於其機台上言曼置二組平行的輸送帶以及一 組由驅動器驅動於二輸送帶間作三度空間移動的工 該工作模組係併列組設一起，且彼此之輸送帶對應銜接， 且驅動器受控於控制裝置； 該輸入裝置具有受控於控制裝置的推送器，用以將承 載Μ内的工件依控制裝置預設的模式輸往工作模組特定的 聊746 輪送帶； 該輸出裝置具有受控於控制裝置的收集器，用以將完 成構裝步驟的工件自後端工作模組的輸送帶上移置承載度 内，藉此，構成-、组可以完成半導體元件特定構裝步驟的 構裝設備。 本發明經由前揭構裝設備整體之組成構造設計，於實 施時，除該設備可提供使用者依其所需擴充其工作模组外 用^其構裝步驟的項目選用特定的工作頭外，使其可適 用於夕項構裝步驟外，而且透過該構裝設備創新的設計， ，該構裝設備進行預定的構裝步驟時，配合特定的配送方 式，有效減少工作頭的間置時間，進而提升i產能。 【實施方式】 有=明可擴充式半導體元件構裝設備之施 例，凊配合參閱第一、二圖所示，並 上工作模組（1)、_輸入罗署/、匕括有二組（含）以 )以及 m '"置（2)、一輸出裝置（3 )以及一組用以控制輸入裝置 輸出梦罟r q、a l 2 )、工作模組（1 )及 輸出裝置（3)作動的控制裝置（圖未示）…： 该二工作模組（"主要係各 平行的輸送帶（U)，該二 乂 ：： 控於控制裝置的驅動構件 （11)疋由獨立党 待加工物件，且讓該二工 ）各別驅動’用以輸送 組（1)且於機台（10 、 1)各具有二該工作模 裝設-組可由驅動器（ 相對於輸送帶（11)上方 的區域作=度空n移叙 驅動於二輸送帶（11)間 間移動的工作頭（"），該驅動器（1 2 )包括受控於控制裝置的前後軸向驅動件（⑴） 左=向驅動件（122)及上下轴向驅動件（η ’该别後軸向驅動件（〗9 ” 1 2 1 )裝設於機台（1 0 )上， 1右軸向驅動件卩1 P 9 , )羞5又於則後軸向驅動件（1 2 移動上:可為前後抽向驅動件（1 2 1 )驅動作前後軸向 移二f下轴向驅動件（123)裝設於左右轴向驅動件 叙杜ri)，上下轴向驅動件（123)可為左右軸向驅 22)驅動作左右軸向移動，該工作頭（1 則裝设於上下軸向驅動件（ 1卞、丄23)上，工作頭（13) _ 可為上下軸向驅動件（1 2 3 )驅動作上下軸向移動，藉 此’結合前後軸向驅動件（1川、上下軸向驅動件； 1 2 3 )以及左右軸向驅動件（1 2 2 )之驅動控制，使 工作頭可作三度空間的移動； 該輸入裝置（2)包括-組設於前工作模組（1 )輪 入端的導轨f 9 TJ I Z 1 )，以及一組受控於控制裝置沿導軌（ 2^)移動的推送器（2〇)，該推送器（2〇)中且具 有組以上用以將元件承載匣内推出待加工半成品的推送鲁 口亥輸出裝置（3 )包括一組設於後工作模组（工） 入端的導勒^ f q 1、 k d丄），以及一組受控於控制裝置沿導軌（ 3:)移動的收集器（30)，該收集器（30)中具有 組以上用以後工作模組（1 )輸送帶（1 1 )上完成加 工的=成品移置承載s内的收集構件（32)。 月J述工作模組中之工作頭（丄3 )上設有投光構件（ 580746 ^二V以及連接控制裝置的影像感測元件（13 2)( ’藉以配合控制裝置以影像位置判斷手段，確定工 作頭 (1 〇 \ 疋否位於預定工作點處，達成精確定位之功 則述工作模、组（1 )為點膠用途時，該工作模組（]_ )之工作 Γ 1 Q、 ,- *j. (13)可裝設點膠構件，且該工作模組（i 測重器（134);該工作模組⑴為植片 … 時，该工作模、组（1 )之工作頭（1 3 )可裝 設真空吸嘴，且於該工作模《且（1…广 13)了裝 5，r , Q 〇 锻、、且Q 1 )中设置一組位置校正 ^ )，該位置校正器（1 3 3 )為一連接栌制裝 測元件’藉以利用影像位置判斷手段確定工作' 頭（1 3 )所吸取的物件是否偏斜。 、前述中設於工作模組（1)中用以驅動工作頭（13 的驅動器（1 2 )中，該前後轴向驅動件（"工） f右軸向驅動件（1”）以及上下軸向驅動#(123 可=控：控制裝置的伺服馬達結合螺桿之傳動機構設 °十 驅動工作頭（1 3 )作三度空間㈣。 有關本發明所提出的可擴充式半導體 依構裝步驟的需要，使用如第一 ：構裝-備可 ,^ ^ 從用如弟、一圖所不的二組工作模 、、且’或者，亦擴充為四組工作模組。該構裝設 半導體元件構裝製程中於载體上點膝之步驟、體^ 點膠黏著晶片之步驟、或於載體上點膠黏著散熱片、.· •等構裝製程步驟。 首先以上述於載體上點膠黏著散熱片之構裝步驟為例 9 580746 來說明本發明之實施方式，#第三、四圖所示，其中：該 構裝设備使用二組併接一起的工作模組（丄A )( 1 B ) ’使其形成二道作業線A、B，各作f線⑷、（b )各有 對應串聯一起二個工作區（A1、A2)、（b1、B2)，其中第一 H组（1 A ) #工作頭（i 3 a )為銜接膠體供應源 的點膠頭，其點膠量的控制，可配合第一工作模組（丄A )中預設的測重器（1 3 4 )來控制，第二工作模組（i B)的工作頭（！ 3B)為可取置散熱片的真空吸嘴，輸 入裝置（2 )位於該第一工作模組（工A)的輸入端，輸 出裝置（3)於該第二工作模組（丄B)的輸出端。 其次，係、由輸入裝置（2 )"軌（2丄）推移承載 匣先對作業線A輸入：^牛a，該工彳& 由第一工作模 組（1A)的輸送帶移送工作區A1中定位，第一工作模組 (1 A )以驅動器（1 2 A )驅動工作頭（丄3 A )移至 乍區A1對工件a上各元件單元特定位置進行點膠步驟， 其中工作頭且藉由側邊的投光構件（丄3 i )對工件&的 投光，以及影像感測元件（i 3 2 ) g己合控制裝置作精確 對位（如第二圖所示者），使膠體可以點置於工件a上的 正確位置，又工件a於點膠的同時，輸入裝置（2 )自承 載E對作業線B輸入工件b，並由第一工作模& ( 1 的輸送帶移送至工作區B1定位，當第-工作模組（丄A) 工作頭（1 3 A )於工作區A1完成對工件 ，接鎢銘石丄 卞a <點膠步驟後 接:移至卫件區B1對卫件b進行點膠工作，而完成點膠 、工件a即由第一工作模組（1 a )的輸送帶移送至第二 10 580746 工作模組（1 B )的工作區A2中定位預備進行黏著散敎片 之步驟，此時’輸入裝置（2)對作業線八輸入工件c:第 一工作模組（1A)的輸送帶移至工件區M中定位，而工 件b完成點膠後由第一工作模組（1A)的輸送帶移送至 第二工作模組（1B)的工作區β2 U位預備進行黏著气 熱片之步驟，同時，輸入裝置（2)另對作㈣B輸入： 件d’以此方式’第一工作模組（丄A)接續對工作區μ 、工作區Β1的卫件進行點膠卫作，輸人裝置（2 )依序對 作業線A、作業線Β輸人工件，進行卫件的點膠動作。 又，第二工作模組（1 B )係以驅動器（丄2 B )驅 動其工作頭（13B)自散熱片放置i(l4)吸取一= 熱片，先行移至位置校正器（i 3 3 )處判斷位置是否: 確，若散熱片位置不正時，可先行由工作頭（丄3 B ^ 整位置後，移置位於卫作區A2處的工件a特定位置上，2 至工件a上各元件單元均黏著有散熱片為止，再接續移至 工作區B2處對工件以行黏著散熱片之步驟，而完 散熱片的工件a經第二工作模組（1B)的輸送帶移向 :端，由輸出裝置（3)的收集器（3〇)沿導軌移動： 準輸送帶，將工件a收納於承載匣内，以此方式，第一、 作模組"B)以其工作頭（13B)持續對工作區；2, 工作區B2的工件進行黏著散熱片卫作，輸出裝置〇 ) 序將完成黏著散熱片的工件收納於承載匣内。 依 再以對載體上内、外區間進行點膠之構裝步驟為例， ，、中·該構裝設備使用二組併接一起的工作模組（ 11 580746 使其形成二道作業線A、B，各作業線（A )、（ B )各有對 應串聯一起二個工作區（Al、A2)、（Bl、B2)，其中第一、 第 作拉組（1 )的工作頭（1 3 )均為銜接膠體供應 源的點膠頭，其點膠量的控制，可配合工作模組（丄）中 員又的’則重器（1 3 4 )來控制，並利用工作頭側邊的投 光構件（1 3 1 )、影像感測元件（工3 2 )結合控制裝 置作位置的判斷。其次’係由輸入裝置（2 )自承載匡内 依序輸出工件於第一工作模組的工作區Α1、βι上，並由第 一工作模、组（i A )的工作頭（丄3 A )先後對工件區ai _ 、工作區B1的工件進行外側區間的點膠作業，而完成外側 區間點膠作業的工件先後移至第二工作模組（1 B )工作 頭（1 3 B )依序對工件進行内側區間的點膠作業，同時 輸入裝置（2)自承載匣内依序對第一工作模組（1A) 的作區Al、B1輸入工件預備進行内側區間的點膠作業， 而由第二工作模組（1 A )完成内側區間點膠作業的工件 ，再藉輪出裝置（3)依序收置於承載匣内。 又以對載體上特定的區間進行點膠之構裝步驟為例，_ 其中：該構裝設備使用二組併接一起的工作模組（1)， 使其形成二道作業線A、B，各作業線（A )、（ B )各有對 應串聯起二個工作區（Al、A2)、（Bl、B2)，其中第一、 第一工作模組（X )的工作頭（i 3 )均為銜接膠體供應 、、的1 I頭，其點膠量的控制，可配合工作模組（1 )中 預没的測曹哭γ 0 1、七 $裔（1 3 4 )來控制，並利用工作頭（1 3 ) 側邊的投光構件（1 3 1 )、影像感測元件（1 3 2 )結 12 580746 合控制裝置作位置的判斷。其次，係由輸入裝置（2 )自 承載E内對作業線A輸出第一工件於第一工作模組（工a )的工作區A1上’即由第一工作模組（ia)的輸送帶轉 达第一工作模組（1 β)的輸送帶移至工作區⑽），由第 二工作模組（1 B)的工作頭（1 3)對該第一工件進行 «步驟’當第—工件進入第二工作模組（ΐβ)時，輸 入裝置（2 )接續對第一工作模組（工Α )輸入第二工件 ’並為第—工作模組（1 Α)的輸送帶移至卫作區（Α1) ’由第一工作模組（1 Α)的卫作頭（1 3 )對該第二工 件進行點膠步驟。580746 发明 Description of the invention [Technical field to which the invention belongs] The present invention relates to an expandable semiconductor component mounting device, and particularly to a kind of conductive material that uses conductive conductors and county materials to perform dependent actions such as sticking crystals and adhering heat. Film, dispensing, ... and other steps of the construction equipment, and can effectively reduce the waiting time of the working end of the equipment to improve the ability. 9 [Previous technology] Today's semiconductor device fabrication process differs depending on the selected wafer carrier or the type of assembly. The implementation process of the fabrication process differs, but in general, The assembly process generally includes: the wafer is cut into a plurality of small wafers, the wafer is adhered to the carrier, the wafer and the carrier are preliminarily connected; the main steps of the electrical connection of pins, molding and sealing, etc., in addition, in order to improve the semiconductor 7G parts The heat dissipation effect, before the molding and sealing, will increase the step of planting a metal heat sink on the carrier. The semiconductor components described in the previous month are used to complete the process steps of all the previous items, and are completed using special equipment. Take the steps of the Bo Ji Feng Zhi Zhi Zheng Zhi film as an example. The semi-finished product with the wafer is placed in the carrier box, and after being transported to the input area of the device, the pushing device mother-person at the input end of the device pushes a mouthpiece + bearing from the carrier box. On the conveyor belt, the semi-finished product is transferred to the semi-finished product on the semi-finished product via the conveyor belt. Each of the & n is free of charge, and is moved from the conveyor belt to the next meter. Positioned at y pre-positions, and then sucked from the device's hot-film placement area-heat sinks, transplanted at 5 pre-positions of the semi-finished product. After the heat sink is attached, it is moved to the output area on the other side of the device by the 钤 and 篆 suspected Putian belts, and the device is moved to the component carrying box for centralized storage by the receiving device of the δ Xuan output area. It can be learned from the above-mentioned operation process of the assembly equipment that the assembly equipment is used. The assembly equipment adopts a one-in-one-out