CN110191571A - Circuit board arrangement and terminal device - Google Patents
Circuit board arrangement and terminal device Download PDFInfo
- Publication number
- CN110191571A CN110191571A CN201910447414.1A CN201910447414A CN110191571A CN 110191571 A CN110191571 A CN 110191571A CN 201910447414 A CN201910447414 A CN 201910447414A CN 110191571 A CN110191571 A CN 110191571A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- region
- conducting film
- heat conducting
- magnetosphere
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention discloses a kind of circuit board arrangement, it includes circuit board (100), at least two electronic components (200) and heat conducting film (300), the circuit board (100) includes that device lays region, electronic component (200) setting is laid on region in the device, the heat conducting film (300) is covered on the device and lays on region, the heat conducting film (300) is affixed with each electronic component (200), and the heat conducting film (300) is laid region with the device and is affixed.The present invention discloses a kind of terminal device.Above scheme, which can solve current terminal device, has that heat dissipation performance is poor.
Description
Technical field
The present invention relates to technical field of communication equipment more particularly to a kind of circuit board arrangements and terminal device.
Background technique
With the promotion of user demand, the function of terminal device is more and more, and performance increasingly optimizes.Correspondingly, terminal
The electronic component integrated in equipment is more and more.Circuit board is inside terminal device for installing the main base of electronic component
Plinth component, the electronic component quantity integrated on the circuit board in terminal device at present are more.In the process of work, electronics member
Device meeting heat production, and then the temperature rise that will lead to terminal device is very fast, how to realize to the electronic component on circuit board preferably
Heat dissipation, is the Main way designed at present.
In current terminal device, only Heat Conduction Material is arranged in the surface of the biggish electronic component of calorific value on circuit boards
Layer, is walked the heat transfer of electronic component by thermal conductive material layer.It will be apparent that electronics member of such mode for quantity terminal
Heat dissipation effect is limited for device.Current terminal device still has the poor problem of heat dissipation performance.
Summary of the invention
The present invention discloses a kind of circuit board arrangement, and it is poor that there are heat dissipation performances to solve the problems, such as current terminal device.
To solve the above-mentioned problems, the present invention adopts the following technical solutions:
A kind of circuit board arrangement, including circuit board, at least two electronic components and heat conducting film, the circuit board include device
Part lays region, and the electronic component setting is laid on region in the device, and the heat conducting film is covered on the device cloth
If on region, the heat conducting film is affixed with each electronic component, the heat conducting film is laid region with the device and is affixed.
Preferably, in foregoing circuit panel assembly, the plate face of the two sides of the circuit board includes that the device lays region,
The device lays region and is provided with the electronic component, and the two sides of the circuit board are provided with the heat conducting film.
Preferably, in foregoing circuit panel assembly, the heat conducting film includes substrate and the heat-conducting layer that is arranged in the substrate.
Preferably, in foregoing circuit panel assembly, the heat conducting film include be arranged in the substrate every magnetosphere, it is described every
The side that the heat-conducting layer deviates from the electronic component is arranged in magnetosphere.
Preferably, described to be electrically connected every magnetosphere with the circuit board ground in foregoing circuit panel assembly.
Preferably, in foregoing circuit panel assembly, it is described every magnetosphere include be arranged in the substrate nickel particle or iron particle.
Preferably, in foregoing circuit panel assembly, it is described every magnetosphere further include the Argent grain being arranged in the substrate, it is described
Argent grain is distributed along the extending direction every magnetosphere.
Preferably, described to pass through epoxy flux low temperature tin cream every magnetosphere and the circuit board in foregoing circuit panel assembly
Ground connection electrical connection.
Preferably, in foregoing circuit panel assembly, the heat conducting film hot pressing is fixed on the device and lays on region.
A kind of terminal device, including circuit board arrangement described above.
The technical solution adopted by the present invention can reach it is following the utility model has the advantages that
In circuit board arrangement disclosed by the invention, heat conducting film is covered on device and lays on region, and heat conducting film and each electricity
Sub- component and device are laid region and are affixed, and dissipating for electronic component all in region is laid to device so as to realize
Thermo-contact since contact area is larger, and covers all electronic components, therefore can preferably realize heat dissipation, in turn
It can be improved the heat dissipation performance of terminal device.
Detailed description of the invention
The drawings described herein are used to provide a further understanding of the present invention, constitutes a part of the invention, this hair
Bright illustrative embodiments and their description are used to explain the present invention, and are not constituted improper limitations of the present invention.In the accompanying drawings:
Fig. 1 is the structural schematic diagram of circuit board arrangement disclosed by the embodiments of the present invention；
Fig. 2 is the partial structural diagram of Fig. 1.
