CN110176349B - 稀土磁铁的加工方法 - Google Patents

稀土磁铁的加工方法 Download PDF

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CN110176349B
CN110176349B CN201910120894.0A CN201910120894A CN110176349B CN 110176349 B CN110176349 B CN 110176349B CN 201910120894 A CN201910120894 A CN 201910120894A CN 110176349 B CN110176349 B CN 110176349B
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增田健
坪仓多惠子
宫坂宽
畠山丰
黑嶋敏浩
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Abstract

稀土磁铁的加工方法具备:对R‑T‑B系稀土磁铁照射激光进行加工的工序;和在上述加工后对上述磁铁进行热处理的工序。热处理具备:将磁铁的温度设为400℃以下的A工序;在A工序之后,将磁铁在400℃以上且700℃以下的范围内的温度T1下保持规定时间的B工序;以及在B工序之后,将磁铁的温度设为低于400℃的C工序。在A工序与B工序之间不使磁铁的温度达到超过700℃。在B工序与C工序之间不使磁铁的温度达到超过700℃。在上述C工序之后不具有将上述磁铁设为超过700℃的温度的工序。

Description

稀土磁铁的加工方法
技术领域
本发明涉及以稀土元素(R)、Fe等的过渡金属元素(T)及硼(B)为主成分的稀土磁铁的加工方法。
背景技术
如专利文献1所记载,提出有通过激光加工R-T-B(R为1种以上的稀土元素,T为Fe等的过渡金属元素)系稀土磁铁的方法。
现有技术文献
专利文献1:日本特开2009-732号公报
发明内容
但是,专利文献1中公开的使用特定的波长的激光的加工方法中,有时加工后的磁铁的磁特性大幅劣化。
本发明是鉴于上述情况而完成的,其目的在于,提供一种能够抑制通过激光进行加工时的磁特性的劣化的稀土磁铁的加工方法。
本发明提供一种稀土磁铁的加工方法,具备:对R-T-B系稀土磁铁照射激光进行加工的工序;以及在所述加工后对所述磁铁进行热处理的工序。
所述热处理具备:
将所述磁铁的温度设为400℃以下的A工序;
在所述A工序之后,将所述磁铁在400℃以上且700℃以下的范围内的温度T1下保持规定时间的B工序;以及
在所述B工序之后,将所述磁铁的温度设为低于400℃的C工序。
在所述A工序与所述B工序之间不使所述磁铁的温度达到超过700℃。
在所述B工序与所述C工序之间不使所述磁铁的温度达到超过700℃。
所述热处理在所述C工序之后不具有将所述磁铁设为超过700℃的温度的工序。
在此,所述热处理能够在所述A工序之前,进一步具备:在超过400℃且1100℃以下的范围内且高于温度T1的温度T2下,将所述磁铁保持规定时间的D工序。
在此,所述B工序的所述规定时间可以为1分钟~48小时。
根据本发明,能够使由于激光的加工而劣化的磁特性恢复。
附图说明
图1(a)~图1(d)是表示本发明的实施方式的热处理的时间与温度的关系的图;
图2(a)~图2(c)表示本发明的实施方式的范围外的热处理的时间与温度的关系;
图3的(a)是表示切断前的磁铁M1的立体图,图3的(b)是表示切断后的磁铁M2的立体图;
图4是实施例1、比较例1及参考例1的磁铁的退磁曲线。
具体实施方式
说明本发明的实施方式的稀土磁铁的制造方法。但是,本发明不限定于以下的实施方式。
(R-T-B系稀土磁铁)
R-T-B系稀土磁铁是含有1种以上的稀土元素R、Fe等的过渡金属元素T、及硼B的体系的稀土磁铁。
稀土元素是指属于长周期型周期表的IIIB族的Sc、Y和镧系元素。镧系元素中包含例如:La、Ce、Pr、Nd、Sm、Eu、Gd、Tb、Dy、Ho、Er、Tm、Yb、Lu等。
T优选含有Fe、Co及Cu全部。通过含有Co,能够不使磁特性降低并提高温度特性。另外,通过含有Cu,可进行得到的磁铁的高矫顽力化、高耐腐蚀性化、和温度特性的改善。作为Fe、Co及Cu以外的过渡金属元素,可举出:Ti、V、Cr、Mn、Ni、Zr、Nb、Mo、Hf、Ta、W等。
另外,本实施方式的磁铁除了R、T及B以外,也可以还含有例如N、Al、Ga、Si、Bi、Sn等的元素的至少1种元素。除此之外,R-T-B系稀土磁铁也可以不可避免地含有O、C、Ca、N等。它们也可以分别以0.5质量%程度以下的量含有。
R-T-B系稀土磁铁可以为烧结磁铁、热加工磁铁、轧制加工磁铁、通电烧结磁铁、金属粘结磁铁。
R-T-B系稀土磁铁可以具有R2T14B晶粒(主相),形成于相邻的两个R2T14B晶粒之间的两颗粒晶界及由相邻的3个以上的R2T14B晶粒包围的多颗粒晶界。R2T14B晶粒的平均粒径通常可以为1μm~30μm程度。
(R-T-B系稀土磁铁的制造方法)
首先,作为初始原料,准备含有R-T-B系稀土磁铁所包含的各元素的原料合金(合金准备工序)。合金准备工序中,将与R-T-B系稀土磁铁的组成对应的原料金属在真空或Ar气等惰性气体的惰性气体氛围中熔融之后,使用其进行铸造,由此得到合金。
另外,准备主要形成主相的第一合金和主要形成晶界相的第二合金,将这些合金进行粉碎并混合,也可以使用所谓的二合金法。
作为原料金属,可以使用例如稀土金属及稀土合金、纯铁、硼铁合金、以及它们的合金及化合物等。铸造合金的铸造方法为例如铸锭法、薄带连铸法、书型铸法(bookmolding)或离心铸造法等。
接着,对合金进行粉碎(粉碎工序)。在粉碎工序中,合金被粉碎至粒径成为数μm程度。粉碎可以吸附氢而进行,也可以使用喷磨机等进行。
接下来,将合金粉成型为目标的形状,得到成型体(成型工序)。成型工序中,通过将合金粉充填至模具内进行加压,从而成型为任意的形状。此时,优选一边施加磁场一边成型,通过磁场施加使合金粉产生预定的取向,在使结晶轴进行了取向的状态下在磁场中进行成型。磁场中成型的成型体由于结晶轴沿特定方向进行取向,因此能够具有更高的磁各向异性。
将得到的成型体在真空或惰性气体氛围中进行烧结,得到R-T-B系烧结磁铁(烧结工序)。烧结温度需要根据组成、粉碎方法、粒度与粒度分布的不同等各条件进行调整,但通过相对于成型体,进行例如在真空中或惰性气体的存在下以1000℃以上且1200℃以下加热1小时以上且10小时以下的处理而进行烧结。由此,混合粉末进行液相烧结,并得到主相的体积比率提高了的R-T-B系烧结磁铁(烧结体)。烧结成型体之后,从提高生产效率的观点来看,优选烧结体进行骤冷。
通过将得到的R-T-B系烧结磁铁以低于烧结时的温度进行保持等,从而对R-T-B系烧结磁铁实施时效处理(时效处理工序)。时效处理例如以700℃以上且900℃以下的温度加热1小时~3小时,进一步以500℃~700℃的温度加热1小时~3小时的两个阶段加热,或者以600℃附近的温度加热1小时~3小时的一个阶段加热等,根据实施时效处理的次数适宜调整处理条件。通过这种时效处理,能够提高R-T-B系烧结磁铁的磁特性。
此外,在制造烧结磁铁以外的R-T-B系稀土磁铁的情况下,替代烧结工序,而应用公知的热加工、轧制加工等的方法即可。
可以根据需要,将R-T-B系稀土磁铁加工成期望的形状(预先加工工序)。加工方法可列举机械加工、放电加工、超声波加工、滚筒研磨等。
相对于得到的R-T-B系稀土磁铁,照射激光并加工R-T-B稀土磁铁(激光加工工序)。加工的例子可举出切断、切削、槽形成、钻孔、切口形成、切齿、倒角等。激光进行的加工也可以是为了做成割断、破裂及裂纹的起点而在磁铁中形成激光加工痕。
在激光加工后相对于R-T-B系稀土磁铁进行热处理(热处理工序)。
热处理具备:
将磁铁的温度设为400℃以下的A工序;
在A工序之后将磁铁在400℃以上且700℃以下的范围内的温度T1下保持规定时间的B工序;及
在B工序之后,将磁铁的温度设为低于400℃的C工序。
在此,在A工序与B工序之间不使磁铁的温度达到超过700℃。
另外,在B工序与C工序之间不使磁铁的温度达到超过700℃。
另外,该热处理不具有在C工序之后将磁铁设为超过700℃的温度的工序。
A工序的时间没有特别限定,只要成为400℃以下的时间较少即可。例如,优选为1分钟~6小时。
B工序的温度T1低于400℃时,Hk/Hcj不会恢复。B工序的温度T1可以为650℃以下。B工序的温度T1超过700℃时,Hcj大幅变差。B工序中维持于温度T1的规定时间可以设为1分钟~48小时,可以在能得到磁特性的恢复的范围内适宜设定。T1在上述范围为低温时,有必要的热处理时间变长的倾向,生产效率容易降低。另外,T1在上述范围为高温时,热处理时间较短即可,但存在磁特性的不均变大的倾向。优选的T1与T1的维持时间的组合为400℃~600℃、10分钟~12小时,更优选的组合为450℃~550℃、30分钟~6小时。
C工序的时间没有特别限定,例如能够设为10分钟~12小时。
热处理能够进一步具备在A工序之前,在超过400℃且1100℃以下的范围内且高于温度T1的温度T2下,将磁铁保持规定时间的D工序。保持于温度T2的时间可以设为10分钟~6小时。
优选在A工序与D工序之间使磁铁的温度不达到超过1100℃。
另外,优选在D工序之前,设置将磁铁的温度设为400℃的工序,优选在D工序之前不使磁铁的温度达到超过1100℃。
也可以在A工序之前将D工序进行多次。在将D工序进行多次的情况下,可以在两个D工序之间具有将磁铁的温度设为400℃以下的工序。
图1(a)中表示本实施方式的一个例子的热处理H1的时间-温度图案。该热处理H1中,从室温(R.T.)到温度T1直线性地升温,以温度T1维持规定时间,然后,直线性地降温至室温。因此,如图1(a)所示,依次具有:磁铁的温度为400℃以下的A工序;在A工序之后将磁铁的温度在400℃以上且700℃以下的范围内的温度T1保持规定时间的B工序、以及在B工序之后将磁铁的温度设为低于400℃的C工序。另外,热处理H1中,在A工序与B工序之间不使磁铁的温度达到超过700℃,在B工序与C工序之间不使磁铁的温度达到超过700℃,并且不具有在上述C工序之后将磁铁设为超过700℃的温度的工序。
图1(b)中表示本实施方式的一个例子的热处理H2的时间-温度图案。该热处理H2中,还具备在热处理H1之前,从室温到温度T2直线性地升温的E工序、E工序之后在温度T2保持规定时间的D工序、以及从D工序到室温直线性地降温的F工序。如上所述,温度T2为超过400℃且1100℃以下的范围内且比温度T1高的温度。
图1(c)中表示本实施方式的一例的热处理H3的时间-温度图案。该热处理H3与H2不同的点在于,F工序的最终达到温度为400℃,因此,F工序的最终达到时点也兼作A工序。
图1(d)中表示本实施方式的一例的热处理H4的时间-温度图案。该热处理H4与热处理H3不同的点在于,B工序的温度T1为与F工序的最终达到温度及A工序的温度相同的400℃。
此外,图2(a)~图2(c)所示的热处理HH1~HH3不包含于本发明的实施方式。
例如,图2(a)中,存在A~C工序,但在A工序与B工序之间具有将磁铁的温度设为超过700℃的Z工序,因此,不符合实施方式所涉及的热处理。
另外,图2(b)中,存在A~C工序,但在C工序之后具有将磁铁设为超过700℃的温度的Y工序,因此,不包含于本实施方式。
另外,图2(c)的X工序的温度较高,因此,不包含于B工序。
另外,在该热处理工序为适于时效处理的热处理的情况下,也可以在烧结工序后,省略激光加工工序前的时效处理工序。即,热处理工序也能够兼作时效处理工序。
对于通过以上的工序得到的磁铁,也可以实施镀敷、树脂覆膜、氧化处理及化成处理等的表面处理。由此,能够提高磁铁的耐腐蚀性。
得到的磁铁的形状没有特别限定,例如可以设为长方体、六面体、平板状、四棱柱等的柱状、截面形状为C型或圆筒状等的任意的形状。同样,磁铁尺寸也没有特别限定。
本实施方式的磁铁在用于发动机等旋转机用的磁铁的情况下,耐腐蚀性较高,因此能够长期使用,并具有较高的可靠性。本实施方式的磁铁适合作为例如在转子表面安装有磁铁的表面磁铁型(Surface Permanent Magnet:SPM)发动机、将磁铁嵌入转子内部的内部磁铁嵌入型(Interior Permanent Magnet:IPM)发动机、PRM(永磁磁阻发动机,Permanent Magnet Reluctance Motor)等的磁铁使用。具体而言,本实施方式的磁铁适合作为硬盘驱动器的硬盘旋转驱动用主轴发动机及音圈发动机、电动汽车及混合动力汽车用发动机、汽车的电动动力转向用发动机、工作机械的伺服发动机、手机的振动器用发动机、打印用发动机、发电机用发动机等的用途使用。
(作用)
当对稀土磁铁进行激光的加工时,激光接触的部分(加工面)的组织受到损伤,因此磁特性降低。根据本实施方式,能够恢复由于以适当的温度的热处理而导致劣化的磁特性。
实施例
以下,通过实施例进一步详细地说明本发明,但本发明不限定于以下的实施例。
(磁铁的制造)
首先,以得到具有表1所示的磁铁组成(质量%)的烧结磁铁的方式,通过薄带连铸法准备了原料合金。此外,表1中,bal.表示将磁铁组成整体设为100质量%时的的余量,RL表示作为轻稀土元素的Nd及Pr的合计质量%。
【表1】
Nd Pr R<sub>L</sub> Co Al Cu Zr B Fe
磁铁组成 23.6 7.4 31.0 2.0 0.2 0.2 0.15 0.98 余量
接下来,相对于原料合金分别进行在室温下吸附氢之后,在Ar氛围下进行600℃、1小时的脱氢的氢粉碎处理(粗粉碎)。然后,使用喷磨机进行微粉碎,得到平均粒径为4.0μm左右的微粉碎粉末。将得到的微粉碎粉末充填至模具内,进行一边施加1200kA/m的磁场一边施加120MPa的压力的磁场中成型,得到成型体。然后,将得到的成型体在真空中以1060℃保持4小时(真空中)、以850℃保持1小时(Ar氛围下)、及以540℃保持2小时(Ar气氛下),得到多个具有表1所示的组成的磁铁。如图3的(a)所示,得到的磁铁M1具有长30mm×宽20mm×厚2mm的尺寸。
(磁铁的加工)
沿着图3的(a)的虚线L通过光纤激光切断各磁铁M1。切断后的两个磁铁片M2为大致相同的尺寸。将使用的光纤激光的条件示于表2中。这样,得到了实施例及比较例中使用的磁铁片。
【表2】
激光方式 激光波长 光纤直径 输出 加工速度 辅助气体种类 初始气体压力 加工长度
连续 1080nm 35μm 600W 1000mm/min 氮气 1.2MPa 20mm
(实施例1)
对通过光纤激光而切断的磁铁片以图1(b)的热处理图案进行热处理(Ar氛围下)。具体而言,T2=900℃,将T2的时间设为1小时,T1=500℃,将T1的时间设为1小时。室温为23℃。
(比较例1)
相对于通过光纤激光切断的磁铁片,不进行任何热处理。
(参考例1)
另外,作为磁特性的参照,还准备了将磁铁M1的图3的虚线L通过机械加工(金刚石砂轮)切断而得到的参考例的磁铁片(无激光加工)。
(评价)
将实施例1的磁铁片、比较例1的磁铁片、及参考例1的磁铁片以激光切断面S露出于一面的方式分别重叠6个,在激光切断面S的露出面的附近通过BH示踪仪测定了磁特性。图4中表示退磁曲线,表3中表示主要的磁特性。各值是将机械加工(无激光加工)的磁特性设为100进行标准化的相对值。比较例1(激光加工后无热处理)中,表3的所有的磁特性中,都比参考例1(机械加工)变差,特别是Hk/Hcj变差10%以上。与之相对,在实施例1(激光加工后,以500℃进行热处理)的情况下,所有的磁特性中都比比较例1高,磁特性相对于参考例恢复至98%以上。
【表3】
Br(%) Hcj(%) (BH)max(%) Hk/Hcj(%)
参考例1 100% 100% 100% 100%
比较例1 99% 96% 98% 88%
实施例1 100% 98% 100% 100%
(实施例2)
将通过光纤激光而切断的磁铁片以图1(a)的热处理图案进行热处理(Ar氛围下)。具体而言,T1=500℃,将T1的时间保持1小时。室温与实施例1一样。
(比较例2)
将通过光纤激光而切断的磁铁片以图1(a)的热处理图案进行热处理(Ar氛围下)。具体而言,T1=800℃,将T1的时间保持1小时。室温与实施例1一样。
(评价)
将实施例2及比较例2的磁铁片的磁特性与实施例1同样地测定。表4中表示主要的磁特性。比较例2中,特别是Hcj相对于参考例1变差45%。另一方面,实施例2中,所有的磁特性中相对于参考例恢复至96%以上。
【表4】
Br(%) Hcj(%) (BH)max(%) Hk/Hcj(%)
参考例1 100% 100% 100% 100%
实施例2 100% 96% 99% 100%
比较例2 103% 55% 106% 101%

Claims (3)

1.一种稀土磁铁的加工方法,具备:
对R-T-B系稀土磁铁照射激光进行加工的工序;和
在所述加工后对所述磁铁进行热处理的工序,
所述热处理具备:
将所述磁铁的温度设为400℃以下的A工序;
在所述A工序之后,将所述磁铁在400℃以上且700℃以下的范围内的温度T1下保持规定时间的B工序;以及
所述B工序之后,将所述磁铁的温度设为低于400℃的C工序,
在所述A工序与所述B工序之间不使所述磁铁的温度达到超过700℃,
在所述B工序与所述C工序之间不使所述磁铁的温度达到超过700℃,
所述热处理不具有在所述C工序之后将所述磁铁设为超过700℃的温度的工序。
2.根据权利要求1所述的方法,其中,
所述热处理进一步具备:在所述A工序之前,在超过400℃且1100℃以下的范围内且高于温度T1的温度T2下,将所述磁铁保持规定时间的D工序。
3.根据权利要求1或2所述的方法,其中,
所述B工序的所述规定时间为1分钟~48小时。
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