preparation ^ daze mode, that is, each component semi-finished product is moved backward after completing a certain step. Li Xi ^ Carve the work area, and then enter another component semi-finished product, and then continue to enter the process steps of the component Feng σ, Qian Cheng, in the output time of the binary Niu Chengkou A it, the The working end of the equipment is completely idle, so that the equipment has a problem of low productivity per unit time. [Summary of the Invention] The main purpose of this month is to provide an expandable semiconductor device structure U, which is used to solve the problem that the current semiconductor device fabrication process has a low production capacity. In order to achieve the purpose of the previous disclosure, the technical solution provided by the present invention is to provide 7 kinds of expandable semiconductor component assembly equipment, the assembly equipment includes two sets of working modules on the input terminal of the working module, Input device, output device, and control device for controlling the function of the work module, input device, and output device. Among them, the work module has two sets of parallel conveyor belts and one set driven by a driver on its machine. The work modules are moved side-by-side between the two conveyor belts, and the work modules are arranged side by side, and the conveyor belts are connected to each other, and the driver is controlled by the control device. The input device has a pusher controlled by the control device. To output the workpieces in the bearing M to the specific chat module 746 carousel according to the preset mode of the control device; the output device has a collector controlled by the control device, which is used to transfer the completed assembly steps. The workpiece is shifted from the conveyor belt of the back-end work module into the carrying capacity, thereby constituting the assembly equipment that can complete the specific assembly steps of the semiconductor components. The present invention is designed through the composition and structure of the entire front-loading construction equipment. When implemented, the equipment can provide users with the ability to expand their work modules according to their needs. It can be applied outside the construction steps of the item, and through the innovative design of the construction equipment, when the construction equipment performs a predetermined construction step, it cooperates with a specific distribution method to effectively reduce the interposition time of the work head, thereby improving i Capacity. [Embodiment] There are examples of expandable semiconductor component mounting equipment, please refer to the first and second figures for cooperation, and add the working module (1), _ input, and / or two sets (Inclusive) with) and m '" device (2), an output device (3), and a set of input devices to control the output of nightmare rq, al 2), work module (1) and output device (3) Control device for operation (not shown) ...: The two working modules (" are mainly parallel conveyor belts (U), and the two are :: The driving member (11) controlled by the control device) is handled by the independent party Process the object and let the two workers) drive individually to transport the group (1) and each of the machines (10, 1) has two of the working molds installed-the group can be driven by the driver (relative to the conveyor belt (11) above The area is equal to the degree of space n shifting the working head (") that is driven between the two conveyor belts (11). The driver (1 2) includes the front and rear axial drives (⑴) controlled by the control device. Left = The driving member (122) and the upper and lower axial driving members (η 'The other rear axial driving member (〗 9 ”1 2 1) are installed on the machine (1 0), 1 right axial drive 卩 1 P 9,) 5 and then the rear axial drive (1 2 move up: can be driven forward and backward for the forward and backward drive (1 2 1) for axial movement The two lower axial drive members (123) are installed on the left and right axial drive members (Sidurri), the upper and lower axial drive members (123) can be left and right axial drives 22) are driven for left and right axial movement, and the working head ( 1 is installed on the upper and lower axial drive parts (1 卞, 丄 23), the working head (13) _ can be driven by the upper and lower axial drive parts (1 2 3) to move up and down axially, thereby 'combining the front and rear axles The drive control of the drive member (1, 1 and 2 axial drive members; 1 2 3) and the left and right axial drive members (1 2 2), so that the working head can be moved in three degrees; the input device (2) includes -A guide rail f 9 TJ IZ 1) arranged at the wheel-in end of the front working module (1), and a set of pushers (20) controlled by the control device moving along the guide rails (2 ^), the pushers (2) 20) and there are more than two sets of push-out Lukouhai output devices (3) for pushing out the semi-finished products to be processed in the component carrying box, including a set of guides provided at the input end of the rear working module (tool). ^ fq 1, kd 丄), and a set of collectors (30) controlled by the control device moving along the guide rail (3), the collector (30) having more than one set of later-used working modules (1) conveyor belt (1 1) Finished processing = Collecting member (32) in the finished product displacement bearing s. The work head (丄 3) in the work module described in month J is provided with a light projection member (580746 ^ two V and connection control The device's image sensing element (13 2) ('Cooperate with the control device to determine the position of the work head (1 0 \ 疋 is located at a predetermined working point by means of image position judgment means, to achieve the precise positioning of the work, the working mode, group (1 ) For dispensing applications, the work module (] _) works Γ 1 Q,,-* j. (13) Dispensing components can be installed, and the work module (i weight gauge (134); When the working module ⑴ is implanted ..., the working head and the working head (1 3) of the group (1) can be equipped with a vacuum nozzle, and 5 can be installed in the working mold "and (1 ... wide 13), r, Q 〇 forging, and Q 1) is provided with a set of position correction ^), the position corrector (1 3 3) is a connection to a fabricated mounting test element to use image position judgment Working period determination 'head (13) whether the object drawn by deflection. 1. The front and rear axial drive members (" manipulators) f right axial drive members (1 ") and up and down in the driver (1 2) provided in the work module (1) for driving the work head (13). Axial drive # (123 can be controlled: the servo motor of the control device is combined with the drive mechanism of the screw to set ten driving heads (1 3) for three degrees of space). The expandable semiconductor-based assembly steps related to the present invention For the needs, use such as the first: configuration-Bei Ke, ^ ^ From the use of two sets of working models, and 'or, also expand to four sets of working modules. This configuration is equipped with semiconductor components Steps of arranging knees on a carrier in a construction process, a step of applying a wafer to a substrate, or a heat sink on a carrier, etc. • First, perform the above-mentioned steps to administer an adhesive on a carrier. The installation steps of the heat sink are described in Example 9 580746 to illustrate the embodiment of the present invention, as shown in the third and fourth figures, where: the installation equipment uses two sets of working modules (丄 A) connected in parallel (1 B ) 'Make it into two working lines A, B, each f line ⑷, (b) has a corresponding string Two working areas (A1, A2) and (b1, B2) together, where the first H group (1 A) #working head (i 3 a) is the dispensing head connected to the colloid supply source, and the amount of dispensing is controlled , Can be controlled with the preset weight gauge (1 3 4) in the first work module (丄 A), and the work head (! 3B) of the second work module (i B) is a vacuum with a removable heat sink The nozzle, the input device (2) is located at the input end of the first work module (Work A), and the output device (3) is located at the output end of the second work module (丄 B). Secondly, the input device (2) The track (2 丄) moves the carrier box and enters the work line A first: ^ 牛 a, which is positioned in the work area A1 by the conveyor belt of the first work module (1A). The work module (1 A) uses a driver (1 2 A) to drive the work head (丄 3 A) to move to the area A1 to perform the dispensing step on a specific position of each component unit on the workpiece a. The work head and the The light projecting member (丄 3 i) projects the light of the workpiece & and the image sensing element (i 3 2) g accurately controls the positioning device (as shown in the second figure), so that the colloid can be spotted. When the workpiece a is dispensed at the correct position on the workpiece a and the workpiece a is dispensed, the input device (2) inputs the workpiece b from the carrying E to the work line B, and is transferred to the work by the first working mold & (1) Positioning in zone B1, when the first-working module (丄 A) working head (1 3 A) completes the workpiece alignment in the working zone A1, connect tungsten agate 丄 卞 a < dispensing step followed by: move to the guard zone B1 Dispensing the guard piece b, and after completing the dispensing, the workpiece a is transferred from the conveyor of the first work module (1 a) to the work area A2 of the second 10 580746 work module (1 B). The step of adhering the scattered pieces is performed. At this time, the input device (2) inputs the workpiece to the working line c: The conveyor of the first work module (1A) is moved to the workpiece area M for positioning, and the workpiece b is finished after dispensing. Transfer from the conveyor belt of the first work module (1A) to the work area β2 of the second work module (1B) to prepare the step of adhering the gas and heat sheet, and at the same time, the input device (2) also inputs the operation ㈣B: Piece d 'in this way' the first work module (丄 A) continues to perform glue dispensing work on the guards in the work area μ and the work area B1, and enters the equipment. (2) sequentially on the operating line A, input Β artificial member operating line, for dispensing operation guard member. In addition, the second working module (1 B) is driven by a driver (丄 2 B) and its working head (13B) is placed from the heat sink i (l4) to suck one = hot sheet, and then it is moved to the position corrector (i 3 3 ) To determine whether the position is: indeed, if the heat sink is not in the correct position, you can first move the work head (丄 3 B ^ after the position is adjusted, and then move the workpiece a at a specific position in the work area A2, 2 to the workpiece a The component units are all adhered to the heat sink, and then they are moved to the work area B2 to adhere the heat sink to the workpiece, and the workpiece a after the heat sink is moved to the end by the conveyor of the second work module (1B). The collector (30) of the output device (3) moves along the guide rail: the quasi-conveyor belt stores the workpiece a in the carrier box, in this way, the first, the module " B) uses its working head ( 13B) Continue to work on the work area; 2. Work on the work area B2 is adhered to the heat sink, and the output device is 0) The workpiece with the adhered heat sink is sequentially stored in the carrier box. Take the assembly steps for dispensing the inner and outer sections on the carrier as an example. The assembly equipment uses two sets of work modules (11 580746) connected in parallel to form two operation lines A and B. Each work line (A), (B) has two corresponding working areas (Al, A2), (Bl, B2) connected in series, of which the working heads (1 3) of the first and the first pull group (1) Both are dispensing heads that are connected to the colloidal supply source. The control of the amount of dispensing can be controlled by the staff of the work module (丄) and the weight controller (1 3 4), and the light emitted from the side of the work head is used. The component (1 3 1), the image sensing element (work 3 2) are combined with the control device to determine the position. Secondly, the input device (2) sequentially outputs the workpieces to the working area of the first work module from the self-supporting Marina. A1, βι, and the first work die, the work head (i 3 A) of the group (i A) successively dispense the work in the work area ai _ and work area B1 in the outer section, and complete the outer section. The work of the glue operation is successively moved to the second work module (1 B) and the work head (1 3 B) of the inner section of the work is sequentially performed. For the glue operation, the input device (2) sequentially enters the work area Al, B1 of the first work module (1A) from the bearing box to prepare the work for the inner interval, and the second work module (1 A) The workpieces that have completed the inner section dispensing operation are then sequentially placed in the carrier box by the take-out device (3). Taking the assembly step of dispensing the specific sections on the carrier as an example, where: The installation equipment uses two sets of work modules (1) connected in parallel to form two working lines A and B, and each of the working lines (A) and (B) has two working areas (Al, A2) connected in series. ), (Bl, B2), where the working heads (i 3) of the first and first working modules (X) are all 1 I heads that are connected to the colloid supply, and the dispensing volume control can be matched with the working mold. The measurement of Cao crying in group (1) was controlled by γ 0 1 and 7 (1 3 4), and the light emitting member (1 3 1) and image sensing element on the side of the working head (1 3) were used for control. (1 3 2) End 12 580746 The control device is used to judge the position. Secondly, the input device (2) outputs the first workpiece to the work line A from the load bearing E in the first On the working area A1 of the working module (work a), that is, the conveyor belt of the first working module (ia) is transferred to the working belt of the first working module (1 β) and moved to the working area ⑽). The work head (1 3) of the work module (1 B) performs «steps" on the first workpiece. When the first workpiece enters the second work module (ΐβ), the input device (2) continues to the first work module. (Work A) Input the second workpiece 'and move the conveyor belt of the first work module (1 Α) to the Wei Zuo area (Α1)' by the Wei Zuo head (1 3) of the first work module (1 Α) A dispensing step is performed on the second workpiece.
另輸入裝置對第一工作模組（1 A )輸入第二工件之 後，接續以上述之方式依序對作㈣人第三、第四工 件，使其分別移至工作區B卜工作區B 工作模組(1B)之工作頭（1第一 I作頭（13)於完成作業 =工作區Μ、工作區A2的工件點膠作業後，接續移至作 業線B工作區M、B2的卫件進行點膠作業，而作業線 完成點膠作㈣工件透過第—、第二工作模組（1、A)( 1B)的輸送帶配合輸出裝 ®展置（3)依序收置於承載e内 ，作業線B上完成點膠作業後亦以此方式收置」 ，如此’直至所有工件完成點膠作業為止。 再者’本發明使用四組併一起的工作模組時 道各包括有四個工作區的作業線， 二 位於该工作模組⑴群的輸入端，輪出 (二） 工作模組（1)群的輸出端，於操作時，可以第一該 13 工 作模組同時；隹彡一 4 組同時進行相同：第目，第一道步驟’第三、第四工作模 輸入工件i 帛—道’輸入裝置依序對其作業線 件進行作r之工作™ 步驟，或者，由兮進二出之方式接續完成該工件之 ..μ四工作模組依序進行某項加工步驟，· 寻寺0 巾’^ 了解本發料 计於實施時，除哕讯供^ 傅i 口又1有口又 « 模組辦加產旦傷可提供使用者依其所需擴充其工作 ，使^可以:、、’或依其構裝步驟的項目選用特定的工作頭 ，且I工作二泛地適用於多項半導體元件的構裝步驟之外 裝置租成1 =工作頭在投光構件、影像感測元件與控制 定：的广像判斷機制，使工作頭可於工件上進行精確 h備更透過該構裝設備創新的發明設計，使該構 二備進订某項構裝步驟時’配合特定的工件配送手段， t工作模組的工作頭得以接續進行其預定的工作，有效 地減少該工作頭的間署主 揮至極致。 · β ’吏該構裝設備的產能可以發 綜上所述，本發明藉其創新的發明設計，確可解決習 ^構農設=產能偏低之問題，而提供一項更具產業利用價 值之構裝設備，故本發明符合發 文提出申請。 L發月專利之要件，羡依法具 14 580746 【圖式簡單說明】 (一）圖式部分 第一圖係本發明構裝設備之俯視平面示意圖（代表圖） 第二圖係本發明構裝設備之前視平面示意圖。 第三圖係本發明之實施狀態參考圖（一）。 第四圖係本發明之實施狀態參考圖（二）。 (二）元件代表符號After another input device inputs the second work piece to the first work module (1 A), it continues to make the third and fourth work pieces in the above-mentioned manner in order to move it to work area B and work area B respectively. The working head of the module (1B) (1 the first I as the head (13) after finishing the job = work area M, work area A2 workpiece dispensing operation, then move to the work line B work area M, B2 guards Carry out the dispensing operation, and the operation line completes the dispensing operation. The workpieces are sequentially placed on the carrier through the conveyor belts of the first and second working modules (1, A) (1B) with the output device ® display (3). In this way, after the dispensing operation is completed on the operation line B, it is also received in this way ", so that 'until all the workpieces have completed the dispensing operation. Furthermore,' the present invention uses four groups of working modules each including four channels each. The working line of each work area is located at the input end of the work module ⑴ group, and the (two) work module (1) output of the group is rotated. During operation, the 13 work modules can be the first at the same time; 隹彡 One group of 4 performs the same at the same time: the first step, the first step 'the third and fourth working mold input workpiece i —The 'input device' performs sequential work ™ steps on its working wire pieces, or, successively completes the workpiece in the form of two-in-two-out.... The four work modules sequentially perform a certain processing step, · Seeking temples 0 ^ 'Understand that when this material is planned to be implemented, in addition to the information provided by ^ Fu i mouth and 1 mouth and «module office plus production of injuries can provide users to expand their work according to their needs, so that ^ Can: ,, ', or select a specific work head according to the project of its construction steps, and I work is generally applicable to the installation steps of multiple semiconductor components. 1 = The work head is in the light-emitting component, image sense Measuring components and control: The wide-image judgment mechanism enables the work head to be accurately prepared on the workpiece. Through the innovative invention design of the construction equipment, the construction equipment can 'cooperate with a specific workpiece when ordering a certain construction step. With the distribution means, the work head of the t work module can continue to perform its predetermined work, effectively reducing the number of heads of the work head to the extreme. · Β 'The production capacity of the construction equipment can be summarized as described above. The present invention By virtue of its innovative invention design It can solve the problem of low agricultural production = low production capacity, and provide a structural equipment with more industrial utilization value, so the present invention is in line with the application for filing. L issuance of the monthly patent requirements, envy 14 580746 according to law [Figure Brief description of the formula] (1) The first part of the schematic part is a schematic plan view (representative view) of the top of the present invention. The second view is a schematic plan view of the front of the present invention. The third view is an implementation state of the present invention. Refer to Figure (1). The fourth figure is the reference diagram (2) of the implementation status of the present invention.
(1 )工作模組 （1 0 )機台 (1 1 )輸送帶 （1 1 1 )驅動構件 (1 2 )驅動器 (1 2 1 )前後軸向驅動件 (1 2 2 )左右軸向驅動件 (1 2 3 )上下軸向驅動件 (1 3 )工作頭 (131)投光構件 (1 3 3 )位置校正器 (14)散熱片放置區 (2 )輸入裝置 (2 1 )導軌 (3 )輸出裝置 (3 1 )導執 (1 3 2 )影像感測元件 (1 3 4 )測重器 (2 0 )推送器 (2 2 )推送構件 (3 0 )收集器 (3 2 )收集構件(1) Work module (1 0) Machine table (1 1) Conveyor belt (1 1 1) Drive member (1 2) Drive (1 2 1) Front and rear axial drive parts (1 2 2) Left and right axial drive parts (1 2 3) Up and down axial drive (1 3) Working head (131) Light projection member (1 3 3) Position corrector (14) Heat sink placement area (2) Input device (2 1) Guide rail (3) Output device (3 1) Guidance (1 3 2) Image sensing element (1 3 4) Weight measuring device (2 0) Pusher (2 2) Push member (3 0) Collector (3 2) Collecting member
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