Description of symbols:
100- circuit board,
200- electronic component,
300- heat conducting film, 310- substrate, 320- heat-conducting layer, 330- are every magnetosphere, 331- nickel particle or iron particle, 332- silver
Grain,
400- epoxy flux low temperature tin cream.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with the specific embodiment of the invention and
Technical solution of the present invention is clearly and completely described in corresponding attached drawing.Obviously, described embodiment is only the present invention one
Section Example, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not doing
Every other embodiment obtained under the premise of creative work out, shall fall within the protection scope of the present invention.
Below in conjunction with attached drawing, technical solution disclosed in each embodiment that the present invention will be described in detail.
Fig. 1 and Fig. 2 are please referred to, the embodiment of the present invention discloses a kind of circuit board arrangement, and disclosed circuit board arrangement includes
Circuit board 100, at least two electronic components 200 and heat conducting film 300.
Circuit board 100 is the basic component of circuit board arrangement, and circuit board 100 is that electronic component 200 provides installation site,
At least two electronic components 200 are arranged on circuit board 100.Under normal conditions, electronic component 200 and circuit
Plate 100 is electrically connected.
In the embodiment of the present invention, circuit board 100 includes that device lays region, and device, which lays region, may be considered circuit board
For laying the region of electronic component 200 on 100.Each setting of electronic component 200 is laid on region in device.
Heat conducting film 300 is the radiator portion of circuit board arrangement, and heat conducting film 300 is covered on device and lays on region, heat conducting film
300 are affixed with each electronic component 200, and heat conducting film 300 and device are laid region and be affixed, so as to by electronic component
200 and the work of circuit board 100 in the thermal conductivity that generates walk, to achieve the purpose that heat dissipation.
In circuit board arrangement disclosed by the embodiments of the present invention, heat conducting film 300 is covered on device and lays on region, and thermally conductive
Film 300 is laid region with each electronic component 200 and device and is affixed, so as to realize to all in device laying region
The heat dissipation of electronic component contacts, and since contact area is larger, and covers all electronic components, therefore can be preferably
It realizes heat dissipation, and then can be improved the heat dissipation performance of terminal device.
In the embodiment of the present invention, heat conducting film 300 can be realized by the way of glue bonding lays region and electricity with device
Fitting between sub- component 200.In more preferably scheme, heat conducting film 300 can cover in such a way that hot pressing is fixed
It is laid on region in device, realizes that heat conducting film 300 and device lay the patch between region and electronic component 200 by hot pressing
It closes.It undoubtedly can be improved fitting effect in such a way that hot pressing is fixed, be more advantageous to heat dissipation.
In order to improve integrated level, in the preferred scheme, the plate face of the two sides of circuit board 100 may each comprise device laying
Region, device, which lays region, can be set electronic component 200, and heat conducting film has can be set in the two sides of circuit board 100
300, that is to say, that the device of 100 two sides of circuit board lays region and is all covered with heat conducting film 300.
In embodiments of the present invention, heat conducting film 300 can have thermally conductive good material to be made, in order to ensure thermally conductive same
When, be conducive to the assembly of heat conducting film 300, in the preferred scheme, heat conducting film 300 may include substrate 310 and heat-conducting layer 320,
Heat-conducting layer 320 can be set in substrate 310, and substrate 310 is conducive to lay between region and electronic component 200 with device
Fitting.Specifically, substrate 310 can be polyimide substrate.Heat-conducting layer 320 can be graphite-like Heat Conduction Material.This hair
Bright embodiment does not limit the specific type of substrate 310 and heat-conducting layer 320.
In order to improve heating conduction, in the preferred scheme, graphite-like Heat Conduction Material can be evenly distributed in polyamides Asia
In amine substrate, specifically, the layer that graphite-like Heat Conduction Material is formed can be about 20 μm -30 μm.
It is known that the electronic component 200 on circuit board 100 may be subjected to electromagnetism in environment in the process of work
Interference or can to other electronic components 200 in environment generate electromagnetic interference, be based on this, traditional way is in electronics
Metallic shield is covered on component 200, it is contemplated that installation and foozle, the setting meeting of metallic shield is so that entire circuit
The thickness of panel assembly is larger, it is obvious that this is unfavorable for terminal device and designs towards thinner direction.
To solve the above-mentioned problems, in more preferably scheme, heat conducting film 300 may include every magnetosphere 330, every magnetosphere
330 are arranged in substrate 310, can be set every magnetosphere 330 and deviate from the side of electronic component 200, such feelings in heat-conducting layer 320
Under condition, the heat that heat-conducting layer 320 can quickly generate electronic component 200 is guided, then by dissipating outward every magnetosphere 330
It removes.It is formed by having every the metal material of magnetic function every magnetosphere 330, meanwhile, metal material is conducive to auxiliary heat conduction layer 320 will be hot
Amount removes.In a kind of specific embodiment, every magnetosphere 330 may include the nickel particle or iron particle being arranged in substrate 310
331 form.In such cases, heat conducting film 300 has both thermally conductive and electromagnetic shielding function.
Due to being contained in heat conducting film 300 every magnetosphere 330, heat conducting film 300 can design it is thinner, heat conducting film 300 cover
In the case where device lays region and is affixed with electronic component 200 and device laying region, the thickness of whole circuit board device
It spends undoubtedly smaller.Under the premise of especially fixing using hot pressing, the thickness for reducing circuit board arrangement can be more advantageous to.It is a kind of specific
Embodiment in, the thickness of heat conducting film 300 about 0.1mm.
, can be with 100 grounding connection of circuit board every magnetosphere 330 in more preferably scheme, and then it is quiet to be conducive to release
Electricity.It, can also be including Argent grain 332, Argent grain every magnetosphere 330 more preferably in scheme in order to improve electrostatic leakage ability
332 are arranged in substrate 310, and Argent grain 332 can be distributed along the extending direction every magnetosphere 330, the electric conductivity of Argent grain 332
Can be stronger, it is more advantageous to quickly releasing for electrostatic.It is, of course, also possible to be made of the better material of other electric conductivities, such as
Argent grain 332 can be replaced with copper particle.
In order to realize better grounding connection, more preferably in scheme, can pass through every magnetosphere 330 and circuit board 100
The ground connection electrical connection of epoxy flux low temperature tin cream 400.In the embodiment of the present invention, epoxy flux low temperature tin cream 400 is enabled to
The low-temperature alloy of conductive material and 100 earthing position of circuit board in heat conducting film 300 realizes good welds, to realize more good
Good earthing effect.
In circuit board arrangement disclosed by the embodiments of the present invention, heat conducting film 300 is covered on device and lays on region, and and electronics
Component 200 and device are laid region and are affixed, this undoubtedly can be improved the integral waterproofing ability of circuit board arrangement.
Heat conducting film 300 and electronic component 200 and device is enabled to lay by the way of the fixed heat conducting film 300 of hot pressing
Gap between region is smaller, is conducive to preferably thermally conductive.
During preparing circuit board arrangement disclosed by the embodiments of the present invention, operator can be first in circuit board 100
Upper print solder paste, then mount electronic component 200 again, can be tested after being then passed through reflow ovens welding, to be measured to ping
Later disposably heat conducting film 300 can be sticked by the way of hot pressing and lays region and the electronics member device in it in device
On part 200, the final preparation for realizing circuit board arrangement, whole preparation process simple process is conducive to improve production efficiency.
Based on circuit board arrangement disclosed by the embodiments of the present invention, the embodiment of the present invention discloses a kind of terminal device, disclosed
Terminal device include foregoing embodiments description circuit board arrangement.
Terminal device disclosed by the embodiments of the present invention can be mobile phone, tablet computer, E-book reader, game machine, can
The mobile terminals such as wearable device (such as smartwatch), the embodiment of the present invention do not limit the specific type of terminal device.
Emphasis describes the difference between each embodiment, difference between each embodiment in foregoing embodiments of the present invention
As long as optimization feature non-contradiction, can combine to form more preferably embodiment, it is contemplated that style of writing is succinct, then no longer superfluous at this
It states.
The above description is only an embodiment of the present invention, is not intended to restrict the invention.For those skilled in the art
For, the invention may be variously modified and varied.All any modifications made within the spirit and principles of the present invention are equal
Replacement, improvement etc., should be included within scope of the presently claimed invention.
Claims (10)
1. a kind of circuit board arrangement, which is characterized in that including circuit board (100), at least two electronic components (200) and thermally conductive
Film (300), the circuit board (100) include that device lays region, and electronic component (200) setting is laid in the device
On region, the heat conducting film (300) is covered on the device and lays on region, the heat conducting film (300) and each electronics member
Device (200) is affixed, and the heat conducting film (300) is laid region with the device and is affixed.
2. circuit board arrangement according to claim 1, which is characterized in that the plate face of the two sides of the circuit board (100) is equal
Region is laid including the device, the device lays region and is provided with the electronic component (200), the circuit board
(100) two sides are provided with the heat conducting film (300).
3. circuit board arrangement according to claim 1 or 2, which is characterized in that the heat conducting film (300) includes substrate
(310) and heat-conducting layer (320) in the substrate (310) is set.
4. circuit board arrangement according to claim 3, which is characterized in that the heat conducting film (300) includes being arranged described
In substrate (310) every magnetosphere (330), it is described to deviate from the electronics member device in the heat-conducting layer (320) every magnetosphere (330) setting
The side of part (200).
5. circuit board arrangement according to claim 4, which is characterized in that described every magnetosphere (330) and the circuit board
(100) ground connection electrical connection.
6. circuit board arrangement according to claim 4, which is characterized in that it is described every magnetosphere (330) include be arranged described
Nickel particle or iron particle (331) in substrate (310).
7. circuit board arrangement according to claim 6, which is characterized in that it is described every magnetosphere (330) further include be arranged in institute
The Argent grain (332) in substrate (310) is stated, the Argent grain (332) is distributed along the extending direction every magnetosphere (330).
8. circuit board arrangement according to claim 5, which is characterized in that described every magnetosphere (330) and the circuit board
(100) pass through epoxy flux low temperature tin cream (400) ground connection electrical connection.
9. circuit board arrangement according to claim 1, which is characterized in that heat conducting film (300) hot pressing is fixed on described
Device is laid on region.
10. a kind of terminal device, which is characterized in that including circuit board arrangement of any of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910447414.1A CN110191571B (en) | 2019-05-27 | 2019-05-27 | Circuit board device and terminal equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910447414.1A CN110191571B (en) | 2019-05-27 | 2019-05-27 | Circuit board device and terminal equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110191571A true CN110191571A (en) | 2019-08-30 |
| CN110191571B CN110191571B (en) | 2020-11-17 |
Family
ID=67718141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910447414.1A Active CN110191571B (en) | 2019-05-27 | 2019-05-27 | Circuit board device and terminal equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110191571B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0472698A (en) * | 1990-07-12 | 1992-03-06 | Matsushita Electric Ind Co Ltd | Shielding device |
| CN1720108A (en) * | 2002-10-21 | 2006-01-11 | 莱尔德技术公司 | Thermally conductive EMI shield |
| CN102093691A (en) * | 2011-01-06 | 2011-06-15 | 黄柱联 | Heat-dissipation graphite powder mixed plastic material |
| CN103122075A (en) * | 2013-03-19 | 2013-05-29 | 苏州格瑞丰纳米科技有限公司 | High heat-conducting thin graphene-based composite material, as well as preparation method and application thereof |
| CN103665866A (en) * | 2013-12-16 | 2014-03-26 | 宁波今山电子材料有限公司 | Preparation method for graphene-polyimide composite film |
| CN105015094A (en) * | 2014-04-29 | 2015-11-04 | 安炬科技股份有限公司 | Graphene heat dissipation structure |
| CN108242427A (en) * | 2016-12-23 | 2018-07-03 | 光宝电子(广州)有限公司 | The encapsulating structure and packaging technology of electronic products |
-
2019
- 2019-05-27 CN CN201910447414.1A patent/CN110191571B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0472698A (en) * | 1990-07-12 | 1992-03-06 | Matsushita Electric Ind Co Ltd | Shielding device |
| CN1720108A (en) * | 2002-10-21 | 2006-01-11 | 莱尔德技术公司 | Thermally conductive EMI shield |
| CN102093691A (en) * | 2011-01-06 | 2011-06-15 | 黄柱联 | Heat-dissipation graphite powder mixed plastic material |
| CN103122075A (en) * | 2013-03-19 | 2013-05-29 | 苏州格瑞丰纳米科技有限公司 | High heat-conducting thin graphene-based composite material, as well as preparation method and application thereof |
| CN103665866A (en) * | 2013-12-16 | 2014-03-26 | 宁波今山电子材料有限公司 | Preparation method for graphene-polyimide composite film |
| CN105015094A (en) * | 2014-04-29 | 2015-11-04 | 安炬科技股份有限公司 | Graphene heat dissipation structure |
| CN108242427A (en) * | 2016-12-23 | 2018-07-03 | 光宝电子(广州)有限公司 | The encapsulating structure and packaging technology of electronic products |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110191571B (en) | 2020-11-17 |
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