CN110208460B - Supporting structure of microstructure gas detector and preparation method thereof - Google Patents
Supporting structure of microstructure gas detector and preparation method thereof Download PDFInfo
- Publication number
- CN110208460B CN110208460B CN201910436979.XA CN201910436979A CN110208460B CN 110208460 B CN110208460 B CN 110208460B CN 201910436979 A CN201910436979 A CN 201910436979A CN 110208460 B CN110208460 B CN 110208460B
- Authority
- CN
- China
- Prior art keywords
- gas detector
- melt adhesive
- adhesive film
- hot melt
- release paper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/0004—Gaseous mixtures, e.g. polluted air
- G01N33/0009—General constructional details of gas analysers, e.g. portable test equipment
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Food Science & Technology (AREA)
- Combustion & Propulsion (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Measuring Oxygen Concentration In Cells (AREA)
Abstract
A microstructure gas detector supporting structure and a preparation method thereof are disclosed, wherein the method comprises the following steps: s1, setting laser cutting parameters, wherein the parameters comprise cutting distance, size and pattern; s2, carrying out laser cutting on the hot melt adhesive film (1) adhered to the release paper (2) according to the parameters until the hot melt adhesive film (1) is completely cut through but the release paper (2) is not cut, and forming a support gasket (5) array with a frame (6); s3, one surface of a hot melt adhesive film (1) of a support gasket (5) array with a frame (6) is tightly attached to a reading anode plate (3) of the microstructure gas detector, and pressure and hot pressing are applied from one surface of release paper (2) by using flat plate hot pressing to form a support structure; s4, placing the stainless steel screen (7) of the microstructure gas detector on a supporting structure and performing hot pressing, so that the reading anode plate (3) is connected with the stainless steel screen (7) in a solid mode. The method has high processing precision and efficiency, and the stability of the detector is improved by the support structure prepared by the hot melt adhesive film.
Description
Technical Field
The invention relates to the field of microstructure gas detectors, in particular to a supporting structure of a microstructure gas detector and a preparation method thereof.
Background
In a common microstructure gas detector Micromegas, an amplifying structure of the microstructure gas detector Micromegas consists of a stainless steel wire mesh and a reading anode, an air gap is formed between the stainless steel wire mesh and the reading anode by utilizing a supporting structure, and the size and uniformity of the air gap between the stainless steel wire mesh and the anode have direct influence on the amplification factor of the detector.
In the prior art, an anode circuit board and two layers of photosensitive films (the thickness of a single layer is 64um) with photosensitive capability are pressed into a whole in a rolling mode, and then the photosensitive films are made into supporting columns with the diameter of 300um and the distance of 2mm by adopting a photoetching technology. Then, a stainless steel wire mesh with a certain tension is placed on the surface of the support gasket, and the wire mesh is adsorbed on the surface of the gasket by virtue of the electrostatic attraction between the wire mesh and the anode. Thus, a uniform air gap of 128um is formed between the sensing anode and the stainless steel wire mesh. However, the performance of the suspended wire mesh (virtual connection) Micromegas detector manufactured by the technical scheme is not stable. The supporting columns of the detector silk screen are very close in distance, the supporting density is high, and the problem that the detector is difficult to clean is solved by adopting an exposure and etching method, particularly a large-area detector. Meanwhile, the supporting columns on the circuit board are easy to fall off, so that the corresponding areas are not supported, and the tension of the floating screen is not high (15N/cm), so that ignition and discharge are easy to generate. Before the gaskets are machined by laser, the gaskets are manually placed one by one; for a large-area detector, the distance between the stainless steel wire mesh and the supporting gaskets between the anodes is kept unchanged, the quantity of the gaskets is greatly increased, the processing difficulty is greatly increased, the quality, the batch manufacturing efficiency and the batch manufacturing precision of the detector are influenced, and the large-area detector is not favorably manufactured.
Disclosure of Invention
Technical problem to be solved
Aiming at the technical problems, the invention provides a supporting structure of a microstructure gas detector and a preparation method thereof, which are used for solving the problems of detector sparking discharge caused by virtual connection between a stainless steel wire mesh and an anode and high difficulty, low efficiency and low precision in the processing process.
(II) technical scheme
The invention provides a preparation method of a microstructure gas detector supporting structure on one hand, which comprises the following steps: s1, setting laser cutting parameters, wherein the parameters comprise cutting distance, cutting size and cutting pattern; s2, carrying out laser cutting on the hot melt adhesive film 1 adhered to the release paper 2 according to the parameters until the hot melt adhesive film 1 is completely cut through but the release paper 2 is not cut, and forming a support gasket 5 array with a frame 6; s3, one surface of the hot melt adhesive film 1 with the support gasket 5 array of the frame 6 is tightly attached to the reading anode plate 3 of the microstructure gas detector, and pressure is applied from one surface of release paper by using flat plate hot pressing to form a support structure; s4, placing the stainless steel screen 7 of the microstructure gas detector on a supporting structure and carrying out hot pressing, so that the reading anode plate 3 is in solid connection with the stainless steel screen 7.
Optionally, in step S2, the cutting pitch does not exceed 1cm by 1 cm.
Optionally, in step S2, the cut size is no more than 1mm in diameter.
Optionally, before step S1, the method further includes: s0, flattening the hot melt adhesive film 1 adhered on the release paper 2;
optionally, the solid-connection distance between the readout anode plate 3 and the stainless steel screen 7 is hundreds of microns.
Optionally, in step S3, one side of the hot melt adhesive film 1 with the array of support pads 5 of the frame 6 is fixed with the readout anode plate 3 of the microstructure gas detector along the edge of the release paper 2 by using an adhesive tape.
The invention provides a supporting structure of a microstructure gas detector, the supporting structure is a supporting gasket 5 array formed by hot melt adhesive films 1, each supporting gasket 5 comprises: a first glue layer 101, a substrate layer 102 and a second glue layer 103; the substrate layer 102 is formed between the first glue layer 101 and the second glue layer 103, the first glue layer 101 penetrates into mesh holes of the stainless steel wire mesh 7 of the microstructure gas detector, and the second glue layer 103 infiltrates into the reading anode plate 3 of the microstructure gas detector.
Optionally, the diameter of each support pad 5 does not exceed 1 mm.
Optionally, the solid-connection distance between the readout anode plate 3 and the stainless steel screen 7 is hundreds of microns.
Optionally, the first adhesive layer 101 and the second adhesive layer 103 release adhesiveness above a predetermined temperature value.
(III) advantageous effects
The invention provides a supporting structure of a microstructure gas detector and a preparation method thereof, and the supporting structure has the following beneficial effects:
1. the hot melt adhesive film is used as the supporting structure of the microstructure gas detector, so that the stainless steel wire mesh of the detector is actually connected with the supporting gasket, the detector ignition and discharge condition caused by virtual connection is effectively avoided, and the stability of the detector is improved.
2. The laser cutting mode is applied to the array and the frame for manufacturing the hot melt adhesive film gasket, the machining precision is improved, the quantity of the gaskets is reduced, the probability of supporting the defects of the gaskets is reduced, the machining of the gasket array with smaller distance and smaller diameter can be realized, the machining speed is high, and the efficiency is high.
3. The hot melt adhesive film gasket array and the frame are pre-hot-pressed by using a flat plate hot pressing mode, so that manual placement of gaskets is avoided, and the gasket placement efficiency and precision are improved.
Drawings
FIG. 1 is a flow chart schematically illustrating a method for manufacturing a support structure of a microstructure gas detector according to an embodiment of the present invention.
Fig. 2 schematically shows a cross-sectional structure of a raw hot-melt adhesive film 1 and a release paper 2 according to an embodiment of the invention.
FIG. 3 is a schematic diagram illustrating the structure of an uncut hot melt adhesive film 1, and the array of support pads 5 and the frame 6 after cutting and peeling off the excess hot melt adhesive film 1 according to the embodiment of the invention.
Fig. 4 schematically shows a schematic diagram of the release paper 2 covering the surface of the reading anode plate 3 according to the embodiment of the invention.
FIG. 5 schematically illustrates a hot pressing of a flat plate according to an embodiment of the present invention.
Figure 6 schematically illustrates a layout of an array of support pads 5 of a read-out anode plate 3 according to an embodiment of the invention.
FIG. 7 is a schematic view showing an initial state of a flat hot-press hot-melt adhesive film 1 according to an embodiment of the present invention.
Fig. 8 is a schematic diagram showing the supporting structure of the microstructure gas detector according to the embodiment of the invention connecting the reading anode plate 3 and the stainless steel wire mesh 7.
[ reference numerals ]
1-Hot melt adhesive film
101-first glue layer 102-substrate layer 103-second glue layer
2-release paper
3-reading anode plate
4-hot pressing plate
5-support pad
6-frame
7-stainless steel wire net
Direction of F-pressure
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to specific embodiments and the accompanying drawings.
The invention provides a preparation method of a supporting structure of a microstructure gas detector, the specific flow of which is shown in figure 1, and the preparation method comprises the following steps:
and S0, flattening the hot melt adhesive film 1 adhered on the release paper 2.
In an embodiment of the present invention, the hot melt adhesive film 1 is adhered to the silica gel release paper 2 and is in a reel shape, so before laser cutting, the hot melt adhesive film 1 is first cut into small pieces as required and flattened by applying pressure, as shown in fig. 2. Secondly, the release paper 2 adhered with the hot melt adhesive film 1 is fixed on a laser cutting platform by using an adhesive tape. When the laser is fixed, the hot melt adhesive film 1 is arranged on the upper part and is close to a light outlet of the laser; the release paper 2 is arranged below and away from the light outlet of the laser. The reason for flattening the hot melt adhesive film 1 is to prevent inaccurate focusing of a laser focusing lens caused by uneven surfaces of the hot melt adhesive film 1 and the release paper 2, so that the phenomenon of over-cutting or insufficient cutting occurs.
And S1, setting laser cutting parameters including cutting distance, cutting size and cutting pattern.
And setting cutting parameters on laser control software, wherein the cutting distance is not more than 1cm x 1cm, the cutting size is not more than 1mm in diameter, and the cutting pattern is circular. In an embodiment of the present invention, the cutting patterns are arranged as a circular array with a distance of 1cm × 1cm and a diameter of 1mm, and a square hollow frame structure (the size is determined according to the requirement) arranged around the array according to the requirement of the detector.
And S2, performing laser cutting on the hot melt adhesive film 1 adhered to the release paper 2 according to the parameters until the hot melt adhesive film 1 is completely cut through but the release paper 2 is not cut, and forming an array of support gaskets 5 with a frame 6.
According to the laser parameters, the laser is in a state of cutting through the hot melt adhesive film 1 without cutting the silica gel release paper 2 (if the release paper 2 is cut, the paper scraps may not be peeled after the subsequent flat plate hot pressing, and if the cutting is insufficient, the supporting gasket 5 cannot be peeled completely). After cutting, the redundant hot melt adhesive film 1 is peeled off, and the residual support gasket 5 array and the frame 6 are left on the surface of the release paper 2 by means of self viscosity to be used in hot pressing. The hot melt adhesive film 1 before and after cutting is shown in fig. 3, wherein the left figure is the hot melt adhesive film 1 without cutting, and the right figure is the structural schematic diagram of the array of the support pads 5 and the frame 6 after cutting and peeling off the redundant hot melt adhesive film 1.
The required supporting gasket 5 can not be ensured to be completely remained on the surface of the silica gel release paper 2 by depending on the adhesiveness of the hot melt adhesive film 1 and the release paper 2, which is related to the laser cutting effect; if the laser cutting depth is too large, cutting to the release paper 2 to leave paper scraps, as described above; if the cutting depth is small, the hot melt adhesive film 1 cannot be completely cut through and cannot be partially separated from the excess hot melt adhesive film 1. By adjusting the laser parameters, the support pad 5 can remain on the release paper 2.
The laser cutting technology helps to realize the mechanization of the processing of the array of the supporting gaskets 5 and the frame 6, the array processing can realize the interval of 1cm x 1cm and the diameter of 1mm, and the number of the gaskets is reduced and the probability of the defects of the supporting gaskets 5 is reduced by means of the high moving precision of a mechanical platform and the high processing precision of laser cutting, so that the processing of the array of the supporting gaskets 5 with smaller interval and smaller diameter becomes possible; and the moving speed of the mechanical platform and the laser cutting speed are high, the array processing of the support gasket 5 can be efficiently finished, and the time is saved.
And S3, one surface of the hot melt adhesive film 1 of the support gasket 5 array with the frame is tightly attached to the reading anode plate 3 of the microstructure gas detector, and a hot pressing plate 4 is used for applying pressure and hot pressing from one surface of the release paper 2 to form a support structure.
The array of the support gaskets 5 is retained on the surface of the release paper 2 by means of self viscosity, the release paper 2 is turned over, the release paper 2 is far away from the reading anode circuit board 3 at the upper part, the hot melt adhesive film 1 is directly contacted with the reading anode circuit board 3 at the lower part, and the hot melt adhesive film is adhered to the surface of the reading anode circuit board 3 along the edge of the release paper 2 by using a high-temperature adhesive tape; as shown in fig. 4, the release paper 2 is turned over and covered on the surface of the readout anode circuit board 3, the upper release paper 2 is grayish white, and the dotted circles indicate the lower support pad 5 array. Finally, a hot pressing plate 4 is used for applying pressure and hot pressing from one side of the release paper 2, as shown in fig. 5, after the hot melt adhesive film 1 is heated to a certain temperature (different according to the product model and the type of the adhesive), the first adhesive layer 101 on the surface of the hot melt adhesive film 1 starts to release viscosity and starts to infiltrate onto the reading anode plate 3, when the temperature reaches the optimal melting temperature, the viscosity of the first adhesive layer 101 of the hot melt adhesive film 1 is fully released, the fluidity of the adhesive layer reaches the maximum, and the infiltration reading anode plate 3 reaches the optimal effect. After that, the heating of the hot melt adhesive film 1 is stopped, the temperature is reduced to room temperature, and the first adhesive layer 101 is gradually solidified in the process of temperature reduction and returns to the semi-solidified state.
S4, placing the stainless steel screen 7 of the microstructure gas detector on a supporting structure and carrying out hot pressing, so that the reading anode plate 3 is in solid connection with the stainless steel screen 7.
After the hot melt adhesive film 1 is cooled to room temperature, the release paper 2 is peeled off; the hot-melt adhesive film 1 is pre-pressed on the readout anode circuit board 3 as shown in fig. 6. Preheating and pressing the supporting gasket 5 and the frame 6 are finished.
The stainless steel wire net 7 with tension is placed on the upper surface of the support gasket 5 array, the stainless steel wire net 7 is hot-pressed by a roller press, the second adhesive layer 103 on the surface of the hot melt adhesive film 1 starts to release viscosity, when the temperature reaches the optimal melting temperature, the viscosity of the second adhesive layer 103 of the hot melt adhesive film is fully released, the flowability of the second adhesive layer 103 reaches the maximum, and the stainless steel wire net 7 penetrates to reach the optimal effect. And then, stopping heating the hot melt adhesive film 1, cooling the hot melt adhesive film to room temperature, gradually solidifying the adhesive layer in the cooling process, recovering to a semi-solidified state, and cutting off the redundant stainless steel wire mesh after cooling to the room temperature. The hot melt adhesive film 1 thus bonds the stainless steel mesh 7 to the readout anode plate 3.
In steps S4 and S5, the initial state of the hot pressing is shown in fig. 7, the state after the hot pressing is completed is shown in fig. 8, the first adhesive layer 101 of the hot melt adhesive film 1 penetrates through the meshes of the stainless steel wire mesh 7, and the thickness of the second adhesive layer 103 is reduced. Rely on 1 self of hot melt adhesive membrane from type paper 2, combine the mode of platform hot pressing, realized putting the transformation of the integrative hot pressing of support gasket array 5 and frame 6 from the manual gasket of monomer, avoided the manual work to put the gasket, improved the gasket and put efficiency and precision. The mechanized gasket placing mode is particularly suitable for placing a large number of hot melt adhesive film gaskets in a large-area detector. Meanwhile, the supporting structure prepared by the method adopts the supporting distance not less than 10mm, the quantity of the gaskets is reduced, the probability of supporting the defects of the gaskets is reduced under the condition that the supporting area ratio is not increased (less than 1%), and meanwhile, the larger supporting distance is beneficial to cleaning the sensitive area of the detector.
The embodiment of the invention provides a supporting structure of a microstructure gas detector, which is a supporting gasket 5 array formed by hot melt adhesive films 1. As shown in fig. 8, each support pad 5 includes:
the microstructure gas detector comprises a first glue layer 101, a substrate layer 102 and a second glue layer 103, wherein the substrate layer 102 is formed between the first glue layer 101 and the second glue layer 103, the first glue layer 101 penetrates into mesh holes of a stainless steel wire mesh 7 of the microstructure gas detector, and the second glue layer 103 is soaked into a reading anode plate 3 of the microstructure gas detector.
Wherein the diameter of each support pad 5 does not exceed 1 mm. The thicknesses of the first adhesive layer 101 and the second adhesive layer 103 can be the same or different, and specifically according to actual requirements, the first adhesive layer 101 and the second adhesive layer 103 release viscosity above a preset temperature value, and the first adhesive layer and the second adhesive layer soak into the readout anode plate 3 and permeate into the meshes of the stainless steel wire mesh 7. The solid connection distance between the reading anode plate 3 and the stainless steel screen 7 is hundreds of microns.
This kind of bearing structure for detector stainless steel net 7 realizes being connected with reading out anode plate 3 in reality, effectively avoids because the detector condition of discharging of striking sparks that virtual connecing caused, has increased detector stability. The support structure can be applied to the manufacture of Micro-grid Gas detectors (Micromegas) and can also be applied to other Micro-structure detectors as the support structure of an amplifying structure, such as Gas Electron Multipliers (GEMs), thick Gas Electron multipliers (THGEMs) and the like.
In summary, the embodiment of the invention provides a supporting structure of a microstructure gas detector and a manufacturing method thereof, which adopt a hot-melt adhesive film as the supporting structure of the microstructure gas detector, so that a stainless steel wire mesh of the detector is actually connected with a supporting gasket, thereby effectively avoiding the detector ignition and discharge caused by virtual connection and increasing the stability of the detector. The laser cutting mode is applied to the array and the frame for manufacturing the hot melt adhesive film gasket, the machining precision is improved, the quantity of the gaskets is reduced, the probability of supporting the defects of the gaskets is reduced, the machining of the gasket array with smaller distance and smaller diameter can be realized, the machining speed is high, and the efficiency is high. The hot melt adhesive film gasket array and the frame are pre-hot-pressed by using a flat plate hot pressing mode, so that manual placement of gaskets is avoided, and the gasket placement efficiency and precision are improved. The method is particularly suitable for the batch production of large-area detectors.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. A method for preparing a microstructure gas detector supporting structure is characterized by comprising the following steps:
s0, flattening the hot melt adhesive film (1) adhered on the release paper (2);
s1, setting laser cutting parameters, wherein the parameters comprise cutting distance, cutting size and cutting pattern;
s2, carrying out laser cutting on the hot melt adhesive film (1) adhered to the release paper (2) according to the parameters until the hot melt adhesive film (1) is completely cut through but the release paper (2) is not cut, and forming a support gasket (5) array with a frame (6);
s3, closely attaching one surface of the hot melt adhesive film (1) of the support gasket (5) array with the frame (6) to the reading anode plate (3) of the microstructure gas detector, adhering the hot melt adhesive film to the surface of the reading anode plate (3) along the edge of the release paper (2) by using a high-temperature adhesive tape, and applying pressure and hot pressing from one surface of the release paper (2) by using flat plate hot pressing to form the support structure;
s4, placing the stainless steel screen (7) of the microstructure gas detector on the supporting structure and performing hot pressing, so that the reading anode plate (3) is connected with the stainless steel screen (7) in a solid mode.
2. The method of manufacturing a microstructure gas detector support structure according to claim 1, wherein in step S2, the cutting pitch is not more than 1cm x 1 cm.
3. The method of manufacturing a microstructure gas detector support structure according to claim 1, wherein in step S2, the cut size is a diameter not exceeding 1 mm.
4. A support structure for a micro-structured gas detector, characterized in that it is produced by a production method according to any one of claims 1 to 3, the support structure being an array of support pads (5) made of hot-melt adhesive film (1), each support pad (5) comprising:
a first adhesive layer (101), a substrate layer (102), and a second adhesive layer (103);
the substrate layer (102) is formed between the first glue layer (101) and the second glue layer (103), the first glue layer (101) penetrates into meshes of a stainless steel wire mesh (7) of the microstructure gas detector, and the second glue layer (103) is soaked into a reading anode plate (3) of the microstructure gas detector.
5. Support structure for a microstructure gas detector according to claim 4, characterised in that the diameter of each support pad (5) does not exceed 1 mm.
6. The supporting structure of the microstructure gas detector according to claim 4, wherein the distance between the reading anode plate (3) and the stainless steel wire mesh (7) is hundreds of micrometers.
7. The supporting structure of a microstructure gas detector according to claim 4, characterised in that the first glue layer (101) and the second glue layer (103) release their tackiness above a preset temperature value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910436979.XA CN110208460B (en) | 2019-05-23 | 2019-05-23 | Supporting structure of microstructure gas detector and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910436979.XA CN110208460B (en) | 2019-05-23 | 2019-05-23 | Supporting structure of microstructure gas detector and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110208460A CN110208460A (en) | 2019-09-06 |
| CN110208460B true CN110208460B (en) | 2021-08-13 |
Family
ID=67788517
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910436979.XA Active CN110208460B (en) | 2019-05-23 | 2019-05-23 | Supporting structure of microstructure gas detector and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110208460B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113433580B (en) * | 2021-06-25 | 2023-03-10 | 中国科学技术大学 | Gas detector manufacturing method, gas detector and ray detection device |
| CN115950920B (en) * | 2023-03-16 | 2023-06-16 | 中国科学技术大学 | Micro-structure gas detector based on micro-fluidic technology and preparation method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208663910U (en) * | 2018-03-26 | 2019-03-29 | 昆山龙腾光电有限公司 | A kind of cutter device |
| CN108531091B (en) * | 2018-03-28 | 2020-06-26 | 中国科学技术大学 | Hot melt adhesive film hot-pressing method for manufacturing large-area Micromegas detector |
| CN109444224A (en) * | 2018-11-09 | 2019-03-08 | 中国科学技术大学 | A kind of micro-structure gas detector and preparation method thereof |
-
2019
- 2019-05-23 CN CN201910436979.XA patent/CN110208460B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN110208460A (en) | 2019-09-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110208460B (en) | Supporting structure of microstructure gas detector and preparation method thereof | |
| EP2455809A2 (en) | A pellicle for lithography | |
| JP5168920B2 (en) | Semiconductor device manufacturing method and marking device | |
| CN108776562A (en) | A kind of capacitance touch screen production method | |
| JP4042347B2 (en) | Method of processing air bearing surface shape of magnetic head slider and method of manufacturing magnetic head slider | |
| CN107298428B (en) | A method of it is separated for SOG-MEMS chip unit | |
| CN111482337A (en) | Asphalt bonding and hanging method for ultrathin parts | |
| CN105452154A (en) | Methods for bonding material layers to one another and resulting device | |
| CN109769348B (en) | Manufacturing process of copper-buried plate | |
| CN110854258B (en) | Manufacturing method of three-color LED lamp bead | |
| JP2000085089A (en) | Lamination method | |
| TW201901788A (en) | Processing object cutting method | |
| JP2006220789A (en) | Manufacturing method of micro-optical element | |
| JPS61280660A (en) | Manufacture of semiconductor device | |
| CN116581033B (en) | Manufacturing method of Micro-LED MIP lamp bead carrier plate | |
| CN111958335A (en) | Method for changing large coated glass into small wafer | |
| JP3232808B2 (en) | Method of manufacturing thin film magnetic head slider | |
| CN110629171A (en) | Binding method of planar small-specification sputtering target used in testing machine | |
| CN100550310C (en) | The method of wafer cutting | |
| CN107933003A (en) | A kind of strain gauge cap rock diaphragm seal and preparation method thereof and application method | |
| CN115547898B (en) | Quick marking method for wafer defect | |
| CN110729203B (en) | Packaging process of open electrocardiogram sensor | |
| CN110860950B (en) | Manufacturing method based on aluminum nitride ceramic front side metallization for 5G optical module | |
| JP3419932B2 (en) | Manufacturing method of laminated electronic components | |
| JPS54113253A (en) | Bonding method of semiconductor pellet |